Spraying assembly heating device
By designing a spray assembly heating device for ALD equipment, using mica plates, heating films or metal heating wires for heating, the problem that the spray head temperature cannot meet the demand is solved, the precise control of gas temperature is achieved, and the quality of the deposited film and the accuracy of growth control is improved.
Patent Information
- Application Number
- CN202420592242.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-26
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2034-03-26
AI Technical Summary
The spray head temperature of the ALD equipment cannot meet the needs of the deposition reaction, resulting in gas condensation, causing blockage or high temperature, resulting in film contamination and edge curling, affecting the quality of the deposited film.
A spray assembly heating device including an inner ring and an outer ring heating device is designed, and heated using a mica plate, a heating film or a metal heating wire to ensure that the gas temperature remains within the temperature window period.
It realizes efficient heating of the spray components of ALD equipment, ensures that the gas temperature is within the window period, avoids pollution caused by gas condensation and high temperature and film edges, and improves the quality of the deposited film and the accuracy of growth control.
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Figure CN222631550U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a semiconductor manufacturing technology, in particular to a semiconductor deposition device, specifically a spray component heating device of an ALD device. Background Art
[0002] At present, with the development of integrated circuit semiconductor technology, the production quality and processing capacity of integrated chip transistors have also put forward requirements for smaller feature sizes, more transistors, and more wiring layers. The essence of integrated circuit manufacturing is to use thin film deposition technology to form circuits on cut silicon wafers. As an emerging chemical deposition technology, atomic layer deposition technology (ALD) has great advantages in many aspects such as film quality and film efficiency. ALD equipment provides a spray component to supply reaction gas. The temperature of the gas is crucial to the uniformity of film formation. If the reaction temperature is low, it will not be able to meet the energy required for the deposition reaction. The gas will also condense on the surface of the substrate and the inner surface of the gas pipeline due to condensation, causing blockage of the gas pipeline and contamination of the deposited film. However, if the reaction temperature exceeds the temperature window (such as Figure 1 ), the substances produced by the reaction will react chemically with each other and contaminate the deposited film. High temperature will also cause the deposited film to desorb from the substrate, causing the edge of the deposited film to warp, affecting the quality of the deposited film. Only by controlling the deposition temperature within the temperature window range can ALD deposit high-quality films and effectively control the growth rate of the film. Utility Model Content
[0003] The purpose of the utility model is to design a spray assembly heating device which can accurately control the temperature of the spray head in order to solve the problem that the temperature of the spray head of the ALD equipment cannot meet the demand.
[0004] One of the technical solutions of the utility model is:
[0005] A spray assembly heating device, characterized in that: it includes an outer ring heating device for heating the outer ring of the spray head and an inner ring heating device for heating the inner ring of the spray head, the inner ring heating device includes an inner ring metal upper plate 1 and an inner and outer ring metal lower plate 2, two mica plates 3 are installed between the inner ring metal upper plate 1 and the inner ring metal lower plate 2, a heating film 4 is installed between the two mica plates 3, and the heating film 4 is electrically connected to the control circuit; the outer ring heating device includes an outer ring metal upper plate 5 and an outer ring metal lower plate 6, five mica plates 3 are installed between the outer ring metal upper plate 5 and the outer ring metal lower plate 6, a metal heating wire 7 is installed between two adjacent mica plates 3, and the metal heating wire 7 is electrically connected to the control circuit.
[0006] The inner ring metal upper plate 1, the inner ring metal lower plate 2 and the mica plate 3 therebetween are all annular structures.
[0007] The heating film 4 is a woven structure, and its shape matches the mica board 3 .
[0008] The outer ring metal upper plate 5, the outer ring metal lower plate 6 and the mica plate 3 therebetween are all structures consisting of two semicircular rings forming a full circular ring.
[0009] The metal heating wire 7 is an alloy wire.
[0010] Beneficial effects of the utility model:
[0011] The utility model ensures that the temperature of the gas is maintained within the window period when the gas enters the cavity by heating the spray component of the ALD device at high temperature.
[0012] The utility model has high fitting degree and uniform heating, and can ensure that when the gas enters the heating cavity of the ALD equipment, the temperature is maintained within the window period. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 It is a schematic diagram of the heating temperature window of the utility model.
[0014] Figure 2 It is a structural schematic diagram of the inner ring heating device of the utility model.
[0015] Figure 3 It is a structural schematic diagram of the outer ring heating device of the utility model. DETAILED DESCRIPTION
[0016] The utility model is further described below in conjunction with the accompanying drawings and embodiments.
[0017] like Figure 2-Figure 3 shown.
[0018] A spray assembly heating device is installed on the spray assembly to heat the deposition gas entering the spray head. It includes an inner ring heating device ( Figure 2 ) and the outer ring heating device for heating the outer ring of the sprinkler head ( Figure 3), the inner ring heating device includes an inner ring metal upper plate 1 and an inner ring metal lower plate 2, and two mica plates 3 are installed between the inner ring metal upper plate 1 and the inner ring metal lower plate 2. The inner ring metal upper plate 1, the inner ring metal lower plate 2 and the mica plates 3 are all circular ring structures. A woven heating film 4 is installed between the two mica plates 3, and the heating film 4 is electrically connected to the control circuit; the outer ring heating device includes an outer ring metal upper plate 5 and an outer ring metal lower plate 6, and five mica plates 3 are installed between the outer ring metal upper plate 5 and the outer ring metal lower plate 6. The outer ring metal upper plate 5, the outer ring metal lower plate 6 and the mica plates 3 are all structures composed of two semicircular rings forming a full circular ring. A metal heating wire 7 (alloy wire) is installed between two adjacent mica plates 3, and the metal heating wire 7 is electrically connected to the control circuit.
[0019] The parts not involved in the present invention are the same as the prior art or can be implemented by using the prior art.
Claims
1. A spray assembly heating device, characterized in that: The invention comprises an outer ring heating device for heating the outer ring of the shower head and an inner ring heating device for heating the inner ring of the shower head. The inner ring heating device comprises an inner ring metal upper plate (1) and an inner ring metal lower plate (2). Two mica plates (3) are installed between the inner ring metal upper plate (1) and the inner ring metal lower plate (2). A heating film (4) is installed between the two mica plates (3). The heating film (4) is electrically connected to a control circuit. The outer ring heating device comprises an outer ring metal upper plate (5) and an outer ring metal lower plate (6). Five mica plates (3) are installed between the outer ring metal upper plate (5) and the outer ring metal lower plate (6). A metal heating wire (7) is installed between two adjacent mica plates (3). The metal heating wire (7) is electrically connected to the control circuit.
2. The spray assembly heating device according to claim 1, characterized in that: The inner ring metal upper plate (1), the inner ring metal lower plate (2) and the mica plate (3) therebetween are all annular structures.
3. The spray assembly heating device according to claim 1, characterized in that: The heating film (4) is a woven structure, and its shape matches the mica board (3).
4. The spray assembly heating device according to claim 1, characterized in that: The outer ring metal upper plate (5), the outer ring metal lower plate (6) and the mica plate (3) therebetween are all structures consisting of two semicircular rings forming a full circular ring.
5. The spray assembly heating device according to claim 1, characterized in that: The metal heating wire (7) is an alloy wire.