Multi-layer wafer clamping and leveling device

Abstract

The utility model provides a multilayer wafer clamping leveling device, which comprises a plurality of finger pieces, a main frame, a leveling assembly and a clamping unit, the plurality of finger pieces are longitudinally distributed on the inner walls of the two sides of the main frame at equal intervals, so that the finger pieces on the same layer in the transverse direction define a finger unit on the layer at intervals in pairs; wherein the transverse spacing area of each layer of finger unit is in a through shape so as to define a clamping space, the clamping unit is connected with the main frame and is arranged at the clamping space, a clamping head of the clamping unit and each layer of finger unit define a wafer clamping position of each layer, and the leveling assembly is arranged at the position, corresponding to each layer of finger piece, of the main frame and is used for leveling the wafer. The adjusting part of the leveling assembly abuts against the finger piece. Therefore, more wafers are allowed to be carried at a time, and multi-layer finger leveling and wafer position calibration are supported.

Description

Technical Field

[0001] The utility model relates to a semiconductor wafer transmission technology, in particular to a multi-layer wafer clamping and leveling device. Background Art

[0002] With the rapid development of the semiconductor industry, the domestic IC and other industries have doubled their demands for the functional diversity of semiconductor equipment. For example, the PVD, CVD, PECVD, Etch, Plasma and other process equipment used in this field have put forward urgent demands for the ability to simultaneously transport multiple layers of wafers. In addition, with the rapid development of the third-generation semiconductors, the supporting process equipment has also put forward requirements for whether it can simultaneously transport multiple layers of wafers. This requires that the wafer transfer equipment used in conjunction with the above process equipment also has this capability.

[0003] Therefore, in order to improve the WPH (wafers PER HOUR) of the entire equipment or for special applications, multi-layer wafer clamping technology is needed. For this purpose, the prior art has proposed "A multi-finger wafer handling robot" (patent application number 202311050315.2), but the number of finger layers is only 5, and a Foup (Front Opening Unified Pod) can hold 25 layers of wafers. Therefore, it takes multiple times to transport a Foup unit of wafers.

[0004] The reason is that as the number of finger layers increases, if the existing clamping technology is simply superimposed, the finger structure will easily become bloated and costly. At the same time, the increase in the number of layers will also lead to increased manufacturing precision requirements. A typical example is the requirement for flatness consistency between multiple layers of fingers. The more layers there are, the more stringent the error requirements are. This is because as long as one layer of fingers is skewed or the position of the wafer it carries is offset, all the fingers will be unable to complete the overall transportation. Utility Model Content

[0005] Therefore, the main purpose of the present invention is to provide a multi-layer wafer clamping and leveling device, which can carry more wafers at a time and support multi-layer finger leveling and wafer position calibration compared to the background technology.

[0006] In order to achieve the above-mentioned purpose, according to one aspect of the utility model, a multi-layer wafer clamping and leveling device is provided, which includes: a plurality of finger parts, a main frame, a leveling assembly, and a clamping unit. The plurality of finger parts are longitudinally equidistantly arranged on the inner walls on both sides of the main frame, so that the finger parts on the same layer are spaced in pairs laterally to define the finger units of that layer, wherein the lateral spacing areas of the finger units of each layer are through-shaped to define a clamping space, the clamping unit is connected to the main frame and arranged in the clamping space to define the clamping position of each layer of wafers through the clamping head of the clamping unit and the finger units of each layer, wherein the leveling assembly is arranged on the main frame at positions corresponding to the finger parts of each layer, and the adjustment part of the leveling assembly is against the finger parts.

[0007] Preferably, the leveling assembly comprises: a bracket, a wedge-shaped piece, and an adjusting bolt. The bracket is arranged on the main frame at positions corresponding to each layer of finger pieces to carry the wedge-shaped piece. Adjustment screw holes are provided on the wall surface of the main frame at positions corresponding to each layer of the bracket. The wedge-shaped piece is matched with the adjustment screw hole via the adjusting bolt to be adjustably connected to the main frame. The inclined adjustment portion of the wedge-shaped piece is against the finger piece.

[0008] Preferably, guide frames are longitudinally provided on the inner walls on both sides of the main frame, and a pair of adjustment wings are spaced apart from each other on one side of the rear end of the finger member to allow the guide frame to extend into the adjustment wing spacing area, the guide finger members are longitudinally arranged and connected to the guide frames to form a layered arrangement, the bottom surface of the adjustment wing is in the shape of an inclined surface, and the adjustment portion of the leveling assembly is against the adjustment wing of the finger member.

[0009] Preferably, a front stopper is provided at the front end of the finger member, and the end surface of the front stopper abutting against the wafer is in an arc shape similar to the outer circle of the wafer.

[0010] Preferably, a rear limiter is further provided at the front end of the finger member, the rear limiter is spaced apart from the front limiter to define a wafer limit position, and the end face of the rear limiter abutting against the wafer is in an arc shape similar to the outer circle of the wafer.

[0011] Preferably, the clamping unit comprises: a fixed frame, a linear sliding module, a telescope, a push plate, a supporting plate, and a chuck, wherein the fixed frame is fixed on the main frame, the supporting plate is movably connected to the top platform of the fixed frame via the linear sliding module, the telescope is fixed on one side of the platform and its telescopic end is transmission-connected to the supporting plate, the push plate is connected to the supporting plate, and the chuck is arranged at the front end layer of the push plate corresponding to the position of each layer of finger units, and the push plate is driven by the telescope to make the chuck telescope toward the clamping space, so as to define the clamping position of each layer of wafers corresponding to the limit pieces of each layer of finger parts.

[0012] Preferably, the chuck comprises: a top block, a base, and an elastic member, wherein the base is fixed at the front end of the push plate, the front end of the base is provided with an elastic opening, and the interior is provided with an elastic cavity connected to the elastic opening, the tail of the top block is provided with a limiting ring, and the head is provided with a top column, the tail of the top block is abutted against the elastic opening via the limiting ring to be restricted in the elastic cavity, and the elastic member is received in the elastic cavity and abutted against the tail of the top block, so that the top column can elastically expand and contract at the elastic opening.

[0013] Preferably, the clamping unit further comprises: a sensor and a trigger plate, wherein a sensing window is provided on the top platform of the fixed frame, the trigger plate is connected to the back end of the bearing plate to extend to the back of the platform through the sensing window, the sensor is arranged on the back of the platform, and its trigger end is located at the moving path of the trigger plate, and the sensor is connected to the telescope control.

[0014] Preferably, the telescopic device is any one of a telescopic air cylinder, a telescopic hydraulic cylinder, and an electric telescopic cylinder.

[0015] Preferably, the sensor is any one of a micro switch and a photoelectric sensor.

[0016] The multi-layer wafer clamping and leveling device provided by the utility model is cleverly designed in that the finger pieces are arranged in pairs on the inner side walls of the main frame at intervals, so that when the finger unit is combined, a holding space is provided for the clamping unit, so that the clamping position of the wafer can be uniformly adjusted by the clamping unit during the process of the multi-layer finger unit carrying the wafer. At the same time, on the main frame, the present solution also provides a finger unit leveling function by means of a wedge-shaped leveling component abutting against the finger piece, so that the horizontal position of the finger unit and its wafer clamping position can be uniformly calibrated, thereby realizing a multi-layer wafer clamping solution of more than 5 layers in a low-cost and small-volume manner, and theoretically reaching ≥25 layers, corresponding to one Foup at a time, thereby greatly improving the wafer transportation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings constituting a part of this application are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0018] Figures 1 to 3 It is a schematic diagram of the overall structure of the multi-layer wafer clamping and leveling device of the utility model shown from different viewing angles;

[0019] Figure 4 It is a structural schematic diagram of the finger member in the multi-layer wafer clamping and leveling device of the utility model;

[0020] Figure 5It is a structural schematic diagram of the main frame and the leveling assembly in the multi-layer wafer clamping and leveling device of the utility model;

[0021] Figure 6 The utility model is a multi-layer wafer clamping and leveling device. Figure 2 A schematic diagram of the partial cross-sectional structure of the section A in the middle;

[0022] Figures 7 and 8 It is a schematic diagram of the overall structure of the clamping unit in the multi-layer wafer clamping and leveling device of the utility model, shown from different viewing angles;

[0023] Fig. 9 It is a perspective structural schematic diagram of a chuck in the multi-layer wafer clamping and leveling device of the utility model.

[0024] Description of Reference Numerals

[0025] Finger unit 1, main frame 2, leveling assembly 3, clamping unit 4, wafer 9, finger piece 11, adjustment wing 12, clamping space 21, guide frame 22, bracket 31, wedge piece 32, adjustment bolt 33, adjustment screw hole 34, fixing frame 41, linear sliding module 42, telescope 43, push plate 44, bearing plate 45, chuck 46, sensor 47, trigger plate 48, sensing window 49, front limit piece 111, rear limit piece 112, top block 461, base 462, elastic piece 463. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0027] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0029] In the description of the present utility model, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the utility model product is usually placed when in use. They are only for the convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance. The terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0030] In addition, the terms "horizontal", "vertical", "overhanging" and the like do not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0031] In the description of the present utility model, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "layout", "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal connection of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances and in combination with the prior art. In addition, the embodiments of the present utility model and the features in the embodiments can be combined with each other without conflict. And one or more of the components in the diagram may be necessary or non-essential, and the relative position relationship between the components in the above diagram can be adjusted according to actual needs.

[0032] In order to achieve a single load of more wafers and support multi-layer finger leveling and wafer position calibration, such as Figures 1 to 3 The utility model provides a multi-layer wafer clamping and leveling device, which includes: a plurality of finger pieces 11, a main frame 2, a leveling assembly 3, and a clamping unit 4, wherein Figure 2As shown, in this example, the plurality of finger members 11 are longitudinally equidistantly arranged on the inner walls on both sides of the main frame 2, thereby, on the one hand, the finger members 11 on the same layer in the horizontal direction can be spaced in pairs to define the finger units 1 of the layer to carry the wafer, and at the same time, the lateral spacing areas of the finger units 1 of each layer will also form a through shape, so that a clamping space 21 can be defined, thereby through the clamping space 21, the clamping unit 4 can be cleverly connected to the main frame 2 and arranged at the clamping space 21, so that the equipment structure is compact and thus saves equipment space, and at the same time, the clamping position of each layer of wafer can be defined through the clamping head 46 of the clamping unit 4 and the finger units 1 of each layer, thereby calibrating the position of the wafer; wherein the leveling component 3 is arranged on the main frame 2 at the corresponding positions of the finger members 11 of each layer, and the adjusting part of the leveling component 3 is against the finger members 11, so that the horizontal position of the finger members 11 of each layer can be further supported by the leveling component 3, thereby realizing the unified calibration of the horizontal position of the finger units 1 of each layer and their wafer clamping positions. This can theoretically support a finger unit with 1 layer of ≥ 25 layers.

[0033] Specifically, if Figure 1 to Figure 2 , Figures 5 and 6 As shown, in this example, the leveling assembly 3 includes: a bracket 31, a wedge 32, and an adjusting bolt 33, wherein the bracket 31 is arranged on the main frame 2 at a position corresponding to each layer of the finger members 11 to carry the wedge 32, and an adjusting screw hole 34 is provided on the wall surface of the main frame 2 at a position corresponding to each layer of the bracket 31, and the wedge 32 is matched with the adjusting screw hole 34 via the adjusting bolt 33 to be adjustably connected to the main frame 2, wherein in a preferred embodiment, each layer of the finger members 11 can correspond to a pair of brackets 31 and wedges 32 arranged in parallel and spaced apart, so that by manipulating each adjusting bolt 33, the degree to which the inclined adjustment portion of the wedge 32 abuts against the finger members 11 can be adjusted, thereby adjusting the horizontal position of each layer of the finger members 11.

[0034] Furthermore, in order to facilitate the installation of each layer of finger members 11 and to facilitate more precise adjustment of the horizontal position of each layer of finger members 11, as Figures 2 to 5 As shown, guide frames 22 are longitudinally provided on the inner walls on both sides of the main frame 2, and a pair of adjustment wings 12 are spaced apart on one side of the rear end of the finger piece 11 to allow the guide frame 22 to extend into the spacer area of ​​the adjustment wings 12, thereby facilitating the longitudinal arrangement of the guiding finger pieces 11 and being bolted to the guide frames 22 to form a layered arrangement. At the same time, the bottom surface of the adjustment wing 12 is in an inclined shape, so that the inclined adjustment portion of the wedge-shaped piece 32 of the leveling assembly 3 can be abutted against the bottom inclined surface of the adjustment wing 12 of the finger piece 11, thereby being able to more accurately and conveniently adjust the horizontal position of each layer of the finger pieces 11.

[0035] Further, such as Figure 4As shown, in order to facilitate calibration of the position of the wafer on the finger member 11, the front end of the finger member 11 in this example is provided with a front stopper 111 and a rear stopper 112, and the rear stopper 112 is arranged spaced apart from the front stopper 111 to define the wafer limit position, so that when a pair of finger members 11 are combined into a layer of finger unit 1, the position of the wafer on the finger unit 1 can be preliminarily limited. In addition, in a preferred embodiment, in order to avoid damaging the wafer and to better hold the wafer, the front and rear stoppers 111, 112 have an arc shape similar to the outer circle of the wafer when they abut against the wafer.

[0036] Further, such as Figure 7 As shown, the clamping unit 4 in this example includes: a fixed frame 41, a linear sliding module 42, a telescope 43, a push plate 44, a bearing plate 45, and a clamp 46, wherein the fixed frame 41 is fixed on the main frame 2 and is located at the clamping space 21, and the bearing plate 45 is movably connected to the top platform of the fixed frame 41 through the linear sliding module 42, wherein the telescope 43 shown in this example is preferably a telescopic cylinder, which is fixed on one side of the platform and its telescopic end is transmission-connected to the bearing plate 45, and in other optional embodiments, the telescope 43 can also be a telescopic hydraulic cylinder, an electric telescopic cylinder, or any other one of the above. Any one; wherein the push plate 44 and the supporting plate 45 are connected at a right angle, and the chuck 46 is arranged at the front end layer of the push plate 44 corresponding to the position of each layer of finger unit 1, so that the supporting plate 45 drives the push plate 44 through the telescopic device 43 to drive the chuck 46 toward the clamping space 21, so as to define the clamping position of each layer of wafers corresponding to the limiting parts of each layer of finger parts 11, that is, when the finger unit 1 carries the wafer, the chuck 46 can be extended outward by the push plate 44 until it is against the wafer 9, and at this time, it will cooperate with the front limiting part 111 at the front end of the finger part 11 to clamp the wafer 9, thereby uniformly adjusting the position of the wafer 9 on the finger unit 1.

[0037] On the other hand, in order to ensure the uniformity of the wafer clamping positions of each layer in the multi-layer clamping solution, it is necessary to ensure the consistency of the positions of all the clamps 46 when they move to abut against the wafers. Obviously, it is difficult to achieve such design and manufacturing accuracy. Therefore, in order to provide tolerance, such as Fig. 9As shown, in this example, the chuck 46 includes: a top block 461, a base 462, and an elastic member 463, wherein the base 462 is fixed at the front end of the push plate 44, the front end of the base 462 is provided with an elastic port, and the inside is provided with an elastic cavity connected to the elastic port, the tail of the top block 461 is provided with a limit ring, and the head is provided with a top column, the tail of the top block 461 is abutted against the elastic port through the limit ring to be limited in the elastic cavity, and the elastic member 463 is received in the elastic cavity and abutted against the tail of the top block 461, so that the top column can be elastically extended and retracted at the elastic port. Through this arrangement, even if there is a distance error between the chucks 46 of each layer, the tolerance can be adjusted by the elastic extension of the top column, and then the wafer 9 can be clamped and adjusted with the limit members of the finger members 11 of each layer to maintain a uniform clamping position.

[0038] Furthermore, in order to prevent the clamping unit 4 from moving beyond the limit and damaging the wafer, an automatic positioning control is formed, such as Figure 8 As shown, in this example, the clamping unit 4 also includes: a sensor 47, a trigger plate 48, wherein a sensing window 49 is provided on the top platform of the fixed frame 41, and the trigger plate 48 is connected to the back end of the carrier plate 45 to extend to the back of the platform through the sensing window 49, wherein the sensor 47 can be selected as any one of a micro switch and a photoelectric sensor 47, and in this example, the photoelectric sensor 47 is taken as an example, and the photoelectric sensor 47 is arranged on the back of the platform, and its trigger end is located at the moving path of the trigger plate 48, and the sensor 47 is controlled and connected with the telescope 43. With this arrangement, when the telescope 43 drives the carrier plate 45, it will drive the trigger plate 48 to move synchronously until it enters the sensing end of the photoelectric sensor 47 to obtain a control signal, and then stop the telescope 43 from working, thereby making the chuck 46 on the push plate 44 stay at the clamping position of the wafer.

[0039] In summary, the multi-layer wafer clamping and leveling device provided by the utility model cleverly designs the finger pieces 11 to be arranged in pairs on the inner side walls of the main frame 2 at intervals, so that when the finger unit 1 is combined, a holding space is provided for the clamping unit 4, so that the clamping position of the wafer can be uniformly adjusted by the clamping unit 4 during the process of the multi-layer finger unit 1 carrying the wafer. At the same time, on the main frame 2, the present solution also provides a leveling function for the finger unit 1 by means of a wedge-shaped leveling component 3 abutting against the finger piece 11, so that the horizontal position of the finger unit 1 and its wafer clamping position are uniformly calibrated, thereby realizing a multi-layer wafer clamping solution of more than 5 layers in a low-cost and small-volume manner, and theoretically reaching ≥25 layers, corresponding to one Foup at a time, thereby greatly improving the wafer transportation efficiency.

[0040] The preferred embodiments of the utility model disclosed above are only used to help explain the utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the utility model to the specific implementation methods described. Obviously, many modifications and changes can be made according to the contents of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that technicians in the relevant technical field can understand and use the utility model well. The utility model is only limited by the claims and their full scope and equivalents. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the utility model should be included in the scope of protection of the utility model.

[0041] In addition, various implementations of the embodiments of the present utility model can also be arbitrarily combined, as long as they do not violate the concept of the embodiments of the present utility model, they should also be regarded as the contents disclosed in the embodiments of the present utility model.

Claims

1. A multi-layer wafer clamping and leveling device, characterized in that include: A plurality of finger parts, a main frame, a leveling component, and a clamping unit, wherein the plurality of finger parts are longitudinally equidistantly arranged on the inner walls on both sides of the main frame, so that the finger parts on the same layer are spaced in pairs laterally to define the finger units of that layer, wherein the lateral spacing areas of the finger units of each layer are through-shaped to define a clamping space, wherein the clamping unit is connected to the main frame and arranged in the clamping space to define the clamping position of each layer of wafers through the clamping head of the clamping unit and the finger units of each layer, wherein the leveling component is arranged on the main frame at locations corresponding to the finger parts of each layer, and the adjusting portion of the leveling component abuts against the finger parts.

2. The multi-layer wafer clamping and leveling device according to claim 1, characterized in that: The leveling assembly includes: a bracket, a wedge-shaped piece, and an adjusting bolt. The bracket is arranged on the main frame at positions corresponding to each layer of finger pieces to carry the wedge-shaped piece. Adjusting screw holes are provided on the wall surface of the main frame at positions corresponding to each layer of the bracket. The wedge-shaped piece is matched with the adjusting screw holes via the adjusting bolts to be adjustably connected to the main frame. The inclined adjustment portion of the wedge-shaped piece abuts against the finger pieces.

3. The multi-layer wafer clamping and leveling device according to claim 1, characterized in that: A guide frame is longitudinally provided on the inner walls on both sides of the main frame, and a pair of adjustment wings are spaced apart from each other on one side of the rear end of the finger piece to allow the guide frame to extend into the adjustment wing spacing area, the guide finger pieces are longitudinally arranged and connected to the guide frames to form a layered arrangement, the bottom surface of the adjustment wing is in the shape of an inclined surface, and the adjustment portion of the leveling assembly is against the adjustment wing of the finger piece.

4. The multi-layer wafer clamping and leveling device according to claim 1, characterized in that: A front stopper is provided at the front end of the finger member, and the end surface of the front stopper abutting against the wafer is in an arc shape similar to the outer circle of the wafer.

5. The multi-layer wafer clamping and leveling device according to claim 4, characterized in that: A rear limiter is also provided at the front end of the finger member. The rear limiter is arranged spaced apart from the front limiter to define a wafer limit position. The end face of the rear limiter abutting against the wafer is in an arc shape similar to the outer circle of the wafer.

6. The multi-layer wafer clamping and leveling device according to claim 4, characterized in that: The clamping unit includes: a fixed frame, a linear sliding module, a telescope, a push plate, a supporting plate, and a chuck, wherein the fixed frame is fixed on the main frame, the supporting plate is movably connected to the top platform of the fixed frame via the linear sliding module, the telescope is fixed on one side of the platform, and its telescopic end is transmission-connected to the supporting plate, the push plate is connected to the supporting plate, and the chuck is arranged at the front end layer of the push plate corresponding to the position of each layer of finger units, and the push plate is driven by the telescope to make the chuck telescope toward the clamping space, so as to define the clamping position of each layer of wafers corresponding to the limit pieces of each layer of finger parts.

7. The multi-layer wafer clamping and leveling device according to claim 6, characterized in that: The chuck comprises: a top block, a base, and an elastic member, wherein the base is fixed at the front end of the push plate, the front end of the base is provided with an elastic opening, and the interior is provided with an elastic cavity connected with the elastic opening, the tail of the top block is provided with a limiting ring, and the head is provided with a top column, the tail of the top block is abutted against the elastic opening via the limiting ring to be restricted in the elastic cavity, and the elastic member is received in the elastic cavity and abutted against the tail of the top block, so that the top column can elastically expand and contract at the elastic opening.

8. The multi-layer wafer clamping and leveling device according to claim 6, characterized in that: The clamping unit also includes: a sensor and a trigger plate, wherein a sensing window is provided on the top platform of the fixed frame, the trigger plate is connected to the back end of the bearing plate to extend to the back of the platform through the sensing window, the sensor is arranged on the back of the platform, and its trigger end is located at the moving path of the trigger plate, and the sensor is connected to the telescope control.

9. The multi-layer wafer clamping and leveling device according to claim 8, characterized in that: The telescopic device is any one of a telescopic cylinder, a telescopic hydraulic cylinder, and an electric telescopic cylinder.

10. The multi-layer wafer clamping and leveling device according to claim 8, characterized in that: The sensor is any one of a micro switch and a photoelectric sensor.

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