A high-speed communication and multi-layer printed circuit board

Abstract

The utility model discloses a high-speed communication and multi-layer printed circuit board, including a multi-layer printed circuit board, a connection hole, a circuit, a connection hole, an armor plate, a slot, a fixing hole, a support plate, a mounting hole A, and a shielding cover. The multi-layer printed circuit board has connection holes at both ends, the circuit is distributed on the multi-layer printed circuit board, the connection hole is distributed on the circuit side, a slot is opened in the middle of the top of the armor plate, and the multi-layer printed circuit board is installed on the armor plate through the slot, the fixing holes are distributed in the slot, and the multi-layer printed circuit board is fixed to the fixing hole through the connection hole, the support plate is respectively fixed to the front and rear parts of the top of the armor plate, the mounting hole A is distributed on the support plate, and the shielding cover is covered on the multi-layer printed circuit board through the support plate. The utility model solves the problem that high-speed communication and multi-layer printed circuit boards need to reduce electromagnetic interference to ensure signal integrity, and the installation of shielding materials affects the structural layout of high-speed communication and multi-layer printed circuit boards.

Description

Technical Field

[0001] The utility model relates to a circuit board, in particular to a high-speed communication and multi-layer printed circuit board. Background Art

[0002] High-speed communication technology, especially 5G communication, places higher demands on printed circuit boards (PCBs). To meet these requirements, the design and manufacturing technology of multi-layer printed circuit boards are constantly improving. Multi-layer printed circuit boards can provide shorter signal paths, reduce signal attenuation and crosstalk, and thus improve overall performance.

[0003] High-speed communication and multi-layer printed circuit boards need to ensure signal integrity and reduce electromagnetic interference to protect sensitive signal lines from the influence of the external electromagnetic environment. The installation of shielding materials affects the structural layout of high-speed communication and multi-layer printed circuit boards. Utility Model Content

[0004] The purpose of the utility model is to provide a high-speed communication and multi-layer printed circuit board to solve the above technical problems.

[0005] To achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a high-speed communication and multi-layer printed circuit board, including a multi-layer printed circuit board, a connection hole, a circuit, a connection hole, an armor plate, a slot, a fixing hole, a support plate, a mounting hole A, and a shielding cover. The multi-layer printed circuit board has connection holes at both ends, the circuit is distributed on the multi-layer printed circuit board, the connection holes are distributed on the circuit side, a slot is opened in the middle of the top of the armor plate, and the multi-layer printed circuit board is installed on the armor plate through the slot, the fixing holes are distributed in the slot, and the multi-layer printed circuit board is fixed to the fixing holes through the connection holes, the support plate is respectively fixed to the front and rear parts of the top of the armor plate, the mounting hole A is distributed on the support plate, and the shielding cover covers the multi-layer printed circuit board through the support plate.

[0006] Based on the above technical solution, the shielding cover includes a cover shell, heat dissipation holes, mounting holes B, fixing bolts, and peripheral interfaces. The heat dissipation holes are distributed on the top of the cover shell, the mounting holes B are distributed at the front and rear ends of the cover shell, and the cover shell corresponds to the mounting holes A through the mounting holes B. The fixing bolts are fixed to the mounting holes A through the mounting holes B, and the peripheral interfaces are distributed on the side ends of the cover shell.

[0007] Based on the above technical solution, the multilayer printed circuit board is connected to the peripheral device through a peripheral device interface.

[0008] Compared with the prior art, the utility model has the following advantages: the utility model installs a multi-layer printed circuit board on the armor and installs a shielding cover through the armor, thereby resisting external electromagnetic interference and ensuring signal integrity while avoiding direct connection with the multi-layer printed circuit board and avoiding affecting the structural layout. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 This is a schematic diagram of the appearance structure of the utility model.

[0010] Figure 2 This is a schematic diagram of the installation state of the multilayer printed circuit board of the utility model.

[0011] Figure 3 It is a schematic diagram of the structure of the armor plate of the utility model.

[0012] Figure 4 This is a schematic diagram of the shielding cover structure of the utility model.

[0013] In the figure: 1. multilayer printed circuit board, 2. connection hole, 3. line, 4. wire hole, 5. armor plate, 6. slot, 7. fixing hole, 8. support plate, 9. mounting hole A, 10. shielding cover, 11. cover, 12. heat dissipation hole, 13. mounting hole B, 14. fixing bolt, 15. peripheral interface. DETAILED DESCRIPTION

[0014] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0015] like Figures 1 to 4 As shown, a high-speed communication and multi-layer printed circuit board includes a multi-layer printed circuit board 1, a connection hole 2, a circuit 3, a connection hole 4, an armor plate 5, a slot 6, a fixing hole 7, a support plate 8, a mounting hole A9, and a shielding cover 10. The multi-layer printed circuit board 1 has connection holes 2 at both ends, the circuit 3 is distributed on the multi-layer printed circuit board 1, and the connection hole 4 is distributed on the side of the circuit 3. A slot 6 is opened in the middle of the top of the armor plate 5, and the multi-layer printed circuit board 1 is installed on the armor plate 5 through the slot 6. The fixing holes 7 are distributed in the slot 6, and the multi-layer printed circuit board 1 is fixed to the fixing holes 7 through the connection holes 2. The support plate 8 is respectively fixed to the front and rear parts of the top of the armor plate 5, and the mounting hole A9 is distributed on the support plate 8. The shielding cover 10 covers the multi-layer printed circuit board 1 through the support plate 8.

[0016] The shielding cover 10 includes a cover shell 11, heat dissipation holes 12, mounting holes B13, fixing bolts 14, and an external interface 15. The heat dissipation holes 12 are distributed on the top of the cover shell 11, the mounting holes B13 are distributed on the front and rear ends of the cover shell 11, and the cover shell 11 corresponds to the mounting hole A9 through the mounting hole B13. The fixing bolts 14 are fixed to the mounting hole A9 through the mounting hole B13, and the external interface 15 is distributed on the side end of the cover shell 11.

[0017] The multilayer printed circuit board 1 is connected to the peripheral device via the peripheral device interface 15 .

[0018] The working principle of the utility model is as follows: during installation, the multilayer printed circuit board 1 is installed and fixed through the fixing hole 7 of the armor plate 5, the components are installed on the circuit 3 through the connection hole 4, the cover 11 is covered on the multilayer printed circuit board 1 through the support plate 8, the fixing bolt 14 is fixed to the mounting hole A9 through the mounting hole B13, and the multilayer printed circuit board 1 is connected to the peripheral device through the peripheral interface 15. The shielding cover 10 resists external electromagnetic interference and ensures the integrity of the signal under the premise of avoiding direct connection with the multilayer printed circuit board 1 and avoiding affecting the structural layout.

[0019] The above is a preferred embodiment of the present invention. For ordinary technicians in this field, according to the teachings of the present invention, without departing from the principles and spirit of the present invention, changes, modifications, substitutions and variations made to the implementation methods are still within the scope of protection of the present invention.

Claims

1. A high-speed communication and multi-layer printed circuit board, comprising a multi-layer printed circuit board (1), a connection hole (2), a line (3), a connection hole (4), an armor plate (5), a card slot (6), a fixing hole (7), a support plate (8), a mounting hole A (9), and a shielding cover (10), characterized in that: The multilayer printed circuit board (1) has connection holes (2) at both ends, the circuit (3) is distributed on the multilayer printed circuit board (1), the connection holes (4) are distributed on the side of the circuit (3), a slot (6) is opened in the middle of the top of the armor plate (5), and the multilayer printed circuit board (1) is installed on the armor plate (5) through the slot (6), the fixing holes (7) are distributed in the slot (6), and the multilayer printed circuit board (1) is fixed to the fixing holes (7) through the connection holes (2), the support plate (8) is respectively fixed to the front and rear parts of the top of the armor plate (5), the mounting holes A (9) are distributed on the support plate (8), and the shielding cover (10) covers the multilayer printed circuit board (1) through the support plate (8).

2. A high-speed communication and multi-layer printed circuit board according to claim 1, characterized in that: The shielding cover (10) comprises a cover shell (11), a heat dissipation hole (12), a mounting hole B (13), a fixing bolt (14), and an external device interface (15); the heat dissipation hole (12) is distributed at the top of the cover shell (11); the mounting hole B (13) is distributed at the front and rear ends of the cover shell (11); the cover shell (11) corresponds to the mounting hole A (9) through the mounting hole B (13); the fixing bolt (14) is fixed to the mounting hole A (9) through the mounting hole B (13); and the external device interface (15) is distributed at the side end of the cover shell (11).

3. A high-speed communication and multi-layer printed circuit board according to claim 2, characterized in that: The multilayer printed circuit board (1) is connected to the peripheral device via a peripheral device interface (15).

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