A processor heat dissipation structure

Abstract

This utility model relates to the field of heat sink technology, specifically a processor heat dissipation structure. It includes a heat sink body, a bottom cover, and a heat pipe assembly. The heat sink body is mounted on the motherboard, and a CPU mounting socket is mounted on the motherboard. The heat sink body is positioned directly above the CPU mounting socket. The heat sink body includes heat dissipation fins, a fan, copper heat pipes, and a heat-conducting base. The bottom cover is mounted on the lower surface of the motherboard, and there is a detachable connection between the bottom cover and the heat sink body. Heat dissipation holes are provided on the motherboard, located between the CPU mounting socket and the bottom cover. One end of the heat pipe assembly communicates with the inside of the bottom cover, and the other end is located behind the fan. This utility model can achieve simultaneous heat dissipation from both the upper and lower ends of the CPU mounting socket, resulting in good heat dissipation performance.

Description

Technical Field

[0001] The utility model relates to the technical field of radiators, in particular to a processor heat dissipation structure. Background Art

[0002] In recent years, as technology continues to advance, the equipment and components in the field of personal computers have also changed with each passing day. Related products such as hard drives, interface cards, central processing units, etc., process more and more data and process faster and faster. However, the increase in data processing speed also leads to excessively high operating temperatures of internal devices and integrated circuit components in personal computers. Even the chips on the interface cards will generate high heat during execution. Therefore, if the heat is not dissipated in time, it will definitely affect its normal operation, resulting in a decrease in execution speed and even affecting its service life. Therefore, it is generally a common solution to set up a heat dissipation structure for the heat source (i.e., the chip).

[0003] In the prior art, the heat dissipation of the CPU is usually composed of a fan, a heat sink fin, a heat sink copper tube and a heat conductive base. By applying thermal grease between the heat conductive base and the CPU, the heat on the CPU is transferred to the heat sink fins through the heat conductive base and the heat sink copper tube. Then, the fan blows air above the heat sink fins to dissipate the heat through air convection and radiation. The above heat dissipation method is the most common structure, which can only contact a part of the CPU, and its heat dissipation effect still needs to be improved. Utility Model Content

[0004] The utility model aims to provide a processor heat dissipation structure in view of the problems existing in the background technology.

[0005] The technical solution of the utility model is a processor heat dissipation structure, comprising:

[0006] The radiator body is mounted on the mainboard, a CPU mounting base is mounted on the mainboard, the radiator body is arranged directly above the CPU mounting base, the radiator body comprises heat dissipation fins, a fan, a heat dissipation copper tube and a heat conduction base, wherein a plurality of heat dissipation fins are arranged side by side, the fan is mounted on the front side of the plurality of heat dissipation fins, a plurality of heat dissipation copper tubes are arranged and all are mounted on the heat conduction base, and a plurality of heat dissipation fins are mounted on a plurality of heat dissipation copper tubes;

[0007] The bottom cover is installed on the lower surface of the mainboard, and a detachable connection structure is provided between the bottom cover and the radiator body. A heat dissipation hole is provided on the mainboard, and the heat dissipation hole is located between the CPU mounting base and the bottom cover;

[0008] A heat dissipation pipe assembly, one end of which is communicated with the inner side of the bottom cover, and the other end of which is arranged at the rear side of the fan.

[0009] Preferably, both the upper surface and the lower surface of the heat dissipation fins are wavy structures.

[0010] Preferably, the heat dissipation pipe assembly includes an air duct a, a sleeve and an air duct b, one end of the air duct a is arranged between the heat dissipation fins and the fan, the sleeve is vertically connected to the other end of the air duct a, a through hole for the sleeve to pass through is opened on the main board, the air duct b is connected to the inner side of the bottom cover, and the outer wall of the air duct b and the inner wall of the sleeve are gap-matched.

[0011] Preferably, a plurality of connecting rods are connected to the heat-conducting base, and an internal threaded tube is vertically connected to each of the plurality of connecting rods. A plurality of mounting holes a for the internal threaded tube to pass through are provided on the main board, and a plurality of mounting holes b for the internal threaded tube to pass through are provided on the bottom cover, and mounting screws are threadedly connected to each of the plurality of internal threaded tubes.

[0012] Preferably, a strip-shaped hole is provided on the bottom cover.

[0013] Compared with the prior art, the utility model has the following beneficial technical effects: when the fan is working, it transports external gas to the lower surface of the CPU mounting base through the heat dissipation pipe assembly, thereby realizing the heat dissipation of the lower surface of the CPU mounting base, thereby improving the heat dissipation effect of the entire device, and its structure is streamlined and the heat dissipation effect is better. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a structural schematic diagram of the utility model.

[0015] Figure 2 and Figure 3 All of them are explosion diagrams of the present utility model.

[0016] Figure 4 It is a structural schematic diagram of the radiator main body in the utility model.

[0017] Figure numerals: 1, main board; 101, heat dissipation hole; 102, mounting hole a; 103, through hole; 2, heat dissipation fin; 3, fan; 4, CPU mounting base; 5, bottom cover; 501, strip hole; 502, mounting hole b; 6, heat dissipation copper tube; 7, thermal conductive base; 8, internal threaded tube; 9, air duct a; 10, sleeve; 11, air duct b; 12, mounting screw; 13, connecting rod. DETAILED DESCRIPTION

[0018] Embodiment 1

[0019] like Figure 1-Figure 4 As shown, a processor heat dissipation structure proposed in this embodiment includes a heat sink body, a bottom cover 5 and a heat pipe assembly.

[0020] The radiator body is installed on the motherboard 1, and a CPU mounting base 4 is installed on the motherboard 1. The radiator body is arranged directly above the CPU mounting base 4. The radiator body includes cooling fins 2, a fan 3, a cooling copper tube 6 and a thermal conductive base 7, wherein a plurality of cooling fins 2 are arranged side by side, the fan 3 is installed on the front side of the plurality of cooling fins 2, a plurality of cooling copper tubes 6 are arranged and are all installed on the thermal conductive base 7, and a plurality of cooling fins 2 are all installed on a plurality of cooling copper tubes 6.

[0021] The bottom cover 5 is installed on the lower surface of the mainboard 1, and the bottom cover 5 and the radiator body have a detachable connection structure. A plurality of connecting rods 13 are connected to the heat-conducting base 7, and the plurality of connecting rods 13 are vertically connected with internal threaded tubes 8. A plurality of mounting holes a102 for the internal threaded tubes 8 to pass through are provided on the mainboard 1, and a plurality of mounting holes b502 for the internal threaded tubes 8 to pass through are provided on the bottom cover 5, and the plurality of internal threaded tubes 8 are threadedly connected with mounting screws 12; when installing the radiator body and the bottom cover 5, the bottom cover 5 is buckled on the lower surface of the mainboard 1, so that the plurality of mounting holes b502 on the bottom cover 5 are respectively aligned with the plurality of mounting holes a102, and then the plurality of internal threaded tubes 8 are aligned with the plurality of mounting holes a102 and inserted, and then the plurality of mounting screws 12 are respectively threadedly connected with the plurality of internal threaded tubes 8, thereby realizing the fixed installation of the bottom cover 5 and the radiator body; a heat dissipation hole 101 is provided on the mainboard 1, and the heat dissipation hole 101 is located between the CPU mounting base 4 and the bottom cover 5.

[0022] One end of the heat dissipation pipe assembly is connected to the inner side of the bottom cover 5, and a strip hole 501 is provided on the bottom cover 5. The strip hole 501 can ensure that the gas flowing into the bottom cover 5 through the heat dissipation pipe assembly is discharged smoothly. The other end is arranged on the rear side of the fan 3. The heat dissipation pipe assembly includes an air duct a9, a sleeve 10 and an air duct b11. One end of the air duct a9 is arranged between the heat dissipation fins 2 and the fan 3. The sleeve 10 is vertically connected to the other end of the air duct a9. A through hole 103 for the sleeve 10 to pass through is provided on the main board 1. The air duct b11 is connected to the inner side of the bottom cover 5, and the outer wall of the air duct b11 is gap-matched with the inner wall of the sleeve 10.

[0023] The heat on the CPU is conducted to the heat-conducting base 7 through the thermal grease coated on its surface. The heat-conducting base 7 can be made of copper material. The heat-conducting base 7 conducts the heat to multiple heat-dissipating copper tubes 6. The heat-dissipating copper tubes 6 conduct the heat to multiple heat-dissipating fins 2. Starting the fan 3 can accelerate the heat dissipation on the surface of the heat-dissipating fins 2 and ensure the continuous heat absorption effect of the heat-dissipating fins 2. At the same time, when the fan 3 is working, it transports external gas to the lower surface of the CPU mounting base 4 through the heat-dissipating pipe assembly, so as to achieve the heat dissipation of the lower surface of the CPU mounting base 4, thereby improving the heat dissipation effect of the entire device, and its structure is simple and the heat dissipation effect is good.

[0024] Embodiment 2

[0025] like Figure 4 As shown, a processor heat dissipation structure proposed in this embodiment, compared with embodiment one, in this embodiment, the upper surface and the lower surface of the heat dissipation fin 2 are both wavy structures. Through the setting of the above structure, the surface area of ​​the heat dissipation fin 2 can be increased, thereby improving the heat absorption efficiency of the heat dissipation fin 2.

[0026] The implementation modes of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited thereto, and various changes can be made within the knowledge scope of technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A processor heat dissipation structure, characterized in that: include: A radiator body is mounted on a mainboard (1), a CPU mounting base (4) is mounted on the mainboard (1), the radiator body is arranged directly above the CPU mounting base (4), the radiator body comprises radiating fins (2), a fan (3), a radiating copper tube (6) and a heat-conducting base (7), wherein a plurality of radiating fins (2) are arranged side by side, the fan (3) is mounted on the front side of the plurality of radiating fins (2), a plurality of radiating copper tubes (6) are arranged and all are mounted on the heat-conducting base (7), and the plurality of radiating fins (2) are all mounted on the plurality of radiating copper tubes (6); A bottom cover (5), the bottom cover (5) being mounted on the lower surface of the mainboard (1), the bottom cover (5) and the heat sink body being detachably connected, a heat dissipation hole (101) being provided on the mainboard (1), and the heat dissipation hole (101) being located between the CPU mounting base (4) and the bottom cover (5); A heat dissipation pipe assembly, one end of which is connected to the inner side of the bottom cover (5) and the other end of which is arranged on the rear side of the fan (3).

2. A processor heat dissipation structure according to claim 1, characterized in that: The upper surface and the lower surface of the heat dissipation fin (2) are both wavy structures.

3. A processor heat dissipation structure according to claim 1, characterized in that: The heat dissipation pipe assembly comprises an air duct a (9), a sleeve (10) and an air duct b (11); one end of the air duct a (9) is arranged between the heat dissipation fins (2) and the fan (3); the sleeve (10) is vertically connected to the other end of the air duct a (9); a through hole (103) for the sleeve (10) to pass through is provided on the main board (1); the air duct b (11) is communicated with the inner side of the bottom cover (5); and the outer wall of the air duct b (11) is gap-matched with the inner wall of the sleeve (10).

4. The processor heat dissipation structure according to claim 1, characterized in that: A plurality of connecting rods (13) are connected to the heat-conducting base (7), and the plurality of connecting rods (13) are vertically connected to internally threaded tubes (8). The main board (1) is provided with a plurality of mounting holes a (102) for the internally threaded tubes (8) to pass through, and the bottom cover (5) is provided with a plurality of mounting holes b (502) for the internally threaded tubes (8) to pass through. The plurality of internally threaded tubes (8) are threadedly connected to mounting screws (12).

5. The processor heat dissipation structure according to claim 1, characterized in that: The bottom cover (5) is provided with a strip-shaped hole (501).

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