Wafer centering and edge searching device

Abstract

The utility model provides a wafer centering and edge searching device, which relates to the technical field of semiconductor manufacturing and comprises a centering mechanism used for determining the circle center of a wafer. The centering mechanism comprises a bearing device used for placing the wafer; the at least three groups of centering devices are arranged around the bearing device in a spaced surrounding manner, the distance between each group of centering devices and the center of the bearing device is equal, and each group of centering devices is provided with a convex structure capable of driving the wafer to move; and the synchronous driving device is arranged to be capable of driving the at least three groups of centering devices to rotate at the same time, and when the at least three groups of centering devices rotate at the same time, the convex structure pushes the wafer to move, so that the circle center of the wafer and the center of the bearing device are located on the same axis. The problems of inaccurate wafer centering and large error in the prior art are solved, and the wafer processing quality is further improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a wafer centering and edge finding device. Background Art

[0002] In the wafer processing process, the loading and unloading links are undoubtedly crucial. These two steps are not only related to the processing efficiency of the wafer, but also directly affect the final product quality. Especially in the process of loading and unloading, there are strict requirements on the placement of the wafer. Taking the 6-inch wafer as an example, this type of wafer has a positioning edge. If the positioning edge is not accurately placed in the corresponding workbench position, the wafer will not be able to be adsorbed and fixed, which will inevitably affect the smoothness and efficiency of the entire processing process. In addition, if it is not possible to ensure that the center of the wafer is concentric with the center of the operating table, the processing quality of the wafer will also be difficult to guarantee.

[0003] However, in the prior art, problems such as inaccurate wafer centering and large errors often occur, which not only increases the difficulty and complexity of processing, but also may cause damage to the wafer or a decrease in processing quality. Utility Model Content

[0004] The purpose of the present application is to provide a wafer centering and edge finding device, aiming to solve the problems of inaccurate wafer centering and large errors in related technologies, thereby improving the quality of wafer processing.

[0005] Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

[0006] According to a first aspect of the present application, a wafer centering and edge finding device is provided, comprising a centering mechanism for determining the center of a wafer; the centering mechanism comprises:

[0007] A carrying device, used for placing the wafer;

[0008] At least three groups of centering devices are arranged around the carrying device in an interval and surrounding manner, and each group of the centering devices is equidistant from the center of the carrying device, and each group of the centering devices has a protruding structure capable of driving the wafer to move;

[0009] The synchronous driving device is configured to drive the at least three sets of centering devices to rotate simultaneously. When the at least three sets of centering devices rotate simultaneously, the protruding structure pushes the wafer to move horizontally so that the center of the wafer and the center of the supporting device are located on the same axis.

[0010] In an exemplary embodiment of the present application, the protruding structure is configured as a positioning column, and the centering device also includes a positioning turntable, which is rotatably arranged around the carrying device, and the rotation axis is parallel to the axis of the carrying device; the positioning column is fixed to the upper surface of the positioning turntable in the vertical direction, and the fixed point deviates from the center of the positioning turntable, and when the positioning turntable rotates, the positioning column is driven to perform circular motion around the center of the positioning turntable.

[0011] In an exemplary embodiment of the present application, the synchronous drive device comprises:

[0012] A first motor; used for outputting rotational power;

[0013] A driving wheel, fixedly connected to the output shaft of the first motor;

[0014] A plurality of driven wheels are provided, corresponding one to one with the positioning turntable and located directly below the positioning turntable;

[0015] A plurality of transmission shafts are provided, corresponding to the driven wheels one by one, and the two ends are fixedly connected to the center of the driven wheel and the center of the positioning turntable respectively;

[0016] The synchronous belt is wound between the driving wheel and the plurality of driven wheels.

[0017] In an exemplary embodiment of the present application, the centering devices are arranged in five groups, and intervals between adjacent centering devices are equal.

[0018] In an exemplary embodiment of the present application, an edge-finding mechanism for positioning and edge-finding the wafer is also included, and the edge-finding mechanism includes:

[0019] A visual sensor for identifying the position of the wafer positioning edge;

[0020] The light source is used to project light onto the surface of the wafer to increase the brightness of the wafer.

[0021] In an exemplary embodiment of the present application, the light source is an annular structure and is located directly above the supporting device, and the center of the visual sensor and the light source are located on the same axis.

[0022] In an exemplary embodiment of the present application, the edge-finding mechanism further includes: a height adjustment mechanism for adjusting the distance between the light source and the carrying device, the height adjustment mechanism including:

[0023] A slide rail, arranged on one side of the light source along a vertical direction;

[0024] A slider has one side fixedly connected to the light source and the other side slidably connected to the slide rail along the length direction of the slide rail. The slider is provided with a fixing piece for fixing to the slide rail.

[0025] In an exemplary embodiment of the present application, the supporting device is configured as a vacuum suction cup and is capable of rotating, an air duct is arranged below the vacuum suction cup, the top of the air duct is fixedly connected to the vacuum suction cup, the axis of the air duct is coaxial with the center of the vacuum suction cup, an air duct is formed inside the air duct, and the air duct is connected to the interior of the vacuum suction cup.

[0026] In an exemplary embodiment of the present application, it also includes a power output device for providing rotational power to the carrying device and a transmission device for transmitting the power output by the power output device to the carrying device.

[0027] In an exemplary embodiment of the present application, the power output device is a second motor; the transmission device includes:

[0028] A transmission wheel, fixedly connected to the output shaft of the second motor;

[0029] A follower wheel, wherein the air guide pipe passes through the follower wheel and is fixedly connected to the follower wheel;

[0030] The transmission belt is wound between the transmission wheel and the follower wheel.

[0031] The exemplary embodiments of the present application may have some or all of the following beneficial effects:

[0032] In a wafer centering and edge-finding device provided in an example implementation of the present application, the wafer is first placed on a carrier table, and a plurality of centering devices are driven to rotate simultaneously by a synchronous driving device. The plurality of centering devices can drive the wafer to move in a plurality of different directions through their own protruding structures, thereby moving the wafer until its own center and the center of the carrier device are on the same axis. Through the above structure, the wafer is accurately centered, the error is reduced, and the processing quality of the wafer is improved.

[0033] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present application, and together with the specification are used to explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0035] Figure 1 A schematic diagram showing the overall structure of a wafer centering and edge finding device in an embodiment of the present application is shown;

[0036] Figure 2 A schematic diagram showing the bottom structure of a wafer centering and edge finding device in an embodiment of the present application is shown;

[0037] Figure 3 A side view of a wafer centering and edge finding device in an embodiment of the application is shown.

[0038] Description of reference numerals:

[0039] 1. Carrying device; 11. Air guide tube; 2. Centering device; 21. Positioning column; 22. Positioning turntable; 3. Synchronous driving device; 31. First motor; 32. Driving wheel; 33. Driven wheel; 34. Transmission shaft; 35. Synchronous belt; 6. Visual sensor; 7. Light source; 8. Height adjustment mechanism; 81. Slide rail; 82. Sliding block; 9. Second motor; 10. Transmission device; 101. Transmission wheel; 102. Follower wheel; 103. Transmission belt. DETAILED DESCRIPTION

[0040] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that the present application will be comprehensive and complete and fully convey the concepts of the example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their detailed descriptions will be omitted. In addition, the drawings are only schematic illustrations of the present application and are not necessarily drawn to scale.

[0041] Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of the diagram to another component, these terms are used in this specification only for convenience, such as according to the direction of the examples in the drawings. It is understood that if the device of the diagram is turned upside down, the component described as "upper" will become the component "lower". When a structure is "on" other structures, it may mean that the structure is formed integrally on the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure through another structure.

[0042] The terms "a", "an", "the" and "at least one" are used to indicate the presence of one or more elements / components / etc.; the terms "including" and "having" are used to express an open-ended inclusive meaning and mean that additional elements / components / etc. may exist in addition to the listed elements / components / etc.; the terms "first" and "second" are used merely as labels and are not intended to limit the quantity of their objects.

[0043] Reference Figure 1 and Figure 2 In an embodiment of the present application, a wafer centering and edge finding device is provided, including a centering mechanism for determining the center of a wafer; the centering mechanism includes:

[0044] A carrier device 1, used for placing the wafer;

[0045] At least three groups of centering devices 2 are arranged around the carrier device 1 in an interval and surrounding manner, and each group of the centering devices 2 is at an equal distance from the center of the carrier device 1, and each group of the centering devices 2 has a protruding structure that can drive the wafer to move horizontally;

[0046] The synchronous driving device 3 is configured to drive the at least three sets of centering devices 2 to rotate simultaneously. When the at least three sets of centering devices 2 rotate simultaneously, the protruding structure pushes the wafer to move so that the center of the wafer and the center of the supporting device 1 are located on the same axis.

[0047] When the wafer is placed on the carrier 1, the synchronous drive device 3 is immediately started to drive multiple sets of centering devices 2 to rotate synchronously. During the rotation process, the centering device 2 guides the wafer to move horizontally through its own protruding structure until its center is aligned with the center of the carrier 1 to ensure that the two are on the same axis. This achieves the purpose of accurate centering of the wafer, reduces operating errors, and improves the quality of subsequent wafer processing.

[0048] In the embodiment of the present application, the number of centering devices 2 can be set to three groups, four groups, five groups or even more. The increase in the number will undoubtedly significantly improve the centering effect of the wafer and achieve more accurate positioning. It is particularly critical that each group of centering devices 2 is equidistant from the center of the carrier device 1 to ensure that the wafer is evenly stressed in all directions, greatly improving the accuracy and stability of positioning. Preferably, in this embodiment, the centering devices 2 are set to five groups, and the intervals between each group of centering devices 2 are equal, which further optimizes the positioning effect of the wafer and provides a strong guarantee for high-precision processing.

[0049] In the preferred embodiment of the present application, the protruding structure of the centering device 2 is set as a positioning column 21. At the same time, the centering device 2 also includes a positioning turntable 22. A plurality of positioning turntables 22 surround the carrier device 1 to ensure that the axis of rotation is parallel to the axis of the carrier device 1. The synchronous drive device 3 can realize the synchronous movement of all positioning turntables 22 to ensure the coordination and consistency of the positioning process. The positioning column 21 is fixed on the upper surface of the positioning turntable 22 in the vertical direction, and the fixing point is cleverly deviated from the center of the positioning turntable 22, so that when the positioning turntable 22 rotates, the positioning column 21 can perform a circular motion with the center of the positioning turntable 22 as the center. It is particularly noteworthy that when the center of the wafer and the center of the carrier 1 are precisely aligned on the same axis, at least four of the five positioning posts 21 must be in close contact with the side wall of the wafer at the same time (except for the positioning posts 21 located at the positioning edge, which do not contact the side wall of the wafer), and the force applied by each positioning post 21 to the wafer must remain completely consistent, ensuring the accuracy and stability of wafer centering, and providing a solid foundation for subsequent high-precision processing.

[0050] Preferably, when the center of the wafer and the center of the carrier 1 are aligned on the same axis, the center of all the positioning posts 21 should form a straight line with the radius of the wafer to achieve precise collinearity. At this time, although the side walls of the wafer and the positioning posts 21 are in close contact, no additional force is applied to each other, ensuring the gentleness and precision of the positioning process. Specifically, when the positioning posts 21 are rotated to the position closest to the center of the carrier 1, the distance from the positioning posts 21 to the center of the carrier 1 should be exactly equal to the radius of the wafer. This structure not only ensures the high precision of wafer positioning, but also effectively avoids possible damage to the wafer due to external forces, providing reliable guarantee for subsequent high-precision processing.

[0051] Specifically, when the wafer is centering, the synchronous drive device 3 will drive all the positioning turntables 22 to rotate in the same direction. This process ensures the coordination of all the positioning turntables 22 and the positioning posts 21. The rotation of the positioning turntable 22 further drives the positioning posts 21 to rotate. When the side walls of the positioning posts 21 are in precise contact with the side walls of the wafer, the wafer will be guided to move until the center of the wafer is precisely aligned with the center of the carrier 1 on the same axis, thereby efficiently completing the centering of the wafer. At this time, all the positioning posts 21 just rotate to the ideal position closest to the center of the carrier 1, maintaining contact with the side walls of the wafer without applying additional force.

[0052] In the embodiment of the present application, the structure of the centering device 2 is not limited to the above solution, and the cam structure can also be used as one of the preferred solutions of the centering device 2. Specifically, during the rotation of the cam, its unique protrusion structure will achieve precise contact with the side wall of the wafer, thereby guiding the wafer to move, ensuring high precision and stability of wafer centering.

[0053] In the embodiment of the present application, the synchronous drive device 3 includes: a first motor 31, a driving wheel 32, a driven wheel 33, a transmission shaft 34 and a synchronous belt 35. Among them, the first motor 31 is used as a power source for outputting rotational power and is arranged below the carrier device 1. Its output shaft is fixedly connected to the bottom center of the driving wheel 32 to ensure smooth and stable power transmission. The number and position of the driven wheels 33 correspond to the positioning turntable 22 one by one, and each driven wheel 33 is located directly below a positioning turntable 22, ensuring uniform distribution and efficient transmission of power. The transmission shaft 34 is set to multiple, corresponding to the driven wheels 33 one by one, one end is fixedly connected to the center of the upper surface of the driven wheel 33, and the other end is fixedly connected to the center of the lower surface of the positioning turntable 22, ensuring accurate and efficient power transmission. The synchronous belt 35 surrounds the driving wheel 32 and multiple driven wheels 33 to form a closed loop of power transmission, ensuring the coordination and efficient operation of the entire synchronous drive device 3. The specific implementation form of the driving wheel 32, the driven wheel 33 and the synchronous belt 35 can be a combination of a pulley and a belt, or a combination of a sprocket and a chain, which can be selected according to actual needs, and the embodiment of the present application does not impose any special restrictions on this.

[0054] In the embodiment of the present application, in order to realize the search and positioning of the wafer positioning edge, an edge-finding mechanism is also included, and the edge-finding mechanism includes a visual sensor 6 and a light source 7. The visual sensor 6 and the light source 7 are both located above the wafer. The light source 7 is used to project light onto the surface of the wafer to significantly increase the brightness of the wafer surface, creating favorable conditions for the accurate identification of the visual sensor 6. The visual sensor 6 is used to capture and analyze the specific position of the positioning edge.

[0055] Furthermore, the embodiment of the present application does not impose any special restrictions on the specific structure and number of the light source 7. A single light source 7 or multiple light sources 7 may be used to meet the needs of different application scenarios. For example, by setting multiple searchlights at different positions, not only can the brightness of the wafer surface be improved in all directions, but also the shadow area can be effectively eliminated to ensure uniform illumination of the wafer surface, thereby further improving the recognition accuracy of the visual sensor 6 and providing a solid technical guarantee for the high accuracy and stability of wafer positioning.

[0056] As a preferred solution in the embodiment of the present application, the light source 7 is set as a single annular structure, and the center of the visual sensor 6 and the light source 7 are located on the same axis. The advantage of this is that the wafer surface can receive 360-degree light projection in all directions without dead angles, ensuring uniform brightness on the wafer surface, and providing ideal conditions for accurate recognition of the visual sensor 6. At the same time, the annular structure of the light source 7 also effectively avoids the generation of shadows, eliminates recognition errors caused by shadows, and further improves the accuracy and reliability of the visual sensor 6 in identifying the positioning edge.

[0057] In the embodiment of the present application, the edge-finding mechanism further includes a height adjustment mechanism 8 for adjusting the distance between the light source 7 and the carrying device 1, and the height adjustment mechanism 8 includes:

[0058] The slide rail 81 is arranged on one side of the light source 7 along the vertical direction;

[0059] The slider 82 is fixedly connected to the light source 7 on one side and slidably connected to the slide rail 81 in the length direction of the slide rail 81 on the other side; a fixing piece for fixing to the slide rail 81 is provided on the slider 82.

[0060] There is no special restriction on the specific structure of the fixing part. It can be a pin that is plugged into the slide rail 81 to fix the slider 82 to the slide rail 81. It can also be a bolt that is tightened to abut against the slide rail 81 to tighten the slider 82 to the slide rail 81, thereby fixing the slider 82 to the slide rail 81.

[0061] In the embodiment of the present application, there is no special restriction on the number of height adjustment mechanisms 8. However, in order to ensure the stability and balance of the light source 7, it is preferred to use two or more sets of height adjustment devices, especially when the two sets of height adjustment mechanisms 8 are relatively arranged on both sides of the light source 7, which can effectively ensure the balance and stability of the light source 7 during operation, and avoid tilting or instability caused by unilateral adjustment. Of course, according to the actual application scenario and needs, one set of height adjustment mechanisms 8 is also feasible.

[0062] In the embodiment of the present application, the height adjustment mechanism 8 is preferably arranged in two mutually symmetrical groups, which not only fully considers the balance requirement of the light source 7 during use, but also takes into account the convenience and stability of operation.

[0063] Specifically, the operator can make fine adjustments to the fill light requirements of the wafer according to the brightness of the surrounding environment, which can be achieved by adjusting the height of the light source 7. During the specific operation, the operator first needs to smoothly slide the slider 82 along the slide rail 81 to the preset appropriate position, ensuring that the light source 7 can be accurately aligned with the wafer to meet the fill light requirements under different brightness requirements. Subsequently, the slider 82 is fixed to the slide rail 81 by the clamping of the fixing parts or the tightening of the bolts, ensuring the stability of the light source 7 at the adjusted height position, and avoiding the accidental movement of the light source 7 during the working process, thereby realizing the precise adjustment of the height of the light source 7. The above structure not only reflects the flexibility and convenience of adjusting the height of the light source 7, but also fully considers the environmental adaptability in practical applications.

[0064] Furthermore, in order to facilitate the identification of the positioning edge and the movement of the positioning edge to the desired position, the supporting device 1 is configured as a rotatable vacuum suction cup. Specifically, an air guide tube 11 is provided under the vacuum suction cup, and an air duct is formed inside the air guide tube 11. The top of the air guide tube 11 is tightly connected to the center of the bottom of the vacuum suction cup, ensuring the connectivity between the air duct and the inside of the vacuum suction cup, while the bottom of the air duct is connected to the external environment.

[0065] After the wafer is centered, the vacuum suction cup discharges the gas between itself and the wafer through the air duct, thereby achieving adsorption and fixation between the wafer. Then, through the rotation function of the vacuum suction cup, the operator can easily move the positioning edge of the wafer to the desired position.

[0066] In the implementation of the present application, a power output device for providing rotational power to the carrier 1 and a transmission device 10 for transmitting power are also included. Through the power output device and the transmission device 10, the carrier 1 (i.e., the vacuum chuck) can be rotated to achieve precise adjustment of the wafer and its positioning edge. Not only does it greatly improve the convenience of operation, but it also significantly improves the accuracy of the wafer positioning edge position adjustment.

[0067] There is no special restriction on the specific structure of the power output device and the transmission device 10. The power output device, such as a cylinder, can generate stable power; and the transmission device 10, such as a combination of a gear and a rack, can efficiently convert this power into the rotational motion of the carrier 1. Specifically, the air duct 11 passes through the gear and is fixedly connected to the gear, the piston rod of the cylinder is fixedly connected to one end of the rack, and the rack is meshed with the gear. When the cylinder drives the rack to translate, the rack drives the gear to rotate, and then drives the air duct 11 and the vacuum suction cup to rotate, thereby realizing the rotation of the wafer.

[0068] Reference Figure 2 and Figure 3 As a preferred solution in the embodiment of the present application, the power output device is a second motor 9; the transmission device 10 includes: a transmission wheel 101, a follower wheel 102 and a transmission belt 103. The output shaft of the second motor 9 is fixedly connected to the center of the bottom of the transmission wheel 101; the air guide tube 11 passes through the follower wheel 102 and is fixedly connected thereto, ensuring a stable connection between the vacuum suction cup and the power output device. The transmission belt 103 is wrapped around the transmission wheel 101 and the follower wheel 102, realizing effective power transmission. The embodiment of the present application does not impose any special restrictions on the specific structure of the transmission wheel 101, the follower wheel 102 and the transmission belt 103, and pulleys and belts, or sprockets and chains can be selected.

[0069] Those skilled in the art will easily think of other embodiments of the present application after considering the specification and practicing the embodiments of the present application. The present application is intended to cover any modification, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary techniques in the art that the present application does not apply for. The specification and embodiments are only regarded as exemplary, and the true scope and spirit of the present application are pointed out by the appended claims.

Claims

1. A wafer centering and edge finding device, characterized in that: A centering mechanism is included for determining the center of a wafer; the centering mechanism includes: A carrier device (1) for placing the wafer; At least three groups of centering devices (2) are arranged around the carrying device (1) in an interval and surrounding manner, and each group of the centering devices (2) is equidistant from the center of the carrying device (1), and each group of the centering devices (2) has a protruding structure capable of driving the wafer to move horizontally; The synchronous driving device (3) is configured to drive the at least three sets of centering devices (2) to rotate simultaneously. When the at least three sets of centering devices (2) rotate simultaneously, the protruding structure pushes the wafer to move so that the center of the wafer and the center of the supporting device (1) are located on the same axis.

2. A wafer centering and edge finding device according to claim 1, characterized in that: The protruding structure is configured as a positioning column (21), and the centering device (2) also includes a positioning turntable (22), wherein the positioning turntable (22) is rotatably disposed around the carrying device (1), and the rotation axis is parallel to the axis of the carrying device (1); the positioning column (21) is fixedly disposed on the upper surface of the positioning turntable (22) in a vertical direction, and the fixing point is offset from the center of the positioning turntable (22), and when the positioning turntable (22) rotates, the positioning column (21) is driven to perform a circular motion around the center of the positioning turntable (22).

3. A wafer centering and edge finding device according to claim 2, characterized in that: The synchronous drive device (3) comprises: A first motor (31) is used to output rotational power; A driving wheel (32) fixedly connected to the output shaft of the first motor (31); A plurality of driven wheels (33) are provided, corresponding one to one with the positioning turntable (22) and located directly below the positioning turntable (22); A plurality of transmission shafts (34) are provided, corresponding one to one with the driven wheels (33), and two ends of the transmission shafts (34) are respectively fixedly connected to the center of the driven wheel (33) and the center of the positioning turntable (22); A synchronous belt (35) is wound around the driving wheel (32) and the plurality of driven wheels (33).

4. The wafer centering and edge finding device according to claim 1, characterized in that: The centering devices (2) are arranged in five groups, and the intervals between adjacent centering devices (2) are equal.

5. A wafer centering and edge finding device according to any one of claims 1 to 4, characterized in that: It also includes an edge-finding mechanism for positioning and edge-finding the wafer, and the edge-finding mechanism includes: A visual sensor (6) for identifying the position of the wafer positioning edge; A light source (7) is used to project light onto the surface of the wafer to increase the brightness of the wafer.

6. The wafer centering and edge finding device according to claim 5, characterized in that: The light source (7) is an annular structure and is located directly above the carrying device (1); the center of the visual sensor (6) and the center of the light source (7) are located on the same axis.

7. The wafer centering and edge finding device according to claim 5, characterized in that: The edge-finding mechanism further comprises: a height adjustment mechanism (8) for adjusting the distance between the light source (7) and the carrying device (1), the height adjustment mechanism (8) comprising: A slide rail (81) is arranged on one side of the light source (7) along a vertical direction; A slider (82) has one side fixedly connected to the light source (7) and the other side slidably connected to the slide rail (81) along the length direction of the slide rail (81); a fixing member for fixing to the slide rail (81) is provided on the slider (82).

8. The wafer centering and edge finding device according to claim 5, characterized in that: The carrying device (1) is configured as a vacuum suction cup and is capable of rotating. An air guide tube (11) is provided below the vacuum suction cup. The top of the air guide tube (11) is fixedly connected to the vacuum suction cup. The axis of the air guide tube (11) is coaxial with the center of the vacuum suction cup. An air channel is formed inside the air guide tube (11), and the air channel is connected to the inside of the vacuum suction cup.

9. The wafer centering and edge finding device according to claim 8, characterized in that: It also comprises a power output device for providing rotational power to the carrying device (1) and a transmission device (10) for transmitting the power output by the power output device to the carrying device (1).

10. The wafer centering and edge finding device according to claim 9, characterized in that: The power output device is a second motor (9); the transmission device (10) comprises: A transmission wheel (101) fixedly connected to an output shaft of the second motor (9); A follower wheel (102), wherein the air guide pipe (11) passes through the follower wheel (102) and is fixedly connected to the follower wheel (102); The transmission belt (103) is wound between the transmission wheel (101) and the follower wheel (102).

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