Temperature control device of semiconductor cleaning equipment

Abstract

The utility model relates to the technical field of temperature control, and discloses a temperature control device of semiconductor cleaning equipment, which comprises a cleaning barrel, the lower surface of the cleaning barrel is fixedly connected with a base, the outer wall of the base is fixedly connected with a water tank, the inside of the water tank is fixedly connected with a heating plate, and the outer wall of the water tank is fixedly connected with a water delivery pipe. A heating ring is fixedly connected to the outer wall of the water conveying pipe, the outer wall of the heating ring is slidably connected to the interior of the cleaning barrel, a conveying pipe is fixedly connected to the interior of the cleaning barrel, a one-way valve is arranged on the outer wall of the conveying pipe, and a flow dividing ring is fixedly connected to one end of the conveying pipe. According to the temperature control device, the interior of the cleaning barrel is heated by the heating ring through the water tank, meanwhile, cleaning liquid can be extracted from the bottom of the cleaning barrel through the one-way valve and sprayed above the cleaning barrel through the spray head, the problem that most of existing temperature control devices cannot regulate and control the internal temperature is solved, and normal operation of the cleaning process is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of temperature control, in particular to a temperature control device for semiconductor cleaning equipment. Background Art

[0002] Semiconductor refers to a material whose conductivity is between that of a conductor and an insulator at room temperature. Semiconductors are widely used in radios, televisions, and temperature measurement. For example, diodes are devices made of semiconductors. Whether from the perspective of science and technology or economic development, semiconductors are of great importance. At present, in the semiconductor cleaning process, there are strict requirements on the temperature of semiconductor cleaning fluid. Too high or too low a temperature of the cleaning fluid will have a serious impact on the cleaning effect and the semiconductor itself. When the temperature of the cleaning fluid is too high, it may damage the semiconductor in the cleaning fluid. When the temperature is too low, the cleaning effect of the cleaning fluid on the semiconductor may not be ideal. Different semiconductors need to be cleaned at different temperatures to achieve the best effect.

[0003] Most of the existing temperature control devices of semiconductor cleaning equipment monitor the temperature in the cleaning barrel through a temperature monitoring device, and adjust the temperature in the barrel through human intervention, which not only ensures the smooth progress of the cleaning process, but also speeds up the cleaning rate.

[0004] However, the existing temperature control devices of semiconductor cleaning equipment cannot directly control the temperature through their own facilities. The human intervention process is complicated, time-consuming and labor-intensive. At the same time, humans cannot monitor the inside of the cleaning barrel in real time, which can easily lead to temperature out of control and unsatisfactory cleaning effects. Utility Model Content

[0005] The purpose of the utility model is to solve the shortcomings of the prior art and to propose a temperature control device for semiconductor cleaning equipment, aiming to improve the problem that most of the existing temperature control devices can only monitor the temperature but cannot regulate the internal temperature.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a temperature control device for semiconductor cleaning equipment, comprising a cleaning bucket, a base fixedly connected to the lower surface of the cleaning bucket, a water tank fixedly connected to the outer wall of the base, a heating plate fixedly connected to the inside of the water tank, a water pipe fixedly connected to the outer wall of the water tank, a heating ring fixedly connected to the outer wall of the water pipe, a heating ring slidably connected to the inside of the cleaning bucket, a transmission pipe fixedly connected to the inside of the cleaning bucket, a one-way valve provided on the outer wall of the transmission pipe, a diverter ring fixedly connected to one end of the transmission pipe, a nozzle fixedly connected to the outer wall of the diverter ring, and a fixing component provided on the outer wall of the cleaning bucket.

[0007] Furthermore, the fixing assembly comprises a fixing frame, an outer wall of the fixing frame is fixedly connected to an outer wall of the cleaning barrel, and a fixing ring is fixedly connected to the outer wall of the fixing frame.

[0008] Furthermore, a motor is fixedly connected to the interior of the fixing ring, and a rotating shaft is fixedly connected to the output end of the motor.

[0009] Furthermore, a stirring blade is fixedly connected to the outer wall of the rotating shaft, and a connecting plate is fixedly connected to the outer wall of the rotating shaft.

[0010] Furthermore, a connecting rod is fixedly connected to the lower surface of the connecting plate, and a fixing plate is fixedly connected to the outer wall of the connecting rod.

[0011] Furthermore, a connecting shaft is fixedly connected to the interior of the fixing plate, and a stirring blade is fixedly connected to the outer wall of the connecting shaft.

[0012] Furthermore, a cleaning roller is fixedly connected to the outer wall of the rotating shaft, and the outer wall of the cleaning roller is rotatably connected to the inside of the cleaning barrel.

[0013] Furthermore, the outer wall of the stirring blade is arranged inside the cleaning drum.

[0014] The utility model has the following beneficial effects:

[0015] 1. In the utility model, firstly, the interior of the cleaning barrel is heated by the heating ring through the water tank, and at the same time, the cleaning liquid can be drawn from the bottom of the cleaning barrel through the one-way valve and sprayed on the top of the cleaning barrel by the nozzle, so as to achieve the effect of regulating the temperature in the barrel, solving the problem that most of the existing temperature control devices can only monitor the temperature but cannot regulate the internal temperature, improving the practicability of the device and ensuring the normal progress of the cleaning process.

[0016] 2. In the utility model, the motor drives the rotating shaft to rotate, so that the stirring blades can stir the cleaning liquid. At the same time, the connecting plate drives the stirring blades to rotate, thereby achieving the effect of stirring and accelerating the cleaning of the semiconductor and preventing the cleaning liquid from precipitating. This solves the problem that most of the existing temperature control devices cannot stir the internal cleaning liquid, which is prone to precipitation, improves the efficiency of the device, and speeds up the cleaning rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a three-dimensional structural schematic diagram of a temperature control device for semiconductor cleaning equipment proposed by the utility model;

[0018] Figure 2 A cross-sectional view of the internal structure of a cleaning barrel of a temperature control device for semiconductor cleaning equipment proposed by the utility model;

[0019] Figure 3 This is a schematic diagram of the structure of a heating ring portion of a temperature control device for semiconductor cleaning equipment proposed by the utility model;

[0020] Figure 4 The utility model is a schematic diagram of the structure of the rotating shaft part of the temperature control device of the semiconductor cleaning equipment.

[0021] Legend:

[0022] 1. Cleaning bucket; 2. Base; 3. Water tank; 4. Heating plate; 5. Water pipe; 6. Heating ring; 7. Transmission pipe; 8. One-way valve; 9. Diverter ring; 10. Spray nozzle; 11. Fixed frame; 12. Fixed ring; 13. Motor; 14. Rotating shaft; 15. Stirring blade; 16. Connecting rod; 17. Fixed plate; 18. Connecting shaft; 19. Stirring blade; 20. Cleaning drum; 21. Connecting plate. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] Reference Figure 1-Figure 3 , the utility model provides an embodiment: a temperature control device for semiconductor cleaning equipment, including a cleaning barrel 1, the lower surface of the cleaning barrel 1 is fixedly connected with a base 2, the outer wall of the base 2 is fixedly connected with a water tank 3, the interior of the water tank 3 is fixedly connected with a heating plate 4, the outer wall of the water tank 3 is fixedly connected with a water pipe 5, the outer wall of the water pipe 5 is fixedly connected with a heating ring 6, the outer wall of the heating ring 6 is slidably connected to the interior of the cleaning barrel 1, the interior of the cleaning barrel 1 is fixedly connected with a transmission pipe 7, the outer wall of the transmission pipe 7 is provided with a one-way valve 8, one end of the transmission pipe 7 is fixedly connected with a diverter ring 9, the outer wall of the diverter ring 9 is fixedly connected with a nozzle 10, and the outer wall of the cleaning barrel 1 is provided with a fixed component;

[0025] Specifically, when it is necessary to regulate the temperature inside the cleaning bucket 1, first, the heating plate 4 heats the water in the water tank 3. The heated water is introduced into the heating ring 6 by the water pipe 5, so that the heating ring 6 can heat the inside of the cleaning bucket 1, thereby increasing the temperature inside the cleaning bucket 1. At the same time, through the one-way valve 8, the transmission pipe 7 extracts the cleaning liquid from the bottom of the cleaning bucket 1, and then transports it to the nozzle 10 through the diverter ring 9. The nozzle 10 sprays the cleaning liquid from the top of the cleaning bucket 1, which can effectively reduce the temperature inside the cleaning bucket 1. This allows the temperature inside the cleaning bucket 1 to be accurately regulated, ensuring the normal progress of the cleaning process. At the same time, the temperature inside the cleaning bucket 1 can be adjusted as needed to ensure that the cleaning operation is carried out under suitable environmental conditions, improve the cleaning efficiency and quality, and ensure the smooth progress of the cleaning process.

[0026] Reference Figure 1 , Figure 2 and Figure 4 The fixing assembly includes a fixing frame 11, the outer wall of the fixing frame 11 is fixedly connected to the outer wall of the washing barrel 1, and the outer wall of the fixing frame 11 is fixedly connected to a fixing ring 12; the interior of the fixing ring 12 is fixedly connected to a motor 13, and the output end of the motor 13 is fixedly connected to a rotating shaft 14; the outer wall of the rotating shaft 14 is fixedly connected to a stirring blade 15, and the outer wall of the rotating shaft 14 is fixedly connected to a connecting plate 21; the lower surface of the connecting plate 21 is fixedly connected to a connecting rod 16, and the outer wall of the connecting rod 16 is fixedly connected to a fixing plate 17; the interior of the fixing plate 17 is fixedly connected to a connecting shaft 18, and the outer wall of the connecting shaft 18 is fixedly connected to a stirring blade 19; the outer wall of the rotating shaft 14 is fixedly connected to a washing drum 20, and the outer wall of the washing drum 20 is rotatably connected to the interior of the washing barrel 1; the outer wall of the stirring blade 15 is arranged inside the washing drum 20;

[0027] Specifically, when it is necessary to accelerate the cleaning efficiency inside the cleaning barrel 1, first, the output end of the motor 13 fixed by the fixed ring 12 drives the rotating shaft 14 to rotate. The rotating shaft 14 drives the stirring blade 15 and the connecting plate 21 to rotate respectively. The stirring blade 15 performs preliminary stirring in the cleaning liquid inside the cleaning barrel 1, suspends dirt and impurities into the liquid, and plays a pretreatment role. At the same time, the connecting plate 21 is driven by the connecting rod 16 and the fixed plate 17 to rotate the connecting shaft 18 and the stirring blade 19. This allows the cleaning liquid in the cleaning barrel 1 to be fully stirred and mixed, ensuring a more thorough cleaning effect. This not only accelerates the semiconductor cleaning process, but also effectively prevents the formation of precipitates in the cleaning liquid and maintains the stability of the cleaning liquid. At the same time, the cleaning liquid in the cleaning barrel 1 can be fully stirred and mixed, ensuring the efficiency and thoroughness of the cleaning process, accelerating the cleaning rate, and improving the cleaning efficiency.

[0028] Working principle: when the temperature inside the cleaning bucket 1 needs to be regulated, the water inside the water tank 3 is heated by the heating plate 4, and at the same time, the water is introduced into the heating ring 6 by the water pipe 5, so that the heating ring 6 can heat the inside of the cleaning bucket 1, and then the cleaning liquid is extracted from the bottom of the cleaning bucket 1 by the transmission pipe 7 through the one-way valve 8, and then transported to the nozzle 10 by the diverter ring 9, so that the nozzle 10 can spray out from the top of the cleaning bucket 1, thereby reducing the temperature inside the cleaning bucket 1, thereby achieving the effect of regulating the temperature inside the bucket, improving the practicability of the device, and ensuring the normal progress of the cleaning process. When it is necessary to accelerate the cleaning efficiency inside the cleaning barrel 1, the output end of the motor 13 fixed by the fixing ring 12 drives the rotating shaft 14, so that the rotating shaft 14 can respectively drive the stirring blades 15 and the connecting plate 21 to rotate, wherein the stirring blades 15 can preliminarily stir the cleaning liquid inside the cleaning barrel 1, and at the same time, the connecting plate 21 can drive the connecting shaft 18 and the stirring blades 19 to rotate by the connecting rod 16 and the fixing plate 17, thereby further stirring the cleaning liquid inside the cleaning barrel 1, thereby achieving the effect of stirring and accelerating the cleaning of the semiconductor and preventing the cleaning liquid from precipitating, thereby improving the efficiency of the device and accelerating the cleaning rate.

[0029] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A temperature control device for semiconductor cleaning equipment, comprising a cleaning barrel (1), characterized in that: The lower surface of the cleaning bucket (1) is fixedly connected to a base (2), the outer wall of the base (2) is fixedly connected to a water tank (3), the interior of the water tank (3) is fixedly connected to a heating plate (4), the outer wall of the water tank (3) is fixedly connected to a water pipe (5), the outer wall of the water pipe (5) is fixedly connected to a heating ring (6), the outer wall of the heating ring (6) is slidably connected to the interior of the cleaning bucket (1), the interior of the cleaning bucket (1) is fixedly connected to a transmission pipe (7), the outer wall of the transmission pipe (7) is provided with a one-way valve (8), one end of the transmission pipe (7) is fixedly connected to a diverter ring (9), the outer wall of the diverter ring (9) is fixedly connected to a nozzle (10), and the outer wall of the cleaning bucket (1) is provided with a fixed component.

2. The temperature control device of semiconductor cleaning equipment according to claim 1, characterized in that: The fixing assembly comprises a fixing frame (11), the outer wall of the fixing frame (11) is fixedly connected to the outer wall of the cleaning bucket (1), and the outer wall of the fixing frame (11) is fixedly connected to a fixing ring (12).

3. The temperature control device of semiconductor cleaning equipment according to claim 2, characterized in that: A motor (13) is fixedly connected inside the fixing ring (12), and a rotating shaft (14) is fixedly connected to the output end of the motor (13).

4. The temperature control device of semiconductor cleaning equipment according to claim 3, characterized in that: The outer wall of the rotating shaft (14) is fixedly connected with a stirring blade (15), and the outer wall of the rotating shaft (14) is fixedly connected with a connecting plate (21).

5. The temperature control device for semiconductor cleaning equipment according to claim 4, characterized in that: The lower surface of the connecting plate (21) is fixedly connected to a connecting rod (16), and the outer wall of the connecting rod (16) is fixedly connected to a fixing plate (17).

6. A temperature control device for semiconductor cleaning equipment according to claim 5, characterized in that: A connecting shaft (18) is fixedly connected to the interior of the fixing plate (17), and a stirring blade (19) is fixedly connected to the outer wall of the connecting shaft (18).

7. The temperature control device for semiconductor cleaning equipment according to claim 4, characterized in that: The outer wall of the rotating shaft (14) is fixedly connected to a cleaning roller (20), and the outer wall of the cleaning roller (20) is rotatably connected to the interior of the cleaning bucket (1).

8. The temperature control device for semiconductor cleaning equipment according to claim 7, characterized in that: The outer wall of the stirring blade (15) is arranged inside the cleaning drum (20).

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