Transfer substrate

Abstract

The transfer substrate includes: a base substrate; a magnetic plate located on one surface of the base substrate; a mold located on the other surface of the base substrate and including a plurality of grooves; and a magnetic body located in the groove of the mold.

Description

Technical Field

[0001] The present disclosure relates to a transfer substrate. Background Art

[0002] In recent years, in the field of display technology, display devices with excellent characteristics such as thinness and flexibility are being developed. In contrast, the main commercialized displays are LCD (Liquid Crystal Display) and OLED (Organic Light Emitting Diodes) displays.

[0003] On the other hand, a light emitting diode (LED) is a light emitting element that converts electric current into light. A display can be realized using a light emitting element, and a fast response time and flexibility can be realized.

[0004] Light-emitting elements have various advantages, such as long life, low power consumption, excellent initial driving characteristics, and high vibration resistance.

[0005] However, in order to realize a large-area and high-pixel display device using light-emitting elements, a very large number of light-emitting elements must be accurately assembled or transferred on a wiring substrate of the display device. Utility Model Content

[0006] The embodiment is to provide a transfer substrate for realizing efficient transfer of a light emitting element and a transfer method using the same.

[0007] A transfer substrate according to an embodiment includes: a base substrate; a magnetic plate located on one side of the base substrate; a mold located on the other side of the base substrate and including a plurality of grooves; and a magnetic body located in the grooves of the mold.

[0008] The magnetic body may be in the shape of a plate having a plurality of openings, and the mold may be coupled to the openings of the magnetic body.

[0009] The magnetic plate may be provided in a detachable manner with respect to the base substrate.

[0010] The magnetic plate and the magnetic body may have magnetic properties of different polarities.

[0011] The magnetic body may be provided in a movable manner inside the mold.

[0012] Another embodiment relates to a transfer substrate comprising: a base substrate; a conductive plate located on one side of the base substrate; a mold located on the other side of the base substrate and comprising a plurality of grooves; and a conductive pattern located in the grooves of the mold.

[0013] The conductive plate may be electrically connected to the conductive pattern.

[0014] The conductive pattern may be in a plate shape with a plurality of openings formed therein, and the mold may be bonded to the openings of the conductive pattern.

[0015] A transfer substrate according to another embodiment includes: a base substrate; a mold located on one side of the base substrate and including a plurality of grooves; and a conductive pattern located in the grooves of the mold.

[0016] The conductive pattern may be in a plate shape with a plurality of openings formed therein, and the mold may be bonded to the openings of the conductive pattern.

[0017] A transfer method involved in one embodiment includes: a step of preparing a transfer substrate, wherein the transfer substrate includes a base substrate, a magnetic plate located on one side of the base substrate, a mold located on the other side of the base substrate and including a plurality of grooves, and a magnetic body located in the grooves of the mold; a step of attaching a transfer object to the mold; a step of positioning the transfer substrate on a transfer workbench including a lower magnetic plate; and a step of removing the magnetic plate located on the one side of the base substrate.

[0018] In the step of removing the magnetic plate on the one surface of the base substrate, the magnetic body may move toward the transfer stage to press the transfer object toward the transfer stage to transfer the transfer object.

[0019] Alternatively, after the step of removing the magnetic plate located on the one side of the base substrate, the transfer method further includes: a step of attaching the magnetic plate to the one side of the base substrate again.

[0020] In the step of attaching the magnetic plate to the one surface of the base substrate again, the magnetic body may move toward a direction approaching the magnetic plate and away from the transfer stage.

[0021] Another embodiment involves a transfer method including: a step of preparing a transfer substrate, wherein the transfer substrate includes a base substrate, a conductive plate located on one side of the base substrate, a mold located on the other side of the base substrate and including a plurality of grooves, and a conductive pattern located in the grooves of the mold; a step of attaching a transfer object to the mold; a step of positioning the transfer substrate on a transfer workbench including a lower conductive plate; and a step of electrically connecting the lower conductive plate and the conductive pattern.

[0022] In the step of preparing the transfer substrate, the conductive plate and the conductive pattern may be electrically connected, and an electrical attraction may exist between the conductive plate and the conductive pattern.

[0023] It may be that the transfer method further includes a step of releasing the electrical connection between the conductive plate and the conductive pattern before the step of electrically connecting the lower conductive plate and the conductive pattern. In the step of electrically connecting the lower conductive plate and the conductive pattern, the conductive pattern is oriented in the direction of the transfer workbench by the electrical attraction between the lower conductive plate and the conductive pattern, thereby pressing the transfer object in the direction of the transfer workbench, thereby transferring the transfer object.

[0024] The transfer method may further include, after the step of electrically connecting the lower conductive plate and the conductive pattern, a step of releasing the electrical connection between the lower conductive plate and the conductive pattern; and a step of electrically connecting the conductive plate and the conductive pattern.

[0025] Another embodiment involves a transfer method including: a step of preparing a transfer substrate, wherein the transfer substrate includes a base substrate, a mold located on one side of the base substrate and including a plurality of grooves, and a conductive pattern located in the grooves of the mold; a step of attaching a transfer object to the mold; a step of positioning the transfer substrate on a transfer workbench including a lower conductive plate; and a step of electrically connecting the lower conductive plate and the conductive pattern.

[0026] Another embodiment involves a transfer method including: a step of preparing a transfer substrate, wherein the transfer substrate includes a base substrate, a conductive plate located on one side of the base substrate, a mold located on the other side of the base substrate and including a plurality of grooves, and a conductive pattern located in the grooves of the mold and electrically connected to the conductive plate; a step of attaching a transfer object to the mold; a step of positioning the transfer substrate on a transfer workbench; and a step of releasing the electrical connection between the conductive plate and the conductive pattern.

[0027] According to the utility model, a transfer substrate for effectively transferring a light-emitting element and a transfer method using the same are provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 The transfer substrate according to this embodiment is shown.

[0029] Figure 2 Indicates the shape of a magnetic body on a plane.

[0030] Figures 3 to 5 Indicates the slots of various dies.

[0031] Figure 6 A transfer substrate according to another embodiment is shown.

[0032] Figure 7 Indicates the shape of the conductive pattern on a plane.

[0033] Figures 8 to 12 A method for transferring the light emitting element according to this embodiment is described.

[0034] Fig.13 and Fig.14 This shows the transfer process without the magnetic body and the magnetic plate.

[0035] Figures 15 to 19 A method of transferring a light emitting element according to another embodiment is shown.

[0036] Figure 20 to Figure 24 A method of transferring a light emitting element according to another embodiment is shown.

[0037] Figure 25 to Figure 29 A method of transferring a light emitting element according to another embodiment is shown. DETAILED DESCRIPTION

[0038] Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily implement the present invention. The present invention can be implemented in various forms and is not limited to the embodiments described herein.

[0039] In order to clearly explain the present invention, parts not related to the description are omitted, and the same or similar components are given the same symbols throughout the specification.

[0040] In addition, the size and thickness of each structure shown in the figure are arbitrarily shown for the convenience of explanation, and the utility model is not necessarily limited to the situation shown in the figure. In the drawings, in order to clearly indicate each layer and region, the thickness is exaggerated. In addition, in the drawings, for the convenience of explanation, the thickness of some layers and regions is exaggerated.

[0041] In addition, when a layer, film, region, plate or other part is located on or above another part, it includes not only the case where it is directly located on the other part, but also the case where there is another part in between. Conversely, when a part is directly located on another part, it means that there is no other part in between. In addition, being located on or above a part used as a reference means being located above or below the part used as a reference, and does not necessarily mean being located above or above the gravity direction side.

[0042] Furthermore, in the entire specification, when a certain part includes a certain constituent element, unless there is a particular description to the contrary, it does not exclude the inclusion of other constituent elements, but means that the part may further include other constituent elements.

[0043] In addition, throughout the specification, “in plan view” refers to a case where a target portion is viewed from above, and “in cross section” refers to a case where a cross section of the target portion is viewed from the side.

[0044] Hereinafter, a transfer substrate according to the present embodiment and a method of transferring a light emitting element using the transfer substrate will be described with reference to the drawings.

[0045] Figure 1 FIG. 1 shows a transfer substrate 100 according to the present embodiment. Figure 1 The transfer substrate 100 involved in this embodiment includes a base substrate 200, a magnetic plate 300 located on one side of the base substrate 200, a mold 400 located on the other side of the base substrate 200 and including a plurality of grooves 410, and a magnetic body 500 located inside the grooves 410 of the mold 400.

[0046] That is, Figure 1 As shown, the transfer substrate 100 involved in this embodiment may include a magnetic plate 300 and a magnetic body 500 located inside the groove 410 of the mold 400, and the light-emitting element is transferred by using the magnetic force of the magnetic plate 300 and the magnetic body 500. Therefore, in the transfer substrate 100 involved in this embodiment, the magnetic plate 300 and the magnetic body 500 can be set in a detachable form. The magnetic plate 300 can be detached, and the magnetic body 500 is not fixed in the groove 410 of the mold 400 but can move in the groove 410 of the mold 400.

[0047] The magnetic body 500 may be in the form of a mask patterned to have an opening that matches the mold 400 .

[0048] Figure 2 : represents the planar shape of the magnetic body 500. The magnetic body 500 includes a plurality of openings 530 corresponding to the protrusions of the mold 400, and the protrusions of the mold 400 can be inserted into the openings 530 of the magnetic body 500.

[0049] exist Figure 1 4 shows a case where the groove 410 of the mold 400 is in a rectangular shape, but this is only an example, and the shape of the groove 410 of the mold 400 can be various.

[0050] Figures 3 to 5 The grooves 410 of various molds 400 are shown. The magnetic body 500 located inside the grooves 410 is also shown.

[0051] Reference Figure 3 , the cross section of the groove 410 may be a trapezoidal shape. Alternatively, referring to Figure 4 , the cross-sectional shape of the groove 410 may be a quadrilateral on the inner side of the mold 400 and may be a trapezoid at the edge of the mold 400. Alternatively, referring to Figure 5 , the cross-section of the groove 410 may include a curved surface. Figures 3 to 5 The shape of the groove 410 is only an example, and the utility model is not limited thereto. In the transfer process involved in this embodiment, the magnetic body 500 moves from the inner side of the groove 410 toward the outer side of the groove 410, which will be described in detail later. Therefore, the outer width of the groove 410 can be greater than the inner width so that the magnetic body 500 can move. In the case where the outer width is less than the inner width, during the transfer process, the magnetic body 500 may not contribute to the transfer.

[0052] exist Figure 1 In the embodiment of the present invention, the transfer substrate 100 includes a magnetic plate 300 and a magnetic body 500, but in other embodiments, the transfer substrate 100 may include a conductive plate 310 and a conductive pattern 510 instead of the magnetic plate 300 and the magnetic body 500 (see Figure 6 ).

[0053] Figure 6 2 shows a transfer substrate 100 according to another embodiment. Figure 6 The transfer substrate 100 of this embodiment is similar to the transfer substrate 100 except that the transfer substrate 100 includes a conductive plate 310 instead of the magnetic plate 300 and a conductive pattern 510 instead of the magnetic body 500. Figure 1 The same embodiment is the same as that of the embodiment. Specific descriptions of the same components are omitted. That is, a conductive plate 310 can be provided on one side of the base substrate 200. The mold 400 can include a plurality of grooves 410, and a conductive pattern 510 can be provided in the grooves 410 of the mold. The conductive pattern 510 can be in the form of a mask patterned to have an opening that matches the mold 400.

[0054] Figure 7 denoted a planar shape of the conductive pattern 510. The conductive pattern 510 may include a plurality of openings 540 corresponding to the protrusions of the mold 400, and the mold 400 may be inserted into the openings 540 of the conductive pattern 510.

[0055] exist Figure 6 In the embodiment of the present invention, the conductive plate 310 and the conductive pattern 510 can be electrically connected to each other. Through the electrical attraction between the conductive plate 310 and the conductive pattern 510, the conductive pattern 510 can effectively transfer the light-emitting element while moving in the groove 410 of the mold 400, which will be described separately later.

[0056] Hereinafter, a method for transferring a light emitting element according to the present embodiment will be described in detail with reference to the accompanying drawings. Figures 8 to 12 A method for transferring the light emitting element according to this embodiment is described.

[0057] Reference Figure 8, prepare the transfer substrate 100 and the transfer workbench 600. At this time, the description of the transfer substrate 100 is the same as that of the transfer substrate 100. Figure 1 The same. That is, the transfer substrate 100 includes a base substrate 200, a magnetic plate 300 located on one side of the base substrate 200, a mold 400 located on the other side of the base substrate 200 and including a plurality of grooves 410, and a magnetic body 500 located inside the grooves 410 of the mold 400. Specific descriptions of the same components are omitted. A light-emitting element 700 may be provided on the protruding portion of the mold 400. This light-emitting element 700 is a transfer object, and the light-emitting element 700 may be a micro LED chip. As described above, the magnetic body 500 is located on the inner side of the groove 410 of the mold 400 due to the magnetic force between the magnetic plate 300 and the magnetic body 500.

[0058] The transfer stage 600 may include a base stage 610 and a lower magnetic plate 620 located at the lower portion of the base stage 610. In a step before transfer, the lower magnetic plate 620 may be disposed to be spaced apart from the base stage 610. A substrate SUB may be disposed on the upper portion of the base stage 610, and an adhesive layer 110 may be disposed on the substrate SUB. Since the adhesive layer 110 is located on the substrate SUB, the light emitting element 700 located on the transfer substrate 100 may be transferred to the substrate SUB.

[0059] Reference Fig. 9 , move the transfer substrate 100 so that the light emitting element 700 is located on the substrate SUB. In this step, the light emitting element 700 can be bonded to the adhesive layer 110 of the substrate SUB. However, in the case of transferring the light emitting element 700 only by this method, there is a problem that the light emitting element 700 that is not sufficiently bonded to the substrate SUB cannot be transferred. In the case of this embodiment, by using the process described later using the magnetic body 500, the magnetic plate 300 and the lower magnetic plate 620, the light emitting element 700 is not omitted in the transfer.

[0060] Reference Fig.10 , the magnetic plate 300 is separated from the transfer substrate 100, and the lower magnetic plate 620 at the lower part of the base stage 610 is attached to the base stage 610. In the previous step, the magnetic body 500 is located inside the groove 410 of the mold 400 by the magnetic force of the magnetic plate 300, but in Fig.10 In the step of removing the magnetic plate 300 , the lower magnetic plate 620 is brought closer, and the magnetic body 500 moves toward the outside of the groove 410 of the mold 400 due to the magnetic force with the lower magnetic plate 620 .

[0061] Fig.11This shows the case where the magnetic body 500 moves toward the outside of the groove 410 of the mold 400 by the magnetic force with the lower magnetic plate 620 as described above. The movement of the magnetic body 500 pushes the light emitting element 700, so that the light emitting element 700 is separated from the mold 400 and attached to the adhesive layer 110. That is, the light emitting element 700 is well attached to the adhesive layer 110 by the pressure caused by the movement of the magnetic body 500, and no light emitting element 700 is left out, and all the light emitting elements 700 can be transferred.

[0062] Next, refer to Fig.12 The magnetic plate 300 is again disposed on one side of the transfer substrate 100 to separate the transfer stage 600 from the lower magnetic plate 620 below the transfer stage 600. Thus, the magnetic body 500 is located inside the groove 410 of the mold 400 by the magnetic force of the magnetic plate 300.

[0063] That is, the light emitting element transfer method according to this embodiment applies pressure to the light emitting element 700 by using the magnetic force between the magnetic body 500 and the magnetic plate 300 and the magnetic force between the magnetic body 500 and the lower magnetic plate 620 , thereby transferring the light emitting element 700 well.

[0064] Fig.13 and Fig.14 FIG. 5 shows the transfer process when the magnetic body 500 and the magnetic plate 300 are not included. Fig.13 , a light emitting element 700 is provided on the transfer substrate 100 which does not include the magnetic body 500 and the magnetic plate 300 .

[0065] Next, refer to Fig.14 , so that the transfer substrate 100 is located on the adhesive layer 110 of the substrate SUB, thereby transferring the light emitting element 700 to the substrate SUB. Fig.14 As shown, a portion of the light emitting element 700 may not be transferred to the substrate SUB but remain in the mold 400. This may occur when damage is generated in the mold 400 due to multiple uses of the mold 400, or there is an uneven portion in the substrate SUB, or the contact between the transfer substrate 100 and the substrate SUB is weak or there is a non-contact portion. As described above, when a portion of the light emitting element 700 is not transferred, a separate repair process is required.

[0066] However, as described above, the transfer method of the light emitting element involved in this embodiment uses the magnetic force between the magnetic body 500 and the magnetic plate 300 and the magnetic force between the magnetic body 500 and the lower magnetic plate 620 to apply pressure so that the light emitting element 700 is attached to the substrate SUB, thereby solving the problem that the light emitting element 700 is not transferred and remains in the mold 400. Therefore, all the light emitting elements 700 are transferred, and a separate repair process is not required, which is economical.

[0067] The above explains the use of Figure 1 The transfer substrate 100 is transferred by magnetic force, but in other embodiments, it can also be used Figure 6 The transfer substrate 100 is transferred by electric attraction.

[0068] Figures 15 to 19 A method of transferring a light emitting element according to another embodiment is shown.

[0069] Reference Fig.15 , prepare the transfer substrate 100 and the transfer workbench 600. At this time, the description of the transfer substrate 100 is the same as that of the transfer substrate 100. Figure 6 The same. That is, the transfer substrate 100 includes a base substrate 200, a conductive plate 310 located on one side of the base substrate 200, a mold 400 located on the other side of the base substrate 200 and including a plurality of grooves 410, and a conductive pattern 510 located inside the grooves 410 of the mold 400. Specific descriptions of the same components are omitted. A light-emitting element 700 can be provided on the protrusion of the mold 400. This light-emitting element 700 is a transfer object, and the light-emitting element 700 can be a micro LED chip. As described above, the conductive plate 310 and the conductive pattern 510 are electrically connected to each other. Specifically, opposite voltages can be applied to the conductive plate 310 and the conductive pattern 510. As an example, when a negative voltage is applied to the conductive plate 310, a positive voltage is applied to the conductive pattern 510. Through this electrical attraction, the conductive pattern 510 is located inside the groove 410 of the mold 400.

[0070] The transfer stage 600 may include a substrate stage 610 and a lower conductive plate 630 located inside the substrate stage 610. Fig.15 6 shows a case where the lower conductive plate 630 is located inside the substrate stage 610, but according to an embodiment, the lower conductive plate 630 may be located at the lower portion of the substrate stage 610. The lower conductive plate 630 may receive current.

[0071] Next, refer to Fig.16, move the transfer substrate 100 so that the light emitting element 700 is located on the substrate SUB. In this step, the light emitting element 700 can be bonded to the adhesive layer 110 of the substrate SUB. However, when the light emitting element 700 is transferred only by this method, there is a problem that the light emitting element 700 that is not sufficiently bonded to the substrate SUB cannot be transferred. In the case of this embodiment, pressure is applied to the light emitting element 700 by the process described later using the electrical attraction of the conductive plate 310, the conductive pattern 510, and the lower conductive plate 630, so that the light emitting element 700 is not omitted in the transfer.

[0072] Reference Fig.17 ,exist Fig.17 In the step of , the electrical connection between the conductive plate 310 and the conductive pattern 510 is released, and the conductive pattern 510 and the lower conductive plate 630 are electrically connected. Specifically, voltages opposite to each other may be applied to the lower conductive plate 630 and the conductive pattern 510. As an example, when a positive voltage is applied to the lower conductive plate 630, a negative voltage is applied to the conductive pattern 510. Therefore, the electrical attraction between the conductive plate 310 and the conductive pattern 510 is reduced, and an electrical attraction is formed between the lower conductive plate 630 and the conductive pattern 510, so that the conductive pattern 510 moves to a position close to the lower conductive plate 630. That is, the conductive pattern 510 moves toward the outside of the groove 410 of the mold 400.

[0073] Fig.18 This shows the case where the conductive pattern 510 moves toward the outside of the groove 410 of the mold 400 by the electrical attraction with the lower conductive plate 630 as described above. The conductive pattern 510 pushes the light emitting element 700 by the movement of the conductive pattern 510, and the light emitting element 700 is separated from the mold 400 and attached to the adhesive layer 110. That is, the light emitting element 700 can be well attached to the adhesive layer 110 by the pressure caused by the movement of the conductive pattern 510, and no light emitting element 700 is omitted, and all the light emitting elements 700 can be transferred.

[0074] Next, refer to Fig.19 , the electrical connection between the conductive pattern 510 and the lower conductive plate 630 is released, and the conductive plate 310 and the conductive pattern 510 are electrically connected. Therefore, the electrical attraction between the lower conductive plate 630 and the conductive pattern 510 is reduced, and the electrical attraction between the conductive plate 310 and the conductive pattern 510 is formed, so that the conductive pattern 510 moves to a position close to the conductive plate 310. That is, the conductive pattern 510 moves toward the inner side of the groove 410 of the mold 400.

[0075] In the above embodiment, the case where both the conductive plate 310 and the lower conductive plate 630 are included is described, but only one of the conductive plate 310 and the lower conductive plate 630 may be included.

[0076] Figure 20 to Figure 24 A method of transferring a light emitting element according to another embodiment is shown.

[0077] Reference Fig. 20 , prepare the transfer substrate 100 and the transfer workbench 600. At this time, except that the transfer workbench 600 does not include the lower conductive plate 630, Fig.15 Detailed description of the same components will be omitted.

[0078] Next, refer to Fig.21 , the transfer substrate 100 is moved to position the light emitting element 700 on the substrate SUB. In this step, the light emitting element 700 can be bonded to the adhesive layer 110 of the substrate SUB. The conductive plate 310 and the conductive pattern 510 are electrically connected to each other. Specifically, opposite voltages can be applied to the conductive plate 310 and the conductive pattern 510. As an example, when a negative voltage is applied to the conductive plate 310, a positive voltage is applied to the conductive pattern 510. Therefore, by this electrical attraction, the conductive pattern 510 is located inside the groove 410 of the mold 400.

[0079] Next, refer to Fig. 22 , the same voltage is applied to the conductive plate 310 and the conductive pattern 510. Specifically, the same voltage can be applied to the conductive plate 310 and the conductive pattern 510. As an example, a negative voltage is applied to the conductive plate 310, and a negative voltage is also applied to the conductive pattern 510. In this process, an electric repulsive force is generated between the conductive plate 310 and the conductive pattern 510, and the conductive pattern 510 moves in a direction away from the conductive plate 310. That is, the conductive pattern 510 moves toward the outside of the groove 410 of the mold 400.

[0080] Fig.23 As described above, the conductive pattern 510 moves toward the outside of the groove 410 of the mold 400 due to the electric repulsion between the conductive plate 310 and the conductive pattern 510. The conductive pattern 510 pushes the light emitting element 700 due to the movement of the conductive pattern 510, so that the light emitting element 700 is separated from the mold 400 and attached to the adhesive layer 110. That is, the light emitting element 700 can be well attached to the adhesive layer 110 due to the pressure caused by the movement of the conductive pattern 510, and no light emitting element 700 is omitted, and all the light emitting elements 700 can be transferred.

[0081] Next, refer to Fig.24, opposite voltages are applied again to the conductive plate 310 and the conductive pattern 510. As a result, an electric attraction is formed between the conductive plate 310 and the conductive pattern 510, so that the conductive pattern 510 moves toward a position close to the conductive plate 310. That is, the conductive pattern 510 moves toward the inner side of the groove 410 of the mold 400.

[0082] Right now, Figure 20 to Figure 24 In the embodiment involving the lower conductive plate 630 not being included, different voltages are applied to the conductive plate 310 and the conductive pattern 510 in each step, thereby transferring the light emitting element 700 by electric attraction / repulsion.

[0083] Figure 20 to Figure 24 Although the transfer method involved does not include the lower conductive plate 630, the conductive plate 310 may not be included in other embodiments.

[0084] Figure 25 to Figure 29 A method of transferring a light emitting element according to another embodiment is shown.

[0085] Reference Fig.25 , prepare the transfer substrate 100 and the transfer workbench 600. At this time, except that the transfer substrate 100 does not include the conductive plate 310, Fig.15 The specific description of the same components is omitted. Fig.25 In the embodiment, the conductive pattern 510 is not subjected to a separate electric attraction or magnetic force, and the conductive pattern 510 can be fixed in the groove 410 of the mold 400 by a separate fixing member (not shown).

[0086] Next, refer to Fig.26 , the transfer substrate 100 is moved so that the light emitting element 700 is located on the substrate SUB. In this step, the light emitting element 700 can be bonded to the bonding layer 110 of the substrate SUB.

[0087] Next, refer to Fig. 27 , different voltages are applied to the lower conductive plate 630 and the conductive pattern 510. Specifically, opposite voltages may be applied to the lower conductive plate 630 and the conductive pattern 510. As an example, when a positive voltage is applied to the lower conductive plate 630, a negative voltage is applied to the conductive pattern 510. In this process, an electric attraction is generated between the lower conductive plate 630 and the conductive pattern 510, and the conductive pattern 510 moves toward a position close to the lower conductive plate 630. That is, the conductive pattern 510 moves toward the outside of the groove 410 of the mold 400.

[0088] Fig.28As described above, the conductive pattern 510 moves toward the outside of the groove 410 of the mold 400 by the electrical attraction between the lower conductive plate 630 and the conductive pattern 510. The conductive pattern 510 pushes the light emitting element 700 by the movement of the conductive pattern 510, so that the light emitting element 700 is separated from the mold 400 and attached to the adhesive layer 110. That is, the light emitting element 700 can be well attached to the adhesive layer 110 by the pressure caused by the movement of the conductive pattern 510, and no light emitting element 700 is omitted, and all the light emitting elements 700 can be transferred.

[0089] Next, refer to Fig.29 , the same voltage is applied again to the lower conductive plate 630 and the conductive pattern 510. As a result, an electric repulsive force is formed between the lower conductive plate 630 and the conductive pattern 510, so that the conductive pattern 510 moves toward a position away from the lower conductive plate 630. That is, the conductive pattern 510 moves toward the inner side of the groove 410 of the mold 400.

[0090] Right now, Figure 25 to Figure 29 In the embodiment involving the conductive plate 310 not being included, different voltages are applied to the lower conductive plate 630 and the conductive pattern 510 in each step, thereby transferring the light emitting element 700 by electric attraction / repulsion.

[0091] As described above, the transfer substrate and the transfer method using the same according to the present embodiment use the magnetic force of a magnetic body or the electric attraction of a conductor to push the light emitting element, so that when the light emitting element is transferred, the light emitting element will not be missed. Therefore, the transfer is well performed, and a separate repair process is not required, which is economical and practical.

[0092] The embodiments of the present invention are described in detail above, but the scope of the present invention is not limited thereto. Various deformations and improvements of the basic concepts of the present invention defined in the claims by those skilled in the art also fall within the scope of the present invention.

Claims

1. A transfer substrate, characterized in that: include: base substrate; A magnetic plate, located on one side of the base substrate; a mold, located on the other side of the base substrate, comprising a plurality of grooves; as well as The magnetic body is located in the groove of the mold.

2. The transfer substrate according to claim 1, characterized in that The magnetic body is in the shape of a plate with a plurality of openings formed therein. The mold is coupled to the opening of the magnetic body.

3. The transfer substrate according to claim 1, characterized in that The magnetic plate is provided in a detachable manner with respect to the base substrate.

4. The transfer substrate according to claim 1, characterized in that The magnetic plate and the magnetic body have magnetic properties of different polarities from each other.

5. The transfer substrate according to claim 1, characterized in that The magnetic body is provided in a movable manner inside the mold.

6. A transfer substrate, characterized in that: include: base substrate; A conductive plate, located on one side of the base substrate; a mold, located on the other side of the base substrate, comprising a plurality of grooves; as well as The conductive pattern is located in the groove of the mold.

7. The transfer substrate according to claim 6, characterized in that The conductive plate is electrically connected to the conductive pattern.

8. The transfer substrate according to claim 6, characterized in that The conductive pattern is in the shape of a plate having a plurality of openings formed therein. The mold is combined with the opening of the conductive pattern.

9. A transfer substrate, characterized in that: include: base substrate; A mold, located on one side of the base substrate, comprising a plurality of grooves; as well as The conductive pattern is located in the groove of the mold.

10. The transfer substrate according to claim 9, characterized in that The conductive pattern is in the shape of a plate having a plurality of openings formed therein. The mold is combined with the opening of the conductive pattern.

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