Solid laser crystal thermal management device
By using a combination of spray components and a heat dissipation fan in the solid laser crystal thermal management device, the problems of high-power laser heat dissipation demand and increased pressure of water cooling equipment are solved, and efficient heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202421482488.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-26
- Publication Date
- 2025-03-21
- Estimated Expiration
- 2034-06-26
AI Technical Summary
A single air cooling effect cannot meet the heat dissipation needs of high-power lasers. Water cooling equipment needs to build channels in the heat sink to reduce the heat sink temperature, but this will lead to increased pressure problems.
A solid laser crystal thermal management device is designed, using a combination of spray components, microchannel heat sinks, contact heat sinks and heat dissipation fans. The heat dissipation efficiency is improved by spraying coolant and air-cooled heat dissipation, and the opening of water-cooled channels inside the heat sink is avoided.
It realizes efficient heat dissipation of high-power lasers, improves the heat dissipation efficiency of the microchannel heat sink, avoids the problem of increasing pressure, and does not need to build a water-cooled channel inside the heat sink.
Smart Images
Figure CN222654553U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of laser crystal thermal management, in particular to a solid laser crystal thermal management device. Background Art
[0002] During the operation of high-power lasers, laser crystals often generate a large amount of heat due to the thermal conversion of pump energy. If this heat cannot be effectively managed, it will lead to uneven temperature distribution inside the laser crystal, resulting in serious thermal effects and thermal stress, and even crystal deformation, reduced pumping efficiency, affected beam quality, and even crystal explosion. Therefore, thermal management equipment plays a vital role in ensuring the stable operation of the laser and improving the performance of the laser.
[0003] Common laser crystal thermal management devices generally use a heat sink in combination with water cooling or air cooling equipment to manage the thermal performance of laser crystals. However, the air cooling effect alone can no longer meet the heat dissipation requirements of high-power lasers. If the water cooling equipment wants to lower the temperature of the heat sink, it is necessary to build a channel in the heat sink to dissipate heat through flowing water in the channel. However, pressure will also increase in the channel. Therefore, a solid laser crystal thermal management device is needed to solve the above problems. Utility Model Content
[0004] The purpose of the utility model is to provide a solid laser crystal thermal management device to solve the problem raised in the above background technology: a single air cooling effect can no longer meet the heat dissipation requirements of high-power lasers. If a water cooling device wants to lower the temperature of the heat sink, it is necessary to build a channel in the heat sink to dissipate heat through flowing water in the channel, and the pressure in the channel will also increase.
[0005] To achieve the above-mentioned objectives, the utility model provides the following technical solutions: a solid laser crystal thermal management device, comprising a mounting substrate, a spray assembly is arranged between two sides of the upper surface of the mounting substrate, a microchannel heat sink is fixedly connected between the tops of the spray assembly, the spray end of the spray assembly is located directly below the microchannel heat sink, a contact heat sink is fixedly connected to the upper surface of the microchannel heat sink, a laser crystal body is welded to the center of the upper surface of the contact heat sink through an indium foil sleeve, a protective shell is fixedly arranged at the edge of the upper surface of the contact heat sink, a heat dissipation fan is installed on the upper surface of the mounting substrate near the microchannel heat sink, an air outlet end of the heat dissipation fan is located directly below the microchannel heat sink, a temperature sensor is installed on one side of the upper surface of the contact heat sink, the detection end of the temperature sensor is opposite to the position of the indium foil sleeve, and a protective shell is connected to the edge of the upper surface of the microchannel heat sink.
[0006] Preferably, the spray assembly includes two L-shaped connecting plates, and the tops of one side of the two L-shaped connecting plates are fixedly connected to the microchannel heat sink.
[0007] Preferably, an adjustment slot is provided at the bottom of one side of the two L-shaped connecting plates, a spray guide plate is slidably connected between the two adjustment slots, both ends of the spray guide plate extend to the outside of the adjustment slot and are fixedly connected with a connecting block.
[0008] Preferably, a solenoid valve is installed at one end of one of the connecting blocks, the water inlet end of the solenoid valve extends to the interior of the spray guide plate, and is fixedly connected to a water guide pipe, and a plurality of spray heads are installed on the upper surface of the spray guide plate.
[0009] Preferably, each of the spray heads is connected to the water pipe, each of the spray heads is located directly below the microchannel heat sink, and an electric telescopic rod is installed near the adjustment slot on the two L-shaped connecting plates.
[0010] Preferably, the telescopic ends of the two electric telescopic rods are fixedly connected to the spray guide plates that are directly opposite to each other, and two proximity switches are fixedly installed on one side of one of the L-shaped connecting plates near the edge of the adjustment slide groove, and the detection ends of the two proximity switches are directly opposite to the connecting block.
[0011] Technical effects and advantages of the utility model:
[0012] (1) The device can cool the microchannel heat sink by air through the heat dissipation fan. At this time, after the solenoid valve is connected to the coolant, the coolant is sucked and sprayed on the lower surface of the microchannel heat sink through the spray head, thereby accelerating the heat dissipation efficiency of the microchannel heat sink. The spray guide plate can be pulled to move by the electric telescopic rod, so as to evenly spray the coolant on the lower surface of the microchannel heat sink. When the connecting block is close to the proximity switch, the electric telescopic rod runs in the reverse direction, so that the spray guide plate reciprocates in the microchannel heat sink, and the coolant is sprayed on the lower surface of the microchannel heat sink through the spray head. The heat dissipation fan cooperates with the microchannel heat sink to efficiently dissipate the heat, and there is no need to open a water cooling channel inside the microchannel heat sink and the contact heat sink. The problem that a single air cooling effect can no longer meet the heat dissipation requirements of high-power lasers is solved. If the water cooling equipment wants to reduce the temperature of the heat sink, it is necessary to construct a channel in the heat sink to dissipate heat by flowing water in the channel, and the pressure increase will also occur in the channel.
[0013] (2) The device can conduct heat generated by the operation of the laser crystal body through the indium foil sleeve, microchannel heat sink and contact heat sink. The temperature sensor can open the solenoid valve, cooling fan and electric telescopic rod when the temperature outside the indium foil sleeve is too high. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a schematic diagram of the overall structure of the utility model;
[0015] Figure 2It is a schematic diagram of the connection structure between the microchannel heat sink and the laser crystal body in the utility model;
[0016] Figure 3 It is a structural schematic diagram of the spray assembly in the utility model.
[0017] In the figure: 1. Mounting base plate; 2. Spray assembly; 201. L-shaped connecting plate; 202. Adjusting slide groove; 203. Spray guide plate; 204. Spray head; 205. Connecting block; 206. Solenoid valve; 207. Electric telescopic rod; 3. Microchannel heat sink; 4. Contact heat sink; 5. Indium foil sleeve; 6. Laser crystal body; 7. Proximity switch; 8. Cooling fan; 9. Temperature sensor; 10. Protective shell. DETAILED DESCRIPTION
[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0019] The utility model provides Figure 1-3 A solid laser crystal thermal management device shown in the figure includes a mounting substrate 1, a spray assembly 2 is arranged between the two sides of the upper surface of the mounting substrate 1, a microchannel heat sink 3 is fixedly connected between the tops of the spray assembly 2, the spray end of the spray assembly 2 is located directly below the microchannel heat sink 3, a contact heat sink 4 is fixedly connected to the upper surface of the microchannel heat sink 3, a laser crystal body 6 is welded to the center of the upper surface of the contact heat sink 4 through an indium foil sleeve 5, a protective shell 10 is fixedly arranged at the edge of the upper surface of the contact heat sink 4, a heat dissipation fan 8 is installed on the upper surface of the mounting substrate 1 near the microchannel heat sink 3, the air outlet end of the heat dissipation fan 8 is located directly below the microchannel heat sink 3, a temperature sensor 9 is installed on one side of the upper surface of the contact heat sink 4, the detection end of the temperature sensor 9 is directly opposite to the indium foil sleeve 5, and a protective shell 10 is connected to the edge of the upper surface of the microchannel heat sink 3.
[0020] like Figure 1-3A solid laser crystal thermal management device is shown, the spray assembly 2 includes two L-shaped connecting plates 201, the top of one side of the two L-shaped connecting plates 201 is fixedly connected to the microchannel heat sink 3, the bottom of one side of the two L-shaped connecting plates 201 is provided with an adjustment slot 202, a spray guide plate 203 is slidably connected between the two adjustment slots 202, both ends of the spray guide plate 203 extend to the outside of the adjustment slot 202, and are fixedly connected with a connecting block 205, one end of one of the connecting blocks 205 is installed with a solenoid valve 206, the water inlet end of the solenoid valve 206 extends to the inside of the spray guide plate 203, and its fixed There is a water pipe connected to the spray guide plate 203, and multiple spray heads 204 are installed on the upper surface of the spray guide plate 203, each spray head 204 is connected to the water pipe, and each spray head 204 is located directly below the microchannel heat sink 3. Two L-shaped connecting plates 201 are installed with electric telescopic rods 207 near the adjusting slide groove 202, and the telescopic ends of the two electric telescopic rods 207 are fixedly connected to the spray guide plate 203 at the opposite position. Two proximity switches 7 are fixedly installed on one side of one of the L-shaped connecting plates 201 near the edge of the adjusting slide groove 202, and the detection ends of the two proximity switches 7 are directly opposite to the connection block 205.
[0021] The working principle of the utility model is as follows: the heat generated by the operation of the laser crystal body 6 can be conducted by providing the indium foil sleeve 5, the microchannel heat sink 3 and the contact heat sink 4. The temperature sensor 9 can open the solenoid valve 206, the heat dissipation fan 8 and the electric telescopic rod 207 when the temperature outside the indium foil sleeve 5 is too high. The microchannel heat sink 3 can be cooled by air through the heat dissipation fan 8. At this time, after the solenoid valve 206 is connected to the coolant, the coolant is sucked and sprayed on the lower surface of the microchannel heat sink 3 through the spray head 204, thereby accelerating the microchannel heat sink 3. In order to improve the heat dissipation efficiency, the electric telescopic rod 207 can be used to pull the spray guide plate 203 to move, so that the coolant can be evenly sprayed on the lower surface of the microchannel heat sink 3. When the connecting block 205 is close to the proximity switch 7, the electric telescopic rod 207 runs in the reverse direction, so that the spray guide plate 203 can reciprocate on the microchannel heat sink 3. The coolant is sprayed on the lower surface of the microchannel heat sink 3 through the spray head 204, and the heat dissipation fan 8 cooperates with the microchannel heat sink 3 to efficiently dissipate the heat, and there is no need to open a water cooling channel inside the microchannel heat sink 3 and the contact heat sink 4.
[0022] In the description of the present invention, unless otherwise clearly specified and limited, the terms "set", "install", "connect", "connect", and "fix" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0023] The standard parts used in the utility model can all be purchased from the market, and the special-shaped parts can all be customized according to the description and the drawings.
[0024] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A solid laser crystal thermal management device, comprising a mounting substrate (1), characterized in that: A spray assembly (2) is arranged between the two sides of the upper surface of the mounting substrate (1); a microchannel heat sink (3) is fixedly connected between the top of the spray assembly (2); the spray end of the spray assembly (2) is located directly below the microchannel heat sink (3); a contact heat sink (4) is fixedly connected to the upper surface of the microchannel heat sink (3); a laser crystal body (6) is welded to the center of the upper surface of the contact heat sink (4) through an indium foil sleeve (5); a protective sleeve (10) is fixedly arranged at the edge of the upper surface of the contact heat sink (4); a heat dissipation fan (8) is installed on the upper surface of the mounting substrate (1) near the microchannel heat sink (3); an air outlet end of the heat dissipation fan (8) is located directly below the microchannel heat sink (3); a temperature sensor (9) is installed on one side of the upper surface of the contact heat sink (4); a detection end of the temperature sensor (9) is directly opposite to the indium foil sleeve (5); and a protective sleeve (10) is connected to the edge of the upper surface of the microchannel heat sink (3).
2. A solid laser crystal thermal management device according to claim 1, characterized in that: The spray assembly (2) comprises two L-shaped connecting plates (201), and the tops of one side of the two L-shaped connecting plates (201) are fixedly connected to the microchannel heat sink (3).
3. A solid laser crystal thermal management device according to claim 2, characterized in that: The bottom of one side of the two L-shaped connecting plates (201) is provided with an adjustment slot (202), a spray guide plate (203) is slidably connected between the two adjustment slots (202), and both ends of the spray guide plate (203) extend to the outside of the adjustment slot (202) and are fixedly connected with a connection block (205).
4. A solid laser crystal thermal management device according to claim 3, characterized in that: A solenoid valve (206) is installed at one end of one of the connection blocks (205), and a water inlet end of the solenoid valve (206) extends to the interior of the spray guide plate (203), and is fixedly connected to a water guide pipe, and a plurality of spray heads (204) are installed on the upper surface of the spray guide plate (203).
5. A solid laser crystal thermal management device according to claim 4, characterized in that: Each of the spray heads (204) is connected to the water pipe, and each of the spray heads (204) is located directly below the microchannel heat sink (3). The two L-shaped connecting plates (201) are both equipped with electric telescopic rods (207) near the adjustment slide groove (202).
6. A solid laser crystal thermal management device according to claim 5, characterized in that: The telescopic ends of the two electric telescopic rods (207) are fixedly connected to the spray guide plate (203) at a position opposite to each other, and two proximity switches (7) are fixedly installed on one side of one of the L-shaped connecting plates (201) near the edge of the adjustment slide groove (202), and the detection ends of the two proximity switches (7) are at a position opposite to the connection block (205).