Cleaning system

Abstract

The utility model provides a cleaning system, and relates to the technical field of cleaning. The cleaning system comprises a cleaning device, the cleaning device comprises a loading jig, a fixing assembly, a cleaning assembly and a transferring assembly, a plurality of containing grooves are formed in one side of the loading jig, each containing groove is used for containing a Micro-LED array chip, through holes are formed in the side, away from the containing grooves, of the loading jig, and the through holes communicate with the containing grooves; the fixing assembly comprises a vacuum pump, the vacuum pump is connected with the through hole of the loading jig, and the fixing assembly is used for adsorbing the Micro-LED array chip in the placing groove; the cleaning assembly comprises a cleaning container, and the cleaning container is used for containing cleaning liquid; and the transfer assembly is used for placing or taking the loading jig out of the cleaning container. The problem that the chip cleaning effect is different can be solved, and the cleaning efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of cleaning technology, and in particular to a cleaning system. Background Art

[0002] Before preparing the Micro-LED (Micro light emitting diode) micro display screen, the Micro-LED array chip needs to be cleaned. The cleaning process needs to ensure that the photoresist, wax or other contaminants on the chip welding surface are effectively removed without damaging the chip surface coating and electrical properties.

[0003] In the related art, there are problems such as differences in chip cleaning effects and low cleaning efficiency. Utility Model Content

[0004] The purpose of this application is to provide a cleaning system.

[0005] The technical solutions adopted in this application are as follows:

[0006] In a first aspect, an embodiment of the present application provides a cleaning system, the cleaning system comprising a cleaning device, the cleaning device comprising:

[0007] A loading jig, wherein a plurality of placement grooves are provided on one side of the loading jig, each of the placement grooves is used to place a Micro-LED array chip, and a through hole is provided on a side of the loading jig away from the placement groove, the through hole being connected to the placement groove;

[0008] A fixing component, the fixing component comprising a vacuum pump, the vacuum pump being connected to the through hole of the loading fixture, and the fixing component being used for adsorbing the Micro-LED array chip in the placement groove;

[0009] A cleaning component, the cleaning component comprising a cleaning container, the cleaning container being used to hold a cleaning liquid;

[0010] A transfer component is used to place or remove the loading fixture in the cleaning container.

[0011] In one of the embodiments of the first aspect, the fixing assembly further includes a storage element, wherein the storage element is connected to the vacuum pump, and the storage element is used to store the cleaning fluid sucked in by the vacuum pump.

[0012] In one embodiment of the first aspect, the fixing assembly further includes a steam-water separator, and the steam-water separator is connected to the vacuum pump and the storage element respectively.

[0013] In one embodiment of the first aspect, a heater is disposed in the cleaning container, and the heater is used to heat the cleaning liquid contained in the cleaning container.

[0014] In one of the embodiments of the first aspect, an ultrasonic transmitter is further disposed in the cleaning container, and the ultrasonic transmitter is used to vibrate microbubbles in the cleaning liquid contained in the cleaning container.

[0015] In one of the embodiments of the first aspect, the transfer assembly includes a first robotic arm and a clamp, wherein the clamp is installed at the working end of the first robotic arm, and the clamp is used to clamp the loading jig.

[0016] In one embodiment of the first aspect, the cleaning system further comprises:

[0017] A loading device, the loading device is used to place the Micro-LED array chip on the loading fixture;

[0018] A material unloading device is used to take the cleaned workpiece out of the loading fixture.

[0019] In one of the embodiments of the first aspect, the loading device includes a film expanding mechanism, a lifting mechanism and a material suction and swinging plate mechanism, the film expanding mechanism is used to increase the distance between two adjacent Micro-LED array chips, the lifting mechanism is used to reduce the bonding strength between the Micro-LED array chip and the blue film, and the material suction and swinging plate mechanism is used to absorb the Micro-LED array chip and place it on the loading jig.

[0020] In one of the embodiments of the first aspect, the unloading device includes a clamp and a second robotic arm, wherein the clamp is connected to the working end of the second robotic arm, and the clamp is used to grab the cleaned Micro-LED array chip and take it out from the device fixture.

[0021] In one embodiment of the first aspect, the loading device includes a film expansion mechanism, a lifting mechanism, and a material suction and swinging plate mechanism, wherein the film expansion mechanism is used to increase the distance between two adjacent Micro-LED array chips, the lifting mechanism is used to reduce the bonding strength between the Micro-LED array chip and the blue film, and the material suction and swinging plate mechanism is used to absorb the Micro-LED array chip and place it on the loading fixture;

[0022] There are four cleaning containers, and acetone, isopropyl alcohol, hydrochloric acid and pure water are placed in the four cleaning containers respectively. Each of the cleaning containers is provided with a heater, an ultrasonic transmitter and a liquid discharge port. The heater is used to heat the cleaning liquid contained in the cleaning container, the ultrasonic transmitter is used to vibrate the microbubbles in the cleaning liquid contained in the cleaning container, and the liquid discharge port is used to discharge the cleaning liquid;

[0023] The fixing assembly further comprises a storage element, which is a dual-purpose gas and liquid storage tank, the dual-purpose gas and liquid storage tank is connected to the vacuum pump and stores the cleaning liquid sucked in by the vacuum pump;

[0024] The cleaning system further includes a drying device, which includes a blowing mechanism and / or a drying mechanism, and the blowing mechanism and the drying mechanism are used to remove moisture from the surface of the cleaned Micro-LED array chip;

[0025] The unloading device includes a clamp and a second robotic arm, wherein the clamp is connected to the working end of the second robotic arm, and the clamp is used to grab the cleaned Micro-LED array chip and take it out from the device fixture.

[0026] This application proposes a cleaning system. Compared with the related art, this application places the Micro-LED array chips to be cleaned in the placement slot of the loading fixture in sequence through a loading device, and then the chips are adsorbed on the loading fixture under the action of a vacuum pump, and then the loading fixture and the chips are placed in the cleaning container together through a transfer component. After the chips are cleaned by the cleaning liquid, the transfer component removes the loading fixture from the cleaning container, so that the chips can be taken out in batches. Compared with the related art, this application can perform batch cleaning and transfer of Micro-LED array chips, thereby improving the cleaning efficiency and ensuring that the cleaning effect of the same batch of Micro-LED array chips is the same. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0028] Figure 1 A schematic diagram of the structure of a cleaning device in some embodiments of the present application is shown;

[0029] Figure 2 It shows a schematic diagram of the structure of a loading fixture in some embodiments of the present application;

[0030] Figure 3 A schematic diagram of the operation flow structure of a cleaning device in some embodiments of the present application is shown;

[0031] Figure 4 A schematic diagram of the structure of a cleaning system in some embodiments of the present application is shown;

[0032] Figure 5 A schematic diagram of the operating flow structure of the cleaning system in some embodiments of the present application is shown.

[0033] Description of main component symbols:

[0034] 1000-cleaning system; 100-cleaning device; 110-loading fixture; 111-placing slot; 112-through hole; 120-fixing component; 121-vacuum pump; 122-storage element; 123-gas-water separator; 130-cleaning component; 131-cleaning container; 1311-heater; 1312-ultrasonic transmitter; 140-transfer component; 141-first robot arm; 142-clamp; 150-control component; 160-solenoid valve; 200-loading device; 300-unloading device; 400-drying device. DETAILED DESCRIPTION

[0035] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0036] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0037] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0038] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0039] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0040] The general structure of a Micro-LED display screen is that the IC (Integrated Circuit) driver chip at the bottom and the Micro-LED array chip at the top are welded together through flip-chip technology. The Micro-LED array chip needs to be cleaned before flip-chip welding. The cleaning process needs to ensure that the photoresist, wax and other contaminants on the chip welding surface are effectively removed without damaging the chip surface coating and electrical properties.

[0041] The inventor of the present application found that in the related art, the equipment used for chip cleaning is generally suitable for cleaning large-size chips of 2 inches, 4 inches or above, while the size of Micro-LED array chips is relatively small, such as 0.18 inches, 0.13 inches or below. The use of conventional chip cleaning equipment will cause the chip to collide and damage the chip during the cleaning process because the chip size is too small to be fixed. During the degumming and cleaning of Micro-LED array chips, the Micro-LED array chips need to be cleaned with a variety of different solvents. Each Micro-LED array chip is put into the solvent and taken out of the solvent by manual tweezers, which is prone to the following problems: the chip-by-chip clamping makes it impossible to unify the soaking time of each chip in the solvent, and the cleaning effect of each chip is different. The soaking time of the first chip and the last chip in the solvent differs greatly. This time difference will lead to obvious differences in the cleaning effect of the LED. In addition, because the chip is very small and thin, it is easy to slip when manually picking up the chip with tweezers, resulting in chip scratches, edge collapse and other defects. During the entire cleaning process, each chip needs to be picked up by tweezers many times, which requires very high operation requirements for personnel. It is difficult to control chip scratches and edge collapse. At the same time, the production efficiency is low, and multiple picking is time-consuming and labor-intensive.

[0042] For ease of understanding, in this application, Micro-LED array chip refers to an independent chip formed by cutting from a Micro-LED wafer according to the design size. Each Micro-LED array chip includes multiple single LEDs (die) distributed in an array to form a pixel unit to achieve higher brightness and wider color gamut coverage.

[0043] like Figure 1 As shown, the embodiment of the present application provides a cleaning system 1000, which can improve the cleaning effect of the Micro-LED array chip, reduce the problem of effect difference, and improve the cleaning efficiency.

[0044] The cleaning system 1000 includes a cleaning device 100, which includes a loading jig 110, a fixing component 120, a cleaning component 130 and a transfer component 140, wherein a plurality of placement slots 111 are provided on one side of the loading jig 110, each placement slot 111 is used to place a Micro-LED array chip, and a through hole 112 is provided on the side of the loading jig 110 away from the placement slot 111, and the through hole 112 is connected to the placement slot 111. The fixing component 120 includes a vacuum pump 121, which is connected to the through hole 112 of the loading jig 110 and is used to adsorb the Micro-LED array chip in the placement slot 111. The cleaning component 130 includes a cleaning container 131 and a transfer component 140, and the cleaning container 131 is used to hold a cleaning solution. The transfer component 140 is used to place or remove the loading jig 110 in the cleaning container 131.

[0045] Combined Figure 2 As shown, the loading fixture 110 can be a flat plate structure with a plurality of placement grooves 111 on its surface. The size of each placement groove 111 is slightly larger than the size of the Micro-LED array chip to facilitate the placement of the chip and to restrict the sides of the chip to enhance the fixing effect of the chip. It should be noted that in this application, a plurality refers to a positive integer greater than one. In order to meet the batch cleaning requirements in industrial production, the number of placement grooves 111 can be fifty, one hundred, two hundred, three hundred, four hundred, five hundred, etc.

[0046] The vacuum pump 121 is connected to all the through holes 112 of the loading jig 110 through pipes. Since the through holes 112 are connected to the placement grooves 111, when the vacuum pump 121 performs vacuum processing, the side of the chip close to the through holes 112 is adsorbed onto the inner bottom surface of the placement grooves 111, so that all the chips placed in the placement grooves 111 are fixed on the loading jig 110.

[0047] The cleaning container 131 is provided with a cleaning liquid for removing contaminants from the chip surface. After the chip is fixed on the loading fixture 110, the loading fixture 110 can be clamped by the transfer component 140, and the loading fixture 142 can be immersed in the cleaning liquid in the cleaning container 131. After the set immersion time is completed, the transfer component 140 takes the loading fixture 110 out of the cleaning container 131 to complete the chip cleaning operation.

[0048] The size of each Micro-LED array chip is about 2mm*4mm*0.1mm. Since the chip size is too small, it is difficult to fix, and it is easy to cause chip damage when clamping and cleaning the chip. In this embodiment, through the cooperation of the loading fixture 110 and the fixing component 120, multiple chips can be sucked and fixed at one time, and under the drive of the transfer component 140, the loading fixture 110 and the chip are simultaneously put into the cleaning container 131, and a large number of chips are cleaned at the same time, thereby improving the cleaning efficiency. At the same time, the cleaning time of multiple chips cleaned at one time is the same. Only the cleaning time needs to be set to improve the difference in cleaning effects of different chips. In addition, during the cleaning process, the chip is not directly clamped, which can effectively reduce the occurrence of scratches, edge collapse and other problems when a single chip is clamped.

[0049] In some embodiments, the fixing assembly 120 further includes a storage element 122 , which is connected to the vacuum pump 121 , and is used to store the cleaning fluid sucked in by the vacuum pump 121 .

[0050] The storage component 122 can be a dual-purpose gas and liquid storage tank, which can store gas and liquid at the same time. Before cleaning the chip, the vacuum pump 121 can be turned on to make the inside of the gas and liquid storage tank reach a set vacuum value. After the chip is adsorbed and fixed, the vacuum pump 121 can be turned off. The chip remains adsorbed and fixed under the negative pressure of the gas and liquid storage tank. After cleaning, the vacuum can be broken to make the chip fall off the loading fixture 110.

[0051] At the same time, since the gas-liquid storage tank has the function of storing liquid, when the chip is placed in the cleaning liquid, due to the adsorption effect of the gas-liquid storage tank, an appropriate amount of cleaning liquid is sucked into the gas-liquid storage tank through the through hole 112 of the loading fixture 110 and stored in the tank body, ensuring that the liquid will not enter the vacuum pump 121 and cause equipment failure or safety accidents, thereby meeting the normal operation of the vacuum system. At the same time, the absorbed cleaning liquid needs to flow from the surface of the chip to the back, and finally be sucked into the gas-liquid storage tank, so that both the front and back sides of the chip can be effectively cleaned, further improving the cleaning effect.

[0052] In some embodiments, the fixing assembly 120 further includes a steam-water separator 123 , and the steam-water separator 123 is connected to the vacuum pump 121 and the storage element 122 , respectively.

[0053] The steam-water separator 123 is connected to the vacuum pump 121 and the storage element 122 through pipelines, respectively, and can effectively separate the gas mixed with water. During the vacuum operation of the vacuum pump 121, the gas flows from the storage element 122 to the steam-water separator 123, and it is inevitable that some cleaning liquid is mixed. There is a vertically arranged nano-filtration filter in the steam-water separator 123. A large amount of steam and compressed air containing water enter the separator and move downward in a swirling centrifugal manner, because the density of gas and liquid is different. In the process where both need to pass through the filter together, the liquid will be filtered and attached to the filter, while the gas can pass through the filter. The liquid left on the filter will be diverted to the bottom of the separator to condense and discharge, ensuring that the liquid will not enter the vacuum pump 121 to cause equipment failure or safety accidents, and maintain the stable operation of the vacuum pump 121.

[0054] In some embodiments, a solenoid valve 160 is provided between the storage element 122 and the loading fixture 110 , and between the vacuum pump 121 and the steam-water separator 123 .

[0055] The loading fixture 110 and the storage element 122, the storage element 122 and the steam-water separator 123, and the vacuum pump 121 and the steam-water separator 123 are all connected through pipelines. At the same time, corresponding solenoid valves 160 can be set on these connecting pipelines to control the opening and closing conditions of different pipelines.

[0056] Exemplarily, a first solenoid valve 160 is provided between the loading jig 110 and the storage element 122 , a second solenoid valve 160 is provided between the vacuum pump 121 and the steam-water separator 123 , and in addition, a vacuum breaking branch pipe is provided between the first solenoid valve 160 and the loading jig 110 , and a third solenoid valve 160 is provided on the vacuum breaking branch pipe.

[0057] Combined Figure 3 As shown, during the vacuuming process, the first solenoid valve 160 and the third solenoid valve 160 are closed, the second solenoid valve 160 is opened, and the vacuum pump 121 is started, so that the storage element 122 is in a set vacuum negative pressure state, and then the chip is placed in the placement groove 111 of the loading fixture, the first solenoid valve 160 is opened, and the vacuum pump 121 is closed, and the chip is fixed by the negative pressure adsorption of the storage element 122. After the chip is cleaned, the third solenoid valve 160 can be opened to allow the atmosphere to enter the storage element 122, and the vacuum is broken, and the chip falls off the loading fixture 110.

[0058] In addition, the cleaning device 100 also includes a control component 150, which can be a processing computer, and a PLC (Programmable Logic Controller) program is set inside the processing computer. The first solenoid valve 160, the second solenoid valve 160 and the third solenoid valve 160 are all electrically connected to the control component 150 to realize automatic opening and closing of each solenoid valve 160 through the PLC program.

[0059] In some embodiments, a heater 1311 is disposed in the cleaning container 131 , and the heater 1311 is used to heat the cleaning liquid contained in the cleaning container 131 .

[0060] The heater 1311 may be an electromagnetic heating device. The reaction temperature of the cleaning liquid may be increased by setting the heater 1311 , and the cleaning effect of the cleaning liquid may be improved by setting the optimal cleaning temperature of the cleaning liquid.

[0061] In some embodiments, an ultrasonic transmitter 1312 is further disposed in the cleaning container 131 , and the ultrasonic transmitter 1312 is used to vibrate microbubbles in the cleaning liquid contained in the cleaning container 131 .

[0062] The ultrasonic transmitter 1312 can emit cleaning ultrasound to vibrate the microbubbles in the cleaning solution. When the chip is placed in the cleaning solution, the ultrasonic vibration causes the pollutants on the chip to fall off, further improving the cleaning effect.

[0063] In some embodiments, the transfer assembly 140 includes a first robotic arm 141 and a clamp 142 . The clamp 142 is installed at the working end of the first robotic arm 141 , and the clamp 142 is used to clamp the loading fixture 110 .

[0064] The robot arm may be provided with multiple degrees of freedom. After the clamp 142 clamps the loading fixture 110, the loading fixture 110 is placed in the cleaning container 131 and the chip is immersed in the cleaning liquid through the control of the first robot arm 141. Similarly, after the cleaning is completed, the clamp 142 and the loading fixture 110 can be manipulated by the first robot arm 141 to fall off the cleaning container 131.

[0065] like Figure 4 As shown, the cleaning system 1000 includes the cleaning device 100, the loading device 200 and the unloading device 300 in any of the above embodiments. The loading device 200 is used to place the Micro-LED array chip on the loading fixture 110, and the unloading device 300 is used to take the cleaned workpiece out of the loading fixture 110.

[0066] In some embodiments, the loading device 200 includes a film expansion mechanism, a lifting mechanism and a material suction and swing plate mechanism. The film expansion mechanism is used to increase the distance between two adjacent Micro-LED array chips, the lifting mechanism is used to reduce the bonding strength between the Micro-LED array chip and the blue film, and the material suction and swing plate mechanism is used to absorb the Micro-LED array chip and place it on the loading fixture 110.

[0067] Exemplarily, after the Micro-LED wafer is bonded to the blue film, the wafer is cut to form a plurality of Micro-LED array chips. Then, a film expansion mechanism is used to expand the blue film with the Micro-LED array chip adhered thereto, so that the Micro-LED array chip is dispersed as the blue film expands, increasing the spacing between adjacent Micro-LED array chips, and avoiding too small spacing between the Micro-LED array chips, which causes contact wear during operation. Subsequently, the Micro-LED array chip is lifted from the side of the blue film away from the Micro-LED array chip by the ejector pin of the lifting mechanism, so that the viscosity between the dispersed Micro-LED array chip and the blue film is reduced, which is convenient for subsequent suction and transportation. Finally, the suction and plate swinging mechanism includes a suction cup and a robotic arm, which sucks the Micro-LED array chip with reduced adhesive viscosity through the suction cup, and places it on the loading fixture 110 in sequence.

[0068] In some embodiments, the unloading device 300 includes a clamp and a second robotic arm, the clamp is connected to the working end of the second robotic arm, and the clamp is used to grab the cleaned Micro-LED array chip and take it out from the device fixture.

[0069] For example, the unloading device 300 may include a clamp and a second mechanical arm. The part of the clamp that contacts the Micro-LED array chip may be made of a material with low hardness such as polypropylene or polytetrafluoroethylene, which is not easy to damage the chip and can prevent slipping. The structure may be divided into a two-claw structure or a four-claw structure to accommodate Micro-LED array chips of different sizes. The second mechanical arm is used to control the operation of the clamp, and the cleaned Micro-LED array chips are placed in the storage tray in sequence.

[0070] like Figure 5 As shown, in some embodiments, the loading device 200 includes a film expansion mechanism, a lifting mechanism and a material suction and swinging plate mechanism. The film expansion mechanism is used to increase the distance between two adjacent Micro-LED array chips, the lifting mechanism is used to reduce the bonding strength between the Micro-LED array chip and the blue film, and the material suction and swinging plate mechanism is used to absorb the Micro-LED array chip and place it on the loading fixture 110.

[0071] There are four cleaning containers 131, which respectively contain acetone, isopropyl alcohol, hydrochloric acid and pure water. Each cleaning container 131 is provided with a heater 1311, an ultrasonic transmitter 1312 and a liquid discharge port. The heater 1311 is used to heat the cleaning liquid contained in the cleaning container 131, the ultrasonic transmitter 1312 is used to vibrate the microbubbles in the cleaning liquid contained in the cleaning container 131, and the liquid discharge port is used to discharge the cleaning liquid.

[0072] During the cleaning process, the transfer component 140 can clamp the loading fixture 110 and place it in acetone, isopropyl alcohol, and hydrochloric acid in turn, and set the cleaning time in each cleaning container 131 respectively. After completing the cleaning with the cleaning liquid, place it in pure water and use pure water to soak and clean it.

[0073] Of course, in other embodiments, the number of cleaning containers 131 is not limited to four, and the types of cleaning liquids are not limited to the above four. The number of cleaning containers 131 and the types of cleaning liquids can be reasonably set according to actual cleaning conditions and types of pollutants.

[0074] The fixing assembly 120 further includes a storage element 122 , which is a dual-purpose gas and liquid storage tank. The dual-purpose gas and liquid storage tank is connected to the vacuum pump 121 and stores the cleaning liquid sucked in by the vacuum pump 121 .

[0075] A plurality of storage elements 122 may be provided to store different types of cleaning liquids. In this embodiment, two storage elements 122 may be provided, and the two storage elements 122 are respectively a gas storage / organic solvent storage tank and a gas storage / acid solvent storage tank.

[0076] The cleaning system 1000 further includes a drying device 400, and the drying device 400 includes a blow-drying mechanism. In some other embodiments, the drying device 400 further includes a drying mechanism.

[0077] The drying device 400 may include a blowing mechanism and a drying mechanism at the same time, wherein the blowing mechanism and the drying mechanism are a nitrogen blowing device and a vacuum drying device respectively. After the chip cleaning is completed, the transfer component 140 may transfer the chip to the drying device 400, and the chip is sequentially subjected to nitrogen blowing and vacuum drying to improve the drying effect of the chip.

[0078] The unloading device 300 includes a clamp and a second robotic arm. The clamp is connected to the working end of the second robotic arm. The clamp is used to grab the cleaned Micro-LED array chip and take it out from the device fixture.

[0079] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0080] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A cleaning system, characterized in that: The cleaning system comprises a cleaning device, and the cleaning device comprises: A loading jig, wherein a plurality of placement grooves are provided on one side of the loading jig, each of the placement grooves is used to place a Micro-LED array chip, and a through hole is provided on a side of the loading jig away from the placement groove, the through hole being connected to the placement groove; A fixing component, the fixing component comprising a vacuum pump, the vacuum pump being connected to the through hole of the loading fixture, and the fixing component being used for adsorbing the Micro-LED array chip in the placement groove; A cleaning component, the cleaning component comprising a cleaning container, the cleaning container being used to hold a cleaning liquid; A transfer component is used to place or remove the loading fixture in the cleaning container.

2. The cleaning system according to claim 1, characterized in that: The fixing assembly further comprises a storage element, wherein the storage element is connected to the vacuum pump and is used for storing the cleaning fluid sucked in by the vacuum pump.

3. The cleaning system according to claim 2, characterized in that: The fixing assembly further comprises a steam-water separator, and the steam-water separator is respectively connected to the vacuum pump and the storage element.

4. The cleaning system according to claim 1, characterized in that: A heater is arranged in the cleaning container, and the heater is used to heat the cleaning liquid contained in the cleaning container.

5. The cleaning system according to claim 1, characterized in that: An ultrasonic transmitter is also arranged in the cleaning container, and the ultrasonic transmitter is used to vibrate the microbubbles in the cleaning liquid contained in the cleaning container.

6. The cleaning system according to claim 1, characterized in that: The transfer assembly includes a first robotic arm and a clamp, wherein the clamp is installed at the working end of the first robotic arm and is used to clamp the loading jig.

7. The cleaning system according to any one of claims 1 to 6, characterized in that: The cleaning system also includes: A loading device, the loading device is used to place the Micro-LED array chip on the loading fixture; A material unloading device is used to take the cleaned workpiece out of the loading fixture.

8. The cleaning system according to claim 7, characterized in that: The loading device includes a film expansion mechanism, a lifting mechanism and a material suction and swinging plate mechanism. The film expansion mechanism is used to increase the distance between two adjacent Micro-LED array chips, the lifting mechanism is used to reduce the bonding strength between the Micro-LED array chip and the blue film, and the material suction and swinging plate mechanism is used to absorb the Micro-LED array chip and place it on the loading fixture.

9. The cleaning system according to claim 7, characterized in that: The unloading device includes a clamp and a second robotic arm, wherein the clamp is connected to the working end of the second robotic arm, and the clamp is used to grab the cleaned Micro-LED array chip and take it out from the loading fixture.

10. The cleaning system according to claim 7, characterized in that: The loading device includes a film expansion mechanism, a lifting mechanism and a material suction and swinging mechanism. The film expansion mechanism is used to increase the distance between two adjacent Micro-LED array chips, the lifting mechanism is used to reduce the bonding strength between the Micro-LED array chip and the blue film, and the material suction and swinging mechanism is used to absorb the Micro-LED array chip and place it on the loading fixture; There are four cleaning containers, and acetone, isopropyl alcohol, hydrochloric acid and pure water are placed in the four cleaning containers respectively. Each of the cleaning containers is provided with a heater, an ultrasonic transmitter and a liquid discharge port. The heater is used to heat the cleaning liquid contained in the cleaning container, the ultrasonic transmitter is used to vibrate the microbubbles in the cleaning liquid contained in the cleaning container, and the liquid discharge port is used to discharge the cleaning liquid; The fixing assembly further comprises a storage element, which is a dual-purpose gas and liquid storage tank, the dual-purpose gas and liquid storage tank is connected to the vacuum pump and stores the cleaning liquid sucked in by the vacuum pump; The cleaning system further includes a drying device, which includes a blowing mechanism and / or a drying mechanism, and the blowing mechanism and the drying mechanism are used to remove moisture from the surface of the cleaned Micro-LED array chip; The unloading device includes a clamp and a second robotic arm, wherein the clamp is connected to the working end of the second robotic arm, and the clamp is used to grab the cleaned Micro-LED array chip and take it out from the loading fixture.

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