Air injection cover plate and wafer drying equipment

Abstract

The utility model discloses an air injection cover plate and wafer drying equipment. According to the air injection cover plate, a drying groove body is covered with the air injection cover plate, a first main injection pipeline and a second main injection pipeline which are used for drying wafer surfaces of different sizes are arranged on the air injection cover plate, and a set of first auxiliary injection pipelines and two sets of second auxiliary injection pipelines are arranged on the air injection cover plate. The first auxiliary spraying pipeline and the second auxiliary spraying pipeline are provided with spraying openings facing the interior of the drying groove body, and the first auxiliary spraying pipeline and the second auxiliary spraying pipeline correspondingly dry contact point gaps of wafers of different sizes. According to the utility model, the air injection cover plate is provided with the first main injection pipeline and the second main injection pipeline to dry the wafer in a large area; a first auxiliary spraying pipeline and a second auxiliary spraying pipeline are further arranged, the first auxiliary spraying pipeline and the second auxiliary spraying pipeline can correspondingly dry wafer contact point gaps of different sizes, and connectors are arranged on the first auxiliary spraying pipeline and the second auxiliary spraying pipeline, so that the first auxiliary spraying pipeline and the second auxiliary spraying pipeline can be selectively connected with the main spraying pipe according to the sizes of wafers to be dried.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer drying, in particular to an air jet cover plate and wafer drying equipment. Background Art

[0002] In the process of wafer production, cleaning is an indispensable process. After cleaning, in order to prevent damage to the surface of the wafer, the cleaned wafer needs to be dried in time. The existing drying method adopts the IPA gas replacement method, which replaces the water film attached to the surface of the wafer during cleaning with heated IPA gas to achieve the drying effect.

[0003] In the actual production process, the heated IPA gas is discharged into the drying tank through the pipe on the door panel for a replacement operation. Since the gap between the wafer and the flower basket is small, the space for the IPA replacement gas to enter is limited. In order to improve the drying efficiency, auxiliary nozzles perpendicular to the base point are usually set on both sides of the main nozzle.

[0004] When drying the contact points of the wafer, there is only one pair of auxiliary nozzles on the cover plate, namely, a pair corresponding to the contact points on both sides of the wafer. The usual production sizes of wafers are 6 inches and 8 inches. If the size of the wafer to be dried is changed, the auxiliary drying air pipe on the existing cover plate can no longer directly spray the contact point gap position of the wafer, so the drying efficiency and effect of the contact point are deteriorated. If a good drying effect is required, the cover plate needs to be disassembled and replaced, which makes the device inconvenient to use. Utility Model Content

[0005] In order to solve the technical problem in the prior art that wafers of different sizes need to be replaced with different air jet covers, the utility model provides an air jet cover and wafer drying equipment.

[0006] The technical solution adopted by the utility model is:

[0007] The utility model proposes an air jet cover plate, which is covered on a drying tank body, and is provided with a first main spray pipe and a second main spray pipe for drying wafer surfaces of different sizes. The utility model is characterized in that a group of first auxiliary spray pipes and two groups of second auxiliary spray pipes are provided on the air jet cover plate, and the first auxiliary spray pipe and the second auxiliary spray pipe are provided with nozzles facing the drying tank body, and the first auxiliary spray pipe and the second auxiliary spray pipe correspond to the contact point gaps of drying wafers of different sizes;

[0008] The first auxiliary spray pipe comprises two first arms arranged in parallel and a second arm connected between the two parallel arms, a plurality of spray ports are arranged at the bottom of the first arm, the two first arms are connected to the second arm, and the second arm and the two first arms form a first installation position and a second installation position;

[0009] The second auxiliary spray pipe comprises two third arms arranged in parallel and a fourth arm connecting the two third arms, the two third arms are connected to the fourth arm, a plurality of nozzles are arranged at the bottom of the third arm, and two groups of the second auxiliary spray pipes are respectively arranged at the first installation position and the second installation position;

[0010] The main air pipe, the second arm and the fourth arm are respectively provided with connectors, and the main air pipe is connected to two groups of the second auxiliary spray pipes or is connected to the first auxiliary spray pipe and two groups of the second auxiliary spray pipes at the same time.

[0011] Further, the first main spray pipe and the second main spray pipe are respectively provided with two;

[0012] The two first main spray pipes are spaced apart and parallel to the first support arm, a plurality of spray ports are arranged at the bottom of the first main spray pipe, and one end of the two first main spray pipes is an air inlet end and is provided with a first control valve;

[0013] The two second main spray pipes are arranged between the two first main spray pipes and are parallel to the first main spray pipes. A plurality of spray ports are arranged at the bottom of the second main spray pipes. One end of the two second main spray pipes is an air intake end and is provided with a second control valve.

[0014] Furthermore, an auxiliary roller is provided on the jet cover, and the roller is arranged at one end of the jet cover. The bottom surface of the jet cover at the end opposite to the auxiliary roller is provided with a groove for engaging with the edge of the trough body. When the jet cover is pushed, the roller slides along the edge of the drying trough body, and the groove moves along the edge of the drying trough body.

[0015] Furthermore, an opening is provided in the middle of the jet cover plate, and a mounting frame is provided around the opening; the first main jet pipe, the second main jet pipe and the first support arm are fixed to the mounting frame.

[0016] Furthermore, a connecting block fixed to the first arm of the first auxiliary spray pipe is provided on the third arm of the second auxiliary spray pipe.

[0017] Furthermore, the second auxiliary spray pipe corresponds to 8-inch wafers, and the second auxiliary spray pipe corresponds to 6-inch wafers.

[0018] Furthermore, the third arm is parallel to the first arm.

[0019] The utility model also provides a wafer drying device, comprising the air jet cover plate of the utility model.

[0020] Compared with the prior art, the jet cover of the utility model is provided with a first main spray pipe and a second main spray pipe to dry the wafer over a large area; it is also provided with a first auxiliary spray pipe and a second auxiliary spray pipe, and the first auxiliary spray pipe and the second auxiliary spray pipe can correspond to drying the contact point gaps of wafers of different sizes. By arranging connectors on the first auxiliary spray pipe and the second auxiliary spray pipe, it is possible to select the main spray pipe to be connected according to the size of the wafer to be dried. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0022] Figure 1 This is a schematic diagram of the jet surface of the jet cover in the embodiment of the utility model;

[0023] Figure 2 This is a schematic diagram of the back side of the jet cover in the embodiment of the utility model;

[0024] Figure 3 It is a top view of the jet cover plate in the embodiment of the utility model;

[0025] Figure 4 It is a right side view of the jet cover plate in the embodiment of the utility model;

[0026] Figure 5 It is a side view of the jet cover plate in the embodiment of the utility model;

[0027] Figure 6 This is a schematic diagram of the installation of the jet cover in the embodiment of the utility model;

[0028] 1. Jet cover; 01. Drying tank;

[0029] 2. First auxiliary spray pipe; 21. First support arm; 22. Second support arm;

[0030] 3. The second auxiliary spray pipe; 31. The third support arm; 32. The fourth support arm;

[0031] 41. second main spray pipe; 42. first main spray pipe;

[0032] 5. Groove;

[0033] 6. Auxiliary roller;

[0034] 7. Installation frame;

[0035] 81. first control valve; 82. second control valve;

[0036] 9. Main nozzle;

[0037] 10. Connector. DETAILED DESCRIPTION

[0038] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0039] The principle and structure of the present utility model are described in detail below with reference to the accompanying drawings and embodiments.

[0040] like Figure 1-6 As shown, the utility model proposes an air jet cover plate 1, on which a first main jet pipe 42 and a second main jet pipe 41 are provided, and the first main jet pipe 42 and the second main jet pipe 41 are used for large-area drying of the wafer surface in the drying tank body. A group of first auxiliary jet pipes 2 and two groups of second auxiliary jet pipes 3 are also provided on the air jet cover plate 1, and the nozzles of the first auxiliary jet pipes 2 and the second auxiliary jet pipes 3 face the drying tank body, and the first auxiliary jet pipes 2 and the second auxiliary jet pipes 3 correspond to the contact point gaps for drying wafers of different sizes.

[0041] In a specific embodiment, the drying trough body 01 is used to place wafers to be dried. The top of the drying trough body 01 is not closed and is used to place and take wafers. The jet cover 1 is covered on the drying trough body 01. IPA gas is sprayed to the wafers in the drying trough body 01 through the main spray pipe and the auxiliary spray pipe on the jet cover 1 to dry the surface of the wafers in the drying trough body 01 and the contact point gaps of the wafers.

[0042] The jet cover plate 1 is provided with a first main jet pipe 42 and a second main jet pipe 41, which are used to dry wafers of different sizes. The main jet pipe is provided with a plurality of nozzles facing the drying tank body 01 at intervals, and IPA gas is injected into the second main jet pipe 41 or into the first main jet pipe 42 and the second main jet pipe 41 at the same time. The nozzles spray the IPA gas into the drying tank body to dry the wafers in the drying tank body over a large area.

[0043] A group of first auxiliary spray pipes 2 and two groups of second auxiliary spray pipes 3 are also provided on the jet cover. The first auxiliary spray pipes 2 and the second auxiliary spray pipes 3 are provided with nozzles facing the drying tank body. The nozzles of the first auxiliary spray pipes 2 and the second auxiliary spray pipes 3 correspond to the contact point gaps for drying wafers of different sizes.

[0044] The first auxiliary spray pipe 2 includes two parallel first arms and a second arm connected between the two parallel arms. The second arm is connected to the inside of the two first arms. A plurality of nozzles are arranged at intervals at the bottom of the first arm. The nozzles on the two first arms are aimed at the wafers in the drying tank body 01. The first arm 21 and the second arm 22 are connected to form an H shape. The first arm 21 and the second arm 22 form a first installation position and a second installation position for installing two sets of second auxiliary spray pipes 3. By moving the jet cover 1, the first auxiliary spray pipe 2 can be aligned with the contact point gap of the 8-inch wafer in the drying tank body 01.

[0045] The second auxiliary spray pipe 3 is provided with two groups, which are respectively arranged at the first installation position and the second installation position. The second auxiliary spray pipe 3 includes two third arms arranged in parallel and a fourth arm connecting the two third arms. The third arm is parallel to the first arm, and the two third arms are connected to the inside of the fourth arm. After splicing, the whole is in an H shape. The bottom of the third arm is provided with multiple nozzles facing the drying tank body at intervals. By moving the jet cover plate 1, the second auxiliary spray pipe 3 can be aligned with the contact point gap of the 6-inch wafer in the drying tank body 01.

[0046] Connectors are respectively provided on the second arm and the fourth arm, which are connected to the two groups of second auxiliary spray pipes 3 through the main air pipe, or the first auxiliary spray pipe 2 and the two groups of second auxiliary spray pipes 3 are connected at the same time, and IPA gas is injected into the main air pipe. The 6-inch wafer or 8-inch wafer is dried by connecting the two groups of second auxiliary spray pipes 3 or the first auxiliary spray pipe 2 and the two groups of second auxiliary spray pipes 3 at the same time.

[0047] For example, when the size of the wafer to be dried in the drying tank body 01 is 6 inches, IPA gas is injected into the second main spray pipe 41 to dry the 6-inch wafer in the drying tank body on a large area. At this time, the main gas pipe 9 only needs to be connected to the connector 10 on the fourth arm 32 to dry the contact point gap of the 6-inch wafer; when the size of the wafer to be dried in the drying tank body 01 is 8 inches, IPA gas is injected into the first main spray pipe 42 to dry the 8-inch wafer in the drying tank body on a large area. The main gas pipe 9 needs to be connected to the connector 10 on the fourth arm 32 and the connectors 10 on the two second arms 22 to dry the contact point gap of the 8-inch wafer;.

[0048] In a further embodiment, there are two first main spray pipes 42 and two second main spray pipes 41;

[0049] The two first main spray pipes 42 are used in conjunction with the first auxiliary spray pipe 2, and the two second main spray pipes 41 are used in conjunction with the second auxiliary spray pipe 3. The two first main spray pipes 42 are arranged at intervals and in parallel, and the first main spray pipe 42 is parallel to the first arm 21 of the first auxiliary spray pipe 2. The bottom of the first main spray pipe 42 is provided with a plurality of nozzles facing the wafers in the drying tank body 01, and the nozzles are arranged at intervals along the length direction of the first main spray pipe 42. The same end of the two first main spray pipes 42 serves as an air inlet end, and a first control valve 81 is provided at the air inlet end to control whether the first main spray pipe 42 is inlet.

[0050] The two second main nozzle pipes 41 are arranged between the two first main nozzle pipes 42 at intervals and in parallel, and the second main nozzle pipes 41 are parallel to the first main nozzle pipes 42. A plurality of nozzles are arranged at intervals along the length direction at the bottom of the second main nozzle pipes 41. The same end of the two second main nozzle pipes 41 serves as an air intake end, and a second control valve 82 is provided. The second control valve 82 controls whether the two second main nozzle pipes 41 are intake.

[0051] In a further embodiment, the jet cover 1 is further provided with an auxiliary roller 6, which is arranged at one end of the cover. When the jet cover 1 is pushed, the roller slides along the edge of the drying tank body 01. A groove 5 is provided on the bottom surface of the other end of the jet cover 1 opposite to the installation of the auxiliary roller 6. When the cover is covered on the drying tank body 01, the auxiliary roller 6 contacts the edge of the drying tank body 01, and the groove 5 at the other end is relatively engaged with the drying tank body. When the jet cover 1 is pushed, the auxiliary roller 6 slides, and at the same time, the groove moves along the edge of the drying tank body 01. The groove 5 can limit the jet cover 1 to prevent the cover from moving during operation.

[0052] In a further embodiment, an opening is provided in the middle of the cover plate, and a circle of mounting frames 7 are provided around the opening for mounting and fixing the first auxiliary spray pipe 2, the first main spray pipe 42, and the second main spray pipe 41. Both ends of the first arm 21 of the first auxiliary spray pipe 2 are fixed to the mounting frame 7, and both ends of the first main spray pipe 42 and the second main spray pipe 41 are fixed to the mounting frame 7.

[0053] In a further embodiment, a connecting block fixed to the first arm 21 of the first auxiliary spray pipe 2 is provided on the third arm 31 of the second auxiliary spray pipe 3 .

[0054] In a further embodiment, the first auxiliary spray pipe 2 and the first main spray pipe 42 correspond to 8-inch wafers, and the second auxiliary spray pipe 3 and the second main spray pipe 41 correspond to 6-inch wafers.

[0055] The utility model also provides a wafer drying device, which uses the air jet cover plate 1 provided by the utility model.

[0056] Compared with the prior art, the jet cover 1 is provided with a first main spray pipe 42 and a second main spray pipe 41 to dry the wafers over a large area; it is also provided with a first auxiliary spray pipe 2 and a second auxiliary spray pipe 3, and the first auxiliary spray pipe 2 and the second auxiliary spray pipe 3 can correspond to drying the contact point gaps of wafers of different sizes. By arranging a connector 10 on the first auxiliary spray pipe 2 and the second auxiliary spray pipe 3, it is possible to select the main spray pipe 9 to be connected according to the size of the wafer to be dried, without replacing the jet cover.

[0057] It should be noted that the terms used above are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the utility model. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0058] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the utility model.

[0059] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may be subject to various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An air jet cover plate, the air jet cover plate is covered on a drying tank body, the air jet cover plate is provided with a first main jet pipe and a second main jet pipe for drying wafers of different sizes, characterized in that: The jet cover is provided with a group of first auxiliary jet pipes and two groups of second auxiliary jet pipes, the first auxiliary jet pipes and the second auxiliary jet pipes are provided with nozzles facing the drying tank body, and the first auxiliary jet pipes and the second auxiliary jet pipes correspond to the contact point gaps of drying wafers of different sizes; The first auxiliary spray pipe comprises two first arms arranged in parallel and a second arm connected between the two parallel arms, a plurality of spray ports are arranged at the bottom of the first arm, the two first arms are connected to the second arm, and the second arm and the two first arms form a first installation position and a second installation position; The second auxiliary spray pipe comprises two third arms arranged in parallel and a fourth arm connecting the two third arms, the two third arms are connected to the fourth arm, a plurality of nozzles are arranged at the bottom of the third arm, and two groups of the second auxiliary spray pipes are respectively arranged at the first installation position and the second installation position; The main air pipe, the second arm and the fourth arm are respectively provided with connectors, and IPA gas is injected into the main air pipe. The main air pipe is connected to two groups of the second auxiliary spray pipes or simultaneously connects the first auxiliary spray pipe and two groups of the second auxiliary spray pipes.

2. The jet cover plate according to claim 1, characterized in that: There are two first main spray pipes and two second main spray pipes respectively; The two first main spray pipes are spaced apart and parallel to the first support arm, a plurality of spray ports are arranged at the bottom of the first main spray pipe, and one end of the two first main spray pipes is an air inlet end and is provided with a first control valve; The two second main spray pipes are arranged between the two first main spray pipes and are parallel to the first main spray pipes. A plurality of spray ports are arranged at the bottom of the second main spray pipes. One end of the two second main spray pipes is an air intake end and is provided with a second control valve.

3. The jet cover plate according to claim 1, characterized in that: An auxiliary roller is provided at one end of the jet cover, and a groove for engaging with the edge of the drying tank body is provided on the bottom surface of the jet cover at the end opposite to the auxiliary roller. When the jet cover is pushed, the roller slides along the edge of the drying tank body, and the groove moves along the edge of the drying tank body.

4. The jet cover plate according to claim 2, characterized in that: An opening is provided in the middle of the jet cover plate, and a mounting frame is provided around the opening. The first main jet pipe, the second main jet pipe and the first support arm are fixed to the mounting frame.

5. The air jet cover plate according to claim 1, characterized in that: The third supporting arm is provided with a connecting block fixed to the first supporting arm.

6. The air jet cover plate according to claim 1, characterized in that: The first auxiliary spray pipe and the first main spray pipe correspond to 8-inch wafers, and the second auxiliary spray pipe and the second main spray pipe correspond to 6-inch wafers.

7. The air jet cover plate as claimed in claim 2, characterized in that: The third arm is parallel to the first arm.

8. A wafer drying device, characterized in that: It comprises the jet cover plate as described in any one of claims 1 to 7.

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