Wafer cleaning and polishing device

Abstract

The utility model relates to the technical field of wafer processing, and particularly discloses a wafer cleaning and polishing device which comprises two bases, supports are connected to the two bases in a sliding mode, rotating shafts are rotatably installed on the side faces of the two supports, a washing panel is fixedly connected between the two rotating shafts, and a polishing head is arranged on the washing panel. A plurality of spray heads are arranged at the bottom of the washing panel, a drying mechanism is arranged at the top of the washing panel, a turnover mechanism used for driving the washing panel to be turned forwards and backwards is arranged on one support, the turnover mechanism comprises a second motor, and the second motor is fixedly installed on one side of one support. According to the utility model, through the arrangement of the washing panel and the drying mechanism, not only can the wafer be washed, but also the positions of the washing panel and the drying mechanism can be adjusted through the turnover mechanism after the washing is completed, the drying mechanism is used for drying the wafer, the drying speed of the wafer is accelerated, the functionality of the equipment is diversified, and the working efficiency is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of wafer processing, and in particular relates to a wafer cleaning and polishing device. Background Art

[0002] A wafer refers to a silicon chip used to make silicon semiconductor circuits. Its raw material is silicon. During the processing of the wafer, the surface of the wafer needs to be polished. After polishing, excessive impurities will be generated on the surface and need to be cleaned.

[0003] In the Chinese patent with publication number CN220474584U, a wafer polishing and cleaning device is mentioned. The device of the patent can facilitate the subsequent washing and cleaning of the wafers placed under the washing nozzles by accommodating the washing nozzles distributed at equal intervals on the square water pipe. At the same time, the square water pipe can be moved by sliding the assembly column on the support shaft, so that a large area can be washed and the cleaning efficiency can be improved.

[0004] However, the device of this patent can only clean the wafers. After the wafers are rinsed, water stains will remain on the surface of the wafers. The device cannot dry the wafers. Its functionality is single, the natural drying time of the wafers is long, and the working efficiency is low. Utility Model Content

[0005] The utility model aims to provide a wafer cleaning and polishing device to solve the problems in the prior art that the equipment cannot dry the wafer, has single functionality, takes a long time for the wafer to dry naturally, and has low working efficiency.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A wafer cleaning and polishing device comprises two bases, both of which are slidably connected to a bracket, both sides of the two brackets are rotatably mounted with a rotating shaft, a flushing panel is fixedly connected between the two rotating shafts, a plurality of nozzles are arranged at the bottom of the flushing panel, and a drying mechanism is arranged at the top of the flushing panel, and a flipping mechanism for driving the flushing panel to turn back and forth is arranged on one of the brackets.

[0008] Preferably, the flipping mechanism includes motor 2, which is fixedly mounted on one side of one of the brackets, and the output end of the flipping mechanism is fixedly connected to synchronous wheel 2, and one end of the rotating shaft passes through the bracket and is fixedly connected to synchronous wheel 3, and synchronous belt 2 is commonly provided on the outside of synchronous wheel 2 and synchronous wheel 3, and synchronous wheel 2 and synchronous wheel 3 are both rotatably mounted on the side of the bracket.

[0009] Preferably, the drying mechanism comprises a frame, the frame is fixedly mounted on the top of the flushing panel, and a fixing plate is fixedly connected to the inside of the frame, a plurality of fans are rotatably mounted on the top of the fixing plate, and a heating wire is fixedly mounted on the top of the frame.

[0010] Preferably, a motor 1 is fixedly mounted on the bottom of the fixing plate, and an output end of the motor 1 is fixedly connected to the axis of one of the fans.

[0011] Preferably, a synchronous wheel 1 is fixedly mounted on the outside of the plurality of fans, and a synchronous belt 1 is commonly disposed on the outside of the plurality of synchronous wheels 1.

[0012] Preferably, a motor three is fixedly mounted on one side of one of the bases, a threaded rod is fixedly connected to the output end of the motor three, the threaded rod is rotatably mounted on the base, and a sliding rod is fixedly mounted on the other base.

[0013] Preferably, one of the brackets is threadedly connected to the outside of the threaded rod, and the other bracket is slidably sleeved on the outside of the sliding rod.

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] The utility model can not only clean the wafers by arranging the flushing panel and the drying mechanism, but also can adjust the positions of the flushing panel and the drying mechanism by the turning mechanism after the cleaning is completed, and use the drying mechanism to dry the wafers, thereby accelerating the drying speed of the wafers, diversifying the functionality of the equipment, and improving work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a three-dimensional diagram of the utility model;

[0017] Figure 2 It is one of the partial structural schematic diagrams of the utility model;

[0018] Figure 3 for Figure 2 The enlarged view of point A is shown;

[0019] Figure 4 This is the second schematic diagram of the partial structure of the utility model;

[0020] Figure 5 It is a schematic diagram of the overall structure of the drying mechanism of the utility model.

[0021] In the figure:

[0022] 1. Base; 2. Bracket; 3. Rotating shaft; 4. Flushing panel; 5. Drying mechanism; 51. Frame; 52. Fixing plate; 53. Fan; 54. Synchronous wheel one; 55. Synchronous belt one; 56. Motor one; 57. Heating wire; 6. Nozzle; 7. Flipping mechanism; 71. Motor two; 72. Synchronous wheel two; 73. Synchronous wheel three; 74. Synchronous belt two; 8. Motor three; 9. Threaded rod; 10. Sliding rod. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] Reference Figure 1-Figure 5 As shown, a wafer cleaning and polishing device comprises two bases 1, both of which are slidably connected with brackets 2, and both sides of the two brackets 2 are rotatably installed with rotating shafts 3, and a flushing panel 4 is fixedly connected between the two rotating shafts 3. A plurality of nozzles 6 are arranged at the bottom of the flushing panel 4, and a water pipe is connected to one side of the flushing panel 4 for connecting to an external water source. The nozzles 6 are used to flush the wafers to complete the cleaning work of the wafers, and a drying mechanism 5 is arranged on the top of the flushing panel 4, and the drying mechanism 5 is used to dry the wafers. A flipping mechanism 7 for driving the flushing panel 4 to turn back and forth is arranged on one of the brackets 2. After the nozzle 6 flushes the wafer, the flipping mechanism 7 can be driven to drive the flushing panel 4 to flip, and the flushing panel 4 flips so that the drying mechanism 5 faces the wafer, and then the drying mechanism 5 is driven to dry the wafer, thereby accelerating the drying speed of the wafer and improving the work efficiency.

[0025] Specifically, the flipping mechanism 7 includes a motor 2 71, which is fixedly installed on one side of one of the brackets 2. The output end of the flipping mechanism 7 is fixedly connected to a synchronous wheel 2 72. The end of one of the rotating shafts 3 passes through the bracket 2 and is fixedly connected to a synchronous wheel 3 73. The outsides of the synchronous wheels 2 72 and 3 73 are jointly provided with a synchronous belt 2 74, and the synchronous wheels 2 72 and 3 73 are both rotatably installed on the side of the bracket 2. The driving motor 2 71 can drive the synchronous wheel 2 72 to rotate. The rotation of the synchronous wheel 2 72 can drive the synchronous wheel 3 73 to rotate through the synchronous belt 2 74. The rotation of the synchronous wheel 3 73 drives the rotating shaft 3 to rotate. The rotation of the rotating shaft 3 drives the flushing panel 4 to flip, so that the position of the nozzle 6 and the drying mechanism 5 can be controlled, which is convenient for controlling the equipment to clean and dry the wafer.

[0026] More specifically, the drying mechanism 5 includes a frame 51, which is fixedly installed on the top of the flushing panel 4, and a fixed plate 52 is fixedly connected to the inside of the frame 51. A plurality of fans 53 are rotatably installed on the top of the fixed plate 52. The rotation of the fans 53 can generate wind, and the wind blowing toward the surface of the wafer can dry the wafer, thereby accelerating the drying speed of the wafer. A heating wire 57 is fixedly installed on the top of the frame 51, and the wind generated by the fans 53 can be transformed into hot air through the heating wire 57. The hot air blowing toward the surface of the wafer can further accelerate the drying speed of the wafer, thereby improving work efficiency.

[0027] In order to enable multiple fans 53 to blow air toward the wafers at the same time, the following settings are made: a motor 56 is fixedly installed on the bottom of the fixed plate 52, and the output end of the motor 56 is fixedly connected to the axis of one of the fans 53. The outsides of the multiple fans 53 are fixedly sleeved with synchronous wheels 54, and the outsides of the multiple synchronous wheels 54 are commonly provided with a synchronous belt 55. The driving motor 56 can drive one of the fans 53 to rotate, and the rotation of one of the fans 53 can drive one of the synchronous wheels 54 to rotate, and the rotation of one of the synchronous wheels 54 can drive multiple synchronous wheels 54 to rotate synchronously through the synchronous belt 55, and the rotation of multiple synchronous wheels 54 can drive multiple fans 53 to rotate, thereby realizing the synchronous rotation of multiple fans 53.

[0028] Furthermore, a motor three 8 is fixedly installed on one side of one of the bases 1, and a threaded rod 9 is fixedly connected to the output end of the motor three 8. The threaded rod 9 is rotatably installed on the base 1, and a sliding rod 10 is fixedly installed on the other base 1. One of the brackets 2 is threadedly connected to the outside of the threaded rod 9, and the other bracket 2 is slidably sleeved on the outside of the sliding rod 10. Driving the motor three 8 can drive the threaded rod 9 to rotate. Since the bracket 2 and the base 1 are slidably connected, the rotation of the threaded rod 9 can drive the bracket 2 to slide on the base 1, thereby realizing large-area washing and drying and improving cleaning efficiency.

[0029] Working principle: When in use, the staff puts the polished wafer between the two bases 1, connects the flushing panel 4 to the external water source, drives the flushing panel 4 to flush the wafer, and drives the motor 3 8 to slide the bracket 2 at the same time, and the sliding of the bracket 2 drives the flushing panel 4 to slide, so as to achieve large-area flushing of the wafer. After flushing, the flipping mechanism 7 is driven to flip the flushing panel 4, and the flushing panel 4 is flipped so that the drying mechanism 5 faces downward, and the drying mechanism 5 faces the wafer. Then the drying mechanism 5 is driven to dry the wafer, thereby accelerating the drying speed of the wafer, diversifying the functionality of the equipment, and improving work efficiency.

[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer cleaning and polishing device, comprising two bases (1), characterized in that: The two bases (1) are both slidably connected with brackets (2), the sides of the two brackets (2) are both rotatably mounted with rotating shafts (3), a flushing panel (4) is fixedly connected between the two rotating shafts (3), a plurality of nozzles (6) are arranged at the bottom of the flushing panel (4), and a drying mechanism (5) is arranged at the top of the flushing panel (4), and a flipping mechanism (7) for driving the flushing panel (4) to turn back and forth is arranged on one of the brackets (2).

2. A wafer cleaning and polishing device according to claim 1, characterized in that: The flip mechanism (7) comprises a second motor (71), the second motor (71) being fixedly mounted on one side of one of the brackets (2), the output end of the flip mechanism (7) being fixedly connected to a second synchronous wheel (72), the end of one of the rotating shafts (3) passing through the bracket (2) being fixedly connected to a third synchronous wheel (73), the second synchronous wheel (72) and the third synchronous wheel (73) being externally provided with a second synchronous belt (74), and the second synchronous wheel (72) and the third synchronous wheel (73) being rotatably mounted on the side of the bracket (2).

3. A wafer cleaning and polishing device according to claim 1, characterized in that: The drying mechanism (5) comprises a frame (51), wherein the frame (51) is fixedly mounted on the top of the flushing panel (4), and a fixing plate (52) is fixedly connected to the interior of the frame (51), a plurality of fans (53) are rotatably mounted on the top of the fixing plate (52), and a heating wire (57) is fixedly mounted on the top of the frame (51).

4. A wafer cleaning and polishing device according to claim 3, characterized in that: A motor 1 (56) is fixedly mounted on the bottom of the fixing plate (52), and an output end of the motor 1 (56) is fixedly connected to the axis of one of the fans (53).

5. The wafer cleaning and polishing device according to claim 3, characterized in that: A synchronous wheel (54) is fixedly sleeved on the outside of the plurality of fans (53), and a synchronous belt (55) is commonly arranged on the outside of the plurality of synchronous wheels (54).

6. The wafer cleaning and polishing device according to claim 1, characterized in that: A motor three (8) is fixedly mounted on one side of one of the bases (1), a threaded rod (9) is fixedly connected to the output end of the motor three (8), and the threaded rod (9) is rotatably mounted on the base (1), and a sliding rod (10) is fixedly mounted on the other base (1).

7. A wafer cleaning and polishing device according to claim 6, characterized in that: One of the brackets (2) is threadedly connected to the outside of the threaded rod (9), and the other bracket (2) is slidably sleeved on the outside of the sliding rod (10).

Images