Blister packaging structure for protecting FPC (Flexible Printed Circuit) element
By adjusting the depth of the avoidance groove to reach the bottom of the packaging blister tray and being larger than the thickness of the display screen plus backlight, the frictional damage caused by the contact between the FPC component area and the display module in the prior art is solved, and a better FPC component protection effect is achieved.
Patent Information
- Application Number
- CN202421297171.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-06
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2034-06-06
AI Technical Summary
In the existing blister packaging structure, the depth of the avoidance groove is insufficient, resulting in the FPC component area contacting the display module position, which is prone to frictional damage.
By adjusting the depth of the avoidance slot to reach the bottom of the packaging blister tray and greater than the thickness of the display plus backlight, ensuring that the FPC sags naturally into the placement slot and avoiding contact with the bottom side of the cover plate.
It effectively avoids contact between the FPC component area and the display module position, prevents friction damage, and improves the protection effect of the FPC component.
Smart Images

Figure CN222630053U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of blister packaging, in particular to a blister packaging structure for protecting FPC components. Background Art
[0002] The display module needs to be packaged after production is completed and shipped. The display module is placed in a corresponding blister package for packaging and shipping. The display module is bound with an FPC, and the end of the FPC away from the display screen is located outside the display module. The FPC is provided with a component area, which is arranged upward on the upper surface of the FPC.
[0003] When the display module is placed in a blister package, an avoidance groove is set at the position of the blister package relative to the FPC. However, due to the insufficient depth of the avoidance groove, the FPC cannot fall completely, so that the component area on the FPC will contact the position of the relative display module, and thus it is easily damaged by friction. Utility Model Content
[0004] The utility model aims to overcome the shortcomings of the prior art and provide a blister packaging structure for protecting FPC components.
[0005] The purpose of this utility model is achieved through the following technical solutions:
[0006] A blister packaging structure for protecting FPC components, comprising: a packaging blister tray and a display module placed on the packaging blister tray, the display module is bound to an FPC, an end of the FPC away from the end bound to the display module is located outside the display module, a component area is provided on the FPC, an avoidance groove is provided on the packaging blister tray relative to the FPC, the avoidance groove is provided along the thickness direction of the packaging blister tray, and the FPC naturally falls into the avoidance groove.
[0007] In one embodiment, the display module includes a cover plate, a display screen and a backlight arranged in sequence, the size of the cover plate is larger than the size of the display screen and the backlight, the FPC is bound to the display screen, the component area is located on the side of the FPC facing the cover plate, and the component area is correspondingly arranged on the bottom side of the cover plate.
[0008] In one embodiment, a placement platform is provided on the packaging blister tray, and the placement platform is formed by being recessed downward along the upper surface of the packaging blister tray, and the backlight side of the display module is placed downward on the placement platform.
[0009] In one embodiment, a placement groove is provided on the placement platform, the display module is correspondingly placed above the placement groove, and the components on the back side of the backlight are accommodated in the placement groove.
[0010] In one embodiment, the avoidance groove is opened along the outer side of the FPC, and the depth of the avoidance groove is greater than the depth of the placement groove.
[0011] In one embodiment, the depth of the avoidance groove reaches the bottom of the packaging blister tray, and the depth of the avoidance groove is greater than the thickness of the display screen plus the backlight.
[0012] In one embodiment, a plurality of display modules are placed on the packaging blister tray, the packaging blister tray is provided with the placement platform at positions relative to the plurality of display modules, and the packaging blister tray is provided with avoidance grooves at positions relative to the FPC of the plurality of display modules.
[0013] In one embodiment, one placement platform and one avoidance groove form a group, and multiple groups of placement platforms and avoidance grooves are evenly distributed along the width direction of the packaging blister tray.
[0014] In one embodiment, a positioning block for fixing the outer shape of the cover is disposed on the periphery of the placement platform, and the positioning block is relatively disposed at the positions of the two long side segments of the placement platform, and the positioning block between two adjacent placement platforms is used to separate the two placement platforms.
[0015] In one embodiment, a protective film is attached to the upper surface of the cover plate, a protective film tearing handle extends outward from one side of the protective film, and a receiving groove is provided in the packaging blister tray relative to the protective film tearing handle, and the receiving groove is connected to the placement platform.
[0016] Compared with the prior art, the utility model has at least the following advantages:
[0017] The utility model discloses a blister packaging structure for protecting FPC components. By adjusting the depth of the avoidance groove, the depth of the avoidance groove reaches the bottom of the packaging blister tray. The depth of the avoidance groove is greater than the thickness of the display screen plus the backlight. When the display module is placed on the placement platform, the FPC naturally droops into the placement groove, and the component area on the FPC does not contact the bottom side of the cover plate, thereby avoiding damage caused by friction. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.
[0019] Figure 1 A schematic diagram of the structure of a blister tray in a blister packaging structure for protecting FPC components provided by the utility model;
[0020] Figure 2 A schematic side cross-sectional view of a blister packaging structure for protecting FPC components provided by the utility model;
[0021] Figure 3 for Figure 2 A magnified schematic diagram of part A;
[0022] Figure 4 The utility model is a schematic diagram of a top view of a blister packaging structure for protecting FPC components.
[0023] Description of the drawings: 10. Packaging blister tray; 11. Placement platform; 12. Placement slot; 13. Avoidance slot; 14. Positioning block; 15. Accommodation slot; 20. Display module; 21. Cover plate; 211. Protective film; 2111. Protective film tearing handle; 22. Display screen; 23. Backlight; 30. FPC; 31. Component area. DETAILED DESCRIPTION
[0024] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings.
[0025] A blister packaging structure for protecting FPC components, referring to Figure 1 , including a packaging blister tray 10 and a display module 20 placed in the packaging blister tray 10, the display module 20 is bound with an FPC 30, and one end of the FPC 30 away from the binding to the display module 20 is located outside the display module 20, and the display module 20 and the FPC 30 are respectively fixed on the packaging blister tray 10.
[0026] Reference Figure 2 and Figure 3 The display module 20 includes a cover plate 21, a display screen 22 and a backlight 23 which are arranged in sequence. The size of the cover plate 21 is larger than the size of the display screen 22 and the backlight 23, and the periphery of the cover plate 21 is located outside the display screen 22. The FPC 30 is bound to the display screen 22, and a component area 31 is arranged on the FPC 30. The component area 31 is located on the side of the FPC 30 facing the cover plate 21, and the component area 31 is correspondingly arranged on the bottom side of the cover plate 21.
[0027] Reference Figure 1 and Figure 2 A placement platform 11 is provided on the packaging blister tray 10. The placement platform 11 is formed by being recessed downward along the upper surface of the packaging blister tray 10. The placement platform 11 is used to place the display module 20. The backlight 23 of the display module 20 is placed on the placement platform 11 with the side facing downward. A placement groove 12 is provided on the placement platform 11. The display module 20 is correspondingly placed above the placement groove 12. The components on the back of the backlight 23 can be accommodated in the placement groove 12.
[0028] Reference Figure 2 and Figure 3 The packaging blister tray 10 is provided with an avoidance groove 13 for placing the FPC 30. The avoidance groove 13 is adjacent to the placement groove 12, and the depth of the avoidance groove 13 is greater than the depth of the placement groove 12. After the display module 20 is placed on the packaging blister tray 10, the FPC 30 is correspondingly placed in the avoidance groove 13, and the avoidance groove 13 is opened along the shape of the FPC 30. Since the FPC 30 is bound to the display screen 22, and the display screen 22 and the backlight 23 have a certain thickness, the FPC 30 is a flexible circuit board, and the FPC 30 will sag and be placed in the avoidance groove 13.
[0029] Reference Figure 2 and Figure 3 When the depth of the avoidance groove 13 is not enough, that is, the depth of the avoidance groove 13 is less than the thickness of the display screen 22 and the backlight 23, the component area 31 on the FPC 30 will contact the bottom side of the cover plate 21, thereby causing friction. Therefore, the avoidance groove 13 is opened along the thickness direction of the packaging blister tray 10, and the depth of the avoidance groove 13 reaches the bottom of the packaging blister tray 10. The depth of the avoidance groove 13 is greater than the thickness of the display screen 22 plus the backlight 23, so that when the display module 20 is placed on the placement platform 11, the FPC 30 naturally droops into the placement groove 12, and the component area 31 on the FPC 30 will not contact the bottom side of the cover plate 21.
[0030] Reference Figure 4 The placement platform 11 and the avoidance groove 13 on the packaging blister tray 10 are located on the same straight line. Multiple display modules 20 are placed on the packaging blister tray 10. The placement platforms 11 are set at the positions of the packaging blister tray 10 relative to the multiple display modules 20. The packaging blister tray 10 is provided with avoidance grooves 13 at the FPC 30 positions of the multiple display modules 20. One placement platform 11 and one avoidance groove 13 form a group, and multiple groups of placement platforms 11 and avoidance grooves 13 are evenly distributed along the width direction of the packaging blister platform.
[0031] Further, refer to Figure 4 The outer periphery of the placement platform 11 is provided with positioning blocks 14 for fixing the outer shape of the cover plate 21. The positioning blocks 14 are relatively arranged at the positions of the two long side sections of the placement platform 11. The positioning blocks 14 between two adjacent placement platforms 11 play the role of separating the two placement platforms 11. The outer shape of the cover plate 21 is positioned by the positioning blocks 14, so as to fix the display module 20 on the placement platform 11.
[0032] Further, refer to Figure 4A protective film 211 is attached to the upper surface of the cover plate 21, and a protective film tearing handle 2111 extends outward from one side of the protective film 211. A receiving groove 15 is provided in the packaging blister tray 10 relative to the position of the protective film tearing handle 2111. The receiving groove 15 is connected to the placement platform 11. When the display module 20 is placed on the placement platform 11, the protective film tearing handle 2111 is correspondingly placed in the receiving groove 15.
[0033] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.
Claims
1. A blister packaging structure for protecting FPC components, characterized in that: include: A packaging blister tray (10) and a display module (20) placed on the packaging blister tray (10), wherein an FPC (30) is bound to the display module (20), and an end of the FPC (30) away from the end bound to the display module (20) is located outside the display module (20), and a component area (31) is provided on the FPC (30), and an avoidance groove (13) is provided at a position of the packaging blister tray (10) relative to the FPC (30), and the avoidance groove (13) is provided along the thickness direction of the packaging blister tray (10), and the FPC (30) naturally falls into the avoidance groove (13).
2. A blister packaging structure for protecting FPC components according to claim 1, characterized in that: The display module (20) comprises a cover plate (21), a display screen (22) and a backlight (23) which are arranged in sequence; the size of the cover plate (21) is larger than the size of the display screen (22) and the backlight (23); the FPC (30) is bound to the display screen (22); the component area (31) is located on a side of the FPC (30) facing the cover plate (21); and the component area (31) is correspondingly arranged on the bottom side of the cover plate (21).
3. A blister packaging structure for protecting FPC components according to claim 2, characterized in that: A placement platform (11) is provided on the packaging blister tray (10), and the placement platform (11) is formed by being recessed downward along the upper surface of the packaging blister tray (10), and the backlight (23) side of the display module (20) is placed on the placement platform (11) with the side facing downward.
4. A blister packaging structure for protecting FPC components according to claim 3, characterized in that: The placement platform (11) is provided with a placement groove (12), the display module (20) is correspondingly placed above the placement groove (12), and the components on the back side of the backlight (23) are accommodated in the placement groove (12).
5. A blister packaging structure for protecting FPC components according to claim 4, characterized in that: The avoidance groove (13) is opened along the outer side of the FPC (30), and the depth of the avoidance groove (13) is greater than the depth of the placement groove (12).
6. A blister packaging structure for protecting FPC components according to claim 5, characterized in that: The depth of the avoidance groove (13) reaches the bottom of the packaging blister tray (10), and the depth of the avoidance groove (13) is greater than the thickness of the display screen (22) plus the backlight (23).
7. A blister packaging structure for protecting FPC components according to claim 6, characterized in that: A plurality of display modules (20) are placed on the packaging blister tray (10), the packaging blister tray (10) is provided with the placement platform (11) at positions relative to the plurality of display modules (20), and the packaging blister tray (10) is provided with avoidance grooves (13) at positions relative to the FPCs (30) of the plurality of display modules (20).
8. A blister packaging structure for protecting FPC components according to claim 7, characterized in that: One placement platform (11) and one avoidance groove (13) form a group, and multiple groups of placement platforms (11) and avoidance grooves (13) are evenly distributed along the width direction of the packaging blister tray (10).
9. A blister packaging structure for protecting FPC components according to claim 3, characterized in that: A positioning block (14) for fixing the outer shape of the cover plate (21) is arranged on the periphery of the placement platform (11); the positioning block (14) is relatively arranged at the positions of the two long side sections of the placement platform (11); and the positioning block (14) between two adjacent placement platforms (11) is used to separate the two placement platforms (11).
10. A blister packaging structure for protecting FPC components according to claim 3, characterized in that: A protective film (211) is attached to the upper surface of the cover plate (21), a protective film tearing handle (2111) is extended outwardly from one side of the protective film (211), and a receiving groove (15) is provided on the packaging blister tray (10) at a position relative to the protective film tearing handle (2111), and the receiving groove (15) is communicated with the placement platform (11).