Laser annealing equipment

Abstract

The utility model relates to the technical field of laser annealing, and particularly discloses laser annealing equipment which comprises a base, a laser emitting main body and a mounting main body, the laser emitting main body and the mounting main body are arranged on the base, the laser emitting main body is located at the top of the mounting main body, and the mounting main body comprises a conveying mechanism, a supporting platform, a process table and a clamping mechanism; the conveying mechanism and the supporting platforms are both arranged on the base, the two supporting platforms are located on the two sides of the conveying mechanism, the top faces of the supporting platforms are flush with the top face of the conveying mechanism, the two process tables are arranged, one process table is placed on the conveying mechanism, and the other process table is placed on the supporting platforms. And the clamping mechanism is arranged on the process table and is used for clamping and fixing the wafer placed on the process table. According to the invention, the influence of the loading and unloading process of the wafer on the working efficiency can be weakened.

Description

Technical Field

[0001] The present application relates to the technical field of laser annealing, and in particular to a laser annealing device. Background Art

[0002] There are three main annealing technologies in the semiconductor manufacturing process: furnace annealing, rapid thermal annealing and laser annealing. The mainstream annealing processes are rapid thermal annealing and laser annealing. Rapid thermal annealing heats the entire surface of the silicon wafer using a halogen bulb or lamp on the front or back of the silicon wafer, and the whole is heated to about 1100°C, thereby achieving silicon wafer damage repair and element activation. Laser annealing heats a local area of ​​the silicon wafer surface through the laser beam generated by the equipment, and its heating temperature can exceed 1400°C, thereby achieving the effect of melting the silicon crystal in the laser irradiation area on the surface, and then the silicon crystal damage in the melted area is repaired and the impurity elements are activated.

[0003] In the related technology, a Chinese patent with publication number CN117276143A discloses a laser annealing device and system for silicon carbide wafers, the technical highlights of which are: including a process table; a laser source installed above the process table; a first drive mechanism for driving the horizontal displacement of the process table; and a second drive mechanism for driving the laser source to swing, and the swing axis of the laser source is parallel to the displacement direction of the process table.

[0004] During laser annealing, the wafer is placed on the top surface of the process table, and annealing is achieved by scanning the laser source on the wafer. After laser annealing is completed, the wafer needs to be unclamped and then removed, and the next wafer to be annealed is placed on the process table, and then the wafer is clamped again, and then laser annealing is started; therefore, the wafer loading and unloading process takes a certain amount of time, which is not conducive to improving work efficiency. Utility Model Content

[0005] In order to reduce the impact of wafer loading and unloading processes on work efficiency, the present application provides a laser annealing device.

[0006] The laser annealing equipment provided in this application adopts the following technical solution:

[0007] A laser annealing device comprises a base and a laser emitting body and an installation body arranged on the base, wherein the laser emitting body is located on the top of the installation body, and the installation body comprises a conveying mechanism, a supporting platform, a process table and a clamping mechanism, wherein the conveying mechanism and the supporting platform are both arranged on the base, and two supporting platforms are provided and are located on both sides of the conveying mechanism, and the top surface of the supporting platform is flush with the top surface of the conveying mechanism, and two process tables are provided, wherein one process table is placed on the conveying mechanism and the other process table is placed on the supporting platform, and the clamping mechanism is provided on the process table for clamping and fixing a wafer placed on the process table.

[0008] By adopting the above technical scheme, wafers to be annealed are placed on the top surfaces of the two process tables, and the two wafers are clamped and fixed by the clamping mechanism; the process table located on the top surface of the conveying mechanism can drive the wafer to move, so that the wafer is annealed under the action of the laser emitting body; after the annealing is completed, the two process tables can be pushed to move along the width direction of the conveying mechanism, so that the process table on the conveying mechanism is moved to the vacant supporting platform, and at the same time, the process table originally on the supporting platform is moved to the conveying mechanism, so as to quickly complete the wafer loading process; then in the process of annealing the wafer, the annealed wafer can be removed, and the next wafer can be put in, and then clamped and fixed by the clamping mechanism; thereby, the time interval between two annealing treatments can be shortened, which helps to improve work efficiency.

[0009] Optionally, the clamping mechanism includes a screw, a push plate and a drive assembly, wherein a plurality of screws are provided and a spacer ring is provided on the top surface of the process table, the screw is rotatably provided on the process table, a plurality of push plates are provided, each push plate corresponds to a screw, and the push plate is slidably provided on the process table along the length direction of the screw, the push plate and the screw are threadedly connected, and an end of the push plate close to the center of the process table is used to abut against the peripheral side of a wafer placed on the process table, and the drive assembly is provided on the process table to drive the screw to rotate.

[0010] By adopting the above technical solution, when the driving component drives the screw to rotate, the screw can drive the push plate to slide, so that the ends of the plurality of push plates slide toward or away from each other, thereby clamping or canceling the wafer.

[0011] Optionally, the driving assembly includes a transmission ring gear, a transmission gear and a bevel gear pair, the transmission ring gear and the transmission gear are both rotatably set on the process table, the transmission ring gear and the transmission gear are meshed with each other, there are multiple transmission gears, each transmission gear corresponds to a screw, there are multiple groups of bevel gear pairs, each bevel gear pair corresponds to a transmission gear, and the bevel gear pair is arranged between the transmission gear and the screw.

[0012] By adopting the above technical solution, the transmission gear can be driven to rotate when the transmission ring gear rotates, and the transmission gear drives the corresponding screw to rotate through the bevel gear pair, so that multiple screws rotate synchronously.

[0013] Optionally, a rotating rod is coaxially fixedly connected to one of the transmission gears.

[0014] By adopting the above technical solution, rotating the rotating rod can drive the transmission gear at the end of the rotating rod to rotate, so that the transmission ring gear rotates. At the same time, the transmission ring gear can drive other transmission gears to rotate, so that multiple transmission gears rotate synchronously.

[0015] Optionally, a gripping block is fixedly connected to the end of the rotating rod.

[0016] By adopting the above technical solution, it is convenient to rotate the transmission gear.

[0017] Optionally, the conveying mechanism includes a conveyor belt and a mounting plate fixedly connected to the top surface of the conveyor belt, a locking assembly is provided on the process table, the locking assembly includes an insertion rod and a spring, the insertion rod is slidably provided on the process table, a first socket for inserting the end of the insertion rod, and the spring is connected between the insertion rod and the process table.

[0018] By adopting the above technical solution, after the process table is placed on the top surface of the mounting plate, the end of the insertion rod can be inserted into the first insertion hole, thereby limiting the movement of the process table relative to the mounting plate and fixing the process table on the mounting plate. Therefore, when the conveyor belt drives the mounting plate to move, the mounting plate can better drive the process table to move, which is conducive to the smooth progress of the annealing process.

[0019] Optionally, a second insertion hole for inserting the end of the insertion rod is provided on the support platform.

[0020] By adopting the above technical solution, the process table can be fixed on the corresponding supporting platform by inserting the end of the insertion rod into the second insertion hole, thereby helping to enhance the stability of the process table.

[0021] Optionally, a limit plate is fixedly connected to the support platform, and when the insertion rod and the second insertion hole are coaxial, the process table abuts against the limit plate.

[0022] By adopting the above technical solution, the setting of the limiting plate makes it easier to align the insertion rod and the second insertion hole, thereby making it more convenient to fix the process table.

[0023] Optionally, a guide plate is provided on the support platform, and two guide plates are provided and arranged at intervals, and the distance between the two guide plates is adapted to the width of the process table.

[0024] By adopting the above technical solution, the guide plate can limit the sliding of the process table, making it easier for the process table to slide onto the support platform, and the process table on the support platform can also easily slide to the required position on the mounting plate.

[0025] Optionally, a mounting groove is provided on the top surface of the support platform, the mounting groove is arranged along the width direction of the conveying mechanism, a roller is rotatably provided in the mounting groove, and the roller is used to abut against the bottom surface of the process table.

[0026] By adopting the above technical solution, the process of pushing the process table to slide is made more labor-saving.

[0027] In summary, the present application includes at least one of the following beneficial technical effects:

[0028] 1. When the wafers on the process tables on the conveying mechanism have completed the annealing process, the two process tables can be slid to the side close to the empty support platform, so as to quickly move the annealed wafers out and move the wafers to be annealed to the conveying mechanism, thereby shortening the time interval between the two annealing processes and helping to improve work efficiency.

[0029] 2. Rotate the rotating rod to drive one of the transmission gears to rotate, and the transmission ring gear will rotate accordingly, and the transmission ring gear will drive other transmission gears to rotate, so that multiple screws rotate synchronously, and the screw drives the push plate to move, so that the push plate presses against the wafer, thereby clamping and fixing the wafer, and the operation process is simple. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present application;

[0031] Figure 2 is a cross-sectional view of an embodiment of the present application for illustrating a locking assembly;

[0032] Figure 3 is a cross-sectional view of a process table in an embodiment of the present application;

[0033] Figure 4 It is a structural schematic diagram of the clamping mechanism in an embodiment of the present application.

[0034] 1. Base; 2. Laser emitting body; 21. Mounting seat; 22. Driving mechanism; 23. Laser source; 3. Conveying mechanism; 31. Conveying belt; 32. Mounting plate; 321. First plug hole; 322. Limiting strip; 4. Support platform; 41. Second plug hole; 42. Limiting plate; 43. Guide plate; 44. Mounting groove; 441. Roller; 5. Process table; 51. Receiving groove; 511. Bump; 52. Perforation; 53. Fillet; 6. Clamping mechanism; 61. Screw; 62. Push plate; 621. L-shaped plate; 622. Arc plate; 63. Driving assembly; 631. Transmission gear ring; 632. Transmission gear; 633. Bevel gear pair; 6331. Active bevel gear; 6332. Driven bevel gear; 7. Turnbar; 71. Holding block; 8. Locking assembly: 81. Insertion rod; 82. Spring. DETAILED DESCRIPTION

[0035] The following is combined with Figure 1-4 This application is described in further detail.

[0036] The present application embodiment discloses a laser annealing device. Figure 1 and Figure 2 The laser annealing equipment includes a base 1, a laser emitting body 2 and a mounting body. The base 1 is arranged horizontally. The laser emitting body 2 includes a mounting seat 21, a driving mechanism 22 and a laser source 23. The mounting seat 21 is fixedly connected to the top wall of the base 1, the driving mechanism 22 is arranged on the mounting seat 21, the laser source 23 is arranged at the movable end of the driving mechanism 22, and the emitting end of the laser source 23 faces downward, so that the driving mechanism 22 can drive the laser source 23 to move in the horizontal direction and the vertical direction to anneal the wafer below.

[0037] The installation body includes a conveying mechanism 3, a supporting platform 4 and a process table 5. The conveying mechanism 3 includes a conveyor belt 31 and a mounting plate 32. The conveying direction of the conveyor belt 31 is horizontally arranged; the mounting plate 32 is fixedly connected to the top surface of the conveyor belt 31, and the plate surface of the mounting plate 32 is horizontal. A limit strip 322 is fixedly connected to the top surface of the mounting plate 32 along the width direction of the conveyor belt 31. Two limit strips 322 are provided and arranged at intervals. The spacing between the two limit strips 322 is the same as the width of the process table 5. The limit strips 322 are used to limit the sliding of the process table 5. The conveyor belt 31 is used to drive the mounting plate 32 to move. In other embodiments, the conveyor belt 31 can also be replaced with a cylinder or a linear motor, which can drive the mounting plate 32 to move back and forth in a straight line direction.

[0038] The support platform 4 is fixedly connected to the top surface of the base 1, and the top surface of the support platform 4 is horizontally arranged. Two support platforms 4 are provided, and are respectively located on both sides of the width direction of the conveying mechanism 3. The top surface of the support platform 4 is flush with the top surface of the mounting plate 32. The support platform 4 and the mounting plate 32 are both used to place the process table 5.

[0039] The process table 5 is a rectangular block structure; there are two process tables 5, and the two process tables 5 are adjacently arranged along the width direction of the conveyor belt 31; one process table 5 is located on the top surface of the mounting plate 32, and the other process table 5 is located on the top surface of one of the support platforms 4. A circular receiving groove 51 is provided on the top surface of the process table 5, and the receiving groove 51 is used to place the wafer. A cavity is provided inside the process table 5, and a clamping mechanism 6 for clamping and fixing the wafer is provided in the cavity.

[0040] Reference Figure 3 and Figure 4 The clamping mechanism 6 includes a screw 61, a push plate 62 and a driving assembly 63. A protrusion 511 is fixedly connected to the bottom wall of the cavity, and there are three protrusions 511 arranged in a circular array; there are three screws 61, each screw 61 corresponds to a protrusion 511, and the screws 61 are arranged along the radial direction of the receiving groove 51; the screw 61 passes through the protrusion 511, and the screw 61 and the protrusion 511 are rotatably connected. There are three push plates 62, and each push plate 62 corresponds to a screw 61. The push plate 62 includes an L-shaped plate 621 and an arc-shaped plate 622; one end of the L-shaped plate 621 is vertically arranged, and the vertically arranged end is threadedly connected to the screw 61; the other end of the L-shaped plate 621 is horizontally arranged, and the horizontally arranged end is arranged along the length direction of the screw 61; the arc-shaped plate 622 is fixedly connected to the end of the horizontally arranged end of the L-shaped plate 621, and the arc-shaped plate 622 can be against the peripheral side of the wafer.

[0041] The driving assembly 63 includes a transmission gear ring 631, a transmission gear 632 and a bevel gear pair 633. The transmission gear ring 631 is an internal gear ring, and the axis of the transmission gear ring 631 is coaxial with the axis of the accommodating groove 51, and both are vertically arranged; the transmission gear ring 631 is rotatably arranged on the bottom wall of the cavity. There are three transmission gears 632, and each transmission gear 632 corresponds to a screw rod 61. The transmission gear 632 is rotatably arranged on the bottom wall of the cavity, and the transmission gear 632 is meshed with the inner side of the transmission gear ring 631. A rotating rod 7 is coaxially fixedly connected to one of the transmission gears 632, and a gripping block 71 is fixedly connected to the top of the rotating rod 7. There are three sets of bevel gear pairs 633, and each bevel gear pair 633 corresponds to a transmission gear 632.

[0042] The bevel gear pair 633 includes an active bevel gear 6331 and a driven bevel gear 6332. The active bevel gear 6331 and the transmission gear 632 are coaxially fixedly connected, and the active bevel gear 6331 is located above the transmission gear 632; the driven bevel gear 6332 and the screw 61 are coaxially fixedly connected; the active bevel gear 6331 and the driven bevel gear 6332 are meshed. Therefore, rotating the rotating rod 7 can drive the corresponding transmission gear 632 to rotate, so that the transmission ring gear 631 rotates, and the transmission ring gear 631 drives the other two transmission gears 632 to rotate, so that the three transmission gears 632 rotate synchronously and have the same direction. Under the action of the bevel gear pair 633, the three screws 61 rotate synchronously, and the screws 61 rotate and drive the push plates 62 to slide, so that the three push plates 62 gradually slide to the side close to each other until the end of the push plate 62 is pressed against the peripheral side of the wafer to clamp the wafer.

[0043] Reference Figure 2 , a locking assembly 8 is also provided on the process table 5, and the locking assembly 8 includes an insertion rod 81 and a spring 82. A vertically arranged through hole 52 is provided on the process table 5, and the insertion rod 81 is slidably inserted into the through hole 52; the spring 82 is connected between the insertion rod 81 and the process table 5, and the spring 82 makes the insertion rod 81 have a tendency to slide downward. Correspondingly, a first insertion hole 321 for inserting the end of the insertion rod 81 is provided on the top surface of the mounting plate 32. Therefore, after sliding the process table 5 to the top of the mounting plate 32, aligning the insertion rod 81 with the first insertion hole 321, the spring 82 makes the bottom end of the insertion rod 81 inserted into the first insertion hole 321, and the process table 5 can be fixed on the mounting plate 32.

[0044] A second insertion hole 41 for inserting the end of the insertion rod 81 is provided on the top surface of the support platform 4, so after the process table 5 is slid onto the support platform 4, the bottom end of the insertion rod 81 can be inserted into the second insertion hole 41, thereby fixing the process table 5 on the support platform 4.

[0045] Furthermore, a limit plate 42 is fixedly connected to the top surface of the support platform 4 at a side away from the conveying mechanism 3, and the limit plate 42 is vertically arranged, and the length direction of the limit plate 42 is parallel to the conveying direction of the conveyor belt 31. When one side of the process table 5 abuts against the limit plate 42, the insertion rod 81 and the second insertion hole 41 are in a coaxial position, so it is convenient to insert the insertion rod 81 into the second insertion hole 41, thereby fixing the process table 5.

[0046] A guide plate 43 is fixedly connected to the top surface of the support platform 4. Two guide plates 43 are provided and are symmetrically arranged. The spacing between the two guide plates 43 is the same as the width of the process table 5. The end of the guide plate 43 close to the conveyor belt 31 is provided with an arc surface, so that the process table 5 located on the mounting plate 32 is not easily stuck when it moves to the support platform 4.

[0047] Reference Figure 1and Figure 2 , a mounting groove 44 is also provided on the top surface of the support platform 4, and the mounting groove 44 is arranged along the width direction of the conveying mechanism 3; there are two mounting grooves 44 and they are arranged at intervals. A roller 441 is rotatably provided in the mounting groove 44, and there are multiple rollers 441, which are evenly spaced along the length direction of the mounting groove 44; the top of the roller 441 is located on the outside of the mounting groove 44, so that the roller 441 can be against the bottom surface of the process table 5, making the process of pushing the process table 5 to slide more labor-saving. Furthermore, a rounded corner 53 is provided at the bottom of the process table 5, so that the process table 5 can slide onto the roller 441 more easily.

[0048] The implementation principle of a laser annealing device in the embodiment of the present application is as follows: in the initial state, one process table 5 is placed on the support platform 4 on one side of the mounting plate 32, and the other process table 5 is placed on the top surface of the mounting plate 32; the top surface of the support platform 4 on the other side of the mounting plate 32 is vacant. The wafer on the top surface of the process table 5 on the mounting plate 32 can be annealed. After the annealing is completed, the insertion rods 81 on the two process tables 5 can be pulled out upward, and then the two process tables 5 can be pushed to move to the side where the vacant support platform 4 is located, so that the wafer after annealing is moved to the previously vacant support platform 4, and the next wafer is moved to the processing station on the mounting plate 32. At this time, the insertion rod 81 is released, and the insertion rod 81 is inserted into the corresponding socket under the action of the spring 82 to fix the process table 5, and then the annealing process can be performed. During annealing, the conveyor belt 31 will drive the process table 5 to move through the mounting plate 32. When the annealing is completed, the conveyor belt 31 moves the process table 5 to the initial position again.

[0049] During the annealing process, the rotating rod 7 can be rotated, and under the action of the transmission gear ring 631, multiple transmission gears 632 rotate synchronously, so that multiple screws 61 rotate synchronously, and the screws 61 drive the push plate 62 to slide, so that the push plate 62 is separated from the contact with the wafer, and the wafer is not fixed; then the new wafer to be annealed is placed on the process table 5, and then the rotating rod 7 is rotated in the opposite direction to fix the wafer. Therefore, the loading and unloading process of the wafer and the fixing and canceling process can be carried out during the annealing process of another wafer, which improves the utilization of time and helps to improve work efficiency.

[0050] The above are optional embodiments of the present application, and are not intended to limit the protection scope of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A laser annealing device, characterized in that: The invention comprises a base (1), a laser emitting body (2) and an installation body arranged on the base (1), wherein the laser emitting body (2) is located on the top of the installation body, and the installation body comprises a conveying mechanism (3), a supporting platform (4), a process table (5) and a clamping mechanism (6), wherein the conveying mechanism (3) and the supporting platform (4) are both arranged on the base (1), two supporting platforms (4) are arranged and are located on both sides of the conveying mechanism (3), and the top surface of the supporting platform (4) is flush with the top surface of the conveying mechanism (3), and two process tables (5) are arranged, wherein one process table (5) is placed on the conveying mechanism (3) and the other process table (5) is placed on the supporting platform (4), and the clamping mechanism (6) is arranged on the process table (5) and is used to clamp and fix a wafer placed on the process table (5).

2. A laser annealing device according to claim 1, characterized in that: The clamping mechanism (6) comprises a screw rod (61), a push plate (62) and a driving assembly (63). The screw rod (61) is provided in plurality and a spacer ring is provided on the top surface of the process table (5). The screw rod (61) is rotatably provided on the process table (5). The push plate (62) is provided in plurality and each push plate (62) corresponds to a screw rod (61). The push plate (62) is slidably provided on the process table (5) along the length direction of the screw rod (61). The push plate (62) and the screw rod (61) are threadedly connected. An end of the push plate (62) close to the center of the process table (5) is used to abut against the peripheral side of a wafer placed on the process table (5). The driving assembly (63) is provided on the process table (5) and is used to drive the screw rod (61) to rotate.

3. A laser annealing device according to claim 2, characterized in that: The driving assembly (63) comprises a transmission gear ring (631), a transmission gear (632) and a bevel gear pair (633); the transmission gear ring (631) and the transmission gear (632) are both rotatably arranged on the process table (5); the transmission gear ring (631) and the transmission gear (632) are meshed with each other; a plurality of transmission gears (632) are provided, each transmission gear (632) corresponds to a screw rod (61); a plurality of bevel gear pairs (633) are provided, each bevel gear pair (633) corresponds to a transmission gear (632); and the bevel gear pair (633) is arranged between the transmission gear (632) and the screw rod (61).

4. A laser annealing device according to claim 3, characterized in that: A rotating rod (7) is coaxially and fixedly connected to one of the transmission gears (632).

5. A laser annealing device according to claim 4, characterized in that: A gripping block (71) is fixedly connected to the end of the rotating rod (7).

6. The laser annealing equipment according to claim 1, characterized in that: The conveying mechanism (3) comprises a conveying belt (31) and a mounting plate (32) fixedly connected to the top surface of the conveying belt (31); a locking assembly (8) is arranged on the process table (5); the locking assembly (8) comprises an insertion rod (81) and a spring (82); the insertion rod (81) is slidably arranged on the process table (5); a first insertion hole (321) is provided on the mounting plate (32) for inserting an end of the insertion rod (81); and the spring (82) is connected between the insertion rod (81) and the process table (5).

7. A laser annealing device according to claim 6, characterized in that: The support platform (4) is provided with a second insertion hole (41) for inserting the end of the insertion rod (81).

8. A laser annealing device according to claim 7, characterized in that: The support platform (4) is fixedly connected to a limit plate (42), and when the insertion rod (81) and the second insertion hole (41) are coaxial, the process table (5) and the limit plate (42) abut against each other.

9. The laser annealing equipment according to claim 1, characterized in that: The support platform (4) is provided with a guide plate (43), and two guide plates (43) are provided and arranged at intervals, and the distance between the two guide plates (43) is adapted to the width of the process table (5).

10. The laser annealing equipment according to claim 1, characterized in that: A mounting groove (44) is provided on the top surface of the support platform (4), the mounting groove (44) being arranged along the width direction of the conveying mechanism (3), a roller (441) being rotatably arranged in the mounting groove (44), the roller (441) being used to abut against the bottom surface of the process table (5).

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