Wafer edge leveling device

Abstract

The wafer edge leveling device is characterized in that a rotating assembly comprises a rotating motor and a rotating platform; the rotating motor is installed on the frame assembly, and an output shaft of the rotating motor faces upwards. The rotating platform is used for bearing a wafer and is mounted on an output shaft of the rotating motor; the lifting assembly comprises a lifting air cylinder and a lifting table. The lifting air cylinder is installed on the frame assembly, and an output shaft of the lifting air cylinder faces upwards. The lifting table is used for lifting the wafer and is mounted on an output shaft of the lifting cylinder; the wafer centering assembly comprises a centering air cylinder and a pair of wafer centering discs which are symmetrically arranged with the rotating platform as the center. The centering air cylinder is installed on the frame assembly and controls the pair of wafer centering discs to move face to face or back to back so as to center the wafer. The optical fiber sensor comprises a transmitting end and a receiving end, and light between the transmitting end and the receiving end is located on one side of the wafer and is perpendicular to the wafer. The wafer edge leveling device is simple and reasonable in structure, the edge leveling action of the wafer can be completed through simple action, the action is simple, and the device cost is low.

Description

Technical Field

[0001] The utility model relates to the technical field of automated semiconductor equipment, in particular to a wafer leveling device. Background Art

[0002] During the wafer manufacturing process, in order to facilitate the machine to identify the direction and positioning of the wafer, a completely horizontal edge will be added to the edge of the wafer. This edge is called a flat edge. Figure 1 As shown, a 6-inch wafer has a flat edge.

[0003] In certain wafer production processes, it is necessary to ensure that the flat edges of the wafers face in a consistent direction, and therefore it is necessary to provide a wafer leveling device that is simple in operation and low in device cost. Utility Model Content

[0004] The utility model aims to provide a wafer leveling device, which uses simple actions to complete the wafer leveling action and saves costs.

[0005] The technical solution of the utility model is as follows: a wafer leveling device, characterized in that it includes: a frame component, a rotating component, a lifting component, a wafer centering component, and an optical fiber sensor, wherein:

[0006] The rotating assembly includes a rotating motor and a rotating platform; the rotating motor is installed on the frame assembly, and the output shaft of the rotating motor faces upward; the rotating platform is used to carry the wafer and is installed on the output shaft of the rotating motor; the lifting assembly includes a lifting cylinder and a lifting platform; the lifting cylinder is installed on the frame assembly, and the output shaft of the lifting cylinder faces upward; the lifting platform is used to lift and lower the wafer and is installed on the output shaft of the lifting cylinder; the wafer centering assembly includes a centering cylinder and a pair of wafer centering disks symmetrically arranged with the rotating platform as the center; the centering cylinder is installed on the frame assembly to control the pair of wafer centering disks to move toward or away from each other to center the wafer; the optical fiber sensor includes a transmitting end and a receiving end, and the light between the transmitting end and the receiving end is located on one side of the wafer and is perpendicular to the wafer.

[0007] In the above scheme: in the initial state, the lifting cylinder is in the ascending state, the lifting platform is higher than the rotating platform, the centering cylinder controls a pair of wafer centering plates to be in the outwardly open state, and the 6-inch wafer is placed on the lifting platform;

[0008] Then, the lifting cylinder is controlled to be in a descending state, so that the lifting platform is lower than the rotating platform, and then the wafer is placed on the rotating platform;

[0009] Next, the centering cylinder is closed and then opened, that is, a pair of wafer centering plates are controlled to move toward each other and then move away from each other, so that the 6-inch wafer can be centered.

[0010] Next, the rotating motor drives the rotating platform carrying the wafer to rotate. When the light beam emitted by the optical fiber sensor is not blocked by the wafer (i.e., the flat edge of the wafer is tangent to the light beam), the position of the flat edge of the wafer is determined;

[0011] Finally, the rotating motor stops rotating, and the lifting cylinder rises again, lifting the 6-inch wafer, completing the entire action.

[0012] Furthermore, in order to control a pair of wafer centering plates to move toward or away from each other, the centering cylinder is a parallel finger cylinder, which is installed on the bottom plate of the frame assembly; the two guide rail slides of the parallel finger cylinder are respectively connected to the pair of wafer centering plates through connecting arms. The bottom ends of a pair of connecting arms are respectively connected to the two guide rail slides of the parallel finger cylinder, and the top ends of a pair of connecting arms are respectively connected to the bottoms of the two wafer centering plates, so that the pair of wafer centering plates can be quickly separated after the wafer centering is completed.

[0013] Furthermore, the inner side surface of the wafer centering disk is a curved surface to match the wafer so that the force generated by contact with the wafer is uniform and the wafer is not damaged.

[0014] Furthermore, the lifting platform is arc-shaped and arranged around the outer side of the rotating platform so that the lifting platform and the rotating platform do not interfere with each other. A plurality of support rods are evenly arranged on the upper surface of the lifting platform, and the tops of all the support rods are in the same plane.

[0015] Furthermore, the frame assembly includes a top plate, a bottom plate, and side plates to form a frame box structure, and an intermediate bracket is provided inside the frame assembly, and the rotating motor and the lifting cylinder are both installed on the intermediate bracket.

[0016] Furthermore, the top plate of the frame assembly is provided with a light through hole for cooperating with the optical fiber sensor, a displacement long hole for cooperating with the displacement of the connecting arm, a lifting hole for cooperating with the lifting platform, and a circular through hole for cooperating with the rotating platform.

[0017] The transmitting end and receiving end of the optical fiber sensor are located above and below the wafer respectively. The setting of the light through hole ensures that the top plate will not block the light. When the wafer is not leveled, the plane structure of the wafer will block the light, and the receiving end cannot receive the light. When the wafer is leveled, the flat edge of the wafer is tangent to the light, and the receiving end can receive the light from the transmitting end. The displacement long hole facilitates the passage and displacement of the connecting arm. The lifting hole adopts an arc shape that matches the lifting platform. The circular through hole facilitates the installation of the rotating platform.

[0018] The utility model has a simple and reasonable structure, can complete the wafer leveling action through simple actions, has simple actions and low device cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1This is a schematic diagram of the structure of a 6-inch wafer;

[0020] Figure 2 The front view of the wafer leveling device (the lifting cylinder is in the rising state);

[0021] Figure 3 for Figure 2 Stereoscopic image of

[0022] Figure 4 The front view of the wafer leveling device (the lifting cylinder is in the lowered state);

[0023] Figure 5 for Figure 4 Middle RR profile;

[0024] Figure 6 for Figure 4 Stereoscopic image of

[0025] Figure 7 Top view of the wafer leveling device (wafer centering plate opened);

[0026] Figure 8 Top view of the wafer leveling device (wafer centering plate closed);

[0027] Fig. 9 A schematic diagram of the top plate structure of a wafer leveling device;

[0028] Fig.10 Schematic diagram of the structure of the wafer leveling device (excluding the frame component);

[0029] In the figure: top plate 1, bottom plate 2, wafer 3, intermediate bracket 4, rotating motor 5, rotating platform 6, lifting cylinder 7, lifting platform 8, support rod 9, centering cylinder 10, wafer centering disk 11, optical fiber sensor 12, light through hole 13, displacement long hole 14, lifting hole 15, circular through hole 16, connecting arm 17. DETAILED DESCRIPTION

[0030] The wafer leveling device, as shown in the figure, includes: a frame assembly, a rotating assembly, a lifting assembly, a wafer centering assembly, and an optical fiber sensor.

[0031] 1. A frame assembly includes a top plate 1, a bottom plate 2, and side plates to form a frame structure, and an intermediate bracket 4 is arranged inside the frame assembly.

[0032] 2. The rotating assembly includes a rotating motor 5 and a rotating platform 6. The rotating motor is mounted on the middle bracket of the frame assembly. The output shaft of the rotating motor faces upward, and the rotating platform is mounted on the output shaft of the rotating motor.

[0033] 3. The lifting assembly includes a lifting cylinder 7 and a lifting platform 8. The lifting cylinder is installed on the middle bracket of the frame assembly, the output shaft of the lifting cylinder faces upward, and the lifting platform is installed on the output shaft of the lifting cylinder. The lifting platform is arc-shaped and arranged around the outside of the rotating platform, and multiple support rods 9 are evenly arranged on the upper surface of the lifting platform, and the tops of all the support rods are in the same plane.

[0034] 4. A wafer centering assembly, comprising a centering cylinder 10 and a pair of wafer centering disks 11 symmetrically arranged with a rotating platform as the center, wherein the inner side surface of the wafer centering disk is an arc surface; the centering cylinder is a parallel finger cylinder, which is installed on the bottom plate of the frame assembly, and the two guide rail slides of the parallel finger cylinder are respectively connected to a pair of wafer centering disks through connecting arms 17 to control the pair of wafer centering disks to move toward or away from each other to center the wafer.

[0035] 5. The optical fiber sensor 12 includes a transmitting end and a receiving end. The light between the transmitting end and the receiving end is located on one side of the wafer and is perpendicular to the wafer.

[0036] like Fig. 9 As shown, the top plate of the frame assembly is provided with a light through hole 13 for cooperating with the optical fiber sensor, a displacement long hole 14 for cooperating with the displacement of the connecting arm, a lifting hole 15 for cooperating with the lifting platform, and a circular through hole 16 for cooperating with the rotating platform.

[0037] The working process of the wafer leveling device is as follows:

[0038] 1) In the initial state, such as Figure 2 , 3 As shown, the lifting cylinder is in the ascending state, the lifting platform is higher than the rotating platform, and the centering cylinder controls a pair of wafer centering plates to be in the outwardly open state, placing a 6-inch wafer on the lifting platform;

[0039] 2) Then, if Figure 4 , 5 6, the lifting cylinder is controlled to be in a descending state, so that the lifting platform is lower than the rotating platform, and then the wafer is placed on the rotating platform;

[0040] 3) Then, if Figure 7 , 8 As shown in the figure, the centering cylinder is closed and then opened, that is, a pair of wafer centering disks are controlled to run toward each other and then back to back, so that the 6-inch wafer can be centered. Then, the rotating motor drives the rotating platform carrying the wafer to rotate. When the light beam emitted by the optical fiber sensor is not blocked by the wafer (such as Figure 6 As shown, the flat edge of the wafer is tangent to the light), which determines the flat edge position of the wafer; finally, the rotary motor stops rotating, and the lifting cylinder rises again to lift the 6-inch wafer, completing the entire action.

Claims

1. Wafer leveling device, characterized in that: include: Frame components; Rotating components, including rotating motors and rotating platforms; The rotating motor is mounted on the frame assembly, and the output shaft of the rotating motor faces upward; The rotating platform is used to carry the wafer and is installed on the output shaft of the rotating motor; The lifting assembly includes a lifting cylinder and a lifting platform; the lifting cylinder is installed on the frame assembly, and the output shaft of the lifting cylinder faces upward; the lifting platform is used for lifting the wafer and is installed on the output shaft of the lifting cylinder; The wafer centering assembly comprises a centering cylinder and a pair of wafer centering disks symmetrically arranged with the rotating platform as the center; the centering cylinder is installed on the frame assembly to control the pair of wafer centering disks to move toward or away from each other to center the wafer; The optical fiber sensor comprises a transmitting end and a receiving end. The light between the transmitting end and the receiving end is located on one side of the wafer and is perpendicular to the wafer.

2. The wafer leveling device according to claim 1, characterized in that: The centering cylinder is a parallel finger cylinder, which is installed on the bottom plate of the frame assembly; the two guide rail slides of the parallel finger cylinder are respectively connected to a pair of wafer centering disks through connecting arms.

3. The wafer leveling device according to claim 2, characterized in that: The inner side surface of the wafer centering disc is a curved surface to match the wafer.

4. The wafer leveling device according to claim 1, characterized in that: The lifting platform is arc-shaped and arranged around the outer side of the rotating platform, and a plurality of supporting rods are evenly arranged on the upper surface of the lifting platform.

5. The wafer leveling device according to claim 1, characterized in that: An intermediate bracket is arranged inside the frame assembly, and the rotating motor and the lifting cylinder are both mounted on the intermediate bracket.

6. The wafer leveling device according to claim 2, characterized in that: The top plate of the frame assembly is provided with a light through hole for matching the optical fiber sensor, a displacement long hole for matching the displacement of the connecting arm, a lifting hole for matching the lifting platform, and a circular through hole for matching the rotating platform.

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