Thin film electroplating cylinder with ionic membrane protection plate
By covering the ion film guard plate on the anode channel of the thin film electroplating cylinder and setting an ion film below the lower anode, the problems of bulging, breaking and incomplete electroplating caused by gas adhesion during electroplating are solved, and uniform adhesion of the electroplating layer and improving the electroplating quality are achieved.
Patent Information
- Application Number
- CN202420493856.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-12
- Publication Date
- 2025-03-25
- Estimated Expiration
- 2034-03-12
AI Technical Summary
During the film plating process, the gas generated by the lower anode ionization is prone to adhere to the workpiece film, resulting in problems such as bulging, breaking and incomplete electroplating.
A thin film electroplating cylinder with an ion film guard plate is designed. By covering the ion film guard plate on the anode channel and setting an ion film below the lower anode, the ionized gas collects on the ion film and discharges from both sides to prevent the gas from adhering to the film.
It effectively prevents gas from gathering and impacting on the lower surface of the film, ensures full contact between the film workpiece and the plating solution, solves the problems of bulging, breaking and incomplete electroplating, and makes the electroplating layer evenly adhere to the film, improving the electroplating quality.
Smart Images
Figure CN222666059U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electroplating equipment, in particular to a thin film electroplating cylinder with an ion membrane guard plate. Background Art
[0002] Electroplating is the process of obtaining a metal deposit layer on a solid surface by electrolysis, the purpose of which is to change the surface properties of the solid material. Electroplating processes can be divided into many types, including zinc plating, copper plating, nickel plating, chrome plating, etc. For example, chrome plating is a widely used electroplating process that can improve the corrosion resistance and hardness of metals while also increasing the aesthetics of the metal. In addition, there are processes such as alloy electroplating, which deposit two or more metals on the cathode at the same time to form a coating with the required structure and performance to meet the requirements of various special surface properties. Therefore, it is widely used in electronics, aviation, automobiles, machinery and other fields.
[0003] Thin film electroplating is an important branch of electroplating, and the thin film electroplating cylinder is the main equipment for thin film electroplating. During the production process of the thin film electroplating cylinder, the cathode (also called the lower anode) immersed in the plating solution will ionize and generate gas. These gases are easy to gather in the plating solution to form bubbles. The bubbles rise under the action of buoyancy and adhere to the workpiece film, causing it to bulge and break. The bubbles will block the contact between the plating solution and the film surface, so that the coating cannot be formed at the attachment point.
[0004] The above problems need to be solved urgently. Utility Model Content
[0005] In order to overcome the disadvantage of the prior art that bubbles generated by the plate ionized gas are easily attached to the workpiece film and damage the electroplating on the film surface, the utility model provides a thin film electroplating cylinder with an ion membrane guard plate.
[0006] The technical solution of the utility model is as follows:
[0007] A thin film electroplating cylinder with an ion membrane guard plate comprises a plating tank body, wherein the bottom plate and the side plates of the plating tank body are combined to form a plating tank, a plurality of guard plate fixing plates are arranged in the plating tank along the width direction of the plating tank, the guard plate fixing plates separate the plating tank, a guard plate side fixing frame is arranged along the length direction of the plating tank, and the two ends of the guard plate side fixing frame are respectively connected to two adjacent guard plate fixing plates; two guard plate fixing plates and two guard plate side fixing frames are combined to form an anode channel, the ion membrane guard plate covers the anode channel, the lower anode is covered under the ion membrane guard plate, and the ion membrane guard plate is used to install the ion membrane.
[0008] Further, in one embodiment, along the length direction of the plating tank, water inlet guide boxes are symmetrically provided on both sides of the bottom of the plating tank, and an anti-vortex return water box is provided in the middle, a water inlet hole is provided on the side wall of the water inlet guide box facing the outside, a side baffle is fixed on the top of the water inlet guide box on the same side as the water inlet hole, water outlet holes are provided on the side walls on both sides of the anti-vortex return water box, and the lower anode is arranged on the top of the water inlet guide box and the anti-vortex return water box;
[0009] The side fixing frame of the guard plate is L-shaped, and there is a gap between the vertical plate surface and the side plate of the plating tank, and the side water retaining plate is located below the side fixing frame of the guard plate.
[0010] Furthermore, in one embodiment, the ion membrane guard plate is a concave arc-shaped plate, and a plurality of through holes are provided on the arc-shaped plate to facilitate the flow of the electroplating solution.
[0011] Further, in one embodiment, the ion membrane guard plate includes a fixed guard plate and a detachable guard plate, the fixed guard plate is fixed on the guard plate side fixing frame, and the detachable guard plate is detachably connected to the guard plate side fixing frame and / or the guard plate fixing plate.
[0012] Furthermore, in one embodiment, there is a gap between the side water baffle and the side fixing frame to form an exhaust channel to exhaust the gas generated by the ionization of the lower anode.
[0013] Furthermore, in one embodiment, a water inlet channel and a water outlet channel are provided on the bottom plate, the water inlet channel is connected to the water inlet guide box, the water outlet channel is connected to the anti-vortex return water box, and the water inlet channel and the water outlet channel are staggered.
[0014] Furthermore, in one embodiment, the side water baffle is L-shaped, and the horizontal portion is provided with guide holes along the width direction of the plating tank.
[0015] Furthermore, in one embodiment, the water inlet hole and the water outlet hole are both oblong holes.
[0016] Furthermore, in one embodiment, along the length direction of the plating tank, protective plates are respectively provided on both sides of the bottom plate, and mounting grooves are formed between the protective plates, the bottom plate and the side plates.
[0017] Furthermore, in one embodiment, staggered support plates are provided below the bottom plate along the length direction and the width direction of the plating tank, respectively, and the top ends of the support plates are connected to the bottom of the bottom plate.
[0018] The utility model according to the above scheme has the beneficial effect that the guard plate fixing plate and the guard plate side fixing frame arrange the ion membrane guard plate cover above the lower anode for electroplating, the ion membrane guard plate is between the lower anode and the film, the gas generated by the ionization of the lower anode flows up to the ion membrane installed on the ion membrane guard plate, the ionized gas gathers on the ion membrane and is discharged from under the guard plate fixing frames on both sides, ensuring that there is no gas accumulation and impact on the lower surface of the film, ensuring that the plated surface of the film workpiece can fully contact the plating solution, solving the problem that the gas generated by the ionization of the lower anode adheres to the film to cause bulging, breakage and incomplete electroplating, so that the electroplating layer is evenly attached to the film, improving the electroplating quality. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 It is a partial structural schematic diagram of the utility model;
[0020] Figure 2 for Figure 1 sectional view of
[0021] Figure 3 for Figure 1 A magnified view of part A;
[0022] Figure 4 for Figure 1 Magnified view of part B.
[0023] In the figure, 100, plating tank body; 110, bottom plate; 120, side plate; 130, support plate; 140, protective plate; 200, water inlet guide box; 210, water inlet hole; 300, side water baffle; 310, guide hole; 400, side fixing frame of guard plate; 500, guard plate fixing plate; 600, anti-vortex return water box; 610, water outlet hole; 700, water inlet channel; 800, ion membrane guard plate; 810, fixed guard plate; 820, detachable guard plate; 900, water outlet channel; 1, plating tank. DETAILED DESCRIPTION
[0024] The utility model is further described below in conjunction with the accompanying drawings and embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on another element, or there can be one or more centered elements between them. When an element is described as "connected" to another element, it can be directly connected to another element, or there can be one or more centered elements between them. The terms "vertical", "horizontal", "left", "right", "inside", "outside" and similar expressions used in this specification are only for the purpose of illustration. In the description of the utility model, the term "multiple" means two or more. The term "include" and any variation thereof are intended to be non-exclusive inclusions, and one or more other features, integers, steps, operations, units, components and / or combinations thereof may exist or be added. In addition, unless otherwise expressly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. All technical and scientific terms used in this specification have the same meaning as those generally understood by technicians in the technical field of the utility model. The terms used in the specification of the utility model are only for the purpose of describing specific embodiments and are not used to limit the utility model. The term "and / or" used in this specification includes any and all combinations of one or more related listed items.
[0025] In addition, the technical features involved in different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.
[0026] like Figure 1 and Figure 2As shown, the present application provides an embodiment of a thin film electroplating cylinder with an ion membrane guard plate, the thin film electroplating cylinder with an ion membrane guard plate includes a plating tank body 100, the bottom plate 110 and the side plate 120 of the plating tank body 100 enclose a plating tank 1, a plurality of guard plate fixing plates 500 are arranged in the plating tank 1 along the width direction of the plating tank 1, the guard plate fixing plates 500 separate the plating tank 1, a guard plate side fixing frame 400 is arranged along the length direction of the plating tank 1, and the two ends of the guard plate side fixing frame 400 are respectively connected to two adjacent guard plate fixing plates 500; the two guard plate fixing plates 500 and the two guard plate side fixing frames 400 enclose an anode channel, the ion membrane guard plate 800 covers the anode channel, the lower anode (not shown in the figure) is covered under the ion membrane guard plate 800, the ion membrane guard plate 800 is located between the film and the lower anode, and the ion membrane installed on the ion membrane guard plate 800 isolates the film from the lower anode. The guard plate fixing plate 500 and the guard plate side fixing frame 400 cover the ion membrane guard plate 800 above the lower anode for electroplating. The ion membrane guard plate 800 facilitates the installation of the ion membrane and protects the ion membrane. Since the ion membrane isolates the film and the lower anode, the gas generated by the ionization of the lower anode rises and adheres to the ion membrane to generate large bubbles and is discharged from the bottom of the guard plate fixing frames on both sides, ensuring that there is no gas collection and impact on the lower surface of the film, ensuring that the surface of the film workpiece can fully contact with the plating solution, solving the problem of gas generated by the ionization of the lower anode adhering to the film to cause bulging, fracture and incomplete electroplating, so that the electroplating layer is evenly plated on the film, improving the electroplating quality.
[0027] like Figure 2-Figure 4 As shown, in one embodiment, along the length direction of the plating tank 1, water inlet guide boxes 200 are symmetrically provided on both sides of the bottom of the plating tank 1, and an anti-vortex return water box 600 is provided in the middle, a water inlet hole 210 is provided on the side wall of the water inlet guide box 200 facing the outside, and a side water baffle plate 300 is fixed to the top of the water inlet guide box 200 on the same side of the water inlet hole 210, water outlet holes 610 are provided on the side walls on both sides of the anti-vortex return water box 600, and the lower anode is arranged on the top of the water inlet guide box 200 and the anti-vortex return water box 600; the side fixing frame 400 of the guard plate is L-shaped, and there is a gap between the vertical plate surface and the side plate 120 of the plating tank 1, and the side water baffle plate 300 is located below the side fixing frame 400 of the guard plate.
[0028] The guard plate fixing plates 500 and the side plates 120 at the front and rear ends design the four sides of the ion membrane guard plate 800 to be closed. The plating liquid flows out from the water inlet hole 210 of the water inlet guide box 200 into the plating tank 1, and then is guided to the top of the ion membrane along the water retaining plates on both sides and gradually fills the plating tank 1. The reflux flows back from the middle anti-vortex return water box to the liquid storage tank at the bottom of the tank, thereby increasing the liquid circulation volume in the plating tank 1. At the same time, it can ensure that there is no turbulence layer on the liquid surface in the tank in the membrane passing area, thereby improving the electroplating quality and stability.
[0029] like Figure 2As shown, in one embodiment, the ion membrane guard plate 800 is a concave arc plate, and a plurality of through holes are provided on the arc plate to facilitate the flow of the electroplating solution. The ion membrane is installed on the ion membrane guard plate 800, and its lower surface is also an arc surface. Due to the buoyancy, the bubbles attached to the ion membrane will be collected along the arc-shaped lower surface of the ion membrane to the two ends of the ion membrane guard plate 800 that are tilted upward and discharged. When a large number of bubbles are generated, the arc-shaped ion membrane guides the gas to the two sides for discharge, which can prevent the bubbles from rising in the middle position of the ion membrane guard plate 800 to form a spoiler layer, thereby ensuring the normal progress of electroplating and the stability of the film coating.
[0030] To match the arc-shaped ion membrane guard plate 800, the upper end of the guard plate fixing plate 500 is also arc-shaped with a low middle and high ends, which is conducive to the generated gas being discharged from both sides along the arc-shaped lower surface of the ion membrane, thereby ensuring the stability of the coating on the coating surface.
[0031] like Figure 2 As shown, in one embodiment, the ion membrane guard plate 800 includes a fixed guard plate 810 and a removable guard plate 820, the fixed guard plate 810 is fixed on the guard plate side fixing frame 400, and the periphery of the removable guard plate 820 is respectively connected with the guard plate side fixing frame 400 and the guard plate fixing plate 500 by screws. The screw connection is removable and the disassembly and assembly are simple and convenient. The fixed guard plates 810 on both sides can effectively prevent them from blocking the power lines, thereby reducing the influence on the coating thickness of the membrane surfaces on both sides. The removable guard plate 820 can be removed separately, which is convenient for disassembly during equipment maintenance, and is convenient for the equipment to overhaul the lower anode below in the later stage. In other embodiments, the removable guard plate 820 can also be selectively fixedly connected according to actual production needs. For example, one pair of sides of the removable guard plate 820 can be fixed to the guard plate fixing plate 500, and the other pair of sides can be overlapped on the guard plate side fixing frame 400; or one pair of sides of the removable guard plate 820 can be fixed to the guard plate side fixing frame 400, and the other pair of sides can be overlapped on the guard plate fixing plate 500.
[0032] like Figure 4 As shown, in one embodiment, there is a gap between the side water baffle 300 and the side fixing frame to form an exhaust channel to discharge the gas generated by the anode ionization. The exhaust channel allows the bubbles generated by the lower anode to adhere to the ion membrane and then gather at the two ends of the high part where the ion membrane is tilted. The exhaust channel prevents the bubbles from adhering to the side water baffle 300.
[0033] like Figure 1 and Figure 2As shown, in one embodiment, a water inlet channel 700 and a water outlet channel 900 are provided on the bottom plate 110, the water inlet channel 700 is communicated with the water inlet guide box 200, the water outlet channel 900 is communicated with the anti-vortex return water box 600, and the water inlet channel 700 and the water outlet channel 900 are staggered. The staggered arrangement of the water inlet channel 700 and the water outlet channel 900 enables the electroplating solution entering the plating tank 1 to participate in the circulation path of the electroplating solution more completely, which facilitates the stable distribution of the electroplating solution in the plating tank 1.
[0034] like Figure 4 As shown, in one embodiment, the side water baffle 300 is L-shaped, and the horizontal part is provided with a guide hole 310 along the width direction of the plating tank 1. The guide hole 310 facilitates the flow of the plating solution in the plating tank 1 when the water inlet channel 700 and the water outlet channel 900 are in a stopped state. The plating solution at the center of the plating tank 1 can be kept horizontal and at the same height in the plating tank 1 through the guide hole 310, thereby accelerating the cleaning and replacement of the plating solution in the plating tank 1.
[0035] like Figure 3 and Figure 4 As shown, in one embodiment, the water inlet hole 210 and the water outlet hole 610 are both oblong holes. The shapes of the water inlet hole 210 and the water outlet hole 610 can be designed according to actual needs. Generally, the total area of the water inlet holes 210 of the two water inlet guide boxes 200 is consistent with the total area of the water outlet holes 610 of the anti-vortex return water box 600, so that the water inlet rate and the water outlet rate are consistent, maintaining the stability of the volume of the plating solution in the plating tank 1.
[0036] In one embodiment, along the length direction of the plating tank 1, protective plates 140 are respectively provided on both sides of the bottom plate 110, and mounting grooves are formed between the protective plates 140, the bottom plate 110 and the side plates 120. The motor, transmission shaft and other components on the thin film electroplating cylinder with ion membrane protective plates are installed in the mounting grooves, and the protective plates 140 protect them, so that the thin film electroplating cylinder with ion membrane protective plates is integrated, which is convenient for the installation and maintenance of the device.
[0037] In one embodiment, staggered support plates 130 are provided below the bottom plate 110 along the length direction and the width direction of the plating tank 1, and the top of the support plate 130 is connected to the bottom of the bottom plate 110. The support plate 130 supports the plating tank 1 to prevent the bottom plate 110 from being deformed and bent due to a large amount of electroplating liquid in the plating tank 1, ensures the levelness of the bottom of the plating tank 1, and provides installation space for the water inlet channel 700 and the water outlet channel 900, so as to facilitate the water inlet and water outlet connection between the thin film electroplating cylinder with the ion membrane guard plate and the liquid storage tank.
[0038] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the claims attached to the utility model.
[0039] The above is an exemplary description of the utility model patent in conjunction with the accompanying drawings. It is obvious that the implementation of the utility model patent is not limited to the above-mentioned method. As long as various improvements are made by adopting the method concept and technical solution of the utility model patent, or the concept and technical solution of the utility model patent are directly applied to other occasions without improvement, they are all within the protection scope of the utility model.
Claims
1. A thin film electroplating cylinder with an ion membrane guard plate, characterized in that: It includes a plating tank body, the bottom plate and side plates of the plating tank body are combined to form a plating tank, a plurality of guard plate fixing plates are arranged in the plating tank along the width direction of the plating tank, the guard plate fixing plates separate the plating tank, and a guard plate side fixing frame is arranged along the length direction of the plating tank, the two ends of the guard plate side fixing frame are respectively connected to two adjacent guard plate fixing plates; two guard plate fixing plates and two guard plate side fixing frames are combined to form an anode channel, an ion membrane guard plate covers the anode channel, a lower anode is covered under the ion membrane guard plate, and the ion membrane guard plate is used to install an ion membrane.
2. The thin film electroplating tank with an ion membrane guard plate according to claim 1, characterized in that: Along the length direction of the plating tank, water inlet guide boxes are symmetrically arranged on both sides of the bottom of the plating tank, and an anti-vortex return water box is arranged in the middle, a water inlet hole is arranged on the side wall of the water inlet guide box facing the outside, a side baffle is fixed on the top of the water inlet guide box on the same side as the water inlet hole, water outlet holes are arranged on the side walls on both sides of the anti-vortex return water box, and the lower anode is arranged on the top of the water inlet guide box and the anti-vortex return water box; The side fixing frame of the guard plate is L-shaped, and there is a gap between the vertical plate surface and the side plate of the plating tank, and the side water retaining plate is located below the side fixing frame of the guard plate.
3. The thin film electroplating tank with an ion membrane guard plate according to claim 2, characterized in that: The ion membrane guard plate is a concave arc-shaped plate, and a plurality of through holes are arranged on the arc-shaped plate to facilitate the flow of the electroplating solution.
4. The thin film electroplating tank with an ion membrane guard plate according to claim 3, characterized in that: The ion membrane guard plate comprises a fixed guard plate and a detachable guard plate, wherein the fixed guard plate is fixed on the guard plate side fixing frame, and the detachable guard plate is detachably connected to the guard plate side fixing frame and / or the guard plate fixing plate.
5. The thin film electroplating tank with an ion membrane guard plate according to claim 3, characterized in that: A gap is provided between the side water baffle plate and the side fixing frame to form an exhaust passage to exhaust the gas generated by the ionization of the lower anode.
6. The thin film electroplating tank with an ion membrane guard plate according to claim 2, characterized in that: A water inlet channel and a water outlet channel are provided on the bottom plate. The water inlet channel is communicated with the water inlet guide box, and the water outlet channel is communicated with the anti-vortex return water box. The water inlet channel and the water outlet channel are staggered.
7. The thin film electroplating tank with an ion membrane guard plate according to claim 2, characterized in that: The side water baffle is L-shaped, and the horizontal part is provided with guide holes along the width direction of the plating tank.
8. The thin film electroplating tank with an ion membrane guard plate according to claim 2, characterized in that: The water inlet and the water outlet are both oblong holes.
9. The thin film electroplating tank with an ion membrane guard plate according to claim 2, characterized in that: Along the length direction of the plating tank, protective plates are respectively provided on both sides of the bottom plate, and mounting grooves are formed between the protective plates, the bottom plate and the side plates.
10. The thin film electroplating tank with an ion membrane guard plate according to claim 2, characterized in that: Below the bottom plate, staggered support plates are respectively provided along the length direction and the width direction of the plating tank, and the top ends of the support plates are connected to the bottom of the bottom plate.