Infrared movement test package and ceramic substrate based on focal plane infrared movement test

Abstract

The utility model relates to an infrared movement test package and a ceramic substrate based on focal plane infrared movement test, the ceramic substrate comprises a substrate, the substrate is provided with a plurality of connecting holes used for being connected with a metal Dewar, the circumference of each connecting hole in the front surface of the substrate is provided with a first bonding pad, and the first bonding pad is provided with a second bonding pad. A chip mounting area and bonding areas are arranged on the front face of the substrate, the bonding areas are located on the left side and the right side of the chip mounting area, a plurality of second bonding pads used for being connected with a chip to be tested are arranged on the bonding areas, each second bonding pad is connected with one first bonding pad through a conductive material, and the number of the second bonding pads is smaller than that of the first bonding pads. The ceramic substrate is connected with the metal Dewar through a connecting hole of the substrate, a to-be-tested chip is placed above the chip mounting area and welded to the to-be-tested chip through a second bonding pad of the bonding area so that the substrate can be connected with the to-be-tested chip, the to-be-tested chip can be connected with the metal Dewar, the metal Dewar and the to-be-tested chip are separated through the substrate, and the to-be-tested chip is connected with the to-be-tested chip. And the chip to be tested is prevented from being damaged by the pressure of the metal Dewar.

Description

Technical Field

[0001] The present application relates to the field of infrared core testing technology, and in particular to an infrared core testing package and a ceramic substrate based on focal plane infrared core testing. Background Art

[0002] After the infrared movement of the cooled focal plane completes all its processes, the infrared movement chip performance needs to be tested in advance before it is delivered for packaging, and the infrared movement chips with unqualified performance need to be screened out to ensure the improvement of the terminal product yield and achieve the purpose of controlling costs.

[0003] Since the infrared movement of the cooled focal plane needs to work under low-temperature vacuum, the chip of the infrared movement needs to be encapsulated in a liquid nitrogen metal dewar to achieve the working environment. The chip of the infrared movement is interconnected with the liquid nitrogen metal dewar. The metal dewar will shrink due to low temperature, causing the infrared movement to be damaged by the pressure of the dewar. Utility Model Content

[0004] The embodiments of the present application provide an infrared movement test package and a ceramic substrate based on a focal plane infrared movement test, which are used to solve the technical problem that the existing infrared movement package is damaged due to the pressure of the metal Dewar caused by low-temperature shrinkage.

[0005] In order to achieve the above objectives, the embodiments of the present application provide the following technical solutions:

[0006] On the one hand, a ceramic substrate based on focal plane infrared movement testing is provided, including a substrate, a plurality of connection holes for connecting to a metal Dewar are opened on the substrate, a first pad is arranged on the periphery of each connection hole located on the front side of the substrate, a patch area and a bonding area are arranged on the front side of the substrate, the patch area is arranged at the center of the front side of the substrate, the bonding area is arranged on the left and right sides of the patch area, a plurality of second pads for connecting to a chip to be tested are arranged on the bonding area, each of the second pads is connected to one of the first pads through a conductive material, and the number of the second pads is less than the number of the first pads.

[0007] Preferably, at least two third pads for mounting temperature measuring devices are provided on the front side of the substrate.

[0008] Preferably, a bonding debugging area is provided on the front surface of the substrate, and the bonding debugging area is arranged on the upper and lower sides of the patch area, and each of the third pads is arranged between the patch area and the bonding debugging area.

[0009] Preferably, a plurality of gold-plated areas arranged in a matrix are provided on the patch area, a metal film layer is provided on each of the gold-plated areas, and a sheet resistance of the metal film layer is less than 15 mΩ.

[0010] Preferably, the substrate is made of 99.6% white alumina ceramics, and the substrate is circular in shape.

[0011] Preferably, the thickness of the substrate is 1 mm.

[0012] Preferably, the resistance between each of the second pads and the corresponding first pad is less than 1Ω.

[0013] Preferably, at least two mounting holes are formed on the substrate.

[0014] Preferably, a back gold layer is provided on the reverse side of the substrate.

[0015] On the other hand, an infrared movement test package is provided, comprising a metal dewar, a chip to be tested and the above-mentioned ceramic substrate based on the focal plane infrared movement test, the pins of the metal dewar are welded to the first pad through the connecting hole from the back side of the ceramic substrate, the chip to be tested is attached to the patch area of ​​the ceramic substrate and the pins of the chip to be tested are welded to the second pad corresponding to the ceramic substrate, the focal plane photosensitive area of ​​the chip to be tested is located at the center of the ceramic substrate, and the chip to be tested is connected to the metal dewar through the ceramic substrate.

[0016] It can be seen from the above technical scheme that the embodiment of the present application has the following advantages: the ceramic substrate based on the focal plane infrared movement test includes a substrate, a plurality of connection holes for connecting to the metal dewar are opened on the substrate, a first pad is arranged around the circumference of each connection hole located on the front of the substrate, a patch area and a bonding area are arranged on the front of the substrate, the patch area is arranged at the center of the front of the substrate, the bonding area is arranged on the left and right sides of the patch area, and a plurality of second pads for connecting to the chip to be tested are arranged on the bonding area, each second pad is connected to a first pad through a conductive material, and the number of second pads is less than the number of first pads. The ceramic substrate based on the focal plane infrared movement test is connected to the metal dewar through the connection hole of the substrate, the chip to be tested is placed above the patch area and the second pad of the bonding area is used to weld the chip to be tested so that the substrate is connected to the chip to be tested, so that the chip to be tested is interconnected with the metal dewar, the metal dewar and the chip to be tested are separated by the substrate, so as to prevent the chip to be tested from being damaged by the pressure of the metal dewar, and solve the technical problem that the package of the existing infrared movement is damaged by the pressure of the metal dewar due to low temperature shrinkage. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0018] Figure 1 This is a schematic structural diagram of the front side of a ceramic substrate based on focal plane infrared core testing according to an embodiment of the present application;

[0019] Figure 2 This is a schematic structural diagram of the back side of a ceramic substrate based on focal plane infrared movement testing as described in an embodiment of the present application. DETAILED DESCRIPTION

[0020] In order to make the purpose, features, and advantages of the invention of this application more obvious and easy to understand, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the embodiments described below are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0021] In the description of the embodiments of the present application, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0022] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0023] In the embodiments of the present application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0024] The embodiments of the present application provide an infrared movement test package and a ceramic substrate based on focal plane infrared movement test, which are used to solve the technical problem that the existing infrared movement package is damaged due to the pressure of the metal Dewar caused by low-temperature shrinkage.

[0025] Figure 1 This is a schematic structural diagram of the front side of a ceramic substrate based on focal plane infrared movement testing as described in an embodiment of the present application.

[0026] like Figure 1 As shown, an embodiment of the present application provides a ceramic substrate based on focal plane infrared movement testing, including a substrate 10, on which are opened several connection holes 11 for connecting to a metal Dewar, and a first soldering pad 12 is arranged on the periphery of each connection hole 11 located on the front side of the substrate 10, and a patch area 13 and a bonding area 14 are arranged on the front side of the substrate 10, the patch area 13 is arranged at the center of the front side of the substrate 10, and the bonding area 14 is arranged on the left and right sides of the patch area 13, and the bonding area 14 is arranged on the bonding area 14 for connecting to a chip to be tested, each second soldering pad 141 is connected to a first soldering pad 12 through a conductive material, and the number of second soldering pads 141 is less than the number of first soldering pads 12.

[0027] It should be noted that the conductive material can be a conductive layer, conductive traces, etc. made of W, Ti, Au. In the present embodiment, the substrate 10 is made of 99.6% white alumina ceramics, so that the substrate 10 is not easy to deform. Therefore, the substrate 10 generates less stress on the chip to be tested at low temperatures and will not damage the chip to be tested. The substrate 10 can be selected to be circular in shape. In other embodiments, the substrate 10 can also be selected in different shapes according to needs. Among them, the thickness of the substrate 10 is preferably selected to be 1 mm. The ceramic substrate based on the focal plane infrared movement test is made of 99.6% white alumina ceramics and has good thermal conductivity, which can make the chip to be tested connected to the substrate 10 work better.

[0028] In the embodiment of the present application, the connection holes 11 are arranged around the periphery of the substrate 10. If the substrate 10 is circular, at least 50 connection holes 11 are opened on the substrate 10, and the aperture of each connection hole 11 can be selected as 1.5 mm. A circular ring is formed on the front surface of the substrate 11 around the circular periphery of the connection holes 11, and a layer of conductive material is plated on the circular ring to form a first pad 12.

[0029] It should be noted that the connection hole 11 is opened corresponding to the pin of the metal Dewar, and the pin of the metal Dewar extends from the connection hole 11 on the back side of the substrate 10 and is welded to the first pad 12, so that the metal Dewar is fixedly connected to the substrate 10, which greatly shortens the welding time of the substrate 10 and the metal Dewar. In this embodiment, the connection hole 11 opened on the substrate 10 can be set according to the position of the corresponding pin of the metal Dewar, so that the ceramic substrate based on the focal plane infrared movement test greatly shortens the welding time of the substrate 10 and the metal Dewar.

[0030] In the embodiment of the present application, the patch area 13 is arranged at the front center position of the substrate 10, the bonding area 14 is arranged on the left and right sides of the patch area 13, and the pins of the chip to be tested are connected to the second pads 141 of the bonding area 14, so as to facilitate the connection between the pins of the chip to be tested and the substrate 10.

[0031] It should be noted that the position layout of the second pad 141 and the bonding area 14 is set according to the pin position of the chip to be tested, and the second pad 141 is connected to the corresponding first pad 12 through a gold-plated conductive material. In this embodiment, the resistance between each second pad 141 and the corresponding first pad 12 is required to be less than 1Ω.

[0032] The present application provides a ceramic substrate based on focal plane infrared movement testing, including a substrate, a plurality of connection holes for connecting with a metal dewar are opened on the substrate, a first pad is arranged around each connection hole on the front of the substrate, a patch area and a bonding area are arranged on the front of the substrate, the patch area is arranged at the center of the front of the substrate, the bonding area is arranged on the left and right sides of the patch area, and a plurality of second pads for connecting with a chip to be tested are arranged on the bonding area, each second pad is connected to a first pad through a conductive material, and the number of second pads is less than the number of first pads. The ceramic substrate based on focal plane infrared movement testing is connected to the metal dewar through the connection holes of the substrate, the chip to be tested is placed above the patch area, and the second pad of the bonding area is used to weld the chip to be tested so that the substrate is connected to the chip to be tested, so that the chip to be tested is interconnected with the metal dewar, and the metal dewar and the chip to be tested are separated by the substrate to prevent the chip to be tested from being damaged by the pressure of the metal dewar, thereby solving the technical problem that the package of the existing infrared movement is damaged by the pressure of the metal dewar due to low temperature shrinkage.

[0033] like Figure 1As shown, in one embodiment of the present application, at least two third pads 15 for mounting the temperature measuring device are provided on the front side of the substrate 10. A bonding debugging area 16 is provided on the front side of the substrate 10, and the bonding debugging area 16 is provided on the upper and lower sides of the mounting area 13, and each third pad 15 is provided between the mounting area 13 and the bonding debugging area 16.

[0034] It should be noted that a third pad 15 for mounting a temperature measuring device (such as a temperature measuring diode) is designed near the patch area 13, and the temperature measuring device is used to monitor the temperature of the substrate 10. The blank area of ​​the substrate 10 is plated with gold as a bonding debugging area 16.

[0035] like Figure 1 As shown, in one embodiment of the present application, a plurality of gold-plated areas 131 arranged in a matrix are provided on the patch area 13 , and a metal film layer is provided on each gold-plated area 131 , and the sheet resistance of the metal film layer is less than 15 mΩ.

[0036] It should be noted that a patch area 13 is provided at the center of the substrate 10, and the patch area 13 is composed of 16 4*4 gold-plated areas 131 separated from each other and not connected to each other. The ceramic substrate based on the focal plane infrared movement test uses the separated gold-plated areas 131 to form the patch area 13, which is more conducive to the removal of the chip to be tested after the test than a whole gold-plated area, and greatly shortens the time for taking the chip.

[0037] Figure 2 This is a schematic structural diagram of the back side of a ceramic substrate based on focal plane infrared movement testing as described in an embodiment of the present application.

[0038] like Figure 2 As shown, in one embodiment of the present application, at least two mounting holes 17 are provided on the substrate 10. A back gold layer 18 is provided on the reverse side of the substrate 10.

[0039] It should be noted that the mounting hole 17 is for facilitating the installation between the substrate 10 and other components, and the diameter of the mounting hole 17 can be selected to be 1.6 mm. The shape of the back gold layer 18 can be selected to be the same as the shape of the substrate 10, but the size of the back gold layer 18 is smaller than the size of the substrate 10. The ceramic substrate based on the focal plane infrared movement test can block the infrared light radiated from the back through the gold-plated back gold layer 18, avoid the interference of external light on the test of the chip to be tested, and improve the test accuracy of the chip to be tested.

[0040] Embodiment 2:

[0041] An embodiment of the present application provides an infrared movement test package, including a metal dewar, a chip to be tested, and the above-mentioned ceramic substrate based on the focal plane infrared movement test. The pins of the metal dewar pass through the connecting holes from the back side of the ceramic substrate and are welded to the first pads. The chip to be tested is attached to the patch area of ​​the ceramic substrate and the pins of the chip to be tested are welded to the second pads corresponding to the ceramic substrate. The focal plane photosensitive area of ​​the chip to be tested is located at the exact center of the ceramic substrate, so that the chip to be tested is connected to the metal dewar through the ceramic substrate.

[0042] It should be noted that the content of the ceramic substrate based on the focal plane infrared movement test of Example 2 has been described in Example 1, and this example will not repeat the content of the ceramic substrate based on the focal plane infrared movement test. In this embodiment, the ceramic substrate based on the focal plane infrared movement test is applied to the infrared movement test package. When the chip to be tested is attached to the patch area 13 designed on the ceramic substrate, the focal plane photosensitive area of ​​the chip to be tested is exactly in the center of the ceramic substrate, so that the test value of the uniformity of the chip to be tested is closer to the actual value. In this embodiment, the packaging principle of the infrared movement test package is: the ceramic substrate is installed corresponding to the metal Dewar pin, first fixed through the mounting hole 17, and then the metal Dewar pin and the first pad 12 of the ceramic substrate are soldered with solder. The temperature measuring diode is attached to the position of the third pad 15, the temperature measuring diode and the substrate 10 are connected by the bonding machine lead, and then the chip to be tested is attached to the patch area 13, and the chip to be tested is interconnected with the second pad 141 of the bonding area 14. After the bonding is completed, the metal dewar is assembled and vacuumed and filled with liquid nitrogen to complete the test package of the chip to be tested. Among them, the low expansion coefficient of the ceramic substrate can make the stress of the chip to be tested very small at low temperature, and the good thermal conductivity makes the temperature of the chip to be tested closer to the optimal working temperature. The patch area 13 composed of the gold-plated area 131 is separated to make it easier to take the chip after the test is completed to reduce the damage to the chip to be tested. The first pad 12 saves a lot of time compared to the pads interconnected by metal wires. The patch area 13 determines the patch position of the chip to be tested, ensuring that the photosensitive area of ​​the chip to be tested is in the center position so that the test result is closer to the truth. The setting of the bonding debugging area 16 can ensure that the bonding parameters are feasible.

[0043] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0044] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0045] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, and may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0046] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0047] As described above, the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A ceramic substrate based on focal plane infrared core testing, characterized in that: It includes a substrate, which is provided with a plurality of connection holes for connecting to a metal Dewar, a first pad is arranged on the periphery of each connection hole located on the front side of the substrate, a patch area and a bonding area are arranged on the front side of the substrate, the patch area is arranged at the center of the front side of the substrate, the bonding area is arranged on the left and right sides of the patch area, and a plurality of second pads for connecting to a chip to be tested are arranged on the bonding area, each of the second pads is connected to a first pad through a conductive material, and the number of the second pads is less than the number of the first pads.

2. The ceramic substrate based on focal plane infrared core testing according to claim 1, characterized in that: At least two third pads for mounting temperature measuring devices are arranged on the front side of the substrate.

3. The ceramic substrate based on focal plane infrared core testing according to claim 2, characterized in that: A bonding debugging area is arranged on the front side of the substrate, and the bonding debugging area is arranged on the upper and lower sides of the patch area, and each of the third pads is arranged between the patch area and the bonding debugging area.

4. The ceramic substrate based on focal plane infrared core testing according to claim 1, characterized in that: The patch area is provided with a plurality of gold-plated areas arranged in a matrix, each of the gold-plated areas is provided with a metal film layer, and the sheet resistance of the metal film layer is less than 15 mΩ.

5. The ceramic substrate based on focal plane infrared core testing according to claim 1, characterized in that: The thickness of the substrate is 1 mm.

6. The ceramic substrate based on focal plane infrared core testing according to claim 1, characterized in that: The resistance between each of the second pads and the corresponding first pad is less than 1Ω.

7. The ceramic substrate based on focal plane infrared core testing according to claim 1, characterized in that: At least two mounting holes are formed on the base plate.

8. The ceramic substrate based on focal plane infrared core testing according to claim 1, characterized in that: A back gold layer is arranged on the reverse side of the substrate.

9. An infrared movement test package, characterized in that: It comprises a metal Dewar, a chip to be tested and a ceramic substrate based on focal plane infrared movement testing as described in any one of claims 1 to 8, wherein the pins of the metal Dewar pass through the connecting holes from the reverse side of the ceramic substrate and are welded to the first pads, the chip to be tested is attached to the patch area of ​​the ceramic substrate and the pins of the chip to be tested are welded to the second pads corresponding to the ceramic substrate, the focal plane photosensitive area of ​​the chip to be tested is located exactly at the center of the ceramic substrate, and the chip to be tested is connected to the metal Dewar through the ceramic substrate.

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