Silicon wafer coating carrier plate

Abstract

The utility model belongs to the technical field of film coating, and particularly relates to a silicon wafer film coating support plate, which comprises at least one silicon wafer bearing area formed by a plurality of bearing strips in a surrounding manner; and the silicon wafer bearing surface of each bearing strip is obliquely arranged so as to form linear contact support with the lower edge of the silicon wafer. When the silicon wafer is coated, the silicon wafer is placed on the bearing surface, and the lower edge of the silicon wafer and the bearing surface form linear contact support, so that the yield of the silicon wafer is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of film coating, and in particular relates to a silicon wafer film coating carrier. Background Art

[0002] With the development of science and technology, solar cells have been widely used. In the manufacturing process of crystalline silicon solar cells, it is usually necessary to coat the surface of silicon wafers in order to passivate the surface of the silicon wafers and reduce light reflection. At present, when coating silicon wafers, the silicon wafers are usually arranged on a carrier, and then the carrier is transported to the magnetron sputtering cathode module, and then the carrier is transported to the coating position by the conveying device in the magnetron sputtering cathode module, and the silicon wafers are coated by magnetron sputtering coating.

[0003] In the related art, when coating a silicon wafer, the bearing surface of a bearing area of ​​a carrier is usually arranged vertically. When the silicon wafer is placed on the carrier, it will form a surface contact with the bearing area, and the coating area will be reduced, thereby affecting the coating effect of the silicon wafer.

[0004] Therefore, we need to solve the technical problem that the contact area between the silicon wafer and the carrier surface is too large during coating. Utility Model Content

[0005] The utility model aims to provide a silicon wafer coating carrier to solve the above technical problems.

[0006] In order to solve the above technical problems, the utility model provides a silicon wafer coating carrier, characterized in that it includes: at least one silicon wafer carrying area, surrounded by a plurality of carrying bars; and the silicon wafer carrying surface of each carrying bar is obliquely arranged to form a linear contact support with the lower edge of the silicon wafer.

[0007] Furthermore, the silicon wafer supporting surface is an inclined plane.

[0008] Furthermore, one side of the supporting bar corresponding to the silicon wafer supporting surface is in a trapezoidal shape, and its inclined surface is the inclined plane.

[0009] Furthermore, the oblique angle of the silicon wafer bearing surface is 10°~80°.

[0010] Furthermore, the silicon wafer bearing surface is a curved surface.

[0011] Furthermore, the arc surface is a concave arc surface.

[0012] Furthermore, the arc surface is an outwardly convex arc surface.

[0013] Furthermore, bearing bumps are arranged on the bearing surface of the silicon wafer.

[0014] Furthermore, the bearing protrusions are distributed linearly.

[0015] Furthermore, a card slot is arranged on the bearing protrusion.

[0016] Compared with the prior art, the embodiments of the utility model specifically have the following effects: when coating a silicon wafer, the silicon wafer is placed on a carrying surface, and the lower edge of the silicon wafer forms a linear contact support with the carrying surface, thereby improving the yield of the silicon wafer.

[0017] Other features and advantages of the present invention will be set forth in the following description, and in part will become apparent from the description, or may be understood by implementing the present invention.

[0018] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 It is a partial diagram of the bearing area of ​​the utility model;

[0021] Figure 2a The load-bearing surface of the utility model is an inclined surface diagram;

[0022] Figure 2b One side of the load-bearing surface of the utility model is a trapezoidal diagram;

[0023] Figure 3a The load-bearing surface of the utility model is an inner concave surface;

[0024] Figure 3b The utility model is a bearing surface that is an outer convex surface.

[0025] In the figure:

[0026] 10. Carrying area, 11. Silicon wafer, 20. Carrying surface, 21. Carrying bumps, 22. Carrying strips. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solution and advantages of the embodiments of the utility model clearer, the technical solution of the utility model will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] In the related art, when coating a silicon wafer, the bearing surface of a bearing area of ​​a carrier is usually arranged vertically. When the silicon wafer is placed on the carrier, it will form a surface contact with the bearing area, and the coating area will be reduced, thereby affecting the coating effect of the silicon wafer.

[0029] like Figure 1 As shown, at least one embodiment provides a silicon wafer 11 coating carrier, comprising: at least one silicon wafer 11 supporting area 10, the supporting area 10 is used to support the silicon wafer 11, the supporting area 10 is surrounded by a plurality of supporting bars 22, the supporting bars 22 are in contact and support with the silicon wafer 11, the supporting surface 20 of each of the supporting bars 22 is obliquely arranged, the contact support between the supporting bars 22 and the silicon wafer 11 is the contact support between the supporting surface 20 and the silicon wafer 11, because the supporting surface 20 is obliquely arranged, the lower edge of the silicon wafer 11 forms a linear contact support with the supporting surface 20.

[0030] like Figure 2a As shown, in order to better compare the effects of different bearing surfaces 20 forming linear contact support with the silicon wafer 11, the angle between the inclined plane and the horizontal plane is set to 10°, and the bearing surface 20 of the silicon wafer 11 is an inclined plane, and the inclined plane forms a linear contact support with the silicon wafer 11.

[0031] like Figure 2b As shown, in order to better compare the effects of linear contact support formed by different supporting surfaces 20 and the silicon wafer 11, the angle between the extended line of the inclined plane and the horizontal plane is set to 45°, and the side of the supporting bar 22 corresponding to the supporting surface 20 of the silicon wafer 11 is trapezoidal in shape, and its inclined surface is the inclined plane.

[0032] The oblique angle of the carrying surface 20 of the silicon wafer 11 is 10° to 80°. The silicon wafer 11 is placed on the carrying surface 20 with the oblique angle of 10° to 80°. At this time, the silicon wafer 11 and the carrying surface 20 form a linear contact support.

[0033] The bearing surface 20 of the silicon wafer 11 is a curved surface, and the silicon wafer 11 and the bearing surface 20 form a linear contact support.

[0034] like Figure 3aAs shown, the arc surface is an inwardly concave arc surface. In order to better compare the effects of different bearing surfaces 20 and the silicon wafer 11 forming linear contact supports, the angle between the two vertices of the inwardly concave arc surface and the horizontal plane is set to be 60°.

[0035] like Figure 3b In order to better compare the effects of different bearing surfaces 20 and the silicon wafer 11 forming linear contact supports, the angle between the two vertices of the convex arc surface and the horizontal plane is set to 80°.

[0036] In order to better fix and support the silicon wafer 11 , a bearing bump 21 is provided on the bearing surface 20 of the silicon wafer 11 .

[0037] The supporting bumps 21 are distributed linearly and can support the silicon wafer 11 horizontally without affecting the coating effect.

[0038] The support protrusions 21 are provided with slots to fix the silicon wafer 11 so that the silicon wafer 11 is always loaded on the support plate during the coating process.

[0039] All devices (parts without specific structure) selected in this application are universal standard parts or parts known to those skilled in the art, and their structures and principles can be known by those skilled in the art through technical manuals or conventional experimental methods. In addition, the software programs involved in this application are all prior art, and this application does not involve any improvement to the software programs.

[0040] In the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0041] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0042] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. The device embodiments described above are merely schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some communication interfaces, and the indirect coupling or communication connection of devices or units can be electrical, mechanical or other forms.

[0043] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0044] In addition, each functional unit in each embodiment of the present utility model may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0045] Based on the above ideal embodiments of the utility model, the relevant staff can make various changes and modifications without departing from the technical concept of the utility model through the above description. The technical scope of the utility model is not limited to the content of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A silicon wafer coating carrier, characterized in that: include: At least one silicon wafer carrying area, surrounded by a plurality of carrying bars; and the silicon wafer bearing surface of each bearing bar is arranged obliquely to form a linear contact support with the lower edge of the silicon wafer; The silicon wafer bearing surface is provided with bearing bumps.

2. The silicon wafer coating carrier according to claim 1, characterized in that: The silicon wafer carrying surface is an inclined plane.

3. The silicon wafer coating carrier as claimed in claim 2, characterized in that: The side of the supporting bar corresponding to the silicon wafer supporting surface is in a trapezoidal shape, and its inclined surface is the inclined plane.

4. The silicon wafer coating carrier according to claim 2 or 3, characterized in that: The oblique angle of the silicon wafer bearing surface is 10° to 80°.

5. The silicon wafer coating carrier according to claim 1, characterized in that: The silicon wafer bearing surface is a curved surface.

6. The silicon wafer coating carrier as claimed in claim 5, characterized in that: The arc surface is a concave arc surface.

7. The silicon wafer coating carrier as claimed in claim 5, characterized in that: The arc surface is an outwardly convex arc surface.

8. The silicon wafer coating carrier as claimed in claim 1, characterized in that: The bearing convex points are distributed linearly.

9. The silicon wafer coating carrier as claimed in claim 1, characterized in that A card slot is arranged on the bearing protrusion.

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