Wafer cleaning device
By designing a wafer cleaning device combining ultrapure water spraying and nitrogen purge, the problem of high cleanliness of 12-inch wafers is solved, and the comprehensive cleaning and efficient cleaning of large-sized wafers are achieved.
Patent Information
- Application Number
- CN202421446527.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-24
- Publication Date
- 2025-04-18
- Estimated Expiration
- 2034-06-24
AI Technical Summary
The prior art is difficult to achieve high cleanliness cleaning of 12-inch wafers, especially while ensuring comprehensive cleaning and avoiding water stain residues.
A wafer cleaning device is designed, including an ultrapure water cleaning module and a nitrogen purge module. Combined with the rotational action of the material carrier mechanism, the wafer is fully cleaned by combining ultrapure water spraying and nitrogen purge.
This device can ensure uniform distribution of water and uniform purge, significantly improve the cleaning effect of the wafer, making the wafer surface clean and without residues, and is suitable for 12-inch large-sized wafers.
Smart Images
Figure CN222775277U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor production technology, and in particular, to a wafer cleaning device. Background Art
[0002] Wafers are indispensable materials in semiconductor production, and they need to be cleaned with high cleanliness before other production processes can be carried out.
[0003] For large-sized wafers, it is not easy to achieve high-cleanliness cleaning. It is necessary to ensure that every inch of the wafer is cleaned properly, and to prevent the water after cleaning from affecting the cleanliness of the wafer after cleaning. Especially for 12-inch wafers, high-cleanliness cleaning is required to ensure the reliability of further product processing. However, due to their large size, in practice, it is easy to be incompletely cleaned and water stains are likely to remain, resulting in poor overall cleaning effect. Utility Model Content
[0004] The purpose of the present application is to provide a wafer cleaning device, which can improve the problem of poor cleaning effect of 12-inch wafers in the prior art.
[0005] The embodiment of the present application is implemented as follows:
[0006] An embodiment of the present application provides a wafer cleaning device, comprising:
[0007] frame;
[0008] A first chamber, wherein the first chamber is disposed on the frame and the first chamber is provided with a material opening;
[0009] A second chamber, wherein the second chamber is disposed on the frame, and the second chamber is located below the first chamber and communicated with the first chamber;
[0010] A loading mechanism, the loading mechanism comprising a suction plate and a driving module, the driving module being connected to the suction plate, the driving module being capable of driving the suction plate to move between the first chamber and the second chamber and being capable of driving the suction plate to rotate;
[0011] a cleaning component, the cleaning component comprising an ultrapure water cleaning module and a purge module, the ultrapure water cleaning module being disposed in the first chamber and capable of spraying the wafers on the adsorption disk in the second chamber, the purge module being disposed in the first chamber and capable of purging the wafers on the adsorption disk in the second chamber; and
[0012] A drainage cavity is communicated with the second chamber.
[0013] In addition, the wafer cleaning device provided according to the embodiment of the present application may also have the following additional technical features:
[0014] In an optional embodiment of the present application, the wafer cleaning device further includes a rotating lifting module, and the rotating lifting module includes a first group and a second group and both are arranged on the frame;
[0015] The output end of the first group is connected to the ultrapure water cleaning module so that the ultrapure water cleaning module can be pivoted and / or lifted;
[0016] The output end of the second group is connected to the purge module so that the purge module can be pivoted and / or lifted.
[0017] In an optional embodiment of the present application, the purge module is a nitrogen purge module.
[0018] In an optional embodiment of the present application, the purge module includes a purge head, which is fan-shaped and has a plurality of holes disposed on the lower side of the purge head.
[0019] In an optional embodiment of the present application, the wafer cleaning device is provided with two groups of feed connectors, one group of the feed connectors is arranged on a side wall of the first chamber and supplies water to the ultrapure water cleaning module, and the other group of the feed connectors is arranged on a side wall of the first chamber and supplies gas to the purge module.
[0020] In an optional embodiment of the present application, the driving module includes a rotating motor and a lifting mechanism, the lifting mechanism is arranged on the frame, the rotating motor is arranged at the output end of the lifting mechanism, and the output end of the rotating motor is transmission-connected to the adsorption plate to drive the adsorption plate to rotate.
[0021] In an optional embodiment of the present application, the drainage chamber is arranged at the bottom of the frame, and the drainage chamber is connected to the second chamber through a drainage pipe. The wafer cleaning device also includes a negative pressure exhaust mechanism, and the negative pressure exhaust mechanism is connected to the drainage chamber.
[0022] In an optional embodiment of the present application, the negative pressure exhaust mechanism further includes an air-water separator, the negative pressure exhaust mechanism is connected to the drainage cavity, and the air-water separator is arranged between the drainage cavity and the exhaust port of the negative pressure exhaust mechanism.
[0023] In an optional embodiment of the present application, an electrostatic eliminator is provided on the top of the first chamber.
[0024] In an optional embodiment of the present application, the cleaning component further includes a lower cleaning module, the lower cleaning module is disposed on the frame, the lower cleaning module includes a water spray cylinder, and the water spray cylinder extends into the second chamber and does not exceed the height of the adsorption plate.
[0025] The beneficial effects of this application are:
[0026] The wafer cleaning device of the present application cleans the wafer through an ultrapure water cleaning module and a purge module, and cooperates with the rotation of the carrier mechanism to ensure uniform distribution of water and uniform purge, and has a good cleaning effect. The second chamber is arranged below the first chamber to prevent ultrapure water from being thrown around during the cleaning process, thereby ensuring that the device itself is not damaged. The entire device cleans comprehensively, and can also have a good cleaning effect on large-size wafers such as 12 inches, so that the wafer surface is clean and free of residue, which is beneficial to subsequent production. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.
[0028] Figure 1 A schematic diagram of a wafer cleaning device provided in an embodiment of the present application;
[0029] Figure 2 for Figure 1 A schematic diagram showing a first viewing angle with part of the shell hidden;
[0030] Figure 3 for Figure 2 A partial enlarged view of part A;
[0031] Figure 4 for Figure 1 A schematic diagram showing a second perspective with part of the shell hidden;
[0032] Figure 5 for Figure 4 A partial enlarged view of part B;
[0033] Figure 6 for Figure 1 A schematic diagram showing a third viewing angle with part of the shell hidden;
[0034] Figure 7 for Figure 6 A partial enlarged view of part C;
[0035] Figure 8 for Figure 1 A schematic diagram showing a fourth viewing angle with part of the shell hidden;
[0036] Fig. 9 for Figure 8 A partial enlarged view of part D.
[0037] Icons: 100-wafer cleaning device; 10-frame; 11-shell; 20-first chamber; 21-material port; 22-isolation door; 30-second chamber; 40-carrying mechanism; 41-adsorption plate; 42-driving module; 421-rotating motor; 422-lifting mechanism; 4221-slide; 4222-track; 43-pneumatic slip ring; 44-anti-slip claw; 51-ultrapure water cleaning module; 52-purge module; 521-purge head; 501-feed connector; 60-drain chamber; 61-drain pipe; 62-pipeline; 63-exhaust port of negative pressure exhaust mechanism; 64-gas-water separator; 65-drain port; 71-first group; 72-second group; 701-linear drive structure; 702-servo motor; 80-static eliminator; 90-lower cleaning module; 91-water spray gun; 92-water supply head. DETAILED DESCRIPTION
[0038] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.
[0039] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.
[0040] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.
[0041] In the description of this application, it should be noted that the terms "inside", "outside", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product is usually placed when in use, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.
[0042] In the description of this application, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "disposed" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0043] Example
[0044] Please refer to Figures 1 to 9 , an embodiment of the present application provides a wafer cleaning device 100, comprising:
[0045] Rack 10;
[0046] A first chamber 20 , the first chamber 20 is disposed on the frame 10 , and the first chamber 20 is provided with a material port 21 ;
[0047] A second chamber 30 , wherein the second chamber 30 is disposed on the frame 10 , and the second chamber 30 is located below the first chamber 20 and communicates with the first chamber 20 ;
[0048] The object-carrying mechanism 40 includes a suction plate 41 and a driving module 42. The driving module 42 is connected to the suction plate 41. The driving module 42 can drive the suction plate 41 to move between the first chamber 20 and the second chamber 30 and can drive the suction plate 41 to rotate;
[0049] A cleaning component, the cleaning component includes an ultrapure water cleaning module 51 and a purge module 52, the ultrapure water cleaning module 51 is disposed in the first chamber 20 and can spray the wafer on the adsorption disk 41 in the second chamber 30, and the purge module 52 is disposed in the first chamber 20 and can purge the wafer on the adsorption disk 41 in the second chamber 30; and
[0050] The drainage chamber 60 is communicated with the second chamber 30 .
[0051] in, Figure 1 A housing 11 is provided in the middle, and a part of the housing is hidden in other figures.
[0052] The material port 21 is connected to or separated from the outside by an isolation door 22. When the isolation door 22 is opened, the wafer can be placed by a robot. The isolation door 22 can separate dry and wet areas, preventing water from flowing to other equipment outside the wafer cleaning device 100 during the cleaning process.
[0053] For details, please combine Figure 4 and Figure 5, the wafer cleaning device 100 of the present application further includes a rotating lifting module, the rotating lifting module includes a first group 71 and a second group 72 and both are disposed on the frame 10;
[0054] The output end of the first group 71 is connected to the ultrapure water cleaning module 51 so that the ultrapure water cleaning module 51 can be pivoted and / or lifted;
[0055] The output end of the second group 72 is connected to the purge module 52 so that the purge module 52 can be pivoted and / or lifted.
[0056] The first group 71 and the second group 72 have the same structure in the embodiment of the present application, and both include a linear drive structure 701 and a servo motor 702. The servo motor 702 is arranged at the output end of the linear drive structure 701 (a linear motor is used in this embodiment, and the output end is a slider), and can be driven up and down by the slider. The output end of the servo motor 702 is connected to the ultrapure water cleaning module 51 or the purge module 52, and can accurately control the pivot stroke. Combined with the accurate control of the linear drive structure 701, the ultrapure water cleaning module 51 and the purge module 52 can be accurately moved to the predetermined position above the wafer to ensure reliable cleaning work.
[0057] Furthermore, the purge module 52 of this embodiment is a nitrogen purge module. It is understandable that other gases suitable for purge can also be used in the purge module 52, and it is not limited to a nitrogen purge module.
[0058] Please combine Figure 3 The purge module 52 of this embodiment includes a purge head 521, which is fan-shaped and has a plurality of holes on the lower side of the purge head 521. Furthermore, the holes at the bottom of the purge head 521 are all tiny holes, which are spread all over the bottom of the purge head 521. Through uniform and dense purge, it can achieve a rag-like effect, and the purge effect is excellent.
[0059] The wafer cleaning device 100 is provided with two groups of feed connectors 501, one group of feed connectors 501 is arranged on a side wall of the first chamber 20, and supplies water to the ultrapure water cleaning module 51, and the other group of feed connectors 501 is arranged on a side wall of the first chamber 20, and supplies air to the purge module 52. By providing multiple feed connectors 501, the multiple nozzles of the ultrapure water cleaning module 51 can control the water inlet individually, and the control of the feed amount is more precise and accurate. The purge head 521 is relatively large, and the air supply can be dispersed at different positions of the purge head 521 through multiple feed connectors 501, so that the air intake distribution is more uniform, which is conducive to the uniform air outlet of the micropores at the bottom, especially when the flow rate is fast, the jet speed of the micropores can be as close as possible, and the purge effect is better. The feed connectors here are only the same in name, and do not limit the structure of the water supply and air supply to be consistent.
[0060] Please combine Figure 6 and Figure 7 The driving module 42 of this embodiment includes a rotating motor 421 and a lifting mechanism 422. The lifting mechanism 422 is arranged on the frame 10, and the rotating motor 421 is arranged at the output end of the lifting mechanism 422. The output end of the rotating motor 421 is connected to the adsorption disk 41 in a transmission manner to drive the adsorption disk 41 to rotate. Among them, the lifting and lowering of the lifting mechanism 422 can be achieved by an electric cylinder, or by a motor driving a gear rack mechanism, or by a motor driving a lead screw nut, which is not limited here. The rotating motor 421 of this embodiment is set on the track 4222 through a slide 4221, and then the slide 4221 is driven by a motor to make a linear motion, thereby realizing lifting and lowering. The rotating motor 421 is connected to the adsorption disk 41 through a pneumatic slip ring 43, thereby ensuring that the adsorption disk 41 can maintain negative pressure adsorption while being driven by the rotating motor 421 to achieve high-speed rotation. The outer periphery of the adsorption plate 41 is also provided with anti-slip claws 44. When the wafer is placed on the adsorption plate 41, the radial direction of the wafer is blocked by the anti-slip claws 44, so that the wafer will not be radially offset during high-speed rotation, which not only ensures that the ultrapure water cleaning module 51 and the purge module 52 can be cleaned according to the predetermined positions, but also prevents the wafer from being offset and colliding with other structural components, thereby avoiding damage to the wafer.
[0061] The rotating motor 421 can accurately control the rotation speed and rotation stroke of the wafer by precisely controlling the rotation, so that the distribution of ultrapure water and the purging of nitrogen are more accurate. Different control methods can also be used in different cleaning stages to achieve better cleaning effects.
[0062] Please combine Figure 3 as well as Figure 8 and Fig. 9 The drainage chamber 60 is arranged at the bottom of the frame 10, and the drainage chamber 60 is connected with the second chamber 30 through a drainage pipe 61. The bottom of the second chamber 30 is densely covered with water leakage holes. The wafer cleaning device 100 also includes a negative pressure exhaust mechanism, and the negative pressure exhaust mechanism is connected to the drainage chamber 60 through a pipeline 62. Among them, the exhaust port 63 of the negative pressure exhaust mechanism is higher than the height of the drainage chamber 60 to prevent water from being sucked to the exhaust port by negative pressure. A drainage port 65 is provided at the bottom of the drainage chamber 60.
[0063] The negative pressure exhaust mechanism also includes a gas-water separator 64, which is connected to the drainage chamber 60, and the gas-water separator 64 is arranged between the drainage chamber 60 and the exhaust port 63 of the negative pressure exhaust mechanism. By setting the gas-water separator 64, it is possible to further prevent water from being sucked into the exhaust port and to prevent damage to the negative pressure suction device. An electrostatic eliminator 80 is arranged on the top of the first chamber 20. Due to the negative pressure exhaust function, the electrostatic eliminator 80 and the negative pressure exhaust can be used together to effectively drain the water in the gas in the second chamber 30, preventing water molecules from interfering with other equipment.
[0064] The cleaning component of the present application also includes a lower cleaning module 90, which is disposed on the frame 10. The lower cleaning module 90 includes a water spray barrel 91, a water supply head 92 of the water spray barrel 91 is located outside the second chamber 30, and the water spray barrel 91 extends into the second chamber 30 and does not exceed the adsorption plate 41. The spray hole of the water spray barrel 91 faces the upper side of the adsorption plate 41, and during the wafer cleaning process, the lower surface of the wafer can be sprayed and cleaned to improve the cleaning efficiency.
[0065] The principle of this embodiment is:
[0066] The isolation door 22 is opened, and the robot puts the wafer on the adsorption plate 41. After the robot moves out, the isolation door 22 is closed. After the adsorption plate 41 fixes the wafer, the lifting mechanism 422 drives the adsorption plate 41 to descend into the second chamber 30. The static eliminator 80 and the negative pressure exhaust mechanism work simultaneously.
[0067] At this time, the first group 71 and the second group 72 respectively control the ultrapure water cleaning module 51 and the nitrogen purge module to start moving to the top of the wafer to work. First, the nitrogen purge module performs preliminary purge on the wafer, and the rotating motor 421 controls the rotation of the wafer. The ultrapure water sprayed by the ultrapure water cleaning module 51 can be effectively adsorbed by the wafer.
[0068] Then, while the wafer keeps rotating, the water spray barrel 91 below the wafer also sprays water to clean the lower surface. The nitrogen purge module is like a rag, which cleans the surface of the wafer during the continuous spraying of the ultrapure water cleaning module 51. After the spraying is completed, the nitrogen purge module continues to purge, which can dry the surface of the wafer, and the wafer itself is also rotating at a high speed, which can dry the water on the surface.
[0069] After the wafer is cleaned, the lifting mechanism 422 lifts the adsorption plate 41 to the first chamber 20, the isolation door 22 is opened, the robot removes the cleaned wafer, and then puts in a new wafer to repeat the above steps to perform high-cleanliness cleaning of the wafer.
[0070] To sum up, the wafer cleaning device 100 of the present application cleans the wafer through the ultrapure water cleaning module 51 and the purge module 52, and cooperates with the rotation of the carrier mechanism 40 to ensure uniform distribution of water and uniform purge, and has a good cleaning effect. The second chamber 30 is arranged below the first chamber 20, which can prevent the ultrapure water from being thrown around during the cleaning process and ensure that the device itself is not damaged. The entire device is cleaned comprehensively, and it can also have a good cleaning effect on large-size wafers such as 12 inches, so that the wafer surface is clean and free of residue, which is beneficial to subsequent production.
[0071] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A wafer cleaning device, characterized in that: include: frame; A first chamber, wherein the first chamber is disposed on the frame and the first chamber is provided with a material opening; A second chamber, wherein the second chamber is disposed on the frame, and the second chamber is located below the first chamber and communicated with the first chamber; A loading mechanism, the loading mechanism comprising a suction plate and a driving module, the driving module being connected to the suction plate, the driving module being capable of driving the suction plate to move between the first chamber and the second chamber and being capable of driving the suction plate to rotate; A cleaning component, the cleaning component comprising an ultrapure water cleaning module and a purge module, the ultrapure water cleaning module is disposed in the first chamber and can spray the wafers on the adsorption plate in the second chamber, the purge module is disposed in the first chamber and can purge the wafers on the adsorption plate in the second chamber; as well as A drainage cavity is communicated with the second chamber.
2. The wafer cleaning device according to claim 1, characterized in that: The wafer cleaning device further comprises a rotating lifting module, wherein the rotating lifting module comprises a first group and a second group and both are arranged on the frame; The output end of the first group is connected to the ultrapure water cleaning module so that the ultrapure water cleaning module can be pivoted and / or lifted; The output end of the second group is connected to the purge module so that the purge module can be pivoted and / or lifted.
3. The wafer cleaning device according to claim 1 or 2, characterized in that: The purge module is a nitrogen purge module.
4. The wafer cleaning device according to claim 1 or 2, characterized in that: The purge module comprises a purge head, which is fan-shaped and has a plurality of holes arranged on the lower side of the purge head.
5. The wafer cleaning device according to claim 1 or 2, characterized in that: The wafer cleaning device is provided with two groups of feed connectors, one group of which is arranged on a side wall of the first chamber and supplies water to the ultrapure water cleaning module, and the other group of which is arranged on a side wall of the first chamber and supplies gas to the purge module.
6. The wafer cleaning device according to claim 1, characterized in that: The driving module includes a rotating motor and a lifting mechanism, the lifting mechanism is arranged on the frame, the rotating motor is arranged at the output end of the lifting mechanism, and the output end of the rotating motor is transmission-connected with the adsorption disk to drive the adsorption disk to rotate.
7. The wafer cleaning device according to claim 1, characterized in that: The drainage cavity is arranged at the bottom of the frame, and the drainage cavity is connected with the second chamber through a drainage pipe. The wafer cleaning device also includes a negative pressure exhaust mechanism, and the negative pressure exhaust mechanism is connected with the drainage cavity.
8. The wafer cleaning device according to claim 7, characterized in that: The negative pressure exhaust mechanism further comprises an air-water separator, the negative pressure exhaust mechanism is connected to the drainage cavity, and the air-water separator is arranged between the drainage cavity and the exhaust port of the negative pressure exhaust mechanism.
9. The wafer cleaning device according to claim 7, characterized in that: A static eliminator is provided on the top of the first chamber.
10. The wafer cleaning device according to claim 1, characterized in that: The cleaning component further comprises a lower cleaning module, which is arranged on the frame and comprises a water spraying tube, which extends into the second chamber and does not exceed the adsorption plate.