Thermoelectric separation circuit board

Abstract

The utility model discloses a thermoelectric separation circuit board, which comprises a copper substrate and a copper foil circuit layer, the copper foil circuit layer is arranged right above the copper substrate, an insulating layer is arranged between the copper foil circuit layer and the copper substrate, the middle parts of the copper substrate, the insulating layer and the copper foil circuit layer are all provided with mounting holes, the mounting holes are used for mounting LED lamp beads and dissipating heat, and the mounting holes are used for mounting LED lamp beads. And heat dissipation grooves are uniformly formed in the bottom surface of the copper substrate and are used for increasing the heat dissipation area of the copper substrate. The heat dissipation grooves are evenly formed in the bottom face of the copper substrate, the heat dissipation grooves can effectively increase the heat dissipation area of the copper substrate so that it can be guaranteed that the copper substrate can rapidly and effectively dissipate heat generated by the lamp beads, the service life of the whole heat separation circuit board is guaranteed, and meanwhile the through holes are formed in the positions, where the lamp beads are installed, of the whole circuit board. It is guaranteed that heat generated by the lamp beads can be dissipated through the copper substrate, and part of the heat can be discharged into the air.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a thermoelectric separation circuit board. Background Art

[0002] The structure of circuit boards varies according to different usage requirements. Generally, high-power LED lamps use thermoelectric separation circuit boards. The use of thermoelectric separation circuit boards can effectively discharge the heat generated by LED lamps and avoid overheating and damage to the circuit boards.

[0003] The Chinese patent authorization announcement number CN207201075U discloses a thermoelectric separation copper-based circuit board, which is formed by sequentially pressing a copper substrate, an insulating material layer and a copper foil circuit layer. Grooves are provided on the upper and lower surfaces of the copper substrate, and the insulating material layer and the copper foil circuit layer are arranged in the grooves. The copper foil circuit layers on the upper and lower surfaces of the copper substrate are connected. Using this thermoelectric separation copper-based circuit board, it is directly connected to a high-power LED lamp holder through the copper substrate, which greatly improves the heat dissipation efficiency, reduces the aging speed, and prolongs the life of the LED lamp holder; and both sides of the copper substrate can be used at the same time, with a novel structure, which can better meet people's diverse needs.

[0004] The above patent provides a double-sided thermoelectric separation circuit board. The copper substrate of this thermoelectric separation circuit board is placed in the middle. The heat generated by the lamp beads on both sides will be transferred to the copper substrate. Since lamp beads are installed on both sides, the heat dissipation surface of the copper substrate is smaller, resulting in the copper substrate being unable to quickly and effectively dissipate the heat generated by the lamp beads, affecting the service life of the copper substrate. Utility Model Content

[0005] The utility model aims to provide a thermoelectric separation circuit board, aiming to improve the existing thermoelectric separation circuit board in which the copper substrate is placed in the middle, and the heat generated by the lamp beads on both sides is transferred to the copper substrate. Since lamp beads are installed on both sides, the heat dissipation surface of the copper substrate is small, resulting in the copper substrate being unable to quickly and effectively dissipate the heat generated by the lamp beads, affecting the service life of the copper substrate.

[0006] The utility model is achieved in this way:

[0007] A thermoelectric separation circuit board comprises a copper substrate and a copper foil circuit layer, wherein the copper foil circuit layer is arranged directly above the copper substrate, and an insulating layer is arranged between the copper foil circuit layer and the copper substrate, and mounting holes are arranged in the middle of the copper substrate, the insulating layer and the copper foil circuit layer, and the mounting holes are used to install LED lamp beads and dissipate heat, and the bottom surface of the copper substrate is evenly provided with heat dissipation grooves, and the heat dissipation grooves are used to increase the heat dissipation area of ​​the copper substrate.

[0008] Preferably, the copper foil circuit layer, the insulating layer and the copper substrate are bonded and pressed together by an adhesive resin, and the adhesive resin is an insulating thermally conductive resin.

[0009] Preferably, the copper substrate is provided with a plurality of connecting pins along the inner side of the mounting hole, the connecting pins are extended toward the axial center of the mounting hole, the connecting pins are used to connect with the LED lamp beads, and the heat dissipation groove at the bottom of the copper substrate is close to the mounting hole but not connected to the mounting hole.

[0010] Preferably, the insulating layer is made of epoxy resin glass fiber board and is used to separate the copper foil circuit layer and the copper substrate.

[0011] Preferably, fixing holes are provided at the corners of the upper surface of the copper foil circuit layer, and insulating pads are provided at the edges of the fixing holes. The fixing holes and insulating pads are used to fix the circuit board without affecting the normal use of the circuit board. The copper foil circuit layer is provided with multiple welding heads around the mounting holes for welding the circuit board to the lamp beads.

[0012] Preferably, a solder resist layer is coated on the upper surface of the copper foil circuit layer, and the solder resist layer is used to protect the copper foil circuit layer and prevent external conductive materials from contacting the copper foil circuit layer and causing a short circuit.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] 1. The bottom surface of the copper substrate of the utility model is evenly provided with heat dissipation grooves, which can effectively increase the heat dissipation area of ​​the copper substrate to ensure that the copper substrate can quickly and effectively dissipate the heat generated by the lamp beads, thereby ensuring the service life of the entire heat separation circuit board. At the same time, through holes are provided at the positions where the lamp beads are installed on the entire circuit board, ensuring that the heat generated by the lamp beads can not only be dissipated through the copper substrate, but also part of the heat can be discharged into the air.

[0015] 2. A solder resist layer is provided on the surface of the copper foil circuit layer of the utility model. The solder resist layer can prevent the circuit board from contacting with external conductive materials and causing a short circuit. At the same time, the solder resist layer can also effectively protect the copper foil circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the structure of the utility model as a whole from the main viewing angle;

[0017] Figure 2 It is a schematic diagram of the structure of the utility model as a whole at the front end oblique upward viewing angle;

[0018] Figure 3 It is a schematic diagram of the structure of the utility model as a whole at the front oblique downward angle;

[0019] Figure 4 This utility model Figure 1 Schematic diagram of the structure enlarged at point A in the middle.

[0020] In the figure: 1. Copper base plate; 11. Heat dissipation slot; 12. Mounting hole; 13. Connecting pin; 2. Insulation layer; 3. Copper foil circuit layer; 31. Insulation pad; 32. Fixing hole; 33. Soldering head; 34. Solder mask layer. DETAILED DESCRIPTION

[0021] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0022] The following is a further description with reference to the accompanying drawings and specific embodiments:

[0023] Example 1

[0024] like Figure 1 , Figure 2 and Figure 3 As shown, a thermoelectric separation circuit board includes a copper substrate 1 and a copper foil circuit layer 3. The copper foil circuit layer 3 is arranged directly above the copper substrate 1. The copper substrate 1 is used to release the heat generated by the LED lamp beads. The copper foil circuit layer 3 is used to connect with the LED lamp beads, so as to facilitate the control of the operation of the LED lamp beads. An insulating layer 2 is provided between the copper foil circuit layer 3 and the copper substrate 1. The insulating layer 2 is used to separate the copper foil circuit layer 3 and the copper substrate 1. The copper substrate 1, the insulating layer 2 and the middle of the copper foil circuit layer 3 are all provided with mounting holes 12. The mounting holes 12 are used to install LED lamp beads and dissipate heat, which is convenient for the installation of LED lamp beads and also for the heat dissipation of the lamp beads. The bottom surface of the copper substrate 1 is evenly provided with heat dissipation grooves 11. The heat dissipation grooves 11 are used to increase the heat dissipation area of ​​the copper substrate 1, so that the copper substrate 1 can quickly discharge the heat generated by the LED lamp beads.

[0025] like Figure 1 As shown, the copper foil circuit layer 3, the insulating layer 2 and the copper substrate 1 are bonded and pressed together by adhesive resin, and the adhesive resin is an insulating thermal conductive resin. This structure of the thermally and electrically separated circuit board is stable, ensuring sufficient stability during use.

[0026] like Figure 2As shown, the copper substrate 1 is provided with a plurality of connecting pins 13 along the inner side of the mounting hole 12, and the connecting pins 13 are extended toward the axial position of the mounting hole 12. The connecting plate is used to connect with the LED lamp beads, which facilitates the stable connection between the copper substrate 1 and the LED lamp beads. The heat dissipation groove 11 at the bottom of the copper substrate 1 is close to the mounting hole 12 but is not connected to the mounting hole 12. This structure can prevent the heat dissipation groove 11 from affecting the installation of the lamp beads, while not affecting the normal heat dissipation of the heat dissipation groove 11. The insulating layer 2 is made of epoxy resin glass fiber board and is used to separate the copper foil circuit layer 3 and the copper substrate 1.

[0027] like Figure 3 As shown, the corners of the upper surface of the copper foil circuit layer 3 are provided with fixing holes 32, and the edges of the fixing holes 32 are provided with insulating pads 31. The fixing holes 32 cooperate with the insulating pads 31 to fix the circuit board without affecting the normal use of the circuit board, ensuring that the circuit board can be stably fixed in a specified position. The copper foil circuit layer 3 is provided with a plurality of welding heads 33 around the mounting hole 12, which are used for welding the circuit board to the lamp beads, so as to facilitate the connection between the lamp beads and the circuit on the copper foil circuit layer 3.

[0028] Working principle: When in use, the ground pin of the LED lamp bead is welded to the connecting pin 13 according to the use requirements, and the circuit of the LED lamp bead is soldered to the welding head 33 by tin soldering, and the circuit of the LED lamp bead is ensured to be connected with the circuit of the copper foil circuit layer 3. The heat generated by the LED lamp bead when working will be transferred to the copper substrate 1, and then the heat will be discharged by the copper substrate 1. Compared with the prior art, the bottom surface of the copper substrate 1 of the present application is evenly provided with heat dissipation grooves 11, and the heat dissipation grooves 11 can effectively increase the heat dissipation area of ​​the copper substrate 1 to ensure that the copper substrate 1 can quickly and effectively dissipate the heat generated by the lamp bead, thereby ensuring the service life of the entire heat separation circuit board. At the same time, the position where the lamp bead is installed on the entire circuit board is provided with a through hole, which ensures that the heat generated by the lamp bead can not only be dissipated through the copper substrate 1, but also part of the heat can be discharged into the air.

[0029] Example 2

[0030] like Figure 1 , Figure 2 and Figure 3As shown, a thermoelectric separation circuit board includes a copper substrate 1 and a copper foil circuit layer 3. The copper foil circuit layer 3 is arranged directly above the copper substrate 1. The copper substrate 1 is used to release the heat generated by the LED lamp beads. The copper foil circuit layer 3 is used to connect with the LED lamp beads, so as to facilitate the control of the operation of the LED lamp beads. An insulating layer 2 is provided between the copper foil circuit layer 3 and the copper substrate 1. The insulating layer 2 is used to separate the copper foil circuit layer 3 and the copper substrate 1. The copper substrate 1, the insulating layer 2 and the middle of the copper foil circuit layer 3 are all provided with mounting holes 12. The mounting holes 12 are used to install LED lamp beads and dissipate heat, which is convenient for the installation of LED lamp beads and also for the heat dissipation of the lamp beads. The bottom surface of the copper substrate 1 is evenly provided with heat dissipation grooves 11. The heat dissipation grooves 11 are used to increase the heat dissipation area of ​​the copper substrate 1, so that the copper substrate 1 can quickly discharge the heat generated by the LED lamp beads.

[0031] like Figure 1 As shown, the copper foil circuit layer 3, the insulating layer 2 and the copper substrate 1 are bonded and pressed together by adhesive resin, and the adhesive resin is an insulating thermal conductive resin. This structure of the thermally and electrically separated circuit board is stable, ensuring sufficient stability during use.

[0032] like Figure 2 As shown, the copper substrate 1 is provided with a plurality of connecting pins 13 along the inner side of the mounting hole 12, and the connecting pins 13 are extended toward the axial position of the mounting hole 12. The connecting plate is used to connect with the LED lamp beads, which facilitates the stable connection between the copper substrate 1 and the LED lamp beads. The heat dissipation groove 11 at the bottom of the copper substrate 1 is close to the mounting hole 12 but is not connected to the mounting hole 12. This structure can prevent the heat dissipation groove 11 from affecting the installation of the lamp beads, while not affecting the normal heat dissipation of the heat dissipation groove 11. The insulating layer 2 is made of epoxy resin glass fiber board and is used to separate the copper foil circuit layer 3 and the copper substrate 1.

[0033] like Figure 3 As shown, the corners of the upper surface of the copper foil circuit layer 3 are provided with fixing holes 32, and the edges of the fixing holes 32 are provided with insulating pads 31. The fixing holes 32 cooperate with the insulating pads 31 to fix the circuit board without affecting the normal use of the circuit board, ensuring that the circuit board can be stably fixed in a specified position. The copper foil circuit layer 3 is provided with a plurality of welding heads 33 around the mounting hole 12, which are used for welding the circuit board to the lamp beads, so as to facilitate the connection between the lamp beads and the circuit on the copper foil circuit layer 3.

[0034] like Figure 4 As shown, the upper surface of the copper foil circuit layer 3 is coated with a solder resist layer 34, and the solder resist layer 34 is used to protect the copper foil circuit layer 3 and prevent external conductive materials from contacting the copper foil circuit layer 3 and causing a short circuit.

[0035] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may be modified and varied in various ways. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A thermoelectric separation circuit board, comprising a copper substrate (1) and a copper foil circuit layer (3), characterized in that: The copper foil circuit layer (3) is arranged directly above the copper substrate (1), and an insulating layer (2) is provided between the copper foil circuit layer (3) and the copper substrate (1); the copper substrate (1), the insulating layer (2) and the copper foil circuit layer (3) are all provided with mounting holes (12) in the middle, the mounting holes (12) are used to mount LED lamp beads and dissipate heat, and the bottom surface of the copper substrate (1) is evenly provided with heat dissipation grooves (11), and the heat dissipation grooves (11) are used to increase the heat dissipation area of ​​the copper substrate (1).

2. A thermoelectric separation circuit board according to claim 1, characterized in that: The copper foil circuit layer (3), the insulating layer (2) and the copper substrate (1) are bonded and pressed together by bonding resin, and the bonding resin is an insulating thermal conductive resin.

3. The thermoelectric separation circuit board according to claim 1, characterized in that: The copper substrate (1) is provided with a plurality of connection pins (13) along the inner side of the mounting hole (12); the connection pins (13) are extended toward the axial center of the mounting hole (12); the connection pins (13) are used to connect to LED lamp beads; and the heat dissipation groove (11) at the bottom of the copper substrate (1) is close to the mounting hole (12) but is not in communication with the mounting hole (12).

4. The thermoelectric separation circuit board according to claim 1, characterized in that: The insulating layer (2) is made of epoxy resin glass fiber board and is used to separate the copper foil circuit layer (3) and the copper base plate (1).

5. The thermoelectric separation circuit board according to claim 1, characterized in that: The copper foil circuit layer (3) is provided with fixing holes (32) at the corners of the upper surface, and the edges of the fixing holes (32) are provided with insulating pads (31). The fixing holes (32) cooperate with the insulating pads (31) to fix the circuit board without affecting the normal use of the circuit board. The copper foil circuit layer (3) is provided with a plurality of welding heads (33) around the mounting holes (12) for welding the circuit board to the lamp beads.

6. A thermoelectric separation circuit board according to any one of claims 1 to 5, characterized in that: The upper surface of the copper foil circuit layer (3) is coated with a solder resist layer (34), and the solder resist layer (34) is used to protect the copper foil circuit layer (3) and prevent external conductive materials from contacting the copper foil circuit layer (3) and causing a circuit short circuit.

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