Quick-release integrated circuit radiator for computer

Abstract

The utility model relates to the technical field of integrated circuit radiators, in particular to a quick-release integrated circuit radiator for a computer. According to the technical scheme, the quick-release integrated circuit radiator for the computer comprises a radiating assembly, an air cooling assembly and a cold head assembly, the upper and lower ends of the heat dissipation assembly are respectively provided with an air cooling assembly and a cold head assembly. According to the utility model, the hooping bolt passes through the hole of the integrated circuit board to be fixedly connected with the bolt hole, at the moment, the cold head is tightly attached to the heating packaging shell of the integrated circuit, then the buckle and the assembly clamping groove are buckled and connected together, and finally the power supply cable and the power supply are connected to complete assembly. The cooling fan blows outside air out towards the direction of the cooling fins from top to bottom, the heat conduction column diffuses heat absorbed by the cold head to the cooling fins, and heat on the cooling fins is blown out along with cooling airflow, so that the efficient cooling function of the integrated circuit component is achieved, and the mounting and dismounting efficiency is effectively improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of integrated circuit radiators, and in particular relates to a quick-detachable integrated circuit radiator for computers. Background Art

[0002] The function of the radiator is to absorb the heat generated by the integrated circuit and dissipate it into or outside the chassis through various means to ensure that the temperature of the computer components is within the normal range.

[0003] Although the radiator plays an important role in ensuring the stable operation of the computer, in actual application, there are some problems in the installation and removal process of the existing computer integrated circuit radiator. When assembling equipment or performing structural maintenance and replacement, the installation and removal of the heat sink often becomes a bottleneck. Since the radiator needs to be frequently removed and reinstalled, this not only affects work efficiency, but also increases the risk of operational errors. Especially for equipment such as servers and high-performance workstations that need to be frequently upgraded or maintained, the installation and removal efficiency of the heat sink is particularly important.

[0004] Therefore, in view of the above-mentioned existing computer integrated circuit heat sink, because the fan and heat dissipation components are inconvenient to install when they are installed on the circuit board, resulting in low efficiency in installation and disassembly of the heat dissipation device on the integrated circuit, and inconvenience in equipment assembly and structural maintenance and replacement, a quick-detachable computer integrated circuit heat sink can be designed. Utility Model Content

[0005] In order to overcome the problem that the existing integrated circuit radiator for computers is inconvenient to install the fan and the heat dissipation component when it is installed on the circuit board, resulting in low efficiency in installation and disassembly of the heat dissipation device on the integrated circuit, and inconvenient equipment assembly and structural maintenance and replacement.

[0006] The technical scheme of the utility model is: a quick-detachable integrated circuit radiator for computers, including a heat dissipation component, an air cooling component, and a cold head component; the upper and lower ends of the heat dissipation component are respectively provided with the air cooling component and the cold head component; the heat dissipation component includes a heat conducting column, a heat dissipation fin, and an assembly slot; the air cooling component includes a heat dissipation fan, a fan bracket, a bracket structure frame, and a buckle; the cold head component includes a cold head, a support foot, and a bolt hole.

[0007] Preferably, a clamping bolt is first used to pass through the hole of the integrated circuit board and connect and fix it with the bolt hole. At this time, the cold head is tightly attached to the heat-generating packaging shell of the integrated circuit. Then the buckle is connected to the assembly slot buckle. Finally, the power supply cable is connected to the power supply to complete the assembly. The cooling fan blows the external air from top to bottom toward the cooling fins. The thermal conductive column diffuses the heat absorbed by the cold head to the cooling fins. The heat on the cooling fins is blown out with the cooling airflow, thereby realizing the efficient heat dissipation function of the integrated circuit components and effectively improving the installation and disassembly efficiency, solving the problem of the existing integrated circuit radiator for computers, because the fan and the heat dissipation assembly are inconvenient to install when it is installed with the circuit board, resulting in low installation and disassembly efficiency of the heat dissipation device on the integrated circuit, and inconvenience in equipment assembly and structural maintenance and replacement.

[0008] Preferably, heat sink fins are arranged around the heat-conducting column, and the heat-conducting column is connected to the heat sink fins by thermal conduction; assembly slots are arranged on the outer edges of the heat sink fins on both sides, and the assembly slots are integrally formed with the heat sink fins.

[0009] Preferably, a cooling fan is arranged above the thermally conductive column; a fan bracket is arranged at the upper end of the cooling fan, and the fan bracket is fixedly connected to the casing of the cooling fan, and is fixed by first using a clamping bolt to pass through the holes of the integrated circuit board and connect and fix it with the bolt hole. At this time, the cold head is tightly attached to the heat generating packaging casing of the integrated circuit, and then the buckle is connected with the assembly slot buckle, and finally the power supply cable is connected to the power supply to complete the assembly. The cooling fan blows external air from top to bottom toward the cooling fins, and the thermally conductive column diffuses the heat absorbed by the cold head to the cooling fins, and the heat on the cooling fins is blown out with the cooling airflow, thereby realizing the efficient heat dissipation function of the integrated circuit components and effectively improving the installation and disassembly efficiency.

[0010] Preferably, a bracket structure frame is provided on the outside of the cooling fan, and the bracket structure frame is integrally formed with the outer shell of the fan bracket; buckles are provided on the lower ends of both sides of the bracket structure frame, and the buckles are integrally formed with the bracket structure frame, and the buckles are connected to the assembly slot buckles, the bracket structure frame covers the cooling fins, and the outer edges of the cooling fins are connected to the lower end surface slots of the bracket structure frame, thereby effectively improving the structural stability of the connection between the fan bracket and the heat-conducting column and preventing the cooling fan from shaking.

[0011] Preferably, a cold head is provided at the lower end of the heat-conducting column, and the cold head is arranged in close contact with the lower end surface of the heat-conducting column, and the cold head is used to absorb and conduct heat emitted by the integrated circuit components.

[0012] Preferably, the four corners of the cold head are provided with supporting feet, and the supporting feet are integrally formed with the cold head to provide supporting support for the structure above the cold head, thereby improving the stability of the assembly structure.

[0013] Preferably, a bolt hole is provided at one end of the support leg, and the bolt hole is integrally formed with the support leg, and an external bolt passes through the bolt hole.

[0014] Beneficial effects of the utility model:

[0015] 1. The existing computer integrated circuit radiator has the problem that the fan and the heat dissipation component are inconvenient to install when it is installed with the circuit board, resulting in low installation and disassembly efficiency of the heat dissipation device on the integrated circuit, and inconvenience in equipment assembly and structural maintenance and replacement; the clamp bolt is first used to pass through the hole of the integrated circuit board and connect and fix it with the bolt hole. At this time, the cold head is close to the heat-generating package shell of the integrated circuit, and then the buckle is connected with the assembly card slot buckle, and finally the power supply cable is connected to the power supply to complete the assembly. The cooling fan blows the external air from top to bottom toward the heat dissipation fins, and the heat conductive column diffuses the heat absorbed by the cold head to the heat dissipation fins. The heat on the heat dissipation fins is blown out with the heat dissipation airflow, thereby realizing the efficient heat dissipation function of the integrated circuit components and effectively improving the installation and disassembly efficiency; it solves the problem that the existing computer integrated circuit radiator has the problem that the fan and the heat dissipation component are inconvenient to install when it is installed with the circuit board, resulting in low installation and disassembly efficiency of the heat dissipation device on the integrated circuit, and inconvenience in equipment assembly and structural maintenance and replacement;

[0016] 2. By setting the bracket structure frame, the bracket structure frame covers the heat sink fins, and the outer edge of the heat sink fins is connected to the lower end surface slot of the bracket structure frame, thereby effectively improving the structural stability of the connection between the fan bracket and the heat conducting column and preventing the heat sink fan from shaking. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 The present invention is a schematic diagram of the overall three-dimensional structure of a quick-detachable integrated circuit heat sink for computers;

[0018] Figure 2 The following is a schematic diagram of the overall bottom-up stereoscopic structure of a quick-detachable computer integrated circuit heat sink of the utility model;

[0019] Figure 3 The figure shows an overall exploded three-dimensional structure diagram of a quick-detachable computer integrated circuit heat sink of the utility model;

[0020] Figure 4 Shown is a schematic diagram of a cross-sectional three-dimensional structure of a heat dissipation component and a cold head component of a quick-detachable integrated circuit heat sink for a computer according to the utility model.

[0021] The markings in the accompanying drawings are: 1, heat dissipation assembly; 2, air cooling assembly; 3, cold head assembly; 101, thermal conductive column; 102, heat dissipation fins; 103, assembly slot; 201, cooling fan; 202, fan bracket; 203, bracket structure frame; 204, buckle; 301, cold head; 302, support foot; 303, bolt hole. DETAILED DESCRIPTION

[0022] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0023] Please refer to Figure -, the utility model provides an embodiment: a quick-detachable integrated circuit radiator for a computer, including a heat dissipation component, an air cooling component, and a cold head component; the upper and lower ends of the heat dissipation component are respectively provided with an air cooling component and a cold head component; the heat dissipation component includes a heat conducting column, a heat dissipation fin, and an assembly slot; the air cooling component includes a heat dissipation fan, a fan bracket, a bracket structure frame, and a buckle; the cold head component includes a cold head, a support foot, and a bolt hole.

[0024] Please refer to Figure -. In this embodiment, heat dissipation fins are arranged around the heat-conducting column, and the heat-conducting column and the heat-dissipating fins are connected by thermal conduction; assembly slots are arranged on the outer edges of the heat-dissipating fins on both sides, and the assembly slots and the heat-dissipating fins are integrally formed, and a heat-dissipating fan is arranged above the heat-conducting column; a fan bracket is arranged at the upper end of the heat-dissipating fan, and the fan bracket is fixedly connected to the outer shell of the heat-dissipating fan.

[0025] Please refer to Figure -. In this embodiment, a bracket structure frame is provided on the outer side of the cooling fan, and the bracket structure frame is integrally formed with the outer shell of the fan bracket; buckles are provided on the lower ends of both sides of the bracket structure frame, and the buckles are integrally formed with the bracket structure frame, and the buckles are connected with the assembly slot buckles; a cold head is provided at the lower end of the heat-conducting column, and the cold head is tightly arranged on the lower end surface of the heat-conducting column; supporting feet are provided at the four corners of the cold head, and the supporting feet are integrally formed with the cold head; a bolt hole is provided at one end of the supporting foot, and the bolt hole is integrally formed with the supporting foot, and the external bolt passes through the bolt hole.

[0026] When working, first use the clamp bolts to pass through the holes of the integrated circuit board and connect and fix them with the bolt holes. At this time, the cold head is close to the heat-generating packaging shell of the integrated circuit, and then the buckle is connected with the assembly slot buckle. Finally, the power supply cable is connected to the power supply to complete the assembly. The heat dissipation fan blows the external air from top to bottom toward the heat dissipation fins, and the heat-conducting column diffuses the heat absorbed by the cold head to the heat dissipation fins. The heat on the heat dissipation fins is blown out with the heat dissipation airflow, thereby realizing the efficient heat dissipation function of the integrated circuit components and effectively improving the installation and disassembly efficiency; it solves the problem that the existing integrated circuit radiator for computers is inconvenient to install the fan and the heat dissipation component when it is installed with the circuit board, resulting in low installation and disassembly efficiency of the heat dissipation device on the integrated circuit, and inconvenient equipment assembly and structural maintenance and replacement;

[0027] Next, the bracket structure frame covers the heat sink fins, and the outer edges of the heat sink fins are connected to the lower end surface slots of the bracket structure frame, thereby effectively improving the structural stability of the connection between the fan bracket and the heat conducting column and preventing the heat sink fan from shaking.

[0028] Through the above steps, the clamping bolts are first used to pass through the holes of the integrated circuit board and connect and fix them with the bolt holes. At this time, the cold head is tightly attached to the heat-generating packaging shell of the integrated circuit, and then the buckle is connected to the assembly slot buckle. Finally, the power supply cable is connected to the power supply to complete the assembly. The cooling fan blows the external air from top to bottom toward the cooling fins, and the thermal conductive column diffuses the heat absorbed by the cold head to the cooling fins. The heat on the cooling fins is blown out with the cooling airflow, thereby realizing the efficient heat dissipation function of the integrated circuit components and effectively improving the installation and disassembly efficiency, avoiding the existing computer integrated circuit radiator, because the fan and the heat dissipation assembly are inconvenient to install when it is installed with the circuit board, resulting in low installation and disassembly efficiency of the heat dissipation device on the integrated circuit, and inconvenient equipment assembly and structural maintenance and replacement.

[0029] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of those skilled in the art without departing from the purpose of the present invention.

Claims

1. A quick-detachable integrated circuit heat sink for a computer, comprising a heat dissipation component (1), characterized in that: The heat dissipation assembly (1) further comprises an air cooling assembly (2) and a cold head assembly (3); the air cooling assembly (2) and the cold head assembly (3) are respectively arranged at the upper and lower ends of the heat dissipation assembly (1); the heat dissipation assembly (1) comprises a heat conducting column (101), a heat dissipation fin (102), and an assembly slot (103); the air cooling assembly (2) comprises a heat dissipation fan (201), a fan bracket (202), a bracket structure frame (203), and a buckle (204); and the cold head assembly (3) comprises a cold head (301), a support foot (302), and a bolt hole (303).

2. The quick-detachable integrated circuit heat sink for a computer according to claim 1, characterized in that: Heat dissipation fins (102) are arranged around the heat-conducting column (101), and the heat-conducting column (101) and the heat-dissipating fins (102) are connected by thermal conduction; assembly slots (103) are arranged on the outer edges of the heat-dissipating fins (102) on both sides, and the assembly slots (103) and the heat-dissipating fins (102) are integrally formed.

3. The quick-detachable integrated circuit heat sink for a computer according to claim 1, characterized in that: A heat dissipation fan (201) is arranged above the heat-conducting column (101); a fan bracket (202) is arranged at the upper end of the heat dissipation fan (201), and the fan bracket (202) is fixedly connected to the outer shell of the heat dissipation fan (201).

4. The quick-detachable integrated circuit heat sink for a computer according to claim 1, characterized in that: A support structure frame (203) is provided on the outside of the heat dissipation fan (201), and the support structure frame (203) and the outer shell of the fan support (202) are integrally formed; buckles (204) are provided on the lower ends of both sides of the support structure frame (203), and the buckles (204) and the support structure frame (203) are integrally formed, and the buckles (204) and the assembly slot (103) are buckled and connected.

5. The quick-detachable integrated circuit heat sink for a computer according to claim 1, characterized in that: A cold head (301) is arranged at the lower end of the heat-conducting column (101), and the cold head (301) is arranged in close contact with the lower end surface of the heat-conducting column (101).

6. The quick-detachable integrated circuit heat sink for a computer according to claim 1, characterized in that: Support legs (302) are provided at the four corners of the cold head (301), and the support legs (302) and the cold head (301) are integrally formed.

7. The quick-detachable integrated circuit heat sink for a computer according to claim 1, characterized in that: A bolt hole (303) is provided at one end of the support foot (302), and the bolt hole (303) and the support foot (302) are integrally formed, and an external bolt passes through the bolt hole (303).

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