Grinding and polishing integrated machining device

Abstract

The utility model provides a grinding and polishing integrated machining device which comprises a machine table, a Y-axis moving assembly and a Z-axis moving assembly, the Y-axis moving assembly and the Z-axis moving assembly are connected to the machine table, and a rotary adsorption table used for adsorbing wafers is connected to the Y-axis moving assembly so that the rotary adsorption table can move in a reciprocating mode in the Y-axis direction. A grinding and polishing assembly used for grinding wafers is connected to the Z-axis moving assembly so that the grinding and polishing assembly can reciprocate in the Z-axis direction, the grinding and polishing assembly comprises an electric spindle and grinding and polishing wheels which are connected, the electric spindle can drive the grinding and polishing wheels to rotate so as to grind the wafers, and the grinding and polishing wheels comprise the first grinding wheel and the second grinding wheel. The first grinding wheel is connected to the bottom of the second grinding wheel, the radius of the first grinding wheel is smaller than that of the second grinding wheel, and the radius difference between the first grinding wheel and the second grinding wheel is larger than that of the rotary adsorption table. According to the invention, rough grinding thinning and accurate grinding processing of the wafer can be carried out on the same station, the wafer transfer process is reduced, and the processing equipment is simplified.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer grinding equipment, in particular to a grinding and polishing integrated processing device. Background Art

[0002] Wafers are the basic raw materials for manufacturing semiconductor devices. Before integrated circuit packaging, the wafer substrate needs to be thinned. The wafer thinning process includes grinding and polishing. The grinding and polishing process generally involves rapid thinning through rough grinding, followed by fine grinding and polishing through cleaning with polishing fluid. Currently, the grinding and polishing processes are performed separately. Generally, a rough grinding mechanism and a fine grinding mechanism are set up separately. The wafer is first sent to the rough grinding mechanism for rough grinding. After the rough grinding is completed, it is transferred to the fine grinding mechanism for fine grinding and polishing by a robot and a conveyor mechanism. The operation is relatively cumbersome and the wafer is easily damaged during the transfer process, resulting in surface scratches and edge bumps. In addition, the separate setting of the rough grinding mechanism and the fine grinding mechanism makes the grinding and polishing equipment structure cumbersome and the equipment cost high.

[0003] In view of this, the applicant filed this application after studying the existing technology. Utility Model Content

[0004] The utility model provides a grinding and polishing integrated processing device, aiming to improve at least one of the above technical problems.

[0005] In order to solve the above technical problems, the utility model provides an integrated grinding and polishing processing device, including a machine table and a Y-axis moving component and a Z-axis moving component connected to the machine table, the Y-axis moving component is connected to a rotating adsorption table for adsorbing wafers, so that the rotating adsorption table can move back and forth in the Y-axis direction, the Z-axis moving component is connected to a grinding and polishing component for grinding wafers, so that the grinding and polishing component can move back and forth in the Z-axis direction, the grinding and polishing component includes a coupled electric spindle and a grinding and polishing wheel, the electric spindle can drive the grinding and polishing wheel to rotate so as to grind the wafer, the grinding and polishing wheel includes a first grinding wheel and a second grinding wheel, the first grinding wheel is connected to the bottom of the second grinding wheel, its radius is smaller than the radius of the second grinding wheel, and the difference in radius between the two is greater than the radius of the rotating adsorption table.

[0006] As a further optimization, the grinding and polishing assembly is connected to the Z-axis moving assembly through a connecting frame, one end of the connecting frame is connected to the Z-axis moving part, and the other end is provided with a block for fixing the electric spindle.

[0007] As a further optimization, the holding block and the connecting frame are fixedly connected by bolts.

[0008] As a further optimization, the Z-axis moving assembly includes a matching slider and a slide rail, the connecting frame is connected to the slider, and the slider is driven by a motor and a lead screw to move back and forth along the slide rail.

[0009] As a further optimization, the Y-axis moving assembly includes a support table and a guide rail. The rotating adsorption table is connected to the support table, and the guide rail is connected to the machine table. A roller adapted to the guide rail is provided at the bottom of the support table. The support table is driven by a motor and a lead screw to move back and forth along the guide rail.

[0010] As a further optimization, a limiting block is connected to the machine platform to limit the movement of the support platform.

[0011] By adopting the above technical solution, the utility model can achieve the following technical effects:

[0012] The present application provides a grinding and polishing integrated processing device, wherein a rotating adsorption table is connected to a Y-axis moving component, and the grinding and polishing component is connected to a Z-axis moving part. The grinding and polishing component is provided with an electric spindle and a grinding and polishing wheel, and the grinding and polishing wheel is provided with a first grinding wheel and a second grinding wheel. The first grinding wheel is provided at the bottom of the second grinding wheel, and the radius of the first grinding wheel is smaller than that of the first grinding wheel. The difference in radius between the two is greater than the radius of the rotating adsorption table. After the rotating adsorption table adsorbs the wafer, the Y-axis moving component transports the wafer to the bottom of the grinding wheel so that the wafer is located under the first grinding wheel, and the Z-axis moving component drives the grinding and polishing wheel assembly to move downward so that the first grinding wheel and the wafer contact each other. The electric spindle drives the grinding wheel to rotate, and the rotating adsorption table drives the wafer to rotate in the opposite direction to the grinding wheel. The first grinding wheel grinds the wafer. After grinding is completed, the Y-axis moving component continues to move forward until the wafer is located under the working surface of the second grinding wheel, and the Z-axis moving component drives the grinding wheel assembly to continue to move downward until the second grinding wheel contacts the wafer, so that the second grinding wheel can grind the wafer. This device can complete rough grinding and fine grinding at the same workstation without transferring the wafer, reducing the wafer transfer process, simplifying the processing equipment, making the equipment structure simpler, and saving equipment costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0014] Figure 1 This is a schematic structural diagram of a grinding and polishing integrated processing device of the present invention from a first viewing angle;

[0015] Figure 2 This is a schematic structural diagram of a grinding and polishing integrated processing device of the present invention from a second viewing angle;

[0016] Figure 3 This is a schematic diagram of the first grinding wheel in operation;

[0017] Figure 4 This is a schematic diagram of the second grinding wheel in operation;

[0018] Markings in the figure: 1-machine table; 2-Y-axis moving assembly; 21-support table; 22-guide rail; 23-roller; 24-limit block; 3-Z-axis moving assembly; 31-slider; 32-slide rail; 4-rotating adsorption table; 5-grinding and polishing assembly; 51-electric spindle; 52-grinding and polishing wheel; 53-first grinding wheel; 54-second grinding wheel; 6-connecting frame; 61-holding block. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the utility model for which protection is sought, but merely represents the selected embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0020] Example

[0021] Depend on Figures 1 to 4As shown, an embodiment of the present invention provides a grinding and polishing integrated processing device, including a machine table 1 and a Y-axis moving component 2 and a Z-axis moving component 3 connected to the machine table, the Y-axis moving component 2 is connected to a rotary adsorption table 4 for adsorbing wafers, the Y-axis moving component 2 can drive the rotary adsorption table 4 to move back and forth in the Y-axis direction, the Z-axis moving component 3 is connected to a grinding and polishing component 5 for grinding wafers, the Z-axis moving component 3 can drive the grinding and polishing component 5 to move back and forth in the Z-axis direction, the grinding and polishing component 5 includes a coupled electric spindle 51 and a grinding and polishing wheel 52, the electric spindle 51 can drive the grinding and polishing wheel 52 to rotate so as to grind the wafer, the grinding and polishing wheel 52 includes a first grinding wheel 53 and a second grinding wheel 54, the first grinding wheel 53 is connected to the bottom of the second grinding wheel 54, the radius of the first grinding wheel 53 is smaller than the radius of the second grinding wheel 54, and the difference in radius between the two is greater than the radius of the rotary adsorption table 4, and the two are coaxially arranged.

[0022] Specifically, the grinding and polishing assembly 5 is connected to the Z-axis moving assembly 3 through the connecting frame 6. One end of the connecting frame 6 is connected to the Z-axis moving part, and the other end is provided with a block 61 for fixing the electric spindle 51. The block and the connecting frame are fixedly connected by bolts; the Z-axis moving assembly 3 includes a corresponding slider 31 and a slide rail 32. The connecting frame 6 is connected to the slider 31, and the slider 31 is driven by the motor and the screw so that it can move up and down along the slide rail 32.

[0023] Specifically, the Y-axis moving assembly 2 includes a support platform 21 and a guide rail 22. The rotary adsorption platform 4 is connected to the support platform 21, and the guide rail 22 is connected to the machine 1. The bottom of the support platform 21 is provided with rollers 23 that are compatible with the guide rail 22. The support platform 21 is driven by a motor and a lead screw to move forward and backward along the guide rail 22. A limit block 24 is connected to the machine 1 to limit the movement of the support platform 21 and prevent the support platform 21 from separating from the guide rail 22 during movement.

[0024] The present application discloses a grinding and polishing integrated processing device. When in use, one end of the guide rail 22 is connected to the feed device and the other end is connected to the discharge device. The motor and the lead screw cooperate to drive the support table 21 to move back and forth so that the rotary adsorption table can receive and transport the wafer. It should be noted that the rotary adsorption table 4 in the present application adopts an existing device and is prior art, so it will not be described in detail here. In the present application, the first grinding wheel is preferably a coarse grinding wheel, and the second grinding wheel is preferably a fine grinding wheel. After the rotary adsorption table 4 receives the wafer, it adsorbs and fixes the wafer on the rotary adsorption table 4, and the support table 21 is driven to move forward, so that the rotary adsorption table 4 brings the wafer to the rough grinding working point. At this time, the Z-axis moving component 3 drives the grinding and polishing component 5 to move downward until the grinding working surface of the first grinding wheel 53 contacts the wafer, the electric spindle 51 drives the grinding and polishing wheel 52 to rotate, and the rotary adsorption table 4 drives the wafer to rotate in the opposite direction to the grinding and polishing wheel 52, so that the first grinding wheel 53 performs rough grinding and rapid thinning on the wafer; after the thinning is completed, the support table 21 is driven to continue to move forward, so that the rotary adsorption table 4 brings the wafer to the fine grinding working point, and the Z-axis moving component 3 drives the grinding and polishing component 5 to continue to move downward until the grinding working surface of the second grinding wheel 54 contacts the wafer, the electric spindle 51 drives the grinding and polishing wheel 52 to rotate, and the rotary adsorption table 4 drives the wafer to rotate in the opposite direction to the grinding and polishing wheel 52, so that the first grinding wheel 53 performs fine grinding and polishing on the wafer. The difference in radius between the first grinding wheel 53 and the second grinding wheel 54 is greater than the radius of the rotary adsorption platform, which can ensure that the working surface of the second grinding wheel 54 is in full contact with the wafer.

[0025] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A grinding and polishing integrated processing device, comprising a machine table and a Y-axis moving component and a Z-axis moving component connected to the machine table, wherein the Y-axis moving component is connected to a rotary adsorption table for adsorbing wafers so that the rotary adsorption table can reciprocate in the Y-axis direction, and the Z-axis moving component is connected to a grinding and polishing component for grinding wafers so that the grinding and polishing component can reciprocate in the Z-axis direction, characterized in that: The grinding and polishing assembly includes an electric spindle and a grinding and polishing wheel that are engaged with each other. The electric spindle can drive the grinding and polishing wheel to rotate so as to grind the wafer. The grinding and polishing wheel includes a first grinding wheel and a second grinding wheel. The first grinding wheel is connected to the bottom of the second grinding wheel, and its radius is smaller than the radius of the second grinding wheel, and the difference between the two radii is greater than the radius of the rotating adsorption table.

2. A grinding and polishing integrated processing device according to claim 1, characterized in that The grinding and polishing assembly is connected to the Z-axis moving assembly through a connecting frame. One end of the connecting frame is connected to the Z-axis moving part, and the other end is provided with a block for fixing the electric spindle.

3. A grinding and polishing integrated processing device according to claim 2, characterized in that The holding block is fixedly connected to the connecting frame by bolts.

4. The grinding and polishing integrated processing device according to claim 2 is characterized in that The Z-axis moving assembly includes a matching slider and a slide rail, the connecting frame is connected to the slider, and the slider is driven by a motor and a lead screw to reciprocate along the slide rail.

5. The grinding and polishing integrated processing device according to claim 1 is characterized in that The Y-axis moving component includes a support table and a guide rail. The rotating adsorption table is connected to the support table, and the guide rail is connected to the machine table. A roller compatible with the guide rail is provided at the bottom of the support table. The support table is driven by a motor and a lead screw to reciprocate along the guide rail.

6. A grinding and polishing integrated processing device according to claim 5, characterized in that A limiting block is connected to the machine platform to limit the movement of the support platform.

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