Staggered special-shaped radiator
By setting misaligned through grooves and heat conduction plates on the substrate of the radiator and forming airflow channels on the fin set, the problem of uneven heat dissipation of traditional radiators during heat dissipation of multiple electronic chip products is solved, and a more efficient heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202421563203.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-03
- Publication Date
- 2025-05-02
- Estimated Expiration
- 2034-07-03
AI Technical Summary
When traditional radiators dissipate multiple electronic chip products at the same time, it is easy to cause uneven heat dissipation, especially the chip at the downwind port has poor heat dissipation effect, which may lead to excessive working temperature.
A dislocation special-shaped radiator is designed. By setting multiple through grooves and thermal conductor plates on the substrate and forming airflow channels on the fin sets, the thermal conductor plates are staggered in the y-axis direction, avoiding the positional relationship between the upper air outlet and the lower air outlet, thereby achieving uniform heat dissipation.
This design can effectively avoid the problem of uneven heat dissipation, improve heat dissipation efficiency, and achieve rapid heat dissipation of multiple electronic chip products.
Smart Images
Figure CN222826405U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of radiators, in particular to a dislocated special-shaped radiator. Background Art
[0002] With the development of technology, the functions of electronic chip products are becoming more and more powerful. Similarly, the power consumption of electronic chip products is also increasing accordingly. Therefore, during the operation of electronic chip products, a heat sink is usually used to quickly discharge the heat generated by the product to keep the operating temperature within the normal range.
[0003] A traditional heat sink includes a heat conducting plate and a number of fins arranged on the heat conducting plate. The heat conducting plate is attached to the electronic chip product. During operation, the heat of the electronic chip product is first transferred to the heat conducting plate, and then from the heat conducting plate to the fins. The airflow passes through the gaps between the fins, thereby taking away the heat on the fins to achieve heat exchange.
[0004] However, traditional radiators have the following disadvantages: when cooling with air, the airflow is usually blown in from one side of the fin and out from the other side, that is, the direction of the airflow is fixed. When the radiator needs to dissipate heat for two or more electronic chip products at the same time, multiple electronic chip products are arranged side by side, and some electronic chip products are at the upper air outlet and some electronic chip products are at the lower air outlet. In this way, the radiator has a poor heat dissipation effect on the electronic chip products at the lower air outlet, which can easily cause their operating temperature to be too high, affecting normal operation.
[0005] Therefore, how to design a staggered special-shaped heat sink so that it can evenly dissipate heat for multiple electronic chip products, avoid uneven heat dissipation, and at the same time improve the heat dissipation efficiency and achieve rapid heat dissipation. Utility Model Content
[0006] In view of the deficiencies in the prior art, the utility model provides a staggered special-shaped heat sink, which can evenly dissipate heat for multiple electronic chip products, avoiding uneven heat dissipation, while improving heat dissipation efficiency and achieving rapid heat dissipation.
[0007] The purpose of this utility model is achieved through the following technical solutions:
[0008] A dislocated special-shaped radiator, comprising:
[0009] A substrate, the substrate having a bonding surface and a heat dissipation surface, and the substrate is provided with a plurality of through slots, the plurality of through slots are arranged along the y-axis direction and staggered with each other in the x-axis direction;
[0010] A plurality of heat conducting plates, the number of the heat conducting plates is the same as the number of the through slots, and the plurality of heat conducting plates are respectively received in the plurality of through slots;
[0011] A fin group is arranged on the heat dissipation surface of the substrate, and the fin group forms a plurality of air flow channels, and the extension direction of the air flow channels is the y-axis direction.
[0012] In one embodiment, each of the heat conducting plates spans across a plurality of air flow channels, and different heat conducting plates span different air flow channels.
[0013] In one embodiment, the number of the through slots and the number of the heat conducting plates are both two, and the two through slots are staggered with each other in the x-axis direction, that is, the two heat conducting plates are not arranged side by side in the y-axis direction.
[0014] In one of the embodiments, a copper pipe mesh group is provided between the substrate and the fin group, a receiving groove is provided on the heat dissipation surface of the substrate, and the copper pipe mesh group is accommodated in the receiving groove; the copper pipe mesh group is in contact with and fits with the heat conducting plate, and the copper pipe mesh group is in contact with and fits with the fin group.
[0015] In one embodiment, the copper tube network group includes a plurality of copper tubes, and the plurality of copper tubes are welded to each other.
[0016] In one of the embodiments, the copper tube is welded to the fin group by solder, and each of the copper tubes is simultaneously attached to a plurality of the heat conducting plates.
[0017] In one embodiment, the copper tube is a hollow structure, the internal air pressure of the copper tube is negative pressure and the interior is filled with coolant, and a capillary tube is provided on the inner wall of the copper tube.
[0018] In one embodiment, the fin group includes a plurality of fins, the plurality of fins are arranged side by side, and the air flow channel is formed between two adjacent fins.
[0019] In one embodiment, each of the fins includes: a top plate, a bottom plate, and a side plate connecting the top plate and the bottom plate, and the cross-section of the fin is concave; when arranged side by side, the top plate and the bottom plate of the rear fin are abutted against the side plate of the front fin, and the airflow channel is formed between the two fins.
[0020] In one of the embodiments, the heat conductive plate is provided with heat conductive silicone on a side facing the bonding surface.
[0021] In summary, the staggered special-shaped heat sink of the utility model can evenly dissipate heat for multiple electronic chip products, avoiding the phenomenon of uneven heat dissipation; at the same time, it improves the heat dissipation efficiency and achieves rapid heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.
[0023] Figure 1 It is a structural schematic diagram of the dislocated special-shaped radiator of the utility model;
[0024] Figure 2 for Figure 1 An exploded schematic diagram of a misaligned and shaped heat sink is shown;
[0025] Figure 3 for Figure 2 A schematic plan view of the substrate shown;
[0026] Figure 4 for Figure 1 The structural schematic diagram of the dislocated special-shaped radiator shown;
[0027] Figure 5 It is a schematic diagram of the state of the copper pipe mesh group and the base plate;
[0028] Figure 6 for Figure 2 A partial schematic diagram of the fin group shown. DETAILED DESCRIPTION
[0029] In order to facilitate the understanding of the utility model, the utility model will be described more comprehensively with reference to the relevant drawings below. People familiar with this technology can easily understand other advantages and effects of the utility model from the content disclosed in this specification. It should be noted that the structure, proportion, size, etc. illustrated in the drawings of this specification are only used to match the content disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions that can be implemented in the utility model, so they have no technical substantive significance. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effect that can be produced by the utility model and the purpose that can be achieved, should still fall within the scope of the technical content disclosed in the utility model. At the same time, the terms such as "upper", "lower", "left", "right" and "middle" quoted in this specification are only for the convenience of narration, and are not used to limit the scope of the implementation of the utility model, and the change or adjustment of their relative relationship. Without substantially changing the technical content, it should also be regarded as the scope of the implementation of the utility model.
[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.
[0031] The utility model provides a misaligned special-shaped heat sink 10, which aims to solve the problem of uneven heat dissipation of multiple electronic chip products by the existing heat sink. Figure 1 and Figure 2 As shown, the offset special-shaped heat sink 10 includes: a base plate 100 , a plurality of heat conducting plates 200 and a fin group 300 .
[0032] The substrate 100 has a bonding surface 101 and a heat dissipation surface 102 (eg Figure 2 and Figure 4 ), and as Figure 3 As shown, a plurality of through slots 110 are provided on the substrate 100 (the through slots 110 penetrate the bonding surface 101 and the heat dissipation surface 102 of the substrate 100), and at the same time, the plurality of through slots 100 are arranged along the y-axis direction and staggered with each other in the x-axis direction. The number of the heat conducting plates 200 is the same as the number of the through slots 110, and the plurality of heat conducting plates 200 are respectively received in the plurality of through slots 110.
[0033] The fin group 300 is disposed on the heat dissipation surface 102 of the substrate 100, and the fin group 300 forms a plurality of air flow channels 301, and the extension direction of the air flow channels 301 is the y-axis direction. That is, during air cooling, the air flow blows in from one side of the air flow channel 301 and blows out from the other side, and its flow direction is the y-axis direction.
[0034] The main design idea of the staggered special-shaped heat sink 10 of the utility model is to stagger the multiple heat conducting plates 200 in the x-axis direction, and avoid the same straight line in the y-axis direction passing through the multiple heat conducting plates 200 continuously as much as possible, that is, to avoid the heat conducting plates 200 being arranged side by side in the y-axis direction. In this way, when the airflow flows in the y-axis direction, there will be no positional relationship between the upper air outlet and the lower air outlet between the multiple heat conducting plates 200, thereby achieving uniform heat dissipation.
[0035] Preferably, each heat conducting plate 200 spans across multiple airflow channels 301, and different heat conducting plates 200 span different airflow channels 301. In this way, one heat conducting plate 200 will correspond to multiple airflow channels 301 for heat dissipation, and different heat conducting plates 200 corresponding to different airflow channels 301 also means that the heat conducting plates 200 will not block each other in the y-axis direction.
[0036] In this embodiment, if Figure 3 and Figure 4 As shown, there are two through slots 110 and two heat conducting plates 200 , and the two through slots 110 are staggered in the x-axis direction, that is, the two heat conducting plates 200 are not arranged side by side in the y-axis direction.
[0037] When the heat dissipation is working, the bonding surface 101 of the offset special-shaped heat sink 10 is attached to the electronic chip product, and the two heat conducting plates 200 are respectively bonded to the two electronic chip products. The heat generated by the electronic chip product will be transferred to the heat conducting plate 200, and the heat conducting plate 200 will then transfer the heat to the fin group 300. Then, when the airflow flows through the airflow channel 301, it will take away the heat of the fin group 300, thereby achieving heat exchange. Since the two heat conducting plates 200 are not side by side in the y-axis direction, this is equivalent to the airflow temperature for cooling the two heat conducting plates 200 being the same, so that the same heat dissipation effect can be achieved, and uniform heat dissipation can be achieved.
[0038] like Figure 2 As shown, a copper tube mesh group 400 is disposed between the substrate 100 and the fin group 300, and a receiving groove 120 (such as Figure 3 As shown in FIG. 1 , the copper tube mesh group 400 is received in the receiving groove 120. In addition, the copper tube mesh group 400 is in contact with and fits both the heat conducting plate 200 and the fin group 300.
[0039] The copper tube mesh group 400 serves as a medium for heat transfer. The heat of the heat conducting plate 200 will be preferentially transferred to the copper tube mesh group 400, and then transferred to the fin group 300 by the copper tube mesh group 400. The reason for this design is that the copper tube mesh group 400 itself can evenly distribute heat, thereby improving the heat exchange rate of the heat conducting plate 200 and expanding the heat dissipation area of the heat conducting plate 200, so that the heat of the heat conducting plate 200 can be evenly and efficiently transferred to the fin group 300. If there is no copper tube mesh group 400, the heat conducting plate 200 is in direct contact with the fin group 300. Then, during the heat conduction process, the heat conducting plate 200 will concentrate on heating a part of the fin group 300, and the heat conduction effect is poor. After the copper tube mesh group 400 is provided, during the heat conduction process, the heat conducting plate 200 transfers heat to the copper tube mesh group 400, and the overall temperature of the copper tube mesh group 400 rises evenly, and then uses its own larger area to transfer heat to the fin group 300, so that the heat is more dispersed, and the fin group 300 has only the disadvantage of local heat dissipation.
[0040] Preferably, Figure 2 and Figure 5 As shown, the copper tube network group 400 includes a plurality of copper tubes 410, and the plurality of copper tubes 410 are welded to each other. Further, the copper tubes 410 are welded to the fin group 300 by solder, and each copper tube 410 is simultaneously attached to a plurality of heat conducting plates 200.
[0041] Preferably, the copper tube 410 is a hollow structure, the internal air pressure of the copper tube 410 is negative pressure and is filled with coolant, and a capillary tube (not shown) is also provided on the inner wall of the copper tube 410. During the heat conduction process, the area where the copper tube 410 contacts the heat conducting plate 200 heats up quickly, and the coolant inside evaporates to form water vapor and diffuses to other areas that are not in contact with the heat conducting plate 200. After cooling in other areas, the water vapor condenses into a liquid state again and is adsorbed by the capillary tube and flows back to the area in contact with the heat conducting plate 200, thus realizing the internal circulation of the coolant. Such a circulation process can quickly and efficiently absorb the heat of the heat conducting plate 200 to the copper tube mesh group 400, and evenly transfer it to the entire copper tube mesh group 400, significantly expanding the effective heat dissipation area. Of course, the specific structure of the copper tube 410 can also refer to other prior arts.
[0042] In this embodiment, if Figure 6 As shown, the fin group 300 includes a plurality of fins 310 , the plurality of fins 310 are arranged side by side, and an air flow channel 301 is formed between two adjacent fins 310 .
[0043] Preferably, Figure 6 As shown, each fin 310 includes: a top plate 311, a bottom plate 312, and a side plate 313 connecting the top plate 311 and the bottom plate 312, and the cross section of the fin 310 is concave. When arranged side by side, the top plate 311 and the bottom plate 312 of the rear fin 310 are against the side plate 313 of the front fin 310, and an air flow channel 301 is formed between the two fins 310. During heat conduction, the copper pipe mesh group 400 transfers heat to the bottom plate 312, and the bottom plate 312 then transfers heat to the side plate 313 and the top plate 311 in turn. The side plate 313 has a larger area. When the airflow passes through the air flow channel 301, the side plate 313 with a larger area can perform heat exchange more efficiently, thereby improving the heat dissipation performance.
[0044] Compared with the existing heat dissipation fins, the fin 310 of the present invention has the following advantages:
[0045] First, the cross section of the existing heat sink fins is usually an "I-shaped" or "inverted T-shaped" structure, which requires the existing heat sink fins to be welded. The welding process is time-consuming, labor-intensive, and costly, and the heat transfer effect at the joint is poor. The cross section of the fin 310 of the utility model is a "concave shape", and the fin 310 can be directly obtained through a bending and stamping process, which has a lower production cost and higher production efficiency, and the one-piece structure has a better heat transfer effect at the joint;
[0046] Secondly, since the multiple fins 310 do not transfer heat to each other, the multiple fins 310 of the fin group 300 can be spliced by glue without using welding connection like the prior art, so that they can be assembled more quickly and the production cost is lower.
[0047] In one embodiment, if Figure 4 As shown, the heat-conducting plate 200 is provided with a heat-conducting silicone 210 on the side facing the bonding surface 101 . The heat-conducting silicone 210 helps the electronic chip product to transfer heat to the heat-conducting plate 200 more efficiently, thereby improving the heat dissipation performance.
[0048] In summary, the offset special-shaped heat sink 10 of the present invention can evenly dissipate heat for multiple electronic chip products, avoiding the phenomenon of uneven heat dissipation, while improving the heat dissipation efficiency and achieving rapid heat dissipation.
[0049] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.
Claims
1. A dislocated special-shaped heat sink, characterized in that: include: A substrate, the substrate having a bonding surface and a heat dissipation surface, and the substrate is provided with a plurality of through slots, the plurality of through slots are arranged along the y-axis direction and staggered with each other in the x-axis direction; A plurality of heat conducting plates, the number of the heat conducting plates is the same as the number of the through slots, and the plurality of heat conducting plates are respectively received in the plurality of through slots; A fin group is arranged on the heat dissipation surface of the substrate, and the fin group forms a plurality of air flow channels, and the extension direction of the air flow channels is the y-axis direction.
2. The offset special-shaped heat sink according to claim 1, characterized in that: Each of the heat conducting plates spans across a plurality of air flow channels, and different heat conducting plates span different air flow channels.
3. The offset special-shaped heat sink according to claim 1, characterized in that: The number of the through slots and the number of the heat conducting plates are both two, and the two through slots are staggered with each other in the x-axis direction, that is, the two heat conducting plates are not arranged side by side in the y-axis direction.
4. The offset special-shaped heat sink according to claim 1, characterized in that: A copper pipe mesh group is provided between the substrate and the fin group, a receiving groove is provided on the heat dissipation surface of the substrate, and the copper pipe mesh group is accommodated in the receiving groove; the copper pipe mesh group is in contact with the heat conducting plate and in contact with the fin group.
5. The offset special-shaped heat sink according to claim 4, characterized in that: The copper tube network group includes a plurality of copper tubes, and the plurality of copper tubes are welded to each other.
6. The offset special-shaped heat sink according to claim 5, characterized in that: The copper tube and the fin group are welded by solder, and each of the copper tubes is simultaneously attached to a plurality of the heat conducting plates.
7. The offset special-shaped heat sink according to claim 5, characterized in that: The copper tube is a hollow structure, the internal air pressure of the copper tube is negative pressure and the inside is filled with cooling liquid, and a capillary tube is opened on the inner wall of the copper tube.
8. The offset special-shaped heat sink according to claim 1, characterized in that: The fin group includes a plurality of fins, the plurality of fins are arranged side by side, and the air flow channel is formed between two adjacent fins.
9. The offset special-shaped heat sink according to claim 8, characterized in that: Each of the fins includes: a top plate, a bottom plate, and a side plate connecting the top plate and the bottom plate, and the cross-section of the fin is concave; when arranged side by side, the top plate and the bottom plate of the rear fin are abutted against the side plate of the front fin, and the airflow channel is formed between the two fins.
10. The offset special-shaped heat sink according to claim 1, characterized in that: The heat conducting plate is provided with heat conducting silica gel on a side facing the bonding surface.