Simple testing device for storage chip

Abstract

The utility model discloses a simple test device for a memory chip, which comprises a test cabinet, a temperature control box arranged above the test cabinet, a ventilation pipe arranged on the temperature control box, a mounting plate arranged inside the test cabinet, a test cavity formed above the mounting plate, and a temperature control box arranged above the test cabinet, and the test host is connected to the interior of the test cabinet, and a sealing plate is arranged on the test host. According to the simple testing device for the storage chip, a first electric telescopic rod is controlled to work, a fixing plate and buffer plates can be driven to move, the distance between the two buffer plates can be adjusted, chips of different specifications can be conveniently fixed, the applicability of the device is enhanced, meanwhile, a plurality of buffer springs are arranged between the fixing plate and the buffer plates, and the stability of the device is improved. And when the chip is fixed, after the buffer plate is in contact with the chip, the buffer spring can be compressed for buffering, so that the instant clamping force is prevented from being too large, and the chip is prevented from being damaged.

Description

Technical Field

[0001] The utility model relates to the technical field of chip testing, in particular to a simple testing device for a storage chip. Background Art

[0002] Memory chips store data through internal storage particles. Usually, such products are used in normal temperature environments. However, in some special cases, the use of these products will be exposed to high or low temperature environments. Working in high or low temperature environments will have a serious impact on the storage function of the chip, so it is necessary to test the performance of memory chips in high or low temperature environments.

[0003] The announcement number is CN218158217U, which is a simple test device for memory chips that is easy to disassemble. The device includes a housing, a placement cavity and a test cavity are provided inside the housing, a first groove is provided at the bottom of the inner wall of the placement cavity, a dual-axis motor is fixedly connected in the first groove, and a first screw rod and a second screw rod are fixedly connected to the two output shafts of the dual-axis motor, respectively. By driving the motor, the driving gear and the driven gear can be driven to mesh and rotate, and then the support plate can be driven to rotate through the second rotating shaft, so as to achieve the purpose of driving the chip body to rotate, achieve the purpose of uniform heating or cooling, and ensure the accuracy of the test. However, most of these existing test devices are only convenient for fixing chips of specific specifications, and are not convenient for testing chips of different specifications, and have poor applicability. Utility Model Content

[0004] The utility model aims to solve the shortcomings existing in the prior art, and comprises a test cabinet, a temperature control box is arranged above the test cabinet, a ventilation duct is arranged on the temperature control box, and also comprises: a mounting plate, the mounting plate is arranged inside the test cabinet, a test cavity is formed above the mounting plate; a test host, the test host is connected to the inside of the test cabinet, a sealing plate is arranged on the test host; a fixing component, the fixing component is arranged above the tested host; a limiting component, the limiting component is connected to the inside of the test cabinet, and universal wheels are arranged around the limiting component; a first fan, the first fan is arranged on the top of the test cabinet; a second fan, the second fan is arranged on the side wall of the test cabinet; the fixing component comprises a first electric telescopic rod, the first electric telescopic rod is connected to the test host, the first electric telescopic rod is connected to one side of the fixing plate, a buffer plate is arranged on the other side of the fixing plate, and a plurality of buffer springs are arranged between the fixing plate and the buffer plate.

[0005] As a further description of the above technical solution: the lower side of the test host is connected to the support plate, the lower side of the support plate is connected to the second electric telescopic rod, and the second electric telescopic rod is connected to the partition.

[0006] As a further description of the above technical solution: the limiting assembly includes a third electric telescopic rod, the upper part of the third electric telescopic rod is connected to the partition, the lower part of the third electric telescopic rod is connected to the limiting seat, and the lower part of the limiting seat is glued with an anti-slip pad.

[0007] As a further description of the above technical solution: a sealing gasket is arranged on the sealing plate.

[0008] As a further description of the above technical solution: a card block is arranged below the test host, and a card slot adapted to the card block is opened on the support plate.

[0009] As a further description of the above technical solution: a sliding rod is connected to the lower side of the support plate, and a sliding cylinder matched with the sliding rod is arranged on the partition plate.

[0010] As a further description of the above technical solution: the first fan and the second fan are both arranged inside the test chamber, at least two second fans are arranged, and a temperature sensor is arranged inside the test chamber.

[0011] As a further description of the above technical solution: a control panel is arranged on the outside of the test cabinet, and a door panel and an inspection door are arranged on the test cabinet.

[0012] The above technical solution has the following advantages or beneficial effects:

[0013] The utility model can drive the fixing plate and the buffer plate to move and adjust the distance between the two buffer plates by controlling the operation of the first electric telescopic rod, so as to facilitate the fixing of chips of different specifications and enhance the applicability of the device. At the same time, a plurality of buffer springs are arranged between the fixing plate and the buffer plate, so that when the chip is fixed, after the buffer plate contacts the chip, the buffer spring will be compressed for buffering, so as to avoid excessive instantaneous clamping force and prevent damage to the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the structure of a simple testing device in one embodiment of the utility model;

[0015] Figure 2 It is a cross-sectional view of a simple testing device in one embodiment of the utility model;

[0016] Figure 3 for Figure 2 Schematic diagram of the structure of the fixed components in the simple test device;

[0017] Figure 4 for Figure 2 Schematic diagram of the structure of the sliding rod in the simple test device.

[0018] Legend:

[0019] 1. Test cabinet; 2. Temperature control box; 3. Ventilation duct; 4. Mounting plate; 5. Test chamber; 6. Test host; 7. Sealing plate; 8. Fixing assembly; 9. Limiting assembly; 10. Universal wheel; 11. First fan; 12. Second fan; 13. Support plate; 14. Second electric telescopic rod; 15. Partition; 16. Sealing pad; 17. Block; 18. Slot; 19. Slide rod; 20. Slide cylinder; 21. Temperature sensor; 22. Control panel; 23. Door panel; 24. Inspection door; 81. First electric telescopic rod; 82. Fixing plate; 83. Buffer plate; 84. Buffer spring; 91. Third electric telescopic rod; 92. Limiting seat; 93. Anti-slip pad. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] In the description of the present invention, it should be noted that the terms "vertical", "up", "down", "horizontal", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0022] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "set", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0023] like Figure 1-4As shown, a simple memory chip test device of the present invention comprises a test cabinet 1, a temperature control box 2 is arranged above the test cabinet 1, a ventilation duct 3 is arranged on the temperature control box 2, and further comprises: a mounting plate 4, the mounting plate 4 is arranged inside the test cabinet 1, a test cavity 5 is formed above the mounting plate 4; a test host 6, the test host 6 is connected to the inside of the test cabinet 1, and a sealing plate 7 is arranged on the test host 6; a fixing component 8, the fixing component 8 is arranged above the tested host 6; a limit component 9, the limit component 9 is connected to the inside of the test cabinet 1, and universal wheels 10 are arranged around the limit component 9; a first fan 11, the first fan 11 is arranged on the top of the test cabinet 1; the second fan 12, the second fan 12 is arranged on the side wall of the test cabinet 1; the fixing component 8 includes a first electric telescopic rod 81, the first electric telescopic rod 81 is connected to the test host 6, the first electric telescopic rod 81 is connected to one side of the fixing plate 82, a buffer plate 83 is arranged on the other side of the fixing plate 82, and a plurality of buffer springs 84 are arranged between the fixing plate 82 and the buffer plate 83, the lower part of the test host 6 is connected to the support plate 13, the lower part of the support plate 13 is connected to the second electric telescopic rod 14, and the second electric telescopic rod 14 is connected to the partition 15.

[0024] In this embodiment, a plurality of chips to be tested are placed vertically between two fixing components 8 for fixing, and then the door panel 23 is closed and the second electric telescopic rod 14 is controlled to work through the control panel 22, thereby driving the test host 6 and the sealing plate 7 to move upward, so that the test chip passes through the mounting plate 4 and is located in the test cavity 5. At the same time, the sealing plate 7 seals the through hole on the mounting plate 4. Then, according to the test needs, after setting the test temperature, the temperature control box 2 is operated, and the temperature inside the test cavity 5 is adjusted through the ventilation pipe 3. By controlling the operation of the first electric telescopic rod 81, the fixing plate 82 and the buffer plate 83 can be driven to move, and the distance between the two buffer plates 83 can be adjusted, so as to facilitate the fixing of chips of different specifications and enhance the applicability of the device. At the same time, a plurality of buffer springs 84 are arranged between the fixing plate 82 and the buffer plate 83, so that when the chip is fixed, after the buffer plate 83 contacts the chip, the buffer spring 84 will be compressed for buffering, so as to avoid excessive clamping force at the moment and prevent damage to the chip.

[0025] The first fan 11 and the second fan 12 work to quickly disperse the gas introduced into the ventilation pipe 3, so that the gas quickly fills the test area, thereby improving work efficiency.

[0026] like Figure 1 and Figure 2As shown, specifically, the limit assembly 9 includes a third electric telescopic rod 91, the third electric telescopic rod 91 is connected to the partition 15 at the top, the third electric telescopic rod 91 is connected to the limit seat 92 at the bottom, and the limit seat 92 is glued with an anti-skid pad 93 at the bottom; by controlling the third electric telescopic rod 91 to work, the limit seat 92 can be driven to rise and fall, but when the device needs to be moved, the limit seat 92 is driven to rise by controlling the third electric telescopic rod 91 to make the anti-skid pad 93 leave the ground, and the universal wheel 10 is used to facilitate the movement of the device and the adjustment of the position of the device, but when the device needs to be fixed, the limit seat 92 is driven to fall by controlling the third electric telescopic rod 91 to make the anti-skid pad 93 in close contact with the ground, thereby increasing the friction between the ground and the device, which is convenient for fixing the device.

[0027] like Figure 2 and Figure 3 As shown, specifically, a sealing gasket 16 is disposed on the sealing plate 7 ; by disposing the sealing gasket 16 on the sealing plate 7 , the sealing performance of the mounting plate 4 can be enhanced, and the stability of the temperature inside the test cavity 5 can be enhanced.

[0028] like Figure 1 and Figure 2 As shown, specifically, a card block 17 is provided under the test host 6, and a card slot 18 adapted to the card block 17 is opened on the support plate 13; by embedding the card block 17 into the card slot 18, the test host 6 can be stably fixed on the support plate 13, and by pulling the test host 6 horizontally, the card block 17 can slide out of the card slot 18, which facilitates the disassembly of the test host 6, the inspection and replacement of the test host 6, and enhances the practicability of the device.

[0029] like Figure 2 and Figure 4 As shown, specifically, a slide bar 19 is connected to the lower side of the support plate 13, and a slide cylinder 20 matched with the slide bar 19 is provided on the partition plate 15; the slide bar 19 is limited by the slide cylinder 20, so that the slide bar 19 can be vertically lifted and lowered in the slide cylinder 20, so that the slide bar 19 can limit the support plate 13, so that the test host 6 on the support plate 13 can be stably lifted and lowered, thereby enhancing the stability of the device.

[0030] like Figure 1 and Figure 2 As shown, specifically, the first fan 11 and the second fan 12 are both arranged inside the test chamber 5, at least two second fans 12 are arranged, and a temperature sensor 21 is arranged inside the test chamber 5; the temperature inside the test chamber 5 can be monitored in real time by the temperature sensor 21, and displayed on the display screen on the control panel 22, so as to facilitate the operation of the staff.

[0031] like Figure 1 and Figure 2As shown, specifically, a control panel 22 is provided on the outside of the test cabinet 1, and a door panel 23 and an inspection door 24 are provided on the test cabinet 1; the control panel 22 facilitates the control of the device to work, and the inspection door 24 facilitates the inspection of the device.

[0032] Working principle: The staff places multiple chips to be tested vertically between two fixing components 8 for fixing, then closes the door panel 23 and controls the second electric telescopic rod 14 to work through the control panel 22, driving the test host 6 and the sealing plate 7 to move upward, so that the test chip passes through the mounting plate 4 and is located in the test cavity 5. At the same time, the sealing plate 7 seals the through hole on the mounting plate 4. Then, according to the test needs, after setting the test temperature, the temperature control box 2 works, and the temperature inside the test cavity 5 is adjusted through the ventilation pipe 3. By controlling the first electric telescopic rod 81 to work, the fixing plate 82 and the buffer plate 83 can be driven to move, and the distance between the two buffer plates 83 can be adjusted, so as to facilitate the fixing of chips of different specifications and enhance the applicability of the device. At the same time, a plurality of buffer springs 84 are arranged between the fixing plate 82 and the buffer plate 83, so that when the chip is fixed, after the buffer plate 83 contacts the chip, the buffer spring 84 will be compressed internally for buffering, so as to avoid excessive clamping force at the moment and prevent damage to the chip.

[0033] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0034] The preferred embodiments of the utility model disclosed above are only used to help explain the utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the utility model to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that technicians in the relevant technical field can well understand and use the utility model. The utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A simple memory chip test device, comprising a test cabinet (1), a temperature control box (2) is arranged above the test cabinet (1), and a ventilation pipe (3) is arranged on the temperature control box (2), characterized in that: Also includes: A mounting plate (4), the mounting plate (4) being arranged inside the test cabinet (1), and a test cavity (5) being formed above the mounting plate (4); A test host (6), the test host (6) being connected to the inside of the test cabinet (1), and a sealing plate (7) being provided on the test host (6); A fixing component (8), wherein the fixing component (8) is arranged above the host (6) under test; A limit assembly (9), the limit assembly (9) being connected to the inside of the test cabinet (1), and the limit assembly (9) being provided with universal wheels (10) around the periphery; A first fan (11), the first fan (11) being arranged on the top of the test cabinet (1); A second fan (12), the second fan (12) being arranged on a side wall of the test cabinet (1); The fixing assembly (8) comprises a first electric telescopic rod (81), the first electric telescopic rod (81) being connected to the test host (6), the first electric telescopic rod (81) being connected to one side of a fixing plate (82), a buffer plate (83) being provided on the other side of the fixing plate (82), and a plurality of buffer springs (84) being provided between the fixing plate (82) and the buffer plate (83).

2. A simple memory chip test device according to claim 1, characterized in that: The lower part of the test host (6) is connected to a support plate (13), the lower part of the support plate (13) is connected to a second electric telescopic rod (14), and the second electric telescopic rod (14) is connected to a partition plate (15).

3. A simple memory chip testing device according to claim 1, characterized in that: The limiting assembly (9) comprises a third electric telescopic rod (91), the upper portion of the third electric telescopic rod (91) is connected to the partition (15), the lower portion of the third electric telescopic rod (91) is connected to a limiting seat (92), and the lower portion of the limiting seat (92) is glued with an anti-slip pad (93).

4. The simple memory chip testing device according to claim 1, characterized in that: A sealing gasket (16) is provided on the sealing plate (7).

5. The simple memory chip testing device according to claim 2, characterized in that: A card block (17) is arranged below the test host (6), and a card slot (18) adapted to the card block (17) is provided on the support plate (13).

6. A simple memory chip testing device according to claim 2, characterized in that: A sliding rod (19) is connected below the support plate (13), and a sliding cylinder (20) adapted to the sliding rod (19) is arranged on the partition plate (15).

7. The simple memory chip testing device according to claim 1, characterized in that: The first fan (11) and the second fan (12) are both arranged inside the test chamber (5), at least two second fans (12) are arranged, and a temperature sensor (21) is arranged inside the test chamber (5).

8. The simple memory chip testing device according to claim 1, characterized in that: A control panel (22) is arranged on the outside of the test cabinet (1), and a door panel (23) and an inspection door (24) are arranged on the test cabinet (1).

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