Cooling device for ion beam etching wafer

Abstract

The utility model provides a cooling device for ion beam etching of a wafer. The cooling device comprises a carrying table, a jig and a fixing mechanism, wherein the jig is arranged on the carrying table and used for fixing the wafer, and the fixing mechanism is arranged on the carrying table and used for fixing the jig. According to the utility model, the jig is fixed through the fixing mechanism on the carrying table, then helium can be conveyed into the carrying table through an external helium supply system, and finally the helium enters the lower disc through the small holes, so that the lower disc is cooled, the temperature of the lower disc is conducted to the back surface of the wafer, and when the wafer is etched, the temperature of the lower disc is reduced. The surface temperature distribution of the wafer is uniform, in addition, the wafer is fixed through the jig, the wafer can be fixed quickly and conveniently, the working efficiency of wafer etching is improved, and in addition, when the upper disc and the lower disc are connected through the buffer pad, the buffer pad can play a role in buffering and preventing the wafer from being damaged.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a cooling device for ion beam etching wafers. Background Art

[0002] In the modern semiconductor industry, ion beam etching wafer technology plays a vital role. With the continuous pursuit of high performance, miniaturization and high integration of electronic devices, higher and higher requirements are placed on the precision and quality of wafer processing.

[0003] As the basic material of semiconductor devices, wafer surface micro-machining is essential for achieving complex circuit structures and excellent device performance. Ion beam etching technology came into being, which uses the directional bombardment of high-speed ion beams to accurately remove materials on the wafer surface, thereby achieving various fine patterns and structures.

[0004] In the prior art, the change of wafer surface temperature during ion beam etching is rapid and complex. Existing cooling devices may not be able to stably control the wafer temperature, resulting in overheating or overcooling in certain areas, which will have an adverse effect on etching quality and wafer performance. Secondly, the uniformity of wafer surface temperature distribution is crucial to the accuracy and consistency of etching. However, existing cooling devices may find it difficult to achieve uniform distribution of wafer surface temperature, especially when the wafer temperature is constantly changing during etching, which increases the uncertainty and error of etching results. Utility Model Content

[0005] Based on this, the purpose of the utility model is to provide a cooling device for ion beam etching wafers which can achieve uniform distribution of wafer surface temperature.

[0006] The utility model provides the following technical solution: a cooling device for ion beam etching wafers, comprising a carrier, a fixture placed on the carrier for fixing the wafer, and a fixing mechanism arranged on the carrier for fixing the fixture;

[0007] The fixture includes an upper plate, a lower plate, a buffer pad arranged on the lower plate, a plurality of threaded holes evenly spaced apart on the lower plate, a plurality of bolts evenly spaced apart on the upper plate, and a plurality of buckles evenly spaced apart on the inner side of the upper plate. The upper plate and the lower plate are respectively connected to each other through the bolts and the threaded holes thereon, and the lower plate is a hollow structure, and a plurality of small holes are opened at the lower part of the lower plate.

[0008] Furthermore, the carrier includes a column, a feeding portion arranged on the column, and a first circular concave hole and a second circular concave hole are sequentially opened from the side of the feeding portion away from the column, the diameter of the second concave hole is larger than the first concave hole, a step is formed between the second concave hole and the first concave hole, the lower plate is located at the step, passes through the lower side of the second concave hole to the lower part of the column to form an air inlet hole, a first connecting pipe is arranged on the column, the connecting pipe is connected to the air inlet hole, and an exhaust pipe is arranged on the feeding portion, the exhaust pipe is connected to the second concave hole.

[0009] Furthermore, a plurality of vacuum holes are evenly spaced at the step, and the fixing mechanism includes a plurality of vacuum tubes arranged at the lower side of the material placement portion, the vacuum tubes are connected to the vacuum holes, a second connecting tube is provided for connecting all the vacuum tubes, and an external connecting tube for an external vacuum unit is provided on the second connecting tube.

[0010] Furthermore, the cooling device also includes a rotating mechanism for intermittently blocking the exhaust pipe.

[0011] Furthermore, the rotating mechanism includes a motor arranged at the air inlet, a disc arranged on the output shaft of the motor, and a plurality of blocking members arranged in the circumferential direction of the disc.

[0012] Furthermore, the blocking members are evenly spaced and arranged in the circumference of the disc.

[0013] Furthermore, a bracket is fixedly connected to the second concave hole, and the output shaft of the motor is rotatably connected to the bracket.

[0014] The beneficial effects of the utility model are as follows: the fixture is fixed by a fixing mechanism on the carrier, and then helium can be transported into the carrier through an external helium supply system. The helium will eventually enter the interior of the lower plate through the small holes, thereby cooling the lower plate. The temperature of the lower plate will be transmitted to the back of the wafer, thereby achieving a uniform surface temperature distribution of the wafer when etching the wafer. In addition, fixing the wafer by the fixture can facilitate fast and convenient wafer fixation, thereby improving the working efficiency of wafer etching. In addition, the buffer pad is arranged to act as a buffer when the upper plate and the lower plate are connected to prevent damage to the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a three-dimensional structural schematic diagram of the utility model.

[0016] Figure 2 It is a partial three-dimensional structural schematic diagram of the utility model.

[0017] Figure 3 It is a schematic diagram of the three-dimensional structure of the carrier of the utility model.

[0018] Figure 4 It is a schematic diagram of the exploded three-dimensional structure of the fixture of the utility model.

[0019] Figure 5 It is a schematic diagram of the lower three-dimensional structure of the lower plate of the utility model.

[0020] Figure 6 It is a three-dimensional structural schematic diagram of the fixing mechanism of the utility model.

[0021] Figure 7 It is a three-dimensional structural schematic diagram of the rotating mechanism of the utility model.

[0022] The marks in the accompanying drawings are: 1-carrier, 11-column, 12-first connecting pipe, 13-material placing part, 14-first recessed hole, 15-step, 16-vacuum hole, 17-second recessed hole, 18-air inlet, 19-exhaust pipe, 2-jig, 21-upper plate, 22-bolt, 23-clip, 24-wafer, 25-lower plate, 26-threaded hole, 27-buffer pad, 28-small hole, 3-fixing mechanism, 31-vacuum tube, 32-second connecting pipe, 33-external tube, 4-rotating mechanism, 41-motor, 42-disc, 43-blocking member, 44-bracket. DETAILED DESCRIPTION

[0023] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0024] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0026] A cooling device for ion beam etching wafers, such as Figure 1-Figure 6 As shown, it includes a carrier 1, a fixture 2 placed on the carrier 1 for fixing a wafer 24, and a fixing mechanism 3 arranged on the carrier 1 for fixing the fixture 2;

[0027] like Figure 4 and Figure 5 As shown, the fixture 2 includes an upper plate 21, a lower plate 25, a buffer pad 27 arranged on the lower plate 25, a plurality of threaded holes 26 evenly spaced apart on the lower plate 25, a plurality of bolts 22 evenly spaced apart on the upper plate 21, and a plurality of buckles 23 evenly spaced apart on the inner side of the upper plate 21. The upper plate 21 and the lower plate 25 are respectively connected to each other by the bolts 22 and the threaded holes 26 thereon, the lower plate 25 is a hollow structure, and a plurality of small holes 28 are opened at the lower portion of the lower plate 25.

[0028] It can be understood that in the initial state, the fixture 2 is separated from the carrier 1, and the upper plate 21 of the fixture 2 is separated from the lower plate 25. First, the operator places the wafer 24 at the true center inside the upper plate 21, the wafer 24 contacts the buckle 23 and the buckle 23 positions the wafer 24, then the upper plate 21 with the wafer 24 is placed on the lower plate 25, at this time the wafer 24 contacts the buffer pad 27, then the operator can screw the bolt 22 into the threaded hole 26 and tighten it, thereby fixing the wafer 24 between the upper plate 21 and the lower plate 25, wherein the buffer pad 27 is set when the upper plate 21 and the lower plate 25 are connected, the buffer pad 27 can play a buffering role to prevent the wafer 24 from being damaged, and after the wafer 24 is fixed between the upper plate 21 and the lower plate 25, the operator The operator can place the wafer 24 on the carrier 1, and then fix the fixture 2 through the fixing mechanism 3 on the carrier 1, and then helium can be transported into the carrier 1 through the external helium supply system. The helium will eventually enter the interior of the lower plate 25 through the small hole 28, thereby cooling the lower plate 25. The temperature of the lower plate 25 will be transmitted to the back of the wafer 24, so that when the wafer 24 is etched, the surface temperature of the wafer 24 is evenly distributed. When the etched wafer 24 needs to be taken out, first turn off the helium supply system, then turn off the fixing mechanism 3, and then take the fixture 2 out of the carrier 1. After the fixture 2 is taken out, the upper plate 21 and the lower plate 25 of the fixture 2 are separated, thereby taking out the etched wafer 24.

[0029] like Figure 3As shown, the carrier 1 includes a column 11, a feeding portion 13 is arranged on the column 11, and a first circular concave hole 14 and a second circular concave hole 17 are sequentially opened from the side of the feeding portion 13 away from the column 11, the diameter of the second concave hole 17 is larger than the first concave hole 14, a step 15 is formed between the second concave hole 17 and the first concave hole 14, the lower plate 25 is located at the step 15, passes through the lower side of the second concave hole 17 to the lower part of the column 11 to form an air inlet hole 18, a first connecting pipe 12 is arranged on the column 11, and the connecting pipe is connected to the air inlet hole 18, and an exhaust pipe 19 is arranged on the feeding portion 13, and the exhaust pipe 19 is connected to the second concave hole 17.

[0030] It can be understood that the operator can place the fixture 2 at the first recessed hole 14 of the carrier 1, and the lower plate 25 of the fixture 2 contacts the step 15, and then connects to the output pipe of the external helium supply system through the first connecting tube 12. The helium of the external helium supply system will pass through the first connecting tube 12, the air inlet 18, and reach the second recessed hole 17 in sequence. The helium reaching the second recessed hole 17 will enter the lower plate 25 through the small hole 28, and the helium will also be discharged from the exhaust pipe 19. The exhaust pipe 19 can be connected to the input pipe of the helium supply system, thereby realizing the circulation and utilization of helium. The external helium supply system is a prior art and will not be explained in detail here.

[0031] like Figure 6 As shown, a plurality of vacuum holes 16 are evenly spaced at the step 15, and the fixing mechanism 3 includes a plurality of vacuum tubes 31 arranged at the lower side of the placing portion 13, the vacuum tubes 31 are connected to the vacuum holes 16, a second connecting tube 32 connecting all the vacuum tubes 31, and an external tube 33 for an external vacuum unit is arranged on the second connecting tube 32.

[0032] It can be understood that when the operator places the fixture 2 into the first recessed hole 14 and the lower plate 25 contacts the step 15, the external tube 33 is connected to the external vacuum system, the external vacuum system is started, and the vacuum hole 16 is evacuated through the external tube 33, the second connecting tube 32, and the vacuum tube 31. The vacuum hole 16 generates negative pressure to adsorb the lower plate 25 of the fixture 2, thereby achieving the effect of fixing the fixture 2.

[0033] like Figure 7As shown, the cooling device also includes a rotating mechanism 4 for intermittently blocking the exhaust pipe 19, the rotating mechanism 4 includes a motor 41 arranged at the air inlet 18, a disc 42 arranged on the output shaft of the motor 41, and a plurality of blocking members 43 arranged circumferentially of the disc 42, the blocking members 43 are evenly spaced around the circumference of the disc 42, a bracket 44 is fixedly connected to the second recessed hole 17, and the output shaft of the motor 41 is rotatably connected to the bracket 44.

[0034] It can be understood that when the external helium supply system inputs helium into the carrier 1, the operator can start the motor 41, the motor 41 drives the disk 42 to rotate, the disk 42 drives the blocking member 43 to rotate, and the blocking member 43 rotates to block the gap of the exhaust pipe 19, thereby preventing helium from flowing out of the exhaust pipe 19 directly and quickly, and allowing more helium to flow into the lower plate 25 to achieve cooling of the wafer 24. The setting of the bracket 44 can reduce the bearing capacity of the output shaft of the motor 41, and the bracket 44 can share a part of the load, thereby making the blocking member 43 rotate more stably and extending the service life of the rotating mechanism 4.

[0035] To summarize, the fixture 2 is fixed by the fixing mechanism 3 on the carrier 1, and then helium can be transported into the carrier 1 through the external helium supply system. The helium will eventually enter the interior of the lower plate 25 through the small hole 28, thereby cooling the lower plate 25. The temperature of the lower plate 25 will be transmitted to the back of the wafer 24, thereby achieving a uniform surface temperature distribution of the wafer 24 when etching the wafer 24. In addition, fixing the wafer 24 by the fixture 2 can facilitate quick and convenient fixing of the wafer 24, thereby improving the working efficiency of etching the wafer 24. In addition, the buffer pad 27 is set when the upper plate 21 is connected to the lower plate 25, and the buffer pad 27 can act as a buffer to prevent damage to the wafer 24.

[0036] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0037] The above-mentioned embodiments only express several implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A cooling device for ion beam etching wafers, characterized in that: It includes a carrier, a fixture placed on the carrier for fixing the wafer, and a fixing mechanism arranged on the carrier for fixing the fixture; The fixture includes an upper plate, a lower plate, a buffer pad arranged on the lower plate, a plurality of threaded holes evenly spaced apart on the lower plate, a plurality of bolts evenly spaced apart on the upper plate, and a plurality of buckles evenly spaced apart on the inner side of the upper plate. The upper plate and the lower plate are respectively connected to each other through the bolts and the threaded holes thereon, and the lower plate is a hollow structure, and a plurality of small holes are opened at the lower part of the lower plate.

2. The cooling device according to claim 1, characterized in that: The carrier includes a column, a material placement portion arranged on the column, a first circular concave hole and a second circular concave hole are sequentially opened from the side of the material placement portion away from the column, the diameter of the second concave hole is larger than the first concave hole, a step is formed between the second concave hole and the first concave hole, the lower plate is located at the step, passes through the lower side of the second concave hole to the lower part of the column to form an air inlet hole, a first connecting pipe is arranged on the column, the connecting pipe is connected to the air inlet hole, and an exhaust pipe is arranged on the material placement portion, the exhaust pipe is connected to the second concave hole.

3. The cooling device according to claim 2, characterized in that: A plurality of vacuum holes are evenly spaced at the step, and the fixing mechanism includes a plurality of vacuum tubes arranged at the lower side of the material placement portion, the vacuum tubes are connected to the vacuum holes, a second connecting tube is provided for connecting all the vacuum tubes, and an external connecting tube for an external vacuum unit is provided on the second connecting tube.

4. The cooling device according to claim 2, characterized in that: The cooling device further comprises a rotating mechanism for intermittently blocking the exhaust pipe.

5. The cooling device according to claim 4, characterized in that: The rotating mechanism includes a motor arranged at the air inlet, a disc arranged on the output shaft of the motor, and a plurality of blocking members arranged in the circumferential direction of the disc.

6. The cooling device according to claim 5, characterized in that: The blocking members are arranged at even intervals in the circumference of the disc.

7. The cooling device according to claim 6, characterized in that: A bracket is fixedly connected to the second concave hole, and the output shaft of the motor is rotatably connected to the bracket.

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