Vacuum chuck suitable for four-inch and six-inch wafers
By designing a vacuum suction cup including a cylinder and a suction cup housing, the structure of the rolling disc and suction cup housing is used to achieve adsorption of four-inch and six-inch wafers, the problem that the vacuum suction cup can only adapt to one wafer size in the prior art is solved, and flexible processing of multi-size wafers is achieved.
Patent Information
- Application Number
- CN202421549031.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-02
- Publication Date
- 2025-04-29
- Estimated Expiration
- 2034-07-02
AI Technical Summary
Existing vacuum suction cups can only fit one wafer size and cannot fit four-inch and six-inch wafers at the same time.
A vacuum suction cup including a cylinder and a suction cup housing is designed, and the four-inch and six-inch wafers are absorbed through the structural design of the rolling disc and suction cup housing. The specific implementation method is to rotate the suction cup housing so that the air groove corresponds to the suction hole positions of different sizes, thereby generating adsorption forces at the bottoms of the six-inch and four-inch suction holes respectively.
It realizes flexible adsorption of four-inch and six-inch wafers, and is convenient to convert and meets the market's demand for multi-size wafer processing.
Smart Images
Figure CN222813579U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer-related equipment, in particular to a vacuum suction cup suitable for four-inch and six-inch wafers. Background Art
[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits, and its original material is silicon. High-purity polycrystalline silicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing, and slicing, the silicon crystal rod forms a silicon wafer, that is, a wafer. The transportation of wafers requires the use of vacuum suction cups. The existing vacuum suction cups can only adapt to one size. In order to meet market demand and adapt to both four-inch and six-inch wafers, a vacuum suction cup suitable for four-inch and six-inch wafers is needed. Utility Model Content
[0003] The main purpose of the utility model is to provide a vacuum suction cup suitable for four-inch and six-inch wafers, which can effectively solve the problems in the background technology.
[0004] In order to achieve the above purpose, the technical solution adopted by the utility model is:
[0005] A vacuum suction cup suitable for four-inch and six-inch wafers comprises a column and a suction cup shell, wherein a rolling disc is fixedly mounted on the bottom end of the column, a bottom cavity is fixedly mounted on the top of the suction cup shell, a raised edge is arranged on the top of the bottom cavity, a groove is arranged on the outer surface of the rolling disc, the groove is matched with the raised edge, an inner cavity is arranged at the bottom of the rolling disc, four air grooves are arranged at the bottom of the rolling disc near the inner cavity, four six-inch suction holes and four-inch suction holes are arranged through the suction cup shell, a sealing gasket is arranged on the bottom surface of the rolling disc, the sealing gasket is overlapped with the bottom surface of the bottom cavity, and a raised pattern is arranged on the bottom of the suction cup shell.
[0006] Preferably, the four six-inch suction holes correspond to the positions of the air slots.
[0007] Preferably, the four four-inch suction holes correspond to the positions of the inner cavity.
[0008] Preferably, a vacuum pump connection port is provided on one side wall of the column, a through hole is provided in the inner cavity, and the through hole is in communication with the vacuum pump connection port.
[0009] Preferably, second nameplates are fixedly mounted at four locations on the top surface of the rolling disk, and the four second nameplates correspond to the positions of the air grooves.
[0010] Preferably, four first nameplates are equidistantly and fixedly mounted on the outer surface of the suction cup shell, and the four first nameplates correspond to the positions of the six-inch suction holes.
[0011] Compared with the prior art, the utility model has the following beneficial effects: by rotating the suction cup shell, the positions of the first nameplate and the second nameplate are made to correspond, thereby achieving the correspondence between the air groove and the six-inch suction hole. At this time, turning on the vacuum pump assembly can generate adsorption force at the bottom of the six-inch suction hole and the four-inch suction hole, which is used to adsorb the six-inch wafer. The suction cup shell is rotated to misalign the first nameplate and the second nameplate, and the bottom air groove and the six-inch suction hole are misaligned, so that the four six-inch suction holes at the bottom lose adsorption force, while the four internal four-inch suction holes still have adsorption force, thereby achieving adsorption of the four-inch wafer, and the conversion operation is convenient. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] Figure 1 This is a schematic diagram of a first three-dimensional structure of a vacuum suction cup suitable for four-inch and six-inch wafers of the utility model;
[0013] Figure 2 This is a second three-dimensional structural schematic diagram of a vacuum suction cup suitable for four-inch and six-inch wafers of the utility model;
[0014] Figure 3 This is a three-dimensional structural schematic diagram of a vacuum suction cup rolling plate suitable for four-inch and six-inch wafers of the utility model;
[0015] Figure 4 The utility model is a three-dimensional structural schematic diagram of a vacuum suction cup housing suitable for four-inch and six-inch wafers.
[0016] In the figure: 1. Cylinder; 2. Suction cup shell; 3. First nameplate; 4. Vacuum pump connection port; 5. Raised texture; 6. Six-inch suction hole; 7. Four-inch suction hole; 8. Second nameplate; 9. Groove; 10. Through hole; 11. Inner cavity; 12. Air groove; 13. Bottom cavity; 14. Raised edge; 15. Rolling disk. DETAILED DESCRIPTION
[0017] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.
[0018] like Figure 1-4As shown, a vacuum suction cup suitable for four-inch and six-inch wafers includes a column 1 and a suction cup shell 2, wherein a rolling plate 15 is fixedly mounted on the bottom end of the column 1, a bottom cavity 13 is fixedly mounted on the top of the suction cup shell 2, a raised edge 14 is provided on the top of the bottom cavity 13, a groove 9 is provided on the outer surface of the rolling plate 15, and the groove 9 is adapted to the raised edge 14, an inner cavity 11 is provided at the bottom of the rolling plate 15, four air grooves 12 are provided at the bottom of the rolling plate 15 near the inner cavity 11, four six-inch suction holes 6 and four-inch suction holes 7 are penetrated through the suction cup shell 2, a sealing gasket is provided on the bottom of the rolling plate 15, and the sealing gasket overlaps with the bottom surface of the bottom cavity 13, and a raised pattern 5 is provided on the bottom of the suction cup shell 2.
[0019] In this embodiment, the four six-inch suction holes 6 correspond to the positions of the air grooves 12; the four four-inch suction holes 7 correspond to the positions of the inner cavity 11; a vacuum pump connection port 4 is provided on one side wall of the column 1, and a through hole 10 is provided in the inner cavity 11, and the through hole 10 is connected to the vacuum pump connection port 4; second nameplates 8 are fixedly installed on the top surface of the rolling plate 15 at four places, and the four second nameplates 8 correspond to the positions of the air grooves 12; four first nameplates 3 are fixedly installed at equal intervals on the outer surface of the suction cup shell 2, and the four first nameplates 3 correspond to the positions of the six-inch suction holes 6.
[0020] Specifically, the suction cup shell 2 is rotated to make the first nameplate 3 correspond to the second nameplate 8, so that the air groove 12 corresponds to the six-inch suction hole 6. At this time, the vacuum pump assembly is turned on to generate adsorption force at the bottom of the six-inch suction hole 6 and the four-inch suction hole 7, which is used to adsorb the six-inch wafer. The suction cup shell 2 is rotated to make the first nameplate 3 and the second nameplate 8 misaligned, and the bottom air groove 12 and the six-inch suction hole 6 misaligned, so that the four six-inch suction holes 6 at the bottom lose adsorption force, and the four internal four-inch suction holes 7 still have adsorption force, thereby achieving adsorption of the four-inch wafer, and the conversion operation is convenient.
[0021] Working principle: In the utility model, the central column 1 is externally connected to a fixing device, and the vacuum pump connection port 4 is externally connected to a vacuum pump assembly. When the vacuum pump assembly is turned on, the air in the inner cavity 11 can be extracted, so that the six-inch suction holes 6 and the four-inch suction holes 7 corresponding to the bottom generate adsorption force, and the first nameplate 3 and the second nameplate 8 are made to correspond in position by rotating the suction cup shell 2, so that the air groove 12 and the six-inch suction hole 6 correspond in position. At this time, when the vacuum pump assembly is turned on, adsorption force can be generated at the bottom of the six-inch suction hole 6 and the four-inch suction hole 7 for adsorbing six-inch wafers, and the first nameplate 3 and the second nameplate 8 are misaligned by rotating the suction cup shell 2, and the bottom air groove 12 and the six-inch suction hole 6 are misaligned, so that the four six-inch suction holes 6 at the bottom lose adsorption force, and the four internal four-inch suction holes 7 still have adsorption force, thereby realizing the adsorption of four-inch wafers, and the conversion operation is convenient.
[0022] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.
Claims
1. A vacuum chuck suitable for four-inch and six-inch wafers, comprising a column (1) and a chuck housing (2), characterized in that: A rolling disc (15) is fixedly mounted on the bottom end of the column (1), a bottom cavity (13) is fixedly mounted on the top of the suction cup shell (2), a raised edge (14) is provided on the top of the bottom cavity (13), a groove (9) is provided on the outer surface of the rolling disc (15), the groove (9) is adapted to the raised edge (14), an inner cavity (11) is provided at the bottom of the rolling disc (15), four air grooves (12) are provided at the bottom of the rolling disc (15) near the inner cavity (11), four six-inch suction holes (6) and a four-inch suction hole (7) are provided through the suction cup shell (2), a sealing gasket is provided on the bottom surface of the rolling disc (15), the sealing gasket is overlapped with the bottom surface of the bottom cavity (13), and a raised pattern (5) is provided on the bottom of the suction cup shell (2).
2. A vacuum chuck suitable for four-inch and six-inch wafers according to claim 1, characterized in that: The four six-inch suction holes (6) correspond to the positions of the air grooves (12).
3. The vacuum chuck suitable for four-inch and six-inch wafers according to claim 1, characterized in that: The four four-inch suction holes (7) correspond to the positions of the inner cavity (11).
4. The vacuum chuck suitable for four-inch and six-inch wafers according to claim 1, characterized in that: A vacuum pump connection port (4) is provided on one side wall of the column (1), a through hole (10) is provided in the inner cavity (11), and the through hole (10) is in communication with the vacuum pump connection port (4).
5. The vacuum chuck suitable for four-inch and six-inch wafers according to claim 1, characterized in that: Second nameplates (8) are fixedly mounted at four locations on the top surface of the rolling plate (15), and the four second nameplates (8) correspond to the positions of the air grooves (12).
6. The vacuum chuck suitable for four-inch and six-inch wafers according to claim 1, characterized in that: Four first nameplates (3) are fixedly installed at equal intervals on the outer surface of the suction cup shell (2), and the four first nameplates (3) correspond to the positions of the six-inch suction holes (6).