Cathode assembly for electroplating basket

Abstract

The utility model provides a cathode assembly for an electroplating basket, which relates to the technical field of electroplating and comprises a main body, the main body is arranged in the electroplating basket and is electrically connected with a cathode, a mixed flow channel is arranged in the main body, and the mixed flow channel is communicated with an inner cavity of the electroplating basket; the cathode assembly for the electroplating basket can guide the flow of the electroplating liquid connected into the electroplating basket so as to ensure that electronic components can be fully and internally circularly electroplated in the electroplating basket.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating, in particular to a cathode assembly for an electroplating basket. Background Art

[0002] Electroplating technology is widely used in the surface treatment of various metals and chip electronic components. With the continuous development of science and technology, people have higher and higher requirements for electronic terminal products, and the development of future electronic products will inevitably develop towards miniaturization and high reliability. The size of chip electronic components will also become smaller and smaller, only in this way can the requirements of miniaturization of the new generation of electronic products be met. Conventional basic component surface treatment uses vibration plating, barrel plating or centrifugal equipment to achieve nickel plating and tin plating.

[0003] Small-sized chip electronic components tend to float up during electroplating, resulting in insufficient electroplating of some electronic components and low electroplating quality. In order to improve the electroplating quality of small-sized chip electronic components during the electroplating process, a closed method is now used to electroplate small-sized chip electronic components, that is, the plating solution flows in the plating basket, so that the small-sized chip electronic components are electroplated in the plating solution submerged in the plating basket. However, in this way, a small number of electronic components will still stick to the inner top wall of the plating basket and not flow, that is, they are not completely submerged, which also leads to insufficient electroplating.

[0004] Therefore, it is necessary to provide a cathode assembly for a plating basket to guide the flow of the plating solution in the plating basket to ensure that the electronic components can be electroplated with sufficient internal circulation flow in the plating basket. Utility Model Content

[0005] In order to solve the above problems, the utility model provides a cathode assembly for a plating basket to guide the flow of the plating solution in the plating basket, so as to ensure that the electronic components can be electroplated in a sufficient internal circulation in the plating basket.

[0006] The utility model is realized by the following technical solutions:

[0007] The utility model provides a cathode assembly for an electroplating basket, comprising a main body, which is arranged in the electroplating basket and electrically connected to the cathode. A mixed flow channel is arranged in the main body, and the mixed flow channel is connected to the inner cavity of the electroplating basket.

[0008] Furthermore, the main body is in the shape of an elongated column.

[0009] Furthermore, the mixed flow channel is arranged vertically.

[0010] Furthermore, a cathode conductive material is provided on the outer peripheral side of the main body, and the cathode conductive material is electrically connected to the cathode.

[0011] Furthermore, a docking port is provided at one end of the main body, the docking port is communicated with the mixed flow channel, and the docking port is aligned with the liquid inlet of the electroplating basket.

[0012] Furthermore, one end of the main body is provided with a first tapered end for guiding the electroplating liquid.

[0013] Furthermore, the first tapered end is provided with a first guiding slope for guiding the electroplating liquid.

[0014] Furthermore, one end of the main body is provided with a second tapered end for guiding the electroplating liquid.

[0015] Furthermore, the second tapered end is provided with a second guiding slope for guiding the electroplating liquid.

[0016] Beneficial effects of the utility model:

[0017] The utility model adopts a main body arranged in an electroplating basket and electrically connected to a cathode. When electroplating is performed, electronic components are placed in the electroplating basket, and electroplating liquid is connected to the electroplating basket through a pipeline, and then circulates in the electroplating basket under the guidance of a mixed flow channel. During the circulation of the electroplating liquid, the electronic components are driven to circulate and electroplate at the same time, so that the electronic components can fully circulate internally and the quality of electroplating can be improved. In summary, the cathode assembly for the electroplating basket can guide the flow of the electroplating liquid connected to the electroplating basket to ensure that the electronic components can be electroplated in a fully internal circulation in the electroplating basket. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a cross-sectional view of a cathode assembly for an electroplating basket and an electroplating basket of the utility model.

[0019] The reference numerals are as follows:

[0020] Main body 1, mixed flow channel 11, cathode conductive material 12, docking port 13, first tapered end 14, first guide slope 141, second tapered end 15, second guide slope 151;

[0021] Electroplating basket 2, liquid inlet 21. DETAILED DESCRIPTION

[0022] In order to more clearly and completely illustrate the technical solution of the present invention, the present invention is further described below in conjunction with the accompanying drawings.

[0023] Please refer to Figure 1 The utility model provides a cathode assembly for an electroplating basket, including a main body 1, which is arranged in an electroplating basket 2 and electrically connected to the cathode. A mixed flow channel 11 is provided in the main body 1, and the mixed flow channel 11 is connected to the inner cavity of the electroplating basket 2.

[0024] In this embodiment, when electroplating is performed, the electronic components are placed in the electroplating basket 2, and the electroplating solution is connected to the electroplating basket 2 through a pipeline, that is, the electroplating solution enters the electroplating basket in a gushing manner, and then the electroplating solution circulates in the electroplating basket 2 under the guidance of the mixed flow channel 11. The circulation path is to take the mixed flow channel 11 as the center of the flow, flow out from the top of the mixed flow channel 11, flow in an annular manner with the outer peripheral side of the main body 1 as the branch path, and enter again from the bottom of the mixed flow channel 11 to form a circulating flow. During the circulation of the electroplating solution, the electronic components are driven to circulate and electroplate at the same time, so that the electronic components can be fully circulated internally, thereby improving the quality of electroplating.

[0025] In summary, the cathode assembly for the electroplating basket can guide the flow of the electroplating solution connected to the electroplating basket to ensure that the electronic components can be electroplated in a sufficient internal circulation in the electroplating basket.

[0026] In this embodiment, the main body 1 is in the shape of an elongated column, and the elongated column structure makes the mixed flow channel 11 elongated, which is convenient for increasing the flow distance of the electroplating solution during circulation, so that there is sufficient time for electroplating.

[0027] In this embodiment, the mixed flow channel 11 is vertically arranged, so that the electroplating solution can circulate in the electroplating basket in a fountain-like manner, thereby increasing the flow rate.

[0028] In this embodiment, a cathode conductive material 12 is provided on the outer peripheral side of the main body 1. The cathode conductive material 12 is electrically connected to the cathode. The cathode conductive material 12 is ring-shaped and embedded on the outer peripheral side of the main body 1. During the electroplating process, the cathode conductive material 12 is electrically connected to the cathode, so that the electroplating process proceeds smoothly.

[0029] In this embodiment, a docking port 13 is provided at one end of the main body 1, and the docking port 13 is communicated with the mixed flow channel 11. The docking port 13 is aligned with the liquid inlet 21 of the electroplating basket 2. The liquid inlet 21 is used to dock with the liquid outlet of the electroplating liquid through a pipeline, so that the electroplating liquid can enter the electroplating basket 2. After the electroplating liquid enters the electroplating basket 2, the electroplating liquid directly enters the mixed flow channel 11 from the docking port 13 to flow.

[0030] In this embodiment, a first conical end 14 for guiding the plating liquid is provided at one end of the main body 1. When electroplating is performed, the plating liquid will fill the plating basket 2. After the plating liquid flows out of the mixed flow channel 11, under the action of the inner wall restriction of the plating basket 2, the plating liquid will flow downward along the side wall of the main body 1 under the guidance of the first conical end 14.

[0031] In this embodiment, the first tapered end 14 is provided with a first guiding slope 141 for guiding the electroplating solution, and the first guiding slope 141 is used to guide the flow of the internally circulated electroplating solution.

[0032] In this embodiment, a second conical end 15 for guiding the plating liquid is provided at one end of the main body 1; when electroplating is performed, the plating liquid will fill the plating basket 2, and when the plating liquid needs to re-enter the mixed flow channel 11, the plating liquid will flow along the side wall of the main body 1 under the guiding effect of the second conical end 15, and will flow back into the mixed flow channel 11 under the restriction of the inner wall of the plating basket 2.

[0033] In this embodiment, the second tapered end 15 is provided with a second guiding slope 151 for guiding the electroplating liquid. The second guiding slope 151 is used to guide the flow of the inner circulating electroplating liquid so that the electroplating liquid drives the electronic components to flow back into the mixed flow channel 11.

[0034] Of course, the present utility model may have many other implementations. Based on the present implementation, other implementations obtained by ordinary technicians in this field without any creative work are all within the scope of protection of the present utility model.

Claims

1. A cathode assembly for an electroplating basket, comprising a main body, characterized in that: The main body is arranged in the electroplating basket and is electrically connected to the cathode. A mixed flow channel is arranged in the main body, and the mixed flow channel is connected to the inner cavity of the electroplating basket.

2. The cathode assembly for an electroplating basket according to claim 1, characterized in that: The main body is in the shape of an elongated column.

3. The cathode assembly for an electroplating basket according to claim 1, characterized in that: The mixed flow channel is arranged vertically.

4. The cathode assembly for an electroplating basket according to claim 1, characterized in that: A cathode conductive material is disposed on the outer peripheral side of the main body, and the cathode conductive material is electrically connected to the cathode.

5. The cathode assembly for an electroplating basket according to claim 1, characterized in that: A docking port is provided at one end of the main body, the docking port is communicated with the mixed flow channel, and the docking port is aligned with the liquid inlet of the electroplating basket.

6. The cathode assembly for an electroplating basket according to claim 1, characterized in that: One end of the main body is provided with a first tapered end for guiding the electroplating liquid.

7. The cathode assembly for an electroplating basket according to claim 6, characterized in that: The first tapered end is provided with a first guiding slope for guiding the electroplating liquid.

8. The cathode assembly for an electroplating basket according to claim 1, characterized in that: One end of the main body is provided with a second tapered end for guiding the electroplating liquid.

9. The cathode assembly for an electroplating basket according to claim 8, characterized in that: The second tapered end is provided with a second guiding slope for guiding the electroplating liquid.

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