Radiator and semiconductor module

Abstract

The embodiment of the utility model discloses a radiator and a semiconductor module. The heat sink includes: a copper substrate; the aluminum substrate is arranged on the surface of the copper substrate; the special-shaped expansion surface is arranged on the surface of the aluminum substrate, the special-shaped expansion surface comprises a plurality of special-shaped heat dissipation structures, the special-shaped heat dissipation structures are vertically arranged on the aluminum substrate, and the special-shaped heat dissipation structures and the aluminum substrate are integrally formed. Efficient heat transfer of the radiator can be achieved, the durability and reliability of connection are improved, the forming difficulty of the special-shaped radiating structure is reduced, and the process cost is reduced.

Description

Technical Field

[0001] The embodiments of the utility model relate to the technical field of power electronics, and in particular to a heat sink and a semiconductor module. Background Art

[0002] High-power chip modules are widely used in industrial drive systems, for example, electric drive systems for electric vehicles. Currently, such systems face a common challenge. With the improvement of chip integration and the increase in power, the cooling power density is getting higher and higher. When exceeding a certain temperature, the life of the chip decreases sharply with the increase in temperature. In order to give full play to the performance of the drive system and improve life and reliability, the industry needs a high-performance cooling solution. At present, the most commonly used in the prior art is the welded copper base plate needle-type radiator. The main forming methods of the radiator are cold forging, cold extrusion, and hot extrusion. Nickel plating is required, the process is complex, and the cost is relatively high.

[0003] Strengthening the heat dissipation of high-power semiconductor chips can improve the efficiency and life of high-power chip modules, and is also an effective means to reduce the failure of semiconductor chips. The use of a package base plate combined with a pin-type heat sink is a cooling method that has developed rapidly in recent years. In order to give full play to the characteristics of this solution, two major problems need to be solved: 1) the connection problem between the pin-type heat dissipation substrate and the substrate on the chip side; 2) the durability and reliability of the connection. At present, the widely used technology is the copper pin-type substrate soldering technology, but it brings a new challenge. The difficulty of forming copper is large, so there is a problem of relatively high process cost. Due to the difficulty in forming, the needle side basically uses cylindrical needles, and it is difficult to use special-shaped needles to achieve enhanced heat transfer and improve performance. In addition, the precipitation of copper ions will cause electrochemical corrosion to the cooling circuit, and nickel plating is required on the surface. In order to solve the problem of welding connection, the all-aluminum structure also needs nickel plating. In addition, since aluminum has a larger linear expansion coefficient than the substrate, the durability and reliability of the welding connection is not good, and the failure rate is high. Utility Model Content

[0004] The utility model provides a radiator and a semiconductor module, so as to realize efficient heat transfer of the radiator, improve the durability and reliability of the connection, reduce the difficulty of forming a special-shaped heat dissipation structure, and reduce the process cost.

[0005] According to one aspect of the utility model, a radiator is provided, the radiator comprising:

[0006] Copper substrate;

[0007] An aluminum substrate, wherein the aluminum substrate is arranged on the surface of the copper substrate;

[0008] A special-shaped extension surface is arranged on the surface of the aluminum substrate, the special-shaped extension surface includes a plurality of special-shaped heat dissipation structures, the special-shaped heat dissipation structures are vertically arranged on the aluminum substrate, and the special-shaped heat dissipation structures are integrally formed with the aluminum substrate.

[0009] Optionally, the copper substrate has a thickness of 0.1 mm-4 mm.

[0010] Optionally, the thickness of the aluminum substrate is 0.6 mm-10 mm.

[0011] Optionally, the shape of the special-shaped heat dissipation structure includes at least one of a cylinder, a cone, a wave and a water drop.

[0012] Optionally, the special-shaped heat dissipation structures are arranged in an array with gaps between them.

[0013] Optionally, the special-shaped heat dissipation structure is made of aluminum.

[0014] According to another aspect of the present invention, a semiconductor module is provided. The semiconductor module comprises the heat sink described in any one of the above aspects.

[0015] Optionally, the semiconductor module further includes a substrate, and the substrate is welded on the surface of the heat sink.

[0016] Optionally, the semiconductor module further includes a semiconductor chip, and the semiconductor chip is disposed on a surface of the substrate.

[0017] Optionally, the semiconductor chip includes at least one of a processor, an IGBT and a SIC.

[0018] The technical solution of the embodiment of the utility model connects the copper substrate and the substrate by welding to achieve efficient heat transfer and improve the durability and reliability of the connection; the aluminum substrate makes full use of the good processing performance of aluminum to make various shapes of special-shaped heat dissipation structures, reducing the difficulty of forming special-shaped heat dissipation structures and reducing process costs. In summary, the utility model solves the connection problem of the pin-shaped heat dissipation substrate and the substrate on the chip side in the prior art; the durability and reliability problem of the connection.

[0019] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present utility model, nor are they intended to limit the scope of the present utility model. Other features of the present utility model will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0021] Figure 1 It is a structural schematic diagram of a radiator provided according to an embodiment of the utility model. DETAILED DESCRIPTION

[0022] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0023] It should be noted that the terms "first", "second", etc. in the specification and claims of the utility model and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the utility model described here can be implemented in an order other than those illustrated or described here. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0024] Figure 1 is a schematic diagram of a heat sink according to an embodiment of the present invention, referring to Figure 1 The embodiment of the utility model provides a heat sink 1, which includes: a copper substrate 10; an aluminum substrate 20, which is arranged on the surface of the copper substrate 10; a special-shaped extension surface 30, which is arranged on the surface of the aluminum substrate 20, and the special-shaped extension surface 30 includes a plurality of special-shaped heat dissipation structures 31, which are vertically arranged on the aluminum substrate 20, and the special-shaped heat dissipation structures 31 are integrally formed with the aluminum substrate 20.

[0025] Specifically, the copper substrate 10 in the heat sink 1 is used as the top plate, and is connected to the substrate in the semiconductor module by welding to achieve efficient heat transfer, avoiding the large difference in thermal expansion coefficient between the aluminum material and the substrate of the pure aluminum heat sink, which may cause reliability problems. The aluminum substrate 20 makes full use of the good processing properties of aluminum and can be made into various shapes of special-shaped heat dissipation structures 31, avoiding the problems of pure copper needle-shaped molding difficulties and high process costs. In addition, due to the natural oxide layer formed on the aluminum surface of the aluminum substrate 20, no coating is required, and the coolant circuit can directly pass through the heat dissipation needle surface.

[0026] The radiator 1 uses a copper-aluminum composite material (not a copper-aluminum alloy) for cooling and heat dissipation. The copper-aluminum composite technology uses continuous casting and rolling technology, which can be stably produced in large quantities, and the copper-aluminum bonding interface has high mechanical strength. The copper-aluminum composite material is used, and copper material is used on the substrate connection surface, which effectively ensures the connection reliability and durability reliability of the copper-copper welding surface. The special-shaped heat dissipation structure 31 is formed on the special-shaped extension surface 30. The material of the special-shaped heat dissipation structure 31 can be aluminum, which fully utilizes the good processing properties of aluminum, greatly reduces the difficulty of the needle-shaped molding process, and utilizes the natural oxide layer protection on the aluminum surface. No anti-corrosion coating is required, which further simplifies the process and reduces the dead weight compared to pure copper.

[0027] The technical solution of the embodiment of the utility model connects the copper substrate and the substrate by welding to achieve efficient heat transfer and improve the durability and reliability of the connection; the aluminum substrate makes full use of the good processing performance of aluminum to make various shapes of special-shaped heat dissipation structures, reducing the difficulty of forming special-shaped heat dissipation structures and reducing process costs. In summary, the utility model solves the connection problem of the pin-shaped heat dissipation substrate and the substrate on the chip side in the prior art; the durability and reliability problem of the connection.

[0028] Continue to refer Figure 1 Optionally, the thickness of the copper substrate 10 is 0.1 mm-4 mm.

[0029] Continue to refer Figure 1 Optionally, the thickness of the aluminum substrate 20 is 0.6 mm-10 mm.

[0030] Specifically, the thickness of the copper substrate 10 can be 0.1 mm-4 mm, and the thickness of the aluminum substrate 20 can be 0.6 mm-10 mm. The specific thickness can be determined according to the actual heat dissipation needs and process selection. The copper-aluminum composite material (non-copper-aluminum alloy) is applied to the cooling and heat dissipation of the chip. The copper-aluminum composite technology adopts continuous casting and rolling technology, which can be stably produced in large quantities, and the mechanical strength of the copper-aluminum bonding interface is high.

[0031] Continue to refer Figure 1 Optionally, the shape of the special-shaped heat dissipation structure 31 includes at least one of a cylinder, a cone, a wave and a water drop.

[0032] Specifically, the copper substrate 10 in the heat sink 1 and the substrate on the chip side are connected by welding, and the surface of the aluminum substrate 20 forms a special-shaped extension surface 30 to enhance heat transfer. The anisotropic heat dissipation structure 31 on the special-shaped extension surface 30 can be in the shape of a cylinder, a cone, a wave, a water drop, etc.

[0033] Continue to refer Figure 1 Optionally, the special-shaped heat dissipation structures 31 are arranged in an array with gaps between them.

[0034] Specifically, the special-shaped heat dissipation structures 31 are arranged in an array with gaps between them, which can achieve efficient heat transfer and is beneficial to heat dissipation.

[0035] Continue to refer Figure 1 Optionally, the material of the special-shaped heat dissipation structure 31 is aluminum.

[0036] Specifically, the material of the special-shaped heat dissipation structure 31 can be aluminum. Due to the natural oxide layer formed on the surface of aluminum, no coating is required, and the coolant circuit can directly pass through the surface of the special-shaped heat dissipation structure 31.

[0037] An embodiment of the utility model further provides a semiconductor module, which includes the heat sink provided by any embodiment of the utility model.

[0038] Since the semiconductor module includes the heat sink provided by any embodiment of the utility model, the semiconductor module and the heat sink have the same beneficial effects, which will not be described in detail here.

[0039] Optionally, the semiconductor module further includes a substrate, and the substrate is welded on the surface of the heat sink.

[0040] Specifically, the substrate is welded to the copper substrate in the heat sink, thereby achieving efficient heat transfer.

[0041] Optionally, the semiconductor module further includes a semiconductor chip, and the semiconductor chip is disposed on a surface of the substrate.

[0042] Specifically, the semiconductor chip is connected to the copper substrate in the heat sink through the substrate, and the copper-aluminum composite material is made into a heat sink or bottom plate of the semiconductor chip bottom plate to dissipate heat.

[0043] Optionally, the semiconductor chip includes at least one of a processor, an IGBT and a SIC.

[0044] Specifically, the semiconductor chip can be a high-power processor or a power electronic chip, such as IGBT, SIC, etc. In the field of non-automotive supercomputers, immersion cooling is currently used to immerse the semiconductor chip or even the host directly in the cooling liquid to improve the cooling efficiency. Alternatively, the heat dissipation channel is directly encapsulated inside the semiconductor chip to further shorten the heat conduction path.

[0045] The above specific implementations do not constitute a limitation on the protection scope of the present utility model. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present utility model shall be included in the protection scope of the present utility model.

Claims

1. A radiator, characterized in that: include: Copper substrate; An aluminum substrate, wherein the aluminum substrate is arranged on the surface of the copper substrate; A special-shaped extension surface is arranged on the surface of the aluminum substrate, the special-shaped extension surface includes a plurality of special-shaped heat dissipation structures, the special-shaped heat dissipation structures are vertically arranged on the aluminum substrate, and the special-shaped heat dissipation structures are integrally formed with the aluminum substrate.

2. The heat sink according to claim 1, characterized in that: The copper substrate has a thickness of 0.1 mm to 4 mm.

3. The heat sink according to claim 1, characterized in that: The thickness of the aluminum substrate is 0.6 mm-10 mm.

4. The heat sink according to claim 1, characterized in that: The shape of the special-shaped heat dissipation structure includes at least one of a cylinder, a cone, a wave and a water drop.

5. The heat sink according to claim 1, characterized in that The special-shaped heat dissipation structures are arranged in an array with gaps between them.

6. The heat sink according to claim 1, characterized in that The material of the special-shaped heat dissipation structure is aluminum.

7. A semiconductor module, characterized in that: A radiator comprising the radiator described in any one of claims 1 to 6.

8. The semiconductor module according to claim 7, characterized in that It also includes a substrate, which is welded on the surface of the heat sink.

9. The semiconductor module according to claim 8, characterized in that It also includes a semiconductor chip, which is arranged on the surface of the substrate.

10. The semiconductor module according to claim 9, characterized in that The semiconductor chip includes at least one of a processor, an IGBT and a SIC.

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