Wafer iron ring carrying and overturning device

Abstract

The utility model discloses a wafer iron ring carrying and overturning device which comprises a rack, the rack is connected with a horizontal linear module, the rack is provided with a lifting module, the lifting module is connected with a rotating module, the rotating module is connected with a product adsorption mechanism, the product adsorption mechanism comprises a connecting seat, the connecting seat is connected with the rotating module, and the rotating module is connected with the lifting module. The connecting base is connected with a horizontally-arranged first mounting plate, and a product adsorption assembly is arranged on the first mounting plate. The device has the advantages that synchronous adsorption and carrying of two wafer iron rings can be achieved, seamless butt joint in the material taking and placing process is achieved, the adsorption and carrying efficiency of the wafer iron rings is effectively improved, the wafer iron rings of different sizes can be adsorbed, and rapid switching of the adsorption sizes is achieved; the carrying and overturning device is simple and compact in structure, equipment does not need to be replaced or changed when the adsorption size is switched, the overall size of the equipment is not increased, and the equipment space can be effectively saved and the operation cost can be reduced through the product adsorption mechanism which adsorbs up and down.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor wafers, in particular to a wafer iron ring conveying and flipping device. Background Art

[0002] Wafer refers to the silicon chip used in the production of silicon semiconductor integrated circuits. Because of its round shape, it is called a wafer. Various circuit component structures can be processed on the silicon wafer to become an integrated circuit product with specific electrical functions. The wafer iron ring can fix the wafer well so that the expensive wafer will not be damaged or scratched during the production process.

[0003] The existing wafer iron ring adsorption and handling device uses a group of suction cups, which can only adsorb one product. The material taking and placing cannot be done in a continuous manner. The product must be placed on the flipping platform before the material is taken out and placed on the production station, which seriously affects the production efficiency. At the same time, the suction cup group can only adsorb products of one size, and the same suction cup group cannot adsorb and transport products of different sizes. However, the use of multiple wafer iron ring adsorption and handling devices will increase the size of the entire equipment, which will affect the use area of ​​the wafer iron ring operation clean room and increase the wafer iron ring operation cost. For example, a kind of iron ring flipping and handling device disclosed in patent publication number CN220563758U can only adsorb and transport one wafer iron ring at a time. Utility Model Content

[0004] The utility model aims to provide a wafer iron ring transport and flipping device to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a wafer iron ring handling and flipping device, comprising a frame, the frame is connected to a horizontal linear module, the frame is provided with a lifting module, the lifting module is connected to a rotating module, the rotating module is connected to a product adsorption mechanism, the product adsorption mechanism comprises a connecting seat, the connecting seat is connected to the rotating module, the connecting seat is connected to a horizontally arranged first mounting plate, the first mounting plate is provided with a product adsorption assembly, the product adsorption assembly comprises two second mounting plates and two third mounting plates, the two second mounting plates are both arranged above the first mounting plate and symmetrically arranged in the horizontal direction, the two third mounting plates are parallel to the top of the second mounting plates and symmetrically arranged in the horizontal direction, the two third mounting plates are respectively arranged directly above the two second mounting plates and are respectively connected to the corresponding second mounting plates below, a cylinder is connected between the two second mounting plates, and the two second mounting plates and the two third mounting plates are both provided with vacuum suction cups.

[0006] Further preferably, the second mounting plate and the third mounting plate are both U-shaped structures, which play a role of avoidance and can reduce the weight of the second mounting plate and the third mounting plate, thereby reducing the overall weight of the transport and flipping device; each of the second mounting plates and the corresponding third mounting plate are vertically connected with a connecting plate to achieve connection between the second mounting plate and the third mounting plate, thereby ensuring synchronous movement of the second mounting plate and the third mounting plate.

[0007] Further preferably, a fourth mounting plate is provided on the sides of the two second mounting plates, and the two ends of the cylinder are respectively connected to the two fourth mounting plates, and the installation of the cylinder is achieved through the fourth mounting plates. The piston rod end and the cylinder barrel end of the cylinder are respectively connected to the two fourth mounting plates, and the distance between the two fourth mounting plates is adjusted by telescoping the cylinder, thereby achieving the distance adjustment between the two second mounting plates.

[0008] Further preferably, a partition perpendicular to the first mounting plate is provided between the two second mounting plates, and a reinforcing plate is connected between the partition and the connecting seat to ensure the stability of the first mounting plate, and further ensure the stability of the second mounting plate, the third mounting plate and the vacuum suction cup.

[0009] Further preferably, both ends of the two second mounting plates close to the partition plate are provided with limiting bolts to prevent the two second mounting plates from colliding with each other and to control the minimum distance between the two second mounting plates.

[0010] Further preferably, a linear guide rail is provided between the two second mounting plates and the first mounting plate, and the guide rail of the linear guide rail is provided on the first mounting plate. The setting of the linear guide rail facilitates the adjustment of the distance between the two second mounting plates; and limit plates are provided at both ends of the guide rail of the linear guide rail to realize the control of the maximum distance between the second mounting plates.

[0011] Further preferably, a mounting bracket is connected between the lifting module and the rotating module to realize the connection between the lifting module and the rotating module; the rotating module includes a rotating motor, the rotating motor is connected to a hollow rotating platform, the hollow rotating platform is arranged on the mounting bracket, and the hollow rotating platform is connected to a sensor sheet and a slot-type photoelectric switch to realize the rotation angle control of the hollow rotating platform, thereby realizing the flipping control of the product adsorption mechanism.

[0012] Further preferably, the lifting module is a linear slide module to achieve high-precision and fast movement.

[0013] Beneficial effects: The wafer iron ring conveying and flipping device of the utility model realizes position adjustment of the product adsorption mechanism through the horizontal linear module and the lifting module, realizes up and down flipping of the product adsorption mechanism through the rotating module, realizes upper and lower independent adsorption of the wafer iron ring through the product adsorption mechanism, realizes synchronous taking of the wafer iron ring to be tested and the wafer iron ring that has been tested, realizes seamless connection in the material taking and unloading process, and effectively improves the adsorption and conveying efficiency of the wafer iron ring; the spacing between the vacuum suction cups can be adjusted by the cylinder to realize the adsorption of wafer iron rings of different sizes, and realizes rapid switching of adsorption size; the conveying and flipping device has a simple and compact structure, and switching the adsorption size does not require replacement or modification of the equipment, and will not increase the overall size of the equipment; and the product adsorption mechanism for upper and lower adsorption can effectively save equipment space and reduce operating costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the axial structure of the wafer iron ring transport and flipping device disclosed in the embodiment of the utility model;

[0015] Figure 2 It is a right side structural schematic diagram of the wafer iron ring transport and flipping device disclosed in an embodiment of the utility model;

[0016] Figure 3 It is a structural schematic diagram of the product adsorption mechanism disclosed in the embodiment of the utility model;

[0017] Figure 4 It is a schematic diagram of the state of the wafer iron ring transport and flipping device disclosed in an embodiment of the utility model when transporting two wafer iron rings.

[0018] Figure markings: 1-frame, 2-lifting module, 3-rotating module, 31-rotating motor, 32-hollow rotating platform, 33-sensing sheet, 34-slot-type photoelectric switch, 4-product adsorption mechanism, 41-connecting seat, 42-first mounting plate, 43-product adsorption assembly, 431-second mounting plate, 432-third mounting plate, 433-connecting plate, 434-fourth mounting plate, 435-cylinder, 436-vacuum suction cup, 437-limiting bolt, 438-linear guide rail, 439-limiting plate, 44-partition, 45-reinforcement plate. DETAILED DESCRIPTION

[0019] The following are specific embodiments of the present invention and the accompanying drawings to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.

[0020] like Figure 1-4As shown, a wafer iron ring transport and flipping device is used for adsorption and transport of wafer iron rings, and realizes seamless docking in the process of taking and placing materials during the wafer iron ring transport. The transport and flipping device includes a frame 1, the frame 1 is connected to a horizontal linear module, and a lifting module 2 is provided on the frame 1, the lifting module 2 is connected to a rotating module 3, and the rotating module 3 is connected to a product adsorption mechanism 4. Among them, the horizontal linear module is used to drive the frame to move horizontally to realize the overall movement of the transport and flipping device; the lifting module 2 is used to drive the rotating module 3 to rise and fall, and then drive the product adsorption mechanism 4 to rise and fall, and the rotating module 3 is used to drive the product adsorption mechanism 4 to flip, and can realize 180° flipping, and the product adsorption mechanism 4 can realize double-sided adsorption of the wafer iron ring, that is, it has two product adsorption structures, and is arranged in an upper and lower manner, which can realize the adsorption of the wafer iron ring from top to bottom, and realize seamless docking of the wafer iron ring in the process of taking and placing materials.

[0021] In the present application, the product adsorption mechanism 4 includes a connection seat 41, which is connected to the rotating module 3, and the connection seat 41 is connected to a horizontally arranged first mounting plate 42, and the connection between the first mounting plate 42 and the rotating module 3 is realized through the connection seat 41. A product adsorption assembly 43 is provided on the first mounting plate 42, and the product adsorption assembly 43 includes two second mounting plates 431 and two third mounting plates 432, the two second mounting plates 431 are both arranged above the first mounting plate 42 and are symmetrically arranged in the horizontal direction, the two third mounting plates 432 are parallel to the upper part of the second mounting plates 431 and are symmetrically arranged in the horizontal direction, the two third mounting plates 432 are respectively arranged directly above the two second mounting plates 431 and are respectively connected to the corresponding second mounting plates 431 below, a cylinder 435 is connected between the two second mounting plates 431, and vacuum suction cups 436 are provided on the two second mounting plates 431 and the two third mounting plates 432. Two vacuum suction cups 436 are respectively arranged on each second mounting plate 431 and the third mounting plate 432. The two second mounting plates 431 and the four vacuum suction cups 436 form a product adsorption structure, and the two third mounting plates 432 and the four vacuum suction cups 436 form a second product adsorption structure. The two product adsorption structures are arranged up and down, and can adsorb the wafer iron rings respectively. The cylinder 435 is used to adjust the spacing between the two second mounting plates 431, to adjust the spacing between the vacuum suction cups 436 on the two second mounting plates 431, and to adsorb wafer iron rings of different sizes; and it can simultaneously adjust the spacing between the two third mounting plates 432, to adjust the spacing between the vacuum suction cups 436 on the two third mounting plates 432, and can also simultaneously adsorb wafer iron rings of different sizes, that is, the adsorption of different wafer iron rings can be achieved through the adjustment of the cylinder 435. In the present application, the product adsorption component 43 can adsorb 8-inch and 12-inch wafer iron rings, which not only improves the adaptability of the product adsorption mechanism 4, but also has a compact structure, which can save the space occupied by the transport and flipping device. By rotating the module 3, the product adsorption mechanism 4 can be flipped up and down, and the synchronous adsorption of the wafer iron ring to be operated and the wafer iron ring that has been operated can be achieved, which can significantly improve the efficiency of wafer iron ring adsorption and transportation.

[0022] In the present application, the second mounting plate 431 and the third mounting plate 432 are both in a U-shaped structure, which plays a role of giving way, and can effectively reduce the weight of the second mounting plate 431 and the third mounting plate 432, making the handling and flipping device more lightweight. A connecting plate 433 is vertically connected between each second mounting plate 431 and the corresponding third mounting plate 432 to achieve the connection between the second mounting plate 431 and the third mounting plate 432, and after the second mounting plate 431 and the third mounting plate 432 are flipped up and down, there is no need to adjust, and the vacuum suction cup 436 can adsorb the wafer iron ring.

[0023] In the present application, a fourth mounting plate 434 is provided on the sides of the two second mounting plates 431, and the two ends of the cylinder 435 are respectively connected to the two fourth mounting plates 434, so that when the piston rod of the cylinder 435 is extended or retracted, the distance between the two second mounting plates 431 and the two third mounting plates 432 can be adjusted.

[0024] In the present application, a partition plate 44 perpendicular to the first mounting plate 42 is provided between the two second mounting plates 431, and a reinforcing plate 45 is connected between the partition plate 44 and the connecting seat 41, so as to improve the stability of the first mounting plate 42, ensure the stability of the product adsorption assembly 43 during operation, and improve the adsorption quality of the wafer iron ring. The partition plate 44 can separate the two second mounting plates 431 and the two third mounting plates 432, and the limiting bolts 437 provided near the end of the partition plate 44 of the two second mounting plates 431 are used to form a limit, so as to limit the minimum spacing between the two second mounting plates 431 and prevent the two second mounting plates 431 and the two third mounting plates 432 from colliding. A linear guide rail 438 is provided between the two second mounting plates 431 and the first mounting plate 42, and the guide rail of the linear guide rail 438 is provided on the first mounting plate 42, and both ends of the guide rail of the linear guide rail 438 are provided with limiting plates 439. The second mounting plate 431 is slidable along the first mounting plate 42 by means of the linear guide rail 438. In the present application, any one of the two second mounting plates 431 can be fixed first, that is, the slider connected to the second mounting plate 431 can be locked. Then, when the piston rod of the cylinder 435 is extended or retracted, the second mounting plate 431 corresponding to the other unlocked slider can be driven to move forward and backward, so as to adjust the spacing between the two second mounting plates 431, and then adjust the spacing between the third mounting plate 432 and the vacuum suction cups 436 on the second mounting plates 431 and the third mounting plates 432, so as to adsorb wafer iron rings of different sizes without changing the overall size of the transport and flipping device.

[0025] In the present application, a mounting bracket 5 is connected between the lifting module 2 and the rotating module 3 to realize the connection between the lifting module 2 and the rotating module 3 and facilitate the installation of the rotating module 3. The rotating module 3 includes a rotating motor 31, and the rotating motor 31 is connected to a hollow rotating platform 32. The hollow rotating platform 32 is arranged on the mounting bracket 5, and the hollow rotating platform 32 is connected to a sensing sheet 33 and a slot-type photoelectric switch 34. The rotating motor 31 can drive the hollow rotating platform 32 to rotate, and then the sensing sheet and the slot-type photoelectric switch 34 can realize the control of the rotation angle of the hollow rotating platform 32, and the hollow rotating platform 32 can be rotated 180° and stopped, so as to realize the flipping control of the product adsorption component 43.

[0026] In the present application, the lifting module 2 is a linear slide module, which has the advantages of high precision and fast response, and can meet the production operation requirements of wafer iron rings.

[0027] In the present application, the working process of the handling and flipping device is as follows: with the cooperation of the horizontal linear module and the lifting module 2, the product adsorption mechanism 43 is moved to the material picking station, the vacuum suction cup 436 on the second mounting plate 431 adsorbs the wafer iron ring to be operated, and then the rotating module 3 is actuated to flip the second mounting plate 431 upward; the horizontal linear module is actuated to move the product adsorption mechanism 43 to the wafer iron ring operation station, the lifting module 2 drives the rotating module 3 to descend, and the vacuum suction cup 436 on the third mounting plate 432 adsorbs the wafer that has been operated. The wafer iron ring is then moved, and then the lifting module 2 is activated to raise the product adsorption mechanism 4 to the work station to be operated, and the vacuum suction cup 436 on the second mounting plate 431 places the adsorbed wafer iron ring to be operated on the work station; the horizontal linear module is activated to move the transport and flipping device to the back-end work station, and then the rotating module 3 is flipped 180°, and the third mounting plate 432 is rotated upwards, and the vacuum suction cup 436 on the third mounting plate 432 places the wafer iron ring that has been operated on the platform of the back-end process, and then the transport and flipping device is reset to continue the next operation.

[0028] In the present application, when producing products of another size, the spacing between the two second mounting plates 431 and the two third mounting plates 432 is adjusted by the cylinder 435 to achieve rapid switching of the adsorption size.

[0029] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions recorded in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the utility model content within the protection scope of the utility model.

Claims

1. A wafer iron ring transport and flipping device, comprising a frame (1), the frame (1) is connected to a horizontal linear module, the frame (1) is provided with a lifting module (2), the lifting module (2) is connected to a rotating module (3), characterized in that: The rotating module (3) is connected to a product adsorption mechanism (4), the product adsorption mechanism (4) comprising a connection seat (41), the connection seat (41) being connected to the rotating module (3), the connection seat (41) being connected to a first horizontally arranged mounting plate (42), the first mounting plate (42) being provided with a product adsorption assembly (43), the product adsorption assembly (43) comprising two second mounting plates (431) and two third mounting plates (432), the two second mounting plates (431) being both arranged on the first mounting plate (42) The two third mounting plates (432) are parallel to the top of the second mounting plate (431) and are symmetrically arranged in the horizontal direction. The two third mounting plates (432) are respectively arranged directly above the two second mounting plates (431) and are respectively connected to the corresponding second mounting plates (431) below. A cylinder (435) is connected between the two second mounting plates (431). Vacuum suction cups (436) are provided on the two second mounting plates (431) and the two third mounting plates (432).

2. The wafer iron ring transport and flipping device according to claim 1, characterized in that: The second mounting plate (431) and the third mounting plate (432) are both U-shaped structures, and a connecting plate (433) is vertically connected between each second mounting plate (431) and the corresponding third mounting plate (432).

3. The wafer iron ring transport and flipping device according to claim 1, characterized in that: A fourth mounting plate (434) is provided on the sides of the two second mounting plates (431), and the two ends of the cylinder (435) are respectively connected to the two fourth mounting plates (434).

4. The wafer iron ring transport and flipping device according to claim 1, characterized in that: A partition plate (44) perpendicular to the first mounting plate (42) is provided between the two second mounting plates (431), and a reinforcing plate (45) is connected between the partition plate (44) and the connecting seat (41).

5. The wafer iron ring transport and flipping device according to claim 4, characterized in that: The ends of the two second mounting plates (431) close to the partition plate (44) are both provided with limiting bolts (437).

6. The wafer iron ring transport and flipping device according to claim 1, characterized in that: A linear guide rail (438) is provided between the two second mounting plates (431) and the first mounting plate (42); the guide rail of the linear guide rail (438) is arranged on the first mounting plate (42); and limiting plates (439) are provided at both ends of the guide rail of the linear guide rail (438).

7. The wafer iron ring transport and flipping device according to claim 1, characterized in that: A mounting bracket (5) is connected between the lifting module (2) and the rotating module (3); the rotating module (3) comprises a rotating motor (31); the rotating motor (31) is connected to a hollow rotating platform (32); the hollow rotating platform (32) is arranged on the mounting bracket (5); and the hollow rotating platform (32) is connected to a sensing sheet (33) and a slot-type photoelectric switch (34).

8. The wafer iron ring transport and flipping device according to claim 1, characterized in that: The lifting module (2) is a linear slide module.

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