Sheet wafer clamping device
By designing a thin wafer clamping device, the rotating body and clamping jaws can be used to achieve the gripping, transporting and automatic flipping of wafers, the pollution and damage caused by manual operation in the prior art are solved, and the safety and efficiency of operation are improved.
Patent Information
- Application Number
- CN202421413571.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-19
- Publication Date
- 2025-03-21
- Estimated Expiration
- 2034-06-19
AI Technical Summary
In the prior art, the transport and flip of wafers mainly relies on manual operations, which leads to the wafer surface being easily contaminated, the operation is fine and time-consuming, and increases the risk of damage and operational errors.
A thin wafer clamping device is designed, including a grip, a bracket and two clamping devices. The rotating body and the clamping jaw are used to achieve the clamping, transport and automatic flip of the wafer, and the opening and closing of the clamping jaw and the rotation of the rotating body are realized through the gas circuit control system.
It realizes convenient transport and automatic flip of wafers, reduces pollution and operational errors caused by manual contact, and reduces the probability of wafer damage.
Smart Images
Figure CN222653941U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor technology, and in particular to a thin wafer clamping device. Background Art
[0002] With the rapid development of semiconductor technology, wafers, as the core material for integrated circuit manufacturing, have a direct impact on the performance and cost of electronic products due to their quality and production efficiency. During wafer manufacturing and testing, for example, from the wafer back thinning process to the front film peeling process, the wafer needs to be transported and flipped for subsequent processing and testing.
[0003] Currently, the transfer and flipping of wafers in the testing process mainly rely on manual operation. Operators need to wear special gloves and manually transfer and flip the wafers to the designated workstations.
[0004] Since operators need to directly touch the wafer surface with their hands, it is difficult to completely avoid contamination of the wafer surface even if they wear gloves. This contamination may come from particles, grease or other contaminants on the gloves, which may affect the electrical performance and reliability of the wafer.
[0005] The transfer and flipping of wafers require very delicate and careful operations to avoid damage to the wafers. This not only requires high skills of the operators, but also makes the operators easily fatigued during long-term operation, increasing the risk of operating errors. It can be seen that the process of manually transferring and flipping wafers is not easy, and a little carelessness may cause wafer damage. Utility Model Content
[0006] The purpose of the embodiments of the present application is to provide a thin wafer clamping device, which can clamp the wafer through a tool to achieve convenient transportation and automatic flipping, and also eliminate the contamination caused by manual contact with the wafer.
[0007] In the first aspect, a thin wafer clamping device is provided, comprising a handle, a bracket and two clamping devices. A first switch and a second switch are arranged on the handle. One end of the bracket is mounted on the handle, and the other end is provided with two extensions mounted opposite to each other. The two clamping devices are respectively mounted on the two extensions in a symmetrical form; the clamping device comprises a rotating body and a clamping claw, and the clamping claw is mounted on the rotating body. The first switch and the second switch are connected to the clamping device, the first switch is used to control the rotation angle of the rotating body, and the second switch is used to control the opening and closing of the clamping claw. The clamping claws of the two clamping devices face each other, and the movements are synchronized and completely symmetrical; when in use, the thin wafer is placed between the two clamping claws and is clamped by the edges of the clamping claws.
[0008] In one feasible solution, the clamping device is a rotary clamping finger cylinder, comprising a cylinder body, a rotating body and a clamping claw;
[0009] The cylinder body is fixedly mounted on an extension portion of the bracket, a rotating body is mounted on the side of the cylinder body facing the extension portion, and a clamping claw is mounted on the rotating body;
[0010] A first control air circuit and a second control air circuit are provided in the cylinder body; an air flow with a predetermined pressure is introduced into the first control air circuit to control the rotation of the rotating body; an air flow with a predetermined pressure is introduced into the second control air circuit to control the opening and closing of the clamping jaws;
[0011] The first control gas path is connected to the gas supply device; the first switch is used to control the interruption of gas flow and the direction of gas flow entering the first control gas path;
[0012] The second control air path is connected to the air supply device; the second switch is used to control the air flow interruption and the air flow direction entering the second control air path.
[0013] In an operative solution, the clamp includes a first arm and a second arm, and an air flow with a predetermined pressure is introduced into the second control air path to control the first arm and the second arm to move closer or farther away.
[0014] In an operative solution, the clamp further comprises a scissor mechanism, the scissor mechanism comprises a first scissor arm and a second scissor arm, and a middle position of the first scissor arm is hingedly connected to a middle position of the second scissor arm:
[0015] The first end of the first scissor arm is hingedly connected to the end of the first support arm, the first end of the second scissor arm is hingedly connected to the end of the second support arm, and the second end of the first scissor arm is close to the second end of the second scissor arm to clamp the edge of the thin wafer;
[0016] Wherein, when the first end of the first scissor arm is away from the first end of the second scissor arm, the second end of the first scissor arm is close to the second end of the second scissor arm;
[0017] The clamping jaw includes a default state in which the first arm and the second arm are maintained in a separated state.
[0018] In an implementable solution, the clamp further comprises a spring, which is disposed between the first arm and the second arm, and which applies a force to the first arm and the second arm to move away from each other.
[0019] In an implementable scheme, the rotation angle range of the rotating body relative to the extension portion is 0° to 180°; the first switch includes at least two gears, when the first switch is in the first gear, the rotation angle of the rotating body is 0°, and when the first switch is in the second gear, the rotation angle of the rotating body is 180°.
[0020] In an implementable solution, the clamp includes a clamping state and a releasing state; the second switch includes at least two gears, when the second switch is in the first gear, the clamp is in the clamping state, and when the second switch is in the second gear, the clamp is in the releasing state.
[0021] In an implementable solution, the extension portion includes a fixed arm and a movable arm, the first end of the movable arm is connected and fixed to one end of the fixed arm in an angle-adjustable manner, and the second end of the movable arm is equipped with a clamping device.
[0022] In an operative solution, the two extensions of the bracket are fixedly connected via a connecting member, and the connecting member enables the angle adjustment of the movable arm around the end of the fixed arm to be kept synchronous.
[0023] Compared with the prior art, the beneficial effects of this application include at least:
[0024] When the thin wafer clamping device of the present application is used, the staff only needs to hold the handle, then operate the second switch to open the claws of the two clamping devices, then move to the location of the wafer, and operate the second switch again to close the claws of the two clamping devices to clamp the two opposite sides of the wafer. After that, the staff holds the handle to transfer the wafer to the designated station. If it needs to be flipped, it only needs to operate the first switch to make the rotating bodies of the two clamping devices rotate synchronously, and then adjust the angle of the wafer to achieve flipping.
[0025] It can be seen that the wafer clamping device of the present application can easily realize the wafer clamping, transportation and flipping actions, reduce the possibility of operating errors, and reduce the probability of damage during wafer transportation and flipping. At the same time, when the wafer is transported and flipped by the wafer clamping device of this embodiment, the worker's body or clothes have no contact with the wafer, eliminating the pollution problem caused by manual contact with the wafer. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.
[0027] Figure 1 It is a three-dimensional structural diagram of a thin wafer clamping device according to an embodiment of the present application;
[0028] Figure 2 for Figure 1 The diagram of the use status of the medium-thin wafer clamping device;
[0029] Figure 3It is a schematic diagram of the three-dimensional structure of a first clamping device according to an embodiment of the present application;
[0030] Figure 4 for Figure 3 A side view of the middle clamping device when the jaws are in an open state;
[0031] Figure 5 for Figure 3 A side view of the middle clamping device when the jaws are in a closed state;
[0032] Figure 6 is a three-dimensional structural diagram of a second clamping device in a closed state according to an embodiment of the present application;
[0033] Figure 7 for Figure 6 A side view of the middle clamping device;
[0034] Figure 8 is a three-dimensional structural diagram of a second clamping device in an open state according to an embodiment of the present application;
[0035] Fig. 9 for Figure 8 A side view of the middle clamping device;
[0036] Fig.10 It is a three-dimensional structural diagram of a clamping device with a spring in a closed state according to an embodiment of the present application;
[0037] Fig.11 for Fig.10 A magnified view of the structure at center A;
[0038] Fig.12 It is a three-dimensional structural diagram of a clamping device with a spring in an open state according to an embodiment of the present application;
[0039] Fig.13 for Fig.12 A magnified view of the structure at point B.
[0040] Fig.14 It is a three-dimensional structural diagram of a thin-film wafer clamping device with a connecting piece according to an embodiment of the present application.
[0041] In the figure: 10, handle; 11, first switch; 12, second switch; 2, bracket; 21, extension; 211, fixed arm; 212, movable arm; 213, connector; 3, clamping device; 31, rotating body; 32, clamping claw; 321, first arm; 322, second arm; 323, scissor mechanism; 3231, first scissor arm; 3232, second scissor arm; 324, spring; 33, cylinder body; 100, wafer. DETAILED DESCRIPTION
[0042] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.
[0043] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.
[0044] like Figure 1 As shown, this embodiment provides a thin wafer clamping device, including a handle 1, a bracket 2 and two clamping devices 3. The handle 1 is provided with a first switch 11 and a second switch 12. One end of the bracket 2 is mounted on the handle 1, and the other end is provided with two relatively mounted extensions 21. The two clamping devices 3 are respectively mounted on the two extensions 21 in a symmetrical form; the clamping device 3 includes a rotating body 31 and a clamping claw 32, and the clamping claw 32 is mounted on the rotating body 31.
[0045] The first switch 11 and the second switch 12 are connected to the clamping device 3. The first switch 11 is used to control the rotation angle of the rotating body 31, and the second switch 12 is used to control the opening and closing of the clamping claws 32. The clamping claws 32 of the two clamping devices 3 face each other, and the movements are synchronized and completely symmetrical. Figure 2 As shown, the thin wafer is placed between two clamping jaws 32 and is clamped by the clamping jaws 32 at its edges.
[0046] In this embodiment, the clamping device 3 may include different motors to respectively drive the rotation of the rotating body 31 and the opening and closing of the clamping jaws 32. Correspondingly, the first switch 11 and the second switch 12 may be used to control the power on and off and the current direction to realize the rotation of the rotating body 31 and the opening and closing of the clamping jaws 32.
[0047] In this embodiment, if Figure 3As shown, the clamping device 3 can also be a rotating clamping finger cylinder, which can include a cylinder body 33, a rotating body 31 and a clamping jaw 32. The cylinder body 33 is fixedly mounted on an extension 21 of the bracket 2, and the rotating body 31 is mounted on the side of the cylinder body 33 facing the opposite extension 21, and the clamping jaw 32 is mounted on the rotating body 31. A first control air circuit and a second control air circuit are provided in the cylinder body 33 (the internal structure is not shown in the figure). An airflow with a predetermined pressure is introduced into the first control air circuit to control the rotation of the rotating body 31. An airflow with a predetermined pressure is introduced into the second control air circuit to control the opening and closing of the clamping jaw 32.
[0048] Correspondingly, the first switch 11 and the second switch 12 can be airflow control switches, which can control the direction and on / off of the airflow. Specifically, the first control air circuit is connected to the air supply device (not shown in the figure); the first switch 11 is used to control the on / off of the airflow and the direction of the airflow entering the first control air circuit; the second control air circuit is connected to the air supply device; the second switch 12 is used to control the on / off of the airflow and the direction of the airflow entering the second control air circuit. The first switch 11 and the second switch 12 can control the size and direction of the airflow delivered by the air supply device to the first and second control air circuits by controlling the relevant solenoid valves (not shown in the figure), and the solenoid valves can be integrated and installed on the bottom side of the handle 1 or the bracket 2, for example, they can be installed on the bottom surface of the bracket 2 close to the handle 1.
[0049] Because the distance for transferring the wafer may be within a certain limited range, an air supply device can be set in this area, for example, using an air compressor to supply air. The air supply device is connected to the solenoid valve through a pipeline and a quick-release connector. The solenoid valve is also connected to the first and second control air circuits through quick-release pipelines. The pipeline can be arranged along the outer side of the extension portion 21 of the bracket 2 to prevent the pipeline from colliding with the wafer.
[0050] The air supply device can also be a small air pump device, which can be directly installed on the bracket 2 or the handle 1, so that the thin wafer clamping device can be used in any position.
[0051] When the thin wafer clamping device of this embodiment is used, Figure 2 As shown, the staff only needs to hold the handle 1, and then operate the second switch 12 to open the clamping jaws 32 of the two clamping devices 3, and then move to the position of the wafer 100, and operate the second switch 12 again to close the clamping jaws 32 of the two clamping devices 3 to clamp the two opposite sides of the wafer 100. After that, the staff holds the handle 1 to transfer the wafer 100 to the designated station. If it needs to be flipped, it only needs to operate the first switch 11 to make the rotating bodies 31 of the two clamping devices 3 rotate synchronously, and then adjust the angle of the wafer 100 to achieve flipping.
[0052] It can be seen that the wafer clamping device of the present embodiment can easily realize the wafer clamping, transportation and flipping actions, reduce the possibility of operating errors, and reduce the probability of damage during wafer transportation and flipping. At the same time, when the wafer clamping device of the present embodiment is used for transportation and wafer flipping, the worker's body or clothes have no contact with the wafer, eliminating the pollution problem caused by manual contact with the wafer.
[0053] In this embodiment, relative to the extension portion 21, the rotation angle range of the rotating body 31 is 0° to 180°; the first switch 11 includes at least two gears, when the first switch 11 is in the first gear, the rotation angle of the rotating body 31 is 0°, and when the first switch 11 is in the second gear, the rotation angle of the rotating body 31 is 180°.
[0054] In this embodiment, the clamp 32 includes a clamping state and a release state; the second switch 12 includes at least two gears. When the second switch 12 is in the first gear, the clamp 32 is in the clamping state, and when the second switch 12 is in the second gear, the clamp 32 is in the release state.
[0055] In this embodiment, if Figure 4 and Figure 5 As shown, the clamping jaw 32 may include a first arm 321 and a second arm 322. When the clamping device 3 is a rotary clamping finger cylinder, an air flow with a predetermined pressure is introduced into the second control air path to control the first arm 321 and the second arm 322 to move closer or farther away.
[0056] For example, the first direction airflow is introduced into the second control air path, so that the first arm 321 and the second arm 322 are close to each other (see Figure 5 ), and the wafer can be directly clamped by the first arm 321 and the second arm 322. Further, when the second direction airflow is introduced into the second control air path or the first direction airflow introduced previously is released, the first arm 321 and the second arm 322 are moved away from each other (see Figure 4 ), release the wafer.
[0057] In this embodiment, if Figure 6 and Figure 8As shown, the clamp 32 may also include a scissor mechanism 323, the scissor mechanism 323 includes a first scissor arm 3231 and a second scissor arm 3232, and a middle position of the first scissor arm 3231 is hinged to a middle position of the second scissor arm 3232. The first end of the first scissor arm 3231 is hinged to the end of the first arm 321, the first end of the second scissor arm 3232 is hinged to the end of the second arm 322, and the second end of the first scissor arm 3231 and the second end of the second scissor arm 3232 are close to clamp the edge of the thin wafer. When the first arm 321 and the second arm 322 are close, the first end of the first scissor arm 3231 and the first end of the second scissor arm 3232 are close, and at this time, the second end of the first scissor arm 3231 and the second end of the second scissor arm 3232 are far away. The clamp 32 includes a default state, in which the first arm 321 and the second arm 322 can remain away from each other.
[0058] Generally, when the clamping device 3 is a rotating clamping finger cylinder, the first arm 321 and the second arm 322 are generally in a distant state by default. At this time, with the help of the scissor mechanism 323, the second end of the first scissor arm 3231 and the second end of the second scissor arm 3232 are in a close state by default for clamping the wafer.
[0059] For example, Fig. 9 As shown, the first direction airflow is introduced into the second control air path, so that the first arm 321 and the second arm 322 are close to each other, so that the first end of the first scissor arm 3231 is close to the first end of the second scissor arm 3232, and the second end of the first scissor arm 3231 is away from the second end of the second scissor arm 3232, so as to realize the opening of the clamping jaws. Figure 7 As shown, when the second direction airflow is introduced into the second control air path or the first direction airflow is released, the first arm 321 and the second arm 322 are moved away from each other, so that the first end of the first scissors arm 3231 is moved away from the first end of the second scissors arm 3232, and the second end of the first scissors arm 3231 is moved close to the second end of the second scissors arm 3232 to achieve the closure of the clamp.
[0060] In this embodiment, if Fig.10 and Fig.12 As shown, the clamp 32 may further include a spring 324, which is disposed between the first arm 321 and the second arm 322. The spring 324 applies a force to move the first arm 321 and the second arm 322 away from each other. In general, the second end of the first scissor arm 3231 and the second end of the second scissor arm 3232 may be in a close state by default, so as to better clamp the wafer and prevent the wafer from falling out.
[0061] For example, Fig.13As shown, the first direction airflow is introduced into the second control air path, so that the first arm 321 and the second arm 322 are close to each other and the spring 324 is compressed, so that the first end of the first scissor arm 3231 is close to the first end of the second scissor arm 3232, and the second end of the first scissor arm 3231 is away from the second end of the second scissor arm 3232, so as to realize the opening of the clamping jaws. Fig.11 As shown, when the second direction airflow is introduced into the second control air path or the first direction airflow is released, and under the elastic force of the spring 324, the first arm 321 and the second arm 322 are moved away from each other, so that the first end of the first scissors arm 3231 is separated from the first end of the second scissors arm 3232, and the second end of the first scissors arm 3231 is close to the second end of the second scissors arm 3232, so as to achieve the firm closure of the clamp.
[0062] In this embodiment, if Figure 1 , Figure 2 and Fig.14 As shown, the extension part 21 includes a fixed arm 211 and a movable arm 212. The first end of the movable arm 212 is connected and fixed to one end of the fixed arm 211 in an adjustable angle manner, and the second end of the movable arm 212 is installed with the clamping device 3. The fixed arm 211 serves as a supporting base, while the movable arm 212 is responsible for realizing dynamic adjustment. One end of the movable arm 212 is connected and fixed to the fixed arm 211 in an adjustable angle manner, so that the angle of the movable arm 212 relative to the fixed arm 211 can be adjusted, thereby providing a flexible clamping posture adjustment capability.
[0063] In this embodiment, if Fig.14 As shown, the two extensions 21 of the bracket 2 are fixedly connected by a connector 213, and the connector 213 keeps the angle adjustment of the movable arm 212 around the end of the fixed arm 211 synchronized. Specifically, the connector 213 ensures that when one movable arm 212 is adjusted in angle, the other movable arm can also be adjusted accordingly with the same amplitude. This synchronous adjustment mechanism greatly improves the synchronization when the two opposing clamps flip the entire wafer, reducing the possibility of the wafer being twisted and damaged. The connector 213 can be arc-shaped to avoid round wafers.
[0064] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A thin wafer clamping device, characterized in that: include: A handle, on which a first switch and a second switch are disposed; A bracket, one end of which is mounted on the handle and the other end of which is provided with two extensions mounted opposite to each other; Two clamping devices are symmetrically mounted on the two extensions respectively; the clamping devices include a rotating body and a clamping claw, and the clamping claw is mounted on the rotating body; Wherein, the first switch and the second switch are connected to the clamping device, the first switch is used to control the rotation angle of the rotating body, and the second switch is used to control the opening and closing of the clamping jaws; The clamping jaws of the two clamping devices face each other, and the movements are synchronous and completely symmetrical; when in use, the thin wafer is placed between the two clamping jaws and is clamped by the edges of the clamping jaws.
2. The thin wafer clamping device according to claim 1, characterized in that: The clamping device is a rotary clamping finger cylinder, comprising a cylinder body, the rotating body and the clamping claw; The cylinder body is fixedly mounted on an extension portion of the bracket, the rotating body is mounted on a side of the cylinder body facing the extension portion, and the clamping claw is mounted on the rotating body; The cylinder body is provided with a first control air circuit and a second control air circuit; an air flow with a predetermined pressure is introduced into the first control air circuit to control the rotation of the rotating body; an air flow with a predetermined pressure is introduced into the second control air circuit to control the opening and closing of the clamping jaws; The first control gas circuit is connected to the gas supply device; the first switch is used to control the interruption of gas flow and the direction of gas flow entering the first control gas circuit; The second control air path is connected to the air supply device; the second switch is used to control the air flow interruption and the air flow direction entering the second control air path.
3. The thin wafer clamping device according to claim 2, characterized in that: The clamp includes a first arm and a second arm. An airflow with a predetermined pressure is introduced into the second control air path to control the first arm and the second arm to move closer or farther away.
4. The thin wafer clamping device according to claim 3, characterized in that: The clamping jaw further comprises a scissor mechanism, wherein the scissor mechanism comprises a first scissor arm and a second scissor arm, wherein a middle position of the first scissor arm is hingedly connected to a middle position of the second scissor arm: The first end of the first scissor arm is hingedly connected to the end of the first support arm, the first end of the second scissor arm is hingedly connected to the end of the second support arm, and the second end of the first scissor arm and the second end of the second scissor arm are close to each other to clamp the edge of the thin wafer; Wherein, when the first end of the first scissor arm is away from the first end of the second scissor arm, the second end of the first scissor arm is close to the second end of the second scissor arm; The clamping jaw includes a default state in which the first arm and the second arm are kept apart.
5. The thin wafer clamping device according to claim 4, characterized in that: The clamp further includes a spring, which is disposed between the first arm and the second arm and provides a force for the first arm and the second arm to move away from each other.
6. The thin wafer clamping device according to any one of claims 1 to 5, characterized in that: Relative to the extension portion, the rotation angle range of the rotating body is 0° to 180°; the first switch includes at least two gears, when the first switch is in the first gear, the rotation angle of the rotating body is 0°, and when the first switch is in the second gear, the rotation angle of the rotating body is 180°.
7. The thin wafer clamping device according to any one of claims 1 to 5, characterized in that: The clamping jaw includes a clamping state and a releasing state; the second switch includes at least two gears, when the second switch is in a first gear, the clamping jaw is in a clamping state, and when the second switch is in a second gear, the clamping jaw is in a releasing state.
8. The thin wafer clamping device according to any one of claims 1 to 5, characterized in that: The extension portion comprises a fixed arm and a movable arm, the first end of the movable arm is connected and fixed to one end of the fixed arm in an angle-adjustable manner, and the clamping device is installed at the second end of the movable arm.
9. The thin wafer clamping device according to claim 8, characterized in that: The two extensions of the bracket are fixedly connected via a connecting piece, and the connecting piece enables the angle adjustment of the movable arm around the end of the fixed arm to remain synchronized.