Wafer centering device with lifting and transverse moving structure

Abstract

The utility model provides a wafer centering device with a lifting and transverse moving structure. The wafer centering device comprises a supporting and assembling assembly, a transverse moving bearing assembly, a transverse moving driving assembly, a lifting bearing assembly, a lifting driving assembly, an adsorption rotation assembly, a rotation driving assembly and a wafer carrying assembly. According to the wafer centering device, the wafer can be accurately centered to a preset position through accurate control of the transverse moving driving assembly, the lifting driving assembly and the rotary driving assembly in combination with real-time position detection of the centering probe, the requirement for follow-up high-precision machining or testing is met, and the wafer centering efficiency is improved. The device can drive a wafer to transversely, vertically and circumferentially move and rotate in a three-dimensional space, great flexibility is provided for positioning and operation of the wafer, high-precision positioning of the wafer can be achieved, it is ensured that the center of the wafer can be accurately aligned to a preset position, the machining quality and efficiency are improved, and the machining cost is reduced. The method has a wide application prospect in the field of semiconductor manufacturing.

Description

Technical Field

[0001] The utility model relates to integrated circuit production equipment, in particular to a wafer centering device with a lifting and lateral movement structure. Background Art

[0002] Patent document CN117620886A discloses a wafer centering device, which includes a relatively arranged base and a visual adjustment platform, a visual camera is arranged above the visual adjustment platform, and a transition sucker adjustment plate is also arranged above the visual adjustment platform, the transition sucker adjustment plate is connected to the visual adjustment platform through a transition sucker adjustment mechanism, the transition sucker adjustment mechanism is used to adjust the parallelism and height of the transition sucker adjustment plate, and a vacuum rotating sucker is arranged on the transition sucker adjustment plate, the top of the vacuum rotating sucker is used to suck the wafer, and the vacuum rotating sucker is also connected to the difference elimination module mechanism, and the difference elimination module mechanism is used to drive the vacuum rotating sucker to move to change the position of the vacuum rotating sucker. However, the structure of this wafer centering device is relatively complex, occupies a large amount of installation space, and is prone to the problem of reduced detection accuracy after long-term use. Therefore, it is necessary to optimize the structure of this wafer centering device to overcome the above-mentioned defects. Utility Model Content

[0003] The utility model aims to provide a wafer centering device with a lifting and lateral movement structure, so as to save equipment installation space and improve wafer detection accuracy and efficiency.

[0004] The technical solution adopted by the utility model to solve its technical problems is:

[0005] A wafer centering device with a lifting and lateral movement structure, comprising:

[0006] A support assembly component having an assembly space therein;

[0007] A transverse bearing assembly, which is mounted on the supporting assembly assembly through a transverse guide structure, can move transversely on the supporting assembly assembly, and has a bearing space inside;

[0008] A transverse drive assembly is installed in the support assembly and cooperates with the transverse bearing assembly. The transverse drive assembly drives the transverse bearing assembly to move transversely.

[0009] A lifting load-bearing assembly, which is installed in the transverse bearing assembly through a vertical guide structure, can move laterally with the transverse bearing assembly, and can move vertically independently in the transverse bearing assembly, and has a load-bearing space inside;

[0010] A lifting drive assembly is installed in the transverse bearing assembly, can move laterally with the transverse bearing assembly, and cooperates with the lifting bearing assembly, and the lifting drive assembly drives the lifting bearing assembly to move vertically;

[0011] The adsorption rotary assembly is installed in the lifting and carrying assembly through a rotating structure, and can move laterally and vertically with the lifting and carrying assembly, and can independently perform circumferential rotation in the lifting and carrying assembly. It cooperates with the wafer to carry the wafer to move laterally, vertically and rotationally, and perform centering operations on the wafer;

[0012] The rotary drive assembly is installed in the lifting bearing assembly and can move horizontally and vertically with the lifting bearing assembly. It cooperates with the adsorption rotary assembly and is driven by the rotary drive assembly to perform a circumferential rotary motion;

[0013] The wafer loading component is installed in the supporting assembly component and cooperates with the adsorption rotating component so that the adsorption rotating component can place the wafer it carries on the wafer loading component after centering.

[0014] Specifically, the support assembly components include:

[0015] A support seat plate, which is arranged in the transverse direction, and a transverse bearing assembly and a transverse driving assembly are installed on the support seat plate;

[0016] The support stand is installed on the top of the support base plate and extends upwards of the support base plate. The wafer loading assembly is installed on the support stand.

[0017] The traverse bearing assembly includes:

[0018] A transverse guide rail, which is installed on the top of the support seat plate and extends in the transverse direction;

[0019] The transverse moving carrier is installed on the transverse moving guide rail through a slider and can move laterally along the transverse moving guide rail. The lifting bearing assembly and the lifting driving assembly are installed on the transverse moving carrier.

[0020] The traverse drive assembly includes:

[0021] The transverse electric cylinder is installed on the top of the support base plate, and its power output shaft is parallel to the transverse guide rail and is engaged with the transverse carrier. The transverse electric cylinder drives the transverse carrier to move laterally along the transverse guide rail.

[0022] The lifting load-bearing components include:

[0023] A lifting guide rail, which is installed on the transverse moving carriage and extends vertically, and can move laterally with the transverse moving carriage;

[0024] The lifting carrier is installed on the lifting guide rail through a slider, can move laterally with the lifting guide rail, and can move vertically along the lifting guide rail independently. The adsorption rotary assembly and the rotary drive assembly are installed on the lifting carrier.

[0025] The lifting drive assembly includes:

[0026] The lifting motor is installed on the transverse moving carrier and can move laterally with the transverse moving carrier. Its power output shaft is parallel to the lifting guide rail and is connected to the lifting carrier through a ball screw structure. The lifting motor drives the lifting carrier to move vertically along the lifting guide rail.

[0027] The adsorption rotary assembly includes:

[0028] The adsorption plate body is installed on the lifting carrier through bearings. It can move laterally and vertically with the lifting carrier, and can independently perform circumferential rotational motion on the lifting carrier. It is also connected to the suction mechanism through a vacuum seat. The adsorption plate body adsorbs and positions the wafer, and carries the wafer to move laterally, vertically and rotationally.

[0029] The slew drive assembly includes:

[0030] The rotary motor is installed on the lifting carrier and can move horizontally and vertically with the lifting carrier. Its power output shaft is engaged with the adsorption plate body, and the rotary motor drives the adsorption plate body to rotate.

[0031] The wafer loading assembly includes:

[0032] A pair of loading cantilevers are provided, each loading cantilever is installed on a supporting frame, extends laterally to the outside of the supporting frame, and is arranged on both sides of the adsorption plate;

[0033] A pair of loading pads are provided, each loading pad is respectively installed on the top of the loading cantilever, and the wafer on the adsorption plate can be placed on the loading pad and supported by the loading pad.

[0034] The advantages of the utility model are:

[0035] The wafer centering device can ensure that the wafer is accurately centered at the predetermined position through the precise control of the lateral drive component, the lifting drive component and the rotary drive component, combined with the real-time position detection of the centering probe, to meet the needs of subsequent high-precision processing or testing, and can drive the wafer to move and rotate horizontally, vertically and circumferentially in three-dimensional space, providing great flexibility for wafer positioning and operation, and can achieve high-precision positioning of the wafer to ensure that the center of the wafer can be accurately aligned with the predetermined position, thereby improving the processing quality and efficiency, and saving installation space, so that the size and weight of the entire device are reduced to a certain extent, which is convenient for handling and installation. With its advantages of high precision, high flexibility, high degree of automation, compact structure, easy operation, strong versatility, high safety and high reliability, it has broad application prospects in the field of semiconductor manufacturing. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 This is one of the structural schematic diagrams of the wafer centering device with a lifting and lateral movement structure proposed by the utility model;

[0037] Figure 2 This is the second structural schematic diagram of the wafer centering device. DETAILED DESCRIPTION

[0038] In order to make the purpose, technical scheme and advantages of the embodiment of the utility model clearer, the technical scheme in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. The components of the embodiment of the utility model generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiment of the utility model provided in the drawings is not intended to limit the scope of the utility model claimed for protection, but merely represents the selected embodiment of the utility model. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work belong to the scope of protection of the utility model.

[0039] like Figure 1 , Figure 2As shown, the wafer centering device with a lifting and transverse movement structure proposed in the utility model includes a supporting assembly component, a transverse movement bearing component, a transverse movement driving component, a lifting and bearing component, a lifting and driving component, an adsorption and rotation component, a rotation driving component and a wafer loading component; the supporting assembly component has an assembly space, the transverse movement bearing component is installed on the supporting assembly component through a transverse guide structure, can move laterally on the supporting assembly component, and has a bearing space inside, the transverse movement driving component is installed in the supporting assembly component and cooperates with the transverse movement bearing component, and the transverse movement driving component drives the transverse movement bearing component to move laterally, the lifting and bearing component is installed in the transverse movement bearing component through a vertical guide structure, can move laterally with the transverse movement bearing component, and can move vertically independently in the transverse movement bearing component, and has a bearing space inside, the lifting and driving component is installed in the transverse movement bearing component, and can move laterally with the transverse movement bearing component, and can move vertically independently in the transverse movement bearing component. The lifting and lowering bearing assembly moves laterally together and cooperates with the lifting and lowering bearing assembly. The lifting and lowering bearing assembly is driven by the lifting and lowering driving assembly to move vertically. The adsorption and rotary assembly is installed in the lifting and lowering bearing assembly through a rotating structure, and can move laterally and vertically together with the lifting and lowering bearing assembly, and can independently perform circumferential rotational motion in the lifting and lowering bearing assembly. It cooperates with the wafer and can carry the wafer to move laterally, vertically and rotationally, and center the wafer. The rotary drive assembly is installed in the lifting and lowering bearing assembly and can move laterally and vertically together with the lifting and lowering bearing assembly. It cooperates with the adsorption and rotary assembly, and the adsorption and rotary assembly is driven by the rotary drive assembly to perform circumferential rotational motion. The wafer loading assembly is installed in the supporting assembly assembly and cooperates with the adsorption and rotary assembly, so that the adsorption and rotary assembly can perform centering operation on the wafer it carries and then place it on the wafer loading assembly.

[0040] In this embodiment, the support assembly component includes a support base plate 110 and a support stand 120. The support base plate is arranged horizontally, the transverse bearing component and the transverse driving component are installed on the support base plate, the support stand is installed on the top of the support base plate and extends above the support base plate, and the wafer loading component is installed on the support stand.

[0041] The transverse bearing assembly includes a transverse guide rail 210 and a transverse carrier 220. The transverse guide rail is installed on the top of the support base plate and extends laterally. The transverse carrier is installed on the transverse guide rail through a slider and can move laterally along the transverse guide rail. The lifting bearing assembly and the lifting drive assembly are installed on the transverse carrier.

[0042] In this embodiment, a transverse stopper 211 is further provided on the top of the support base plate, and the transverse stopper limits the movement range of the transverse carrier.

[0043] The transverse drive assembly includes a transverse electric cylinder 300, which is installed on the top of the support base plate. Its power output shaft is parallel to the transverse guide rail and is engaged with the transverse carrier. The transverse electric cylinder drives the transverse carrier to move laterally along the transverse guide rail.

[0044] The lifting and carrying assembly includes a lifting guide rail 410 and a lifting carrier 420. The lifting guide rail is installed on the transverse moving carrier and extends vertically. It can move laterally with the transverse moving carrier. The lifting carrier is installed on the lifting guide rail through a slider and can move laterally with the lifting guide rail and can move vertically independently along the lifting guide rail. The adsorption rotation assembly and the rotation drive assembly are installed on the lifting carrier.

[0045] The lifting drive assembly includes a lifting motor 500, which is installed on the transverse moving carrier and can move laterally with the transverse moving carrier. Its power output shaft is parallel to the lifting guide rail and is connected to the lifting carrier through a ball screw structure. The lifting motor drives the lifting carrier to move vertically along the lifting guide rail.

[0046] The adsorption and rotation assembly includes an adsorption plate 600, which is installed on the lifting carrier through bearings. The adsorption plate can move laterally and vertically with the lifting carrier, and can independently perform circumferential rotation on the lifting carrier. It is also connected to the suction mechanism through a vacuum seat 610. The adsorption plate adsorbs and positions the wafer, and carries the wafer to move laterally, vertically and rotationally.

[0047] The rotary drive assembly includes a rotary motor 700, which is installed on the lifting carrier and can move horizontally and vertically with the lifting carrier. Its power output shaft is engaged with the adsorption plate body, and the rotary motor drives the adsorption plate body to rotate.

[0048] The wafer loading assembly includes a loading cantilever 810 and a loading pad 820. A pair of loading cantilevers are provided, each of which is installed on a supporting frame, and extends laterally to the outside of the supporting frame and is arranged on both sides of the adsorption plate. A pair of loading pads are provided, each of which is installed on the top of the loading cantilever. After the wafer on the adsorption plate is centered, the adsorption plate can be driven down by a lifting motor, and at the same time, the adsorption plate releases the wafer and places it on the loading pad, which is supported by the loading pad.

[0049] In this embodiment, a centering probe 900 is provided on the top of the supporting frame, which detects the position of the wafer and controls the operating status of the rotary motor, lifting motor and transverse electric cylinder in real time through the industrial computer, so that the center of the wafer is located at a predetermined position, which is convenient for subsequent processes.

[0050] In the description of the present utility model, it should be noted that when terms such as "upper", "lower", "inner", "outer", "left", "right" and the like indicating orientation or positional relationship appear, it should be understood that the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the utility model product is usually placed when in use, or the orientation or positional relationship commonly understood by those skilled in the art, is only for the convenience of describing the present utility model and simplifying the description, and does not indicate or imply that the equipment or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, when terms such as "first" and "second" appear, they are only used to distinguish the description, and cannot be understood as indicating or implying relative importance. In the description of the present utility model, it should also be noted that, unless otherwise clearly specified and limited, terms such as "installation", "setting", and "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal connection of two elements. For those skilled in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

Claims

1. A wafer centering device with a lifting and lateral movement structure, characterized in that: include: A support assembly component having an assembly space therein; A transverse bearing assembly, which is mounted on the supporting assembly assembly through a transverse guide structure, can move transversely on the supporting assembly assembly, and has a bearing space inside; A transverse drive assembly is installed in the support assembly and cooperates with the transverse bearing assembly. The transverse drive assembly drives the transverse bearing assembly to move transversely. A lifting load-bearing assembly, which is installed in the transverse bearing assembly through a vertical guide structure, can move laterally with the transverse bearing assembly, and can move vertically independently in the transverse bearing assembly, and has a load-bearing space inside; A lifting drive assembly is installed in the transverse bearing assembly, can move laterally with the transverse bearing assembly, and cooperates with the lifting bearing assembly, and the lifting drive assembly drives the lifting bearing assembly to move vertically; The adsorption rotary assembly is installed in the lifting and carrying assembly through a rotating structure, and can move laterally and vertically with the lifting and carrying assembly, and can independently perform circumferential rotation in the lifting and carrying assembly. It cooperates with the wafer to carry the wafer to move laterally, vertically and rotationally, and perform centering operations on the wafer; The rotary drive assembly is installed in the lifting bearing assembly and can move horizontally and vertically with the lifting bearing assembly. It cooperates with the adsorption rotary assembly and is driven by the rotary drive assembly to perform a circumferential rotary motion; The wafer loading component is installed in the supporting assembly component and cooperates with the adsorption rotating component so that the adsorption rotating component can place the wafer it carries on the wafer loading component after centering.

2. The wafer centering device with a lifting and lateral movement structure according to claim 1, characterized in that: The support assembly components include: A support seat plate, which is arranged in the transverse direction, and a transverse bearing assembly and a transverse driving assembly are installed on the support seat plate; The support stand is installed on the top of the support base plate and extends upwards of the support base plate. The wafer loading assembly is installed on the support stand.

3. The wafer centering device with a lifting and lateral movement structure according to claim 2, characterized in that: The traverse bearing assembly includes: A transverse guide rail, which is installed on the top of the support seat plate and extends in the transverse direction; The transverse moving carrier is installed on the transverse moving guide rail through a slider and can move laterally along the transverse moving guide rail. The lifting bearing assembly and the lifting driving assembly are installed on the transverse moving carrier.

4. The wafer centering device with a lifting and lateral movement structure according to claim 3 is characterized in that: The traverse drive assembly includes: The transverse electric cylinder is installed on the top of the support base plate, and its power output shaft is parallel to the transverse guide rail and is engaged with the transverse carrier. The transverse electric cylinder drives the transverse carrier to move laterally along the transverse guide rail.

5. The wafer centering device with a lifting and lateral movement structure according to claim 3, characterized in that: The lifting load-bearing components include: A lifting guide rail, which is installed on the transverse moving carriage and extends vertically, and can move laterally with the transverse moving carriage; The lifting carrier is installed on the lifting guide rail through a slider, can move laterally with the lifting guide rail, and can move vertically along the lifting guide rail independently. The adsorption rotary assembly and the rotary drive assembly are installed on the lifting carrier.

6. The wafer centering device with a lifting and lateral movement structure according to claim 5, characterized in that: The lifting drive assembly includes: The lifting motor is installed on the transverse moving carrier and can move laterally with the transverse moving carrier. Its power output shaft is parallel to the lifting guide rail and is connected to the lifting carrier through a ball screw structure. The lifting motor drives the lifting carrier to move vertically along the lifting guide rail.

7. The wafer centering device with a lifting and lateral movement structure according to claim 5, characterized in that: The adsorption rotary assembly includes: The adsorption plate body is installed on the lifting carrier through bearings. It can move laterally and vertically with the lifting carrier, and can independently perform circumferential rotational motion on the lifting carrier. It is also connected to the suction mechanism through a vacuum seat. The adsorption plate body adsorbs and positions the wafer, and carries the wafer to move laterally, vertically and rotationally.

8. The wafer centering device with a lifting and lateral movement structure according to claim 7, characterized in that: The slew drive assembly includes: The rotary motor is installed on the lifting carrier and can move horizontally and vertically with the lifting carrier. Its power output shaft is engaged with the adsorption plate body, and the rotary motor drives the adsorption plate body to rotate.

9. The wafer centering device with a lifting and lateral movement structure according to claim 7, characterized in that: The wafer loading assembly includes: A pair of loading cantilevers are provided, each loading cantilever is installed on a supporting frame, extends laterally to the outside of the supporting frame, and is arranged on both sides of the adsorption plate; A pair of loading pads are provided, each loading pad is respectively installed on the top of the loading cantilever, and the wafer on the adsorption plate can be placed on the loading pad and supported by the loading pad.

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