Integrated circuit board integrated with heat dissipation waistcoat

Abstract

The utility model discloses an integrated circuit board integrated with a heat dissipation vest, which comprises a circuit board body and a heat dissipation vest arranged on the circuit board body, the silica gel radiating fin is positioned between the radiating waistcoat and the circuit board body and is pressed by the radiating waistcoat; the column core is arranged on the heat dissipation waistcoat, and the first end of the column core extends towards the silica gel heat dissipation sheet; the ventilation cavity penetrates through the heat dissipation waistcoat in the horizontal direction and is used for conducting ventilation and heat dissipation on the column core. According to the integrated circuit board integrated with the heat dissipation waistcoat, the silica gel heat dissipation fins abut against the circuit board body through the column cores, self-adaptive adjustment can be conducted according to the thicknesses of different electronic elements on the circuit board body, the overall heat dissipation efficiency is guaranteed, the column cores transmit heat of the silica gel heat dissipation fins to the elastic pieces to be transmitted to the outside, and the heat dissipation efficiency is improved. And through the through design of the ventilation cavities, the column cores are subjected to heat dissipation when natural airflow passes through the ventilation cavities, so that the heat dissipation waistcoat has good heat dissipation performance, and other heat dissipation equipment does not need to be additionally arranged.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to an integrated circuit board integrated with a heat dissipation vest. Background Art

[0002] A circuit board is a board that connects electronic components to each other through conductive paths. Since electronic components generate heat during operation, the heat dissipation of the heating plate needs to be considered. The conventional method is to solve this problem by installing a heat dissipation vest, that is, a circuit board with an integrated heat dissipation vest.

[0003] In conjunction with publication number CN219698276U, publication date 2023-09-15, a heat dissipation integrated circuit board is disclosed.

[0004] In the prior art including the above patent, it includes a circuit board body, a heat dissipation component and a fixing seat, the fixing seat is provided with a plurality of support columns, the circuit board body is fixedly connected to the support columns, the heat dissipation component is connected to the fixing seat, the heat dissipation component includes a heat dissipation bracket and a heat dissipation fan, one end of the heat dissipation bracket is detachably connected to the circuit board body, the heat dissipation fan is installed at the other end of the heat dissipation bracket, and the heat dissipation fan is inclinedly arranged at the upper end of the circuit board body. The above technology uses the heat dissipation fan that is arranged obliquely, so that the circuit board body can be exposed to the cold air blown by the heat dissipation fan over a large area, the surface temperature is reduced, and the heat of the circuit board body is effectively discharged. However, the heat dissipation fan needs to be driven by a motor, and heat is also generated during the operation of the motor. The space where the circuit board is located is relatively small, so that the distance between the heat generating part of the heat dissipation fan and the circuit board is close, which will affect the heat dissipation of the circuit board. Utility Model Content

[0005] The purpose of the utility model is to provide an integrated circuit board integrated with a heat dissipation vest to solve the above-mentioned problem.

[0006] In order to achieve the above-mentioned purpose, the utility model provides the following technical solutions: an integrated circuit board with an integrated heat dissipation vest, comprising a circuit board body, a heat dissipation vest arranged on the circuit board body, and fixed to the circuit board body by a clamping assembly;

[0007] A silicone heat sink located between the heat sink and the circuit board body and pressed by the heat sink;

[0008] A column core is arranged on the heat dissipation vest, and the first end of the column core extends toward the silicone heat dissipation sheet, and the second end of the column core is provided with an elastic member for maintaining a predetermined height;

[0009] A ventilation cavity runs through the heat dissipation vest in the horizontal direction and is used for ventilating and dissipating heat from the column core.

[0010] Preferably, bucket-shaped heat dissipation openings are provided at both ends of the ventilation cavity, and the narrower end of the heat dissipation opening is communicated with the ventilation cavity.

[0011] Preferably, a plurality of heat-conducting pipes communicating with the ventilation cavity are arranged in a linear array on the ventilation cavity.

[0012] Preferably, the heat conducting pipe is slidably plugged into the column core, and the elastic member covers the heat conducting pipe port.

[0013] Preferably, the heat conducting pipe comprises a tubular portion and a bucket-shaped portion extending toward the silicone heat sink, and the gap between the tubular portion and the column core is a heat dissipation channel.

[0014] Preferably, the heat sink vest is rotatably arranged relative to the circuit board body, and the clamping assembly includes a clamping piece arranged on the heat sink vest and a fastener arranged on the circuit board body, and when the heat sink vest is parallel to the circuit board body, the clamping piece and the fastener are tangent to each other for clamping.

[0015] In the above technical scheme, the utility model provides an integrated circuit board with an integrated heat sink vest, which has the following beneficial effects: the silicone heat sink is pressed tightly against the circuit board body through the column core, and can be adaptively adjusted according to the thickness of different electronic components on the circuit board body, thereby ensuring the overall heat dissipation efficiency. The column core transfers the heat of the silicone heat sink to the elastic part and the outside world, and through the through-connection design of the ventilation cavity, the column core is cooled by natural wind flow passing through, so that the heat sink itself has good heat dissipation performance, and there is no need to install other heat dissipation equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present utility model. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0017] Figure 1 An overall three-dimensional schematic diagram provided for an embodiment of the utility model;

[0018] Figure 2 A schematic diagram of the heat dissipation vest and circuit board structure provided by an embodiment of the utility model;

[0019] Figure 3 A schematic diagram of the heat dissipation vest, heat dissipation port, and elastic member structure provided by an embodiment of the utility model;

[0020] Figure 4 This is a schematic cross-sectional view of the heat dissipation port, ventilation cavity, and heat conduction pipe provided in an embodiment of the utility model.

[0021] Description of reference numerals:

[0022] 1. Circuit board body; 2. Heat dissipation vest; 3. Silicone heat sink; 4. Clip; 5. Fastener; 6. Heat dissipation port; 7. Ventilation cavity; 8. Heat conduction pipe; 81. Tubular portion; 82. Bucket-shaped portion; 9. Column core; 10. Elastic member. DETAILED DESCRIPTION

[0023] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0024] like Figure 1-4 As shown, an integrated circuit board with a heat dissipation vest includes a circuit board body 1 and a heat dissipation vest 2 arranged on the circuit board body 1 and fixed on the circuit board body 1 through a clamping assembly;

[0025] A silicone heat sink 3 located between the heat sink vest 2 and the circuit board body 1 and pressed by the heat sink vest 2;

[0026] A column core 9 is disposed on the heat dissipation vest 2 and has a first end extending toward the silicone heat dissipation sheet 3, and a second end thereof is provided with an elastic member 10 for maintaining a predetermined height;

[0027] A ventilation cavity 7 runs through the heat dissipation vest 2 in the horizontal direction and is used for ventilating and dissipating heat for the column core 9 .

[0028] Specifically, the coating on the heat dissipation vest 2 is graphene material, and the column core 9 and the elastic member 10 are both made of copper. The user puts the silicone heat sink 3 tightly against the circuit board body 1, and then fixes the heat dissipation vest 2 to the circuit board body 1 through the clamping assembly. The silicone heat sink 3 is pressed tightly against the circuit board body 1 through the column core 9, and because the column core 9 is provided with an elastic member 10, it can be adaptively adjusted according to the thickness of different electronic components on the circuit board body 1, so that the column core 9 presents different heights, and can make thinner electronic components also fit tightly against the silicone heat sink 3, thereby ensuring the overall heat dissipation efficiency. The column core 9 transfers the heat of the silicone heat sink 3 to the elastic member 10 and the outside world, and through the through design of the ventilation cavity 7, the column core 9 is cooled when natural wind flows through it.

[0029] In the above technology, the silicone heat sink 3 is pressed tightly against the circuit board body 1 through the column core 9, and can be adaptively adjusted according to the thickness of different electronic components on the circuit board body 1, thereby ensuring the overall heat dissipation efficiency. The column core 9 transfers the heat of the silicone heat sink 3 to the elastic member 10 and the outside world, and through the through-connection design of the ventilation cavity 7, the column core 9 is cooled when natural wind flows through it, so that the heat dissipation vest 2 itself has good heat dissipation performance, and there is no need to install other heat dissipation equipment.

[0030] As an embodiment further provided by the present invention, bucket-shaped heat dissipation openings 6 are provided at both ends of the ventilation cavity 7 , and the narrower end of the heat dissipation opening 6 is communicated with the ventilation cavity 7 .

[0031] Specifically, since the heat dissipation port 6 is in a bucket-shaped structure and the narrower end is connected to the ventilation cavity 7, the wider end is facing the outside. Therefore, when the external wind flows through, the cross-sectional area is reduced, which accelerates the gas flow rate and produces a narrow tube effect, so that the wind speed in the ventilation cavity 7 is relatively large and the column core 9 is cooled, and the hot air in the ventilation cavity 7 is blown out.

[0032] As another embodiment further provided by the present invention, a plurality of heat-conducting pipes 8 communicating with the ventilation cavity 7 are arranged in a linear array on the ventilation cavity 7 .

[0033] Specifically, the heat pipe 8 is arranged on the ventilation cavity 7 in the vertical direction. When the temperature in the ventilation cavity 7 increases, the hot air rises and is directly discharged upward through the heat pipe 8. At this time, the amount of air inside the heat pipe 8 is reduced to form a negative pressure, and air is introduced from both sides through the heat dissipation port 6, so that the cold air enters the ventilation cavity 7 from the heat dissipation port 6 and is heated up, and the hot air is discharged upward from the heat pipe 8 to form a heat dissipation cycle, and the column core 9 is slidably inserted in the heat pipe 8, so that the heat on the column core 9 can be transferred to the heat pipe 8 through the part connected to the heat pipe 8, and the heat is transferred out during the ventilation process of the heat pipe 8 to further dissipate heat, and the elastic member 10 can prevent dust from falling from above from entering the heat pipe 8 and causing blockage of the heat pipe 8.

[0034] As another embodiment further provided by the present invention, the heat conducting pipe 8 includes a tubular portion 81 and a bucket-shaped portion 82 extending toward the silicone heat sink 3 , and the gap between the tubular portion 81 and the column core 9 is a heat dissipation channel.

[0035] Specifically, when the column core 9 is at a predetermined height under the elastic member 10, the lower end of the column core 9 is flush with the lower end of the bucket-shaped portion 82. In the process of fixing the heat dissipation vest 2, the column core 9 is pressed against the silicone heat sink 3 along with the heat dissipation vest 2, and the column core 9 is retracted into the bucket-shaped portion 82 under the reaction force of the silicone heat sink 3. After long-term use, impurities that fall off from the silicone heat sink 3 will be attached to the column core 9. At this time, after the clamping is released, the silicone heat sink 3 is replaced. The column core 9 can be extended downward by pressing the elastic member 10 downward, and some impurities can be squeezed out of the bucket-shaped portion 82 during the movement. Then, the column core 9 is restored to be flush with the lower end of the bucket-shaped portion 82 again, and the impurities on the surface of the column core 9 are removed by the mutual friction between the column core 9 and the lower end of the bucket-shaped portion 82, which is convenient for cleaning. The gap between the column core 9 and the tubular portion 81 is connected to the ventilation cavity 7, forming a heat dissipation channel for the column core 9 and the ventilation cavity 7.

[0036] As another embodiment further provided by the present invention, the heat sink vest 2 is rotatably arranged relative to the circuit board body 1, and the clamping assembly includes a clamping member 4 arranged on the heat sink vest 2 and a fastener 5 arranged on the circuit board body 1, and when the heat sink vest 2 is parallel to the circuit board body 1, the clamping member 4 and the fastener 5 are tangent to each other for clamping.

[0037] Specifically, the clamp 4 is made of a deformable material, and the heat sink vest 2 is rotatably disposed on the circuit board body 1 through a rotating shaft. When the silicone heat sink 3 needs to be replaced, the clamp 4 is bent upward along the tangent line between the fastener 5 and the clamp 4, so that the clamp 4 is deformed and detached from the fastener 5. At this time, the heat sink vest 2 can be rotated to replace the silicone heat sink 3, and then the heat sink vest 2 is rotated again to be parallel to the circuit board body 1. During the rotation process, the clamp 4 is blocked by the fastener 5 to produce a bending deformation, and slides along the outer wall of the fastener 5 until the clamp 4 is tangent to the fastener 5 and is engaged under the deformation potential energy of the clamp 4 itself.

[0038] Working principle: when the silicone heat sink 3 needs to be replaced, the clamp 4 is bent upward along the tangent line between the fastener 5 and the clamp 4, so that the clamp 4 is deformed and separated from the fastener 5. At this time, the heat sink vest 2 can be rotated to replace the silicone heat sink 3, and then the heat sink vest 2 is rotated again to be parallel to the circuit board body 1. During the rotation process, the clamp 4 is blocked by the fastener 5 and bends and deforms, and slides along the outer wall of the fastener 5 until the clamp 4 is tangent to the fastener 5 and is engaged under the deformation potential energy of the clamp 4 itself, and the silicone heat sink 3 is pressed tightly against the circuit board body 1 through the column core 9, and because the column core 9 is provided with an elastic member 10, it can be adaptively adjusted according to the thickness of different electronic components on the circuit board body 1, so that the column core 9 presents different heights, and can make thinner electronic components also fit tightly against the silicone heat sink 3, and the column core 9 is retracted into the bucket-shaped portion by the reaction force of the silicone heat sink 3. 82; the column core 9 transfers the heat of the silicone heat sink 3 to the heat conducting pipe 8. When the temperature in the ventilation cavity 7 increases, the hot air rises and is directly discharged upward through the heat conducting pipe 8. At this time, the amount of air inside the heat conducting pipe 8 is reduced to form a negative pressure, and the design of the heat dissipation port 6 makes the air inlet on both sides produce a narrow tube effect, which cools the ventilation cavity 7 and discharges the hot air, so that the cold air enters the ventilation cavity 7 from the heat dissipation port 6 and is heated up, and the hot air is discharged upward from the heat conducting pipe 8 to form a heat dissipation cycle. After long-term use, the silicone heat sink 3 is replaced, and the column core 9 is driven to extend downward by pressing the elastic member 10 downward, and some impurities are squeezed out of the bucket-shaped portion 82 during the movement, and then the hand is released, so that the column core 9 is restored to be flush with the lower end of the bucket-shaped portion 82 again, and the impurities on the surface of the column core 9 are removed by the mutual friction between the column core 9 and the lower end of the bucket-shaped portion 82, which is convenient for cleaning.

[0039] The above only describes some exemplary embodiments of the present invention by way of illustration. It is undoubted that those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. An integrated circuit board with an integrated heat dissipation vest, comprising a circuit board body (1), characterized in that: It comprises a heat dissipation vest (2) arranged on a circuit board body (1), which is clamped on the circuit board body (1) via a clamping assembly; A silicone heat sink (3) located between the heat sink vest (2) and the circuit board body (1) and pressed by the heat sink vest (2); A column core (9) disposed on the heat dissipation vest (2) and having a first end extending toward the silicone heat dissipation sheet (3), and having a second end provided with an elastic member (10) for maintaining a predetermined height; A ventilation cavity (7) that penetrates the heat dissipation vest (2) in the horizontal direction and is used for ventilating and dissipating heat from the column core (9).

2. The integrated circuit board with integrated heat dissipation vest according to claim 1, characterized in that: Both ends of the ventilation cavity (7) are provided with bucket-shaped heat dissipation openings (6), and the narrower end of the heat dissipation opening (6) is in communication with the ventilation cavity (7).

3. The integrated circuit board with integrated heat dissipation vest according to claim 1, characterized in that: A plurality of heat-conducting pipes (8) in communication with the ventilation cavity (7) are arranged in a linear array on the ventilation cavity (7).

4. The integrated circuit board with integrated heat dissipation vest according to claim 3, characterized in that: The heat conducting pipe (8) and the column core (9) are slidably plugged into each other, and the elastic member (10) covers the port of the heat conducting pipe (8).

5. The integrated circuit board with integrated heat dissipation vest according to claim 4, characterized in that: The heat conducting pipe (8) comprises a tubular portion (81) and a bucket-shaped portion (82) extending towards the silicone heat sink (3), and a gap between the tubular portion (81) and the column core (9) is a heat dissipation channel.

6. The integrated circuit board with integrated heat dissipation vest according to claim 1, characterized in that: The heat dissipation vest (2) is rotatably arranged relative to the circuit board body (1), and the clamping assembly comprises a clamping piece (4) arranged on the heat dissipation vest (2) and a fastener (5) arranged on the circuit board body (1), and when the heat dissipation vest (2) and the circuit board body (1) are in a parallel state, the clamping piece (4) and the fastener (5) are tangent to each other for clamping.

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