Vertical furnace and crystal boat temporary storage device for vertical furnace

Abstract

The utility model discloses a vertical furnace and a wafer boat temporary storage device for the vertical furnace, the wafer boat temporary storage device comprises a wafer boat temporary storage device and a furnace body reaction device, the wafer boat temporary storage device comprises a lifting mechanism and a rotating assembly, the rotating assembly comprises a rotating disc, and the wafer boat temporary storage device is preset with a first position for reacting wafers in a wafer boat; the furnace body reaction device is arranged at the first position and located above the rotating assembly, the rotating disc is divided into a plurality of subareas according to the circumferential angle, and the subareas are each provided with a gap extending in the radial direction of the rotating disc; the lifting mechanism is arranged at the first position and provided with a supporting assembly corresponding to the gap.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor high-end equipment manufacturing, and in particular to a vertical furnace and a wafer boat temporary storage device for the vertical furnace. Background Art

[0002] In semiconductor wafer manufacturing, thin film formation is an important process technology, and the vertical furnace is an important process equipment for wafer thin film growth and high-temperature annealing. Among them, the vertical furnace generally includes a furnace body reaction device and a wafer boat temporary storage device. Among them, the wafer boat temporary storage device is the main component of the semiconductor vertical furnace.

[0003] At present, the structures of the wafer boat temporary storage devices of the existing vertical furnaces are basically the same. As the wafer boat storage area, it also involves semiconductor wafer manufacturing processes such as wafer transmission, wafer boat lifting and lowering, and wafer cooling.

[0004] Figure 1 This is a top view of the existing wafer boat temporary storage device. Figure 1 As shown, the wafer boat temporary storage device includes a wafer transfer arm, a front-opening interface mechanical standard (FIMS), a wafer boat and a lifting mechanism.

[0005] At the beginning of the process, the wafer transfer arm in the wafer boat temporary storage device will grab the wafers in the front-opening wafer box from the front-opening interface mechanical unit and insert them into the wafer boat in the wafer boat temporary storage area device one by one. When the wafer is grabbed, the lifting mechanism will drive the wafer boat into the furnace reaction device for process reaction. This process reaction process will last from tens of minutes to tens of hours. After the process reaction is completed, the wafer boat is moved out of the furnace reaction device with the lifting mechanism, and the entire wafer boat is cooled in the wafer boat temporary storage device. Finally, when the wafer temperature drops below 100°C, the wafer in the wafer boat is grabbed by the wafer transfer arm and the wafer is placed back in the front-opening wafer box.

[0006] As can be seen from the above, the wafer boat storage device is as important as the furnace reaction device. The wafers are exposed to the environment of the wafer boat storage device throughout the process. And the whole process of inserting wafers, lifting the boat, lowering the boat and taking out wafers takes about 2 hours, which is an important process that limits production capacity.

[0007] For the traditional method of placing the wafer boat directly on the supporting assembly of the lifting mechanism instead of placing it on the rotating disk, since the wafer boat and the lifting mechanism are an integrated structure, not only the wafer transfer device cannot efficiently transfer the wafers in the wafer boat, but also the internal structure of the wafer boat temporary storage device is more complicated, resulting in reduced wafer production capacity.

[0008] In addition, although some existing technologies have made many improvements to the wafer boat temporary storage device (for example, placing the wafer boat on a rotating disk), the support component of the lifting mechanism needs to be inserted from the gap between the rotating disk and the wafer boat to lift the wafer boat to the inside of the furnace body reaction device. In order to prevent the lifting mechanism support component from shaking during the insertion of the lifting mechanism support component from the gap between the rotating disk and the wafer boat (or during the lifting mechanism support component placing the wafer boat on the rotating disk), the lifting mechanism and the wafer boat are often an integrated structure. As a result, the internal structure of the wafer boat temporary storage device is more complicated and the wafer production capacity is reduced.

[0009] With regard to the technical problem in the above-mentioned prior art that in order to ensure that the lifting mechanism can drive the wafer boat into the furnace reaction device at a specified position, the lifting mechanism is often an integrated structure with the wafer boat, so that the structure of the wafer boat temporary storage device is relatively complex, thereby limiting the production capacity of the wafers, no effective solution has been proposed so far. Utility Model Content

[0010] The utility model provides a vertical furnace and a wafer boat temporary storage device for the vertical furnace, so as to at least solve the technical problem existing in the prior art that in order to ensure that the lifting mechanism can drive the wafer boat into the furnace body reaction device at a specified position, the lifting mechanism is often an integrated structure with the wafer boat, so that the structure of the wafer boat temporary storage device is relatively complex, thereby limiting the production capacity of the wafer.

[0011] According to one aspect of the present application, a vertical furnace is provided, including a wafer boat temporary storage device and a furnace body reaction device, the wafer boat temporary storage device includes a lifting mechanism and a rotating assembly, wherein the rotating assembly includes a rotating disk, the wafer boat temporary storage device is preset with a first position for reacting wafers in the wafer boat, and the furnace body reaction device is arranged at the first position and located above the rotating assembly, and wherein the rotating disk is divided into a plurality of partitions according to a circumferential angle, and the plurality of partitions are respectively provided with gaps extending radially along the rotating disk; and the lifting mechanism is arranged at the first position, and is provided with a supporting assembly corresponding to the gap.

[0012] Optionally, the rotating disk includes a plurality of rhombus-shaped support plates distributed according to a circumferential angle, wherein at least a portion of two adjacent support plates forms a partition, and a gap is formed between two adjacent support plates.

[0013] Optionally, a second position for cooling the wafers in the wafer boat is preset according to the rotation angle of the rotating disk.

[0014] Optionally, the rotating component includes a hollow rotating shaft, and the rotating shaft is connected to a plurality of partitions extending radially along the rotating disk, the partitions divide the rotating disk into a plurality of partitions, and a porous structure is provided on one side of each partition, and a first delivery pipeline is connected to the bottom of the rotating shaft; and when any one of the plurality of partitions rotates to a second position, the delivery pipeline introduces nitrogen into the partition, and the nitrogen enters the partition corresponding to the second position through the porous structure.

[0015] Optionally, a blower is provided at the bottom end of the rotating shaft, the blower is connected to the second delivery pipeline 170; and the blower discharges nitrogen through the second delivery pipeline.

[0016] Optionally, the blowing device is a turbofan blower.

[0017] Optionally, a third position for conveying the wafer to the rotating disk is preset according to the rotation angle of the rotating disk.

[0018] Optionally, the wafer boat temporary storage device further includes: a wafer transmission device correspondingly arranged at the third position, wherein the wafer transmission device is used to transmit the wafers in the wafer boat.

[0019] Optionally, the wafer transfer device is a mechanical transfer arm.

[0020] According to another aspect of the present application, a wafer boat temporary storage device for a vertical furnace is provided, comprising a lifting mechanism and a rotating assembly, wherein the rotating assembly comprises a rotating disk, and the wafer boat temporary storage device is preset with a first position for reacting wafers in the wafer boat, and wherein the rotating disk is divided into a plurality of partitions according to a circumferential angle, and the plurality of partitions are respectively provided with gaps extending radially along the rotating disk; and the lifting mechanism is arranged at the first position, and the lifting mechanism is provided with a supporting assembly corresponding to the gap.

[0021] The present application provides a vertical furnace and a wafer boat temporary storage device for the vertical furnace. The wafer boat temporary storage device includes a lifting mechanism and a rotating assembly. The rotating assembly includes a rotating disk, and the wafer boat temporary storage device is preset with a first position for reacting the wafers in the wafer boat. The furnace body reaction device is arranged at the first position and is located above the rotating assembly. The rotating disk is divided into a plurality of partitions according to the circumferential angle, and each partition is respectively provided with a gap extending radially along the rotating disk. The lifting mechanism is arranged at the first position, so that the support assembly of the lifting mechanism can lift the wafer boat to the interior of the furnace body reaction device above the rotating assembly through the gap of the rotating disk (or, the support assembly of the lifting mechanism can place the wafer boat that has been reacted in the furnace body reaction device on the rotating disk through the gap of the rotating disk).

[0022] Unlike the prior art, since the rotating disk in the present application is provided with multiple partitions, and each partition is provided with a gap extending radially along the rotating disk, the support assembly of the lifting mechanism can lift the wafer boat to the interior of the furnace reaction device above the rotating assembly through the gaps of the partitions (or, the support assembly of the lifting mechanism can place the wafer boat after the reaction on the rotating disk through the gaps of the partitions). In other words, the lifting mechanism can be set at any position in the wafer boat temporary storage device, and it does not need to be an integrated structure with the wafer boat, and it can stably lift the wafer boat to the furnace reaction device above the rotating assembly. Thereby, the complexity of the structure of the wafer boat temporary storage device is greatly reduced, and the production capacity of the wafer is improved.

[0023] This solves the technical problem in the prior art that in order to ensure that the lifting mechanism can drive the wafer boat into the furnace reaction device at a specified position, the lifting mechanism is often an integrated structure with the wafer boat, so the structure of the wafer boat temporary storage device is relatively complex, thereby limiting the production capacity of the wafer.

[0024] Based on the detailed description of the specific embodiments of the present application in combination with the accompanying drawings below, those skilled in the art will become more aware of the above and other purposes, advantages and features of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Hereinafter, some specific embodiments of the present application will be described in detail in an exemplary and non-limiting manner with reference to the accompanying drawings. The same reference numerals in the accompanying drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that these drawings are not necessarily drawn to scale. In the accompanying drawings:

[0026] Figure 1 It is a top view of the existing wafer boat temporary storage device;

[0027] Figure 2 is a top view of a wafer boat temporary storage device according to an embodiment of the present application;

[0028] Figure 3 is a schematic diagram of a wafer boat located at a first position according to an embodiment of the present application;

[0029] Figure 4 is a top view of a rotating disk according to an embodiment of the present application;

[0030] Figure 5A is a schematic diagram of a support assembly of a lifting mechanism according to an embodiment of the present application driving a wafer boat to move toward a furnace reaction device;

[0031] Figure 5B is a schematic diagram of a wafer boat located in a furnace reaction device according to an embodiment of the present application;

[0032] Figure 5Cis a schematic diagram of a wafer boat located at a second position according to an embodiment of the present application;

[0033] Figure 6 is a schematic diagram of a partition plate according to an embodiment of the present application;

[0034] Figure 7 is a schematic diagram of introducing nitrogen into the partition according to an embodiment of the present application;

[0035] Figure 8 is a schematic diagram of a blast device according to an embodiment of the present application;

[0036] Fig. 9 It is a schematic diagram of the blowing device discharging nitrogen through the second delivery pipeline according to the embodiment of the present application. DETAILED DESCRIPTION

[0037] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0038] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0039] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchanged where appropriate, so as to describe the embodiments of the present invention described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0040] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0041] Figure 2 is a schematic diagram of a wafer boat temporary storage device 10 according to an embodiment of the present application. Figure 3 1 is a schematic diagram of a wafer boat 30 located at a first position 130 according to an embodiment of the present application. Figure 4 It is a top view of the rotating disk 121 according to the embodiment of the present application. Figure 5A It is a schematic diagram showing that the support assembly 111 of the lifting mechanism 110 according to the embodiment of the present application drives the wafer boat 30 to move toward the furnace reaction device 20 . Figure 5B Schematic diagram of a wafer boat 30 located in a furnace reaction device 10 according to an embodiment of the present application. Figure 5C 1 is a schematic diagram of the wafer boat 30 located at the second position 140 according to an embodiment of the present application. Figure 2 As shown, the present application provides a vertical furnace, including a wafer boat temporary storage device 10 and a furnace body reaction device 20, the wafer boat temporary storage device 10 includes a lifting mechanism 110 and a rotating assembly 120, wherein the rotating assembly 120 includes a rotating disk 121, the wafer boat temporary storage device 10 is preset with a first position 130 for reacting the wafers in the wafer boat 30, and the furnace body reaction device 20 is arranged at the first position 130 and is located above the rotating assembly 120, and wherein the rotating disk 121 is divided into a plurality of partitions 1211 according to a circumferential angle, and the plurality of partitions 1211 are respectively provided with gaps 1212 extending radially along the rotating disk 121; and the lifting mechanism 110 is arranged at the first position 130, and is provided with a supporting assembly 111 corresponding to the gap 1212.

[0042] As described in the background technology, for the traditional method of placing the wafer boat directly on the supporting assembly of the lifting mechanism instead of placing the wafer boat on the rotating disk, since the wafer boat and the lifting mechanism are an integrated structure, not only the wafer transfer device cannot efficiently transfer the wafers in the wafer boat, but also the internal structure of the wafer boat temporary storage device is more complicated, thereby reducing the wafer production capacity.

[0043] In addition, although some existing technologies have made many improvements to the wafer boat temporary storage device (for example, placing the wafer boat on a rotating disk), the support component of the lifting mechanism needs to be inserted from the gap between the rotating disk and the wafer boat to lift the wafer boat to the inside of the furnace body reaction device. In order to prevent the wafer boat from shifting due to the vibration caused by the insertion of the support component of the lifting mechanism from the gap between the rotating disk and the wafer boat (or the process of the support component of the lifting mechanism placing the wafer boat on the rotating disk), the lifting mechanism and the wafer boat are often an integrated structure. This will lead to a more complicated structure inside the wafer boat temporary storage device and reduce the wafer production capacity.

[0044] In view of this, the present application provides a vertical furnace. Figure 3 As shown, the vertical furnace includes a wafer boat temporary storage device 10 and a furnace body reaction device 20. The wafer boat temporary storage device 10 includes a lifting mechanism 110 and a rotating assembly 120. The rotating assembly 120 includes a rotating disk 121, and the wafer boat 30 is placed on the rotating disk 121, so that the rotating disk 121 can drive the wafer boat 30 to rotate in a clockwise or counterclockwise direction. The rotation direction of the rotating disk 121 can be determined according to actual conditions, and will not be repeated here.

[0045] In addition, reference Figure 2 As shown, the wafer boat temporary storage device 10 is preset with a first position 130 for reacting the wafers in the wafer boat 30. The first position 130 is provided with a furnace reaction device 20, and the furnace reaction device 20 is just located above the rotating assembly 120, so that the wafer boat 30 can be driven into the furnace reaction device 20 under the drive of the lifting mechanism 110, so as to ensure the processing reaction of the wafers in the wafer boat 30.

[0046] Figure 4 FIG. 1 is a top view of the rotating disk 121 according to an embodiment of the present application. Figure 4 As shown, the rotating disk 121 in this embodiment is divided into three partitions 1211 of the same size according to the circumferential angle (i.e., the circumferential angle corresponding to each partition 1211 is 120°), and each partition 1211 can be provided with a wafer boat 30. Thus, in this embodiment, the number of partitions is increased from one traditional partition (i.e., corresponding to the rotating disk 121 that is not divided) to three independent partitions 1211, and the wafer boat 30 in each partition 1211 can perform corresponding operations, thereby greatly improving the efficiency of the entire reaction process.

[0047] In addition, it is worth noting that the number of partitions 1211 corresponding to the rotating disk 121 can be determined according to actual conditions. The above is just an example of the number of partitions 1211 of the rotating disk 121, and the actual situation is not limited to this.

[0048] Further references Figure 3 and Figure 4 As shown, each partition 1211 is respectively provided with a gap 1212 extending radially along the rotating disk 121, so that the support assembly 111 of the lifting mechanism 110 can pass through the gap 1212 of the partition 1211 and drive the wafer boat 30 into the interior of the furnace body reaction device 20. Specifically, the specific process of the support assembly 111 of the lifting mechanism 110 driving the wafer boat 30 into the interior of the furnace body reaction device 20 and the support assembly 111 of the lifting mechanism 110 placing the wafer boat 30 in the partition 1211 includes:

[0049] For example, first, refer to Figure 2 , Figure 3 as well as Figure 4 As shown, any one of the multiple partitions 1211 of the rotating disk 121 is provided with a wafer boat 30 , and the rotating disk 121 drives the wafer boat 30 to rotate to the first position 130 .

[0050] Then, refer to Figure 5A As shown, when the rotating disk 121 drives the wafer boat 30 to rotate to the first position 130, the support assembly 111 of the lifting mechanism 110 drives the wafer boat 30 placed on the partition 1211 through the gap 1212 of the partition 1211. It is worth noting that it should be clear to those skilled in the art that when the lifting mechanism 110 does not need to perform a lifting operation, the position of the support assembly 111 of the lifting mechanism 110 can be fixed to correspond to the gap 1212 of the partition 1211, or it can be moved to correspond to the gap 1212 of the partition 1211 when the rotating disk 121 drives the wafer boat 30 to rotate to the first position 130, and no specific limitation is made here.

[0051] In addition, since the support assembly 111 of the lifting mechanism 110 drives the wafer boat 30 to move toward the furnace body reaction device 20, if the rotating disk 121 continues to rotate, the partition 130 on the rotating disk 121 may touch the wafer boat 30, thereby causing the wafers in the wafer boat 30 to fall. Therefore, in the above process, the rotating disk 121 stops rotating.

[0052] Further, refer to Figure 5B As shown, since the furnace reaction device 20 is disposed at the first position 130 and is located above the rotating assembly 120, the supporting assembly 111 of the lifting mechanism 110 can eventually drive the wafer boat 30 into the interior of the furnace reaction device 20, so that the wafers in the wafer boat 30 are heated and reacted inside the furnace reaction device 20. In addition, it is worth noting that during the heating reaction of the wafers in the wafer boat 30 inside the furnace reaction device 20, the rotating disk 121 can rotate and perform other operations.

[0053] Afterwards, when the wafers in the wafer boat 30 have finished reacting, the support assembly 111 of the lifting mechanism 110 drives the wafer boat 30 to move downward, and places the wafer boat 30 on the partition 1211 through the gap 1212. It is worth noting that, in the process of the support assembly 111 of the lifting mechanism 110 driving the wafer boat 30 to move toward the rotating disk 121, if the rotating disk 121 continues to rotate, the partition 130 on the rotating disk 121 may touch the wafer boat 30, thereby causing the wafers in the wafer boat 30 to fall off. Therefore, in the above process, the rotating disk 121 stops rotating.

[0054] Finally, reference Figure 5C As shown, when the support assembly 111 of the lifting mechanism 110 places the wafer boat 30 on the partition 1211, the rotating disk 121 continues to rotate and rotates to the second position 140, so that the wafer boat 30 performs corresponding operations in the second position 140. The above content will be described in detail later, so it will not be repeated here.

[0055] From the above description, it can be known that no matter it is the process in which the support component 111 of the lifting mechanism 110 drives the crystal boat 30 to move toward the furnace reaction device 20, or it is the process in which the support component 111 of the lifting mechanism 110 drives the crystal boat 30 to move toward the rotating disk 121, the support component 111 can realize the lifting operation of the crystal boat 30 through the gap 1212 of the partition 1211.

[0056] Therefore, since the rotating disk 121 in the present application is provided with a plurality of partitions 1211, and each partition 1211 is provided with a gap 1212 extending radially along the rotating disk 121, the support assembly 111 of the lifting mechanism 110 can lift the wafer boat 30 to the furnace reaction device 20 above the rotating assembly 120 through the gap 1212 of the partition 1211 (or, the support assembly 111 of the lifting mechanism 110 can place the wafer boat 30 after the reaction on the rotating disk 121 through the gap 1212 of the partition 1211). In other words, the lifting mechanism 110 can be set at any position in the wafer boat temporary storage device 10, and can stably drive the wafer boat 30 into the furnace reaction device 20 without being an integrated structure with the wafer boat 30. Thereby, the complexity of the structure of the wafer boat temporary storage device 10 is greatly reduced, and the production capacity of the wafer is improved.

[0057] This solves the technical problem in the prior art that in order to ensure that the lifting mechanism 110 can drive the wafer boat 30 into the furnace reaction device 20 at a specified position, the lifting mechanism 110 is often an integrated structure with the wafer boat 30, so that the structure of the wafer boat temporary storage device 10 is relatively complex, thereby limiting the production capacity of the wafers.

[0058] Optionally, the rotating disk 121 includes a plurality of rhombus-shaped support plates 1213 distributed according to a circumferential angle, wherein at least a portion of two adjacent support plates 1213 forms a partition 1211 , and a gap 1212 is formed between two adjacent support plates 1213 .

[0059] Specifically, refer to Figure 4 As shown, the rotating disk 121 includes a plurality of rhombus-shaped support plates 1213 distributed according to a circumferential angle. At least a portion of two adjacent support plates 1213 forms a partition 1211, so that the wafer boat 30 can be placed on the two adjacent support plates 1213 (ie, Figure 4 ), thereby ensuring the stability of the wafer boat 30 on the partition 1211. Those skilled in the art should note that, although the present embodiment uses three diamond-shaped support plates 1213 as an example, the actual situation is not limited thereto.

[0060] In addition, reference Figure 4 As shown, since two adjacent support plates 1213 are not in contact, a gap 1212 is formed between the two adjacent support plates 1213. And since three support plates 1213 are provided in this embodiment, the rotating disk 121 includes three partitions 1211, and each partition 1211 is provided with a corresponding gap 1212.

[0061] Furthermore, the size of the gap 1212 corresponds exactly to the size of the supporting assembly 111 of the lifting mechanism 110 , so that the supporting assembly 111 of the lifting mechanism 110 can drive the wafer boat 30 to move toward the furnace reaction device 20 through the gap 1212 , or drive the wafer boat 30 to move toward the rotating disk 121 .

[0062] Therefore, since the present application provides a plurality of rhombus-shaped support plates 1213 distributed according to a circumferential angle, and at least a portion of two adjacent support plates 1213 forms a partition 1211, the wafer boat 30 can be stably placed on the partition 1211. Furthermore, since a gap 1212 is formed between two adjacent support plates 1213, the support assembly 111 of the lifting mechanism 110 can stably drive the wafer boat to perform lifting operations through the gap 1212, thereby preventing the wafers in the wafer boat 30 from moving.

[0063] Optionally, a second position 140 for cooling the wafers in the wafer boat 30 is preset according to the rotation angle of the rotating disk 121 .

[0064] Specifically, refer to Figure 2As shown, the wafer boat temporary storage device 10 is also preset with a second position 140 for cooling the wafers in the wafer boat 30. And because the temperature of the wafers in the wafer boat 30 is often high after the high-temperature oxidation and chemical deposition reactions in the furnace reaction device 20, when the rotating disk 121 rotates from the first position 130 to the second position 140, the wafers in the wafer boat 30 need to be further cooled and the temperature of the wafers is finally reduced to less than 100°C.

[0065] Optionally, the rotating assembly 120 includes a hollow rotating shaft 122, and the rotating shaft 122 is connected to a plurality of partitions 130 extending radially along the rotating disk 121, the partitions 130 divide the rotating disk 121 into a plurality of partitions 1211, and a porous structure 131 is provided on one side of each partition 130, and a first conveying pipeline 150 is connected to the bottom of the rotating shaft 122; and when any one of the plurality of partitions 1211 rotates to the second position 140, the first conveying pipeline 150 introduces nitrogen into the partition 130 through the hollow rotating shaft 122, and the nitrogen enters the partition 1211 corresponding to the second position 140 through the porous structure 131.

[0066] Specifically, Figure 6 Schematic diagram of the partition plate 130 according to an embodiment of the present application. Figure 4 and Figure 6 As shown, the rotating assembly 120 includes a rotating shaft 122 with a hollow interior, and the rotating shaft 122 is arranged at the center of the rotating disk 121. The rotating shaft 122 is connected to a plurality of partitions 130 extending radially along the rotating disk 121, so that each partition 130 can divide the rotating disk 121 into a plurality of partitions 1211, and each partition 1211 has the same size.

[0067] also, Figure 7 Schematic diagram of introducing nitrogen into the partition 130 according to an embodiment of the present application. Figure 7 As shown, the partition 130 is a hollow structure, and a porous structure 131 is provided on one side of the partition 130, while no holes are provided on the other side. A filter is embedded inside the partition 130, so that nitrogen can be purified and particles can be reduced. Furthermore, a first delivery pipeline 150 is connected to the bottom of the rotating shaft 122, so that the first delivery pipeline 150 can pass nitrogen into the interior of the partition 130 through the rotating shaft 122.

[0068] Further, refer to Figure 2 and Figure 7As shown, when the rotating disk 121 drives the wafer boat 30 after the reaction to rotate from the first position 130 to the second position 140, the first delivery pipeline 150 introduces nitrogen gas into the hollow rotating shaft 122. The nitrogen gas enters the interior of the partition 130 through the first delivery pipeline 150 and the hollow rotating shaft 122, and is sprayed into the partition 1211 corresponding to the second position 140 through the porous structure 131 of the partition 130, thereby cooling the wafers in the wafer boat 30.

[0069] Since the partition 130 in this embodiment divides the rotating disk 120 into three partitions 1211, when cooling the wafers in the wafer boat 30, nitrogen enters the interior of the partition 130 through the rotating shaft 122 and is then ejected from the porous structure 131 of the partition 130. Therefore, compared with the existing method where no partition 1211 is set and nitrogen is directly used to cool the wafers in the wafer boat 30, the spatial structure of the partition 1211 in this embodiment is smaller, so that the required amount of nitrogen is greatly reduced, thereby reducing the economic cost.

[0070] In addition, it is worth noting that Figure 7 Only the porous structure 131 of one separator 130 is shown, and the porous structures 131 of the other two separators 130 are not shown. However, it should be clear to those skilled in the art that the structures of the other two separators 130 are the same as those of the separators 130. Figure 6 The structure of the partitions 130 shown is the same.

[0071] Preferably, the partition 130 is a sheet metal structure.

[0072] Optionally, a blower 160 is disposed at the bottom end of the rotating shaft 122 , and the blower 160 is connected to a second conveying pipeline 170 ; and the blower 160 discharges nitrogen through the second conveying pipeline 170 .

[0073] Specifically, Figure 8 is a top view of the blowing device 160 according to an embodiment of the present application. Fig. 9 1 is a schematic diagram of the blowing device 160 discharging nitrogen through the second delivery pipeline 170 according to an embodiment of the present application. Figure 8 and Fig. 9 As shown, a blower 160 is provided at the bottom end of the rotating shaft 122, and the rotating shaft 122 is supported on the blower 160. Therefore, when the wafer located at the second position 140 is cooled, the nitrogen in the partition 1211 corresponding to the second position 140 needs to be discharged. In this case, the blower 160 is started, and the nitrogen in the partition 1211 corresponding to the second position 140 is sucked into the second conveying pipeline 170, and discharged from the wafer boat temporary storage device 10 through the second conveying pipeline 170 with a slight secondary pressure.

[0074] Therefore, since the structure of the partition 1211 is smaller than the structure when the rotating disk 121 is not divided, the blowing device 160 arranged at the bottom end of the rotating shaft 122 can be used to promptly discharge the nitrogen in the partition 1211 from the wafer boat temporary storage device 10, thereby reducing the cooling time of the wafer and improving the cooling efficiency of the wafer.

[0075] Preferably, the blowing device 160 is a turbofan blower.

[0076] Optionally, a third position 180 for transporting wafers to the rotating disk 121 is preset according to the rotation angle of the rotating disk 121. Further optionally, the wafer boat temporary storage device 10 further includes: a wafer transfer device 190 correspondingly arranged at the third position 180, wherein the wafer transfer device 190 is used to transfer the wafers in the wafer boat 30.

[0077] Specifically, refer to Figure 2 As shown, before the rotating disk 121 rotates to the first position 130, the wafer needs to be placed in the wafer boat 30 in advance, and after the wafer in the wafer boat 30 is cooled, the wafer needs to be transported to the outside of the wafer boat temporary storage device 10. Therefore, the wafer boat temporary storage device 10 is also preset with a third position 180 for transporting the wafer to the rotating disk 121. And at the third position 180, a corresponding wafer transfer device 190 is also provided. Among them, the wafer transfer device 190 is used to transfer the wafer in the wafer boat 30.

[0078] Preferably, the wafer transfer device 190 is a mechanical transfer arm.

[0079] In addition, it is worth noting that although the wafer transfer device 190 is still located between the third position 180 and the front-opening interface mechanical unit, since the present embodiment divides the rotating disk 121 into three independent partitions 1211, and the operations in each partition 1211 will not affect other partitions, although the partition 1211 corresponding to the first position 130 will be radiated with heat, the other two partitions 1211 will not be affected. Therefore, when the wafer transfer device 190 grabs the wafers in the wafer boat 30, the wafer transfer device 190 will not be affected by the heat, which will greatly increase the life of the wafer transfer device 190.

[0080] Thus, the overall process of wafer conveying and reaction is as follows: first, the rotating disk 121 rotates to the third position 180, so that the wafer transfer device 190 corresponding to the third position 180 can grab the wafer outside the wafer boat temporary storage device 10 and convey the wafer to the inside of the wafer boat 30. After the inside of the wafer boat 30 is filled with wafers, the rotating disk 121 rotates again.

[0081] Further, the rotating plate 121 rotates 120° and rotates to the first position 130, so that the supporting assembly 111 of the lifting mechanism 110 can drive the wafer boat 30 into the furnace body reaction device 20 through the gap 1212 of the partition 1211. In the process of the supporting assembly 111 of the lifting mechanism 110 driving the wafer boat 30 to move toward the furnace body reaction device 20, the rotating plate 121 stops rotating. And when the wafer boat 30 enters the furnace body reaction device 20, the rotating plate 121 can continue to rotate.

[0082] Afterwards, when the wafer reaction in the furnace reactor 20 is completed, the support assembly 111 of the lifting mechanism 110 drives the wafer boat 30 to move toward the rotating disk 121, and places the wafer boat 30 on the partition 1211 through the gap 1212 of the partition 1211. Similar to the above, when the support assembly 111 of the lifting mechanism 110 drives the wafer boat 30 to move toward the rotating disk 121, the rotating disk 121 stops rotating.

[0083] When the wafer boat 30 is placed in the partition 1212 corresponding to the second position 130, the rotating disk 121 continues to rotate and rotates 120° to the second position 140. At this time, the first conveying pipeline 150 introduces nitrogen into the interior of the partition 130 through the hollow rotating shaft 122, and sprays it through the porous structure 131 of the partition 130, thereby cooling the wafers in the partition 1211.

[0084] Furthermore, when the wafers in the partition 1211 are cooled to a specified temperature, the blowing device 160 is started and the nitrogen in the partition 1211 corresponding to the second position 140 is sucked into the second conveying pipeline 170 and discharged from the wafer boat temporary storage device 10 through the second conveying pipeline 170 with a slight secondary pressure.

[0085] Finally, when the nitrogen in the partition 1211 corresponding to the second position 140 is completely exhausted, the rotating disk 121 continues to rotate and rotates 120°, so that the rotating disk 121 rotates to the third position 180. Therefore, the wafer transfer device 190 corresponding to the third position 180 can grab the wafers in the wafer boat 30 and transport the wafers to the outside of the wafer boat temporary storage device 10.

[0086] In addition, since the rotating disk 121 of the present embodiment is divided into three partitions 1211, and each partition 1211 can hold a wafer boat 30, when any two of the three wafer boats 30 are undergoing process reactions, the remaining wafer boats 30 can be maintained at the same time. Moreover, when a wafer boat 30 that has reached its usage limit is replaced, the normal operation of other wafer boats 30 will not be affected, thereby greatly improving the output efficiency of wafers.

[0087] According to another aspect of the present application, a wafer boat temporary storage device 10 for a vertical furnace is also provided, including a lifting mechanism 110 and a rotating assembly 120, wherein the rotating assembly 120 includes a rotating disk 121, and the wafer boat temporary storage device 10 is preset with a first position 130 for reacting the wafers in the wafer boat 30, and wherein the rotating disk 121 is divided into a plurality of partitions 1211 according to a circumferential angle, and the plurality of partitions 1211 are respectively provided with gaps 1212 extending radially along the rotating disk 121; and the lifting mechanism 110 is provided at the first position 130, and the lifting mechanism 110 is provided with a supporting assembly 111 corresponding to the gap 1212.

[0088] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps described in these embodiments do not limit the scope of the utility model. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, methods and equipment known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be regarded as a part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once a certain item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0089] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0090] In the description of the present utility model, it needs to be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction, and therefore cannot be understood as limiting the scope of protection of the present utility model; the directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0091] The above is only a preferred specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A vertical furnace, comprising a wafer boat temporary storage device (10) and a furnace body reaction device (20), characterized in that: The wafer boat temporary storage device (10) comprises a lifting mechanism (110) and a rotating assembly (120), wherein the rotating assembly (120) comprises a rotating disk (121), the wafer boat temporary storage device (10) is preset with a first position (130) for reacting the wafers in the wafer boat (30), and the furnace reaction device (20) is arranged at the first position (130) and is located above the rotating assembly (120), and wherein The rotating disk (121) is divided into a plurality of partitions (1211) according to a circumferential angle, and each of the plurality of partitions (1211) is provided with a slit (1212) extending radially along the rotating disk (121); and The lifting mechanism (110) is disposed at the first position (130) and is provided with a supporting assembly (111) corresponding to the gap (1212).

2. The vertical furnace according to claim 1, characterized in that: The rotating disk (121) comprises a plurality of rhombus-shaped support plates (1213) distributed according to a circumferential angle, wherein at least a portion of two adjacent support plates (1213) forms a partition (1211), and a gap (1212) is formed between the two adjacent support plates (1213).

3. The vertical furnace according to claim 1, characterized in that: A second position (140) for cooling the wafers in the wafer boat (30) is also preset according to the rotation angle of the rotating disk (121).

4. The vertical furnace according to claim 3, characterized in that: The rotating assembly (120) comprises a hollow rotating shaft (122), and the rotating shaft (122) is connected to a plurality of partitions (130) extending radially along the rotating disk (121), the partitions (130) divide the rotating disk (121) into the plurality of partitions (1211), and wherein A porous structure (131) is provided on one side of each partition (130), and a first conveying pipeline (150) is connected to the bottom of the rotating shaft (122); and When any one of the multiple partitions (1211) rotates to the second position (140), the first delivery pipeline (150) introduces nitrogen into the partition (130) through the hollow rotating shaft (122), and the nitrogen enters the partition (1211) corresponding to the second position (140) through the porous structure (131).

5. The vertical furnace according to claim 4, characterized in that: A blower (160) is disposed at the bottom end of the rotating shaft (122), and the blower (160) is connected to a second conveying pipeline (170); and The blowing device (160) discharges the nitrogen through the second delivery pipeline (170).

6. The vertical furnace according to claim 5, characterized in that: The blowing device (160) is a turbofan blower.

7. The vertical furnace according to claim 1, characterized in that: According to the rotation angle of the rotating disk (121), a third position (180) for transporting wafers to the rotating disk (121) is also preset.

8. The vertical furnace according to claim 7, characterized in that: The wafer boat temporary storage device (10) further includes: a wafer transmission device (190) correspondingly arranged at the third position (180), wherein The wafer transfer device (190) is used to transfer the wafers in the wafer boat (30).

9. The vertical furnace according to claim 8, characterized in that: The wafer transfer device (190) is a mechanical transfer arm.

10. A wafer boat temporary storage device (10) for a vertical furnace, characterized in that: The invention comprises a lifting mechanism (110) and a rotating assembly (120), wherein the rotating assembly (120) comprises a rotating disk (121), and the wafer boat temporary storage device (10) is preset with a first position (130) for reacting to wafers in the wafer boat (30), and wherein The rotating disk (121) is divided into a plurality of partitions (1211) according to a circumferential angle, and each of the plurality of partitions (1211) is provided with a slit (1212) extending radially along the rotating disk (121); and The lifting mechanism (110) is disposed at the first position (130), and the lifting mechanism (110) is provided with a supporting assembly (111) corresponding to the gap (1212).

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