Cooling fin spring inclined block pressing flying surface device in contact with chip

Abstract

The utility model discloses a cooling fin spring inclined block pressing flying surface device contacted with a chip. The cooling fin spring inclined block pressing flying surface device comprises a cooling fin, a chip body is arranged on the cooling fin, a cooling piece is installed on the cooling fin, and a limiting assembly is arranged on the surface of the cooling fin; the limiting assembly comprises an interchange plate installed on the surface of the cooling fin, a chip groove is formed in the interchange plate, the interchange plate is clamped on the surface of the cooling fin through a pressing plate, a clamping positioning column is fixed to the interchange plate and clamped in a limiting groove, the limiting groove is formed in the surface of the pressing plate, and the chip groove is clamped in the clamping positioning column. And limiting operation is carried out on the cooling fins through the limiting assembly. According to the cooling fin spring inclined block pressing flying surface device in contact with the chip, the chip body is subjected to heat dissipation operation through the heat dissipation piece on the cooling fin, the cooling fin is limited through the pressing plate of the limiting assembly, the problem that the chip body is prone to deformation due to the fact that the pressing mode is upward pressing or lateral extrusion is solved, and the overall machining quality is improved.

Description

Technical Field

[0001] The utility model relates to the technical field related to heat sinks, in particular to a heat sink spring inclined block pressing flying surface device which contacts with a chip. Background Art

[0002] During the processing of the chip, in order to improve its heat dissipation performance, the chip needs to be in contact with the heat sink, so it needs to be limited during processing. However, the existing heat sink spring inclined block pressing flying surface device in contact with the chip still has certain defects when used, such as;

[0003] For example, a high-performance heat dissipation chip with publication number CN220796722U is manufactured by attaching the chip module to the upper end of the base, and stabilizing the left and right sides of the chip module through a clamping assembly. The radiator is then attached to the upper end of the chip module, and the limiting rod is attached to the front and rear sides of the chip module. The second bracket is then connected to the first bracket through a connecting assembly. The chip module can be encapsulated between the base and the radiator, and the position of the chip module can be made more stable. At the same time, rigid contact between the radiator and the chip module can be avoided, thereby avoiding damage to the chip module.

[0004] However, this high-performance heat dissipation chip still has the following disadvantages in actual use:

[0005] The chip is clamped by stabilizing the left and right sides of the chip module with a clamping assembly. During actual use, the chip is squeezed by external force as a whole, which not only reduces the overall heat dissipation efficiency, but also easily causes chip deformation due to the overall squeezing. After the chip is deformed, vibration will be generated during the overall processing, making it impossible to ensure the smoothness and flatness of the processed surface. Therefore, the overall processing stability is poor, resulting in reduced processing quality.

[0006] In view of the above problems, it is urgently necessary to carry out innovative design based on the original heat sink spring oblique block pressing flying surface device in contact with the chip. Therefore, we proposed that the heat sink spring oblique block pressing flying surface device in contact with the chip can well solve the above problems. Utility Model Content

[0007] The purpose of the utility model is to provide a heat sink spring bevel block pressing flying surface device in contact with the chip, so as to solve the problem proposed by the above background technology that the positions of the left and right sides of the chip module are stabilized by clamping components on the market to clamp the chip. During actual use, the whole is squeezed by external force, which not only reduces the overall heat dissipation efficiency, but also easily causes the chip to deform due to the overall squeezing. After the chip is deformed, vibration will be generated during the overall processing, so that the smoothness and flatness of the processed surface cannot be guaranteed. Therefore, the stability of the overall processing is poor, resulting in reduced processing quality.

[0008] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a heat sink spring inclined block pressing flying surface device in contact with a chip, comprising a heat sink;

[0009] The heat sink is provided with a chip body, a heat sink is installed on the heat sink, a limiting component is provided on the surface of the heat sink, and the chip body is cooled by the heat sink;

[0010] The limiting assembly includes an interchangeable plate installed on the surface of the heat sink, a chip slot is provided on the interchangeable plate, the interchangeable plate is clamped on the surface of the heat sink by a pressure plate, a snap-fit ​​positioning column is fixed on the interchangeable plate, the snap-fit ​​positioning column is snapped into the limiting slot, the limiting slot is provided on the surface of the pressure plate, and the heat sink is limited by the limiting assembly.

[0011] Preferably, a clamping groove is provided on the interchange plate, and a clamping block is clamped inside the clamping groove.

[0012] Preferably, an auxiliary block is connected to the clamping block, and a slope block is fixed to the auxiliary block.

[0013] Preferably, a quick-release base is installed on the clamping block, the bottom of the quick-release base is connected to the interchangeable plate through a positioning guide column, and a height limiting step is provided at the side end of the clamping block.

[0014] Preferably, the auxiliary block (side end is connected to the limit block through a telescopic spring, and the limit block is fixed on the interchangeable plate.

[0015] Preferably, a height positioning column is installed on the interchange plate, a spring contact column is provided on the interchange plate, and a spring block is installed on the interchange plate.

[0016] Preferably, the interchangeable plate is connected to an interchangeable base via a cylinder, and a first positioning column is provided on the interchangeable base.

[0017] Preferably, a second positioning column is arranged on the opposite side of the first positioning column, and a clamping block is connected to the output end of the cylinder.

[0018] Compared with the prior art, the utility model has the following beneficial effects: the heat sink spring inclined block in contact with the chip presses the flying surface device, the chip body is cooled by the heat sink on the heat sink, and the heat sink is limited by the pressure plate of the limiting assembly, which reduces the problem of easy deformation of the chip body caused by the pressing method of upward pressure or side extrusion, and improves the overall processing quality. The specific contents are as follows:

[0019] (1) The heat sink is limited by the pressure plate of the limiting component, which is convenient for later processing operations. It not only reduces the problem of easy deformation of the chip body caused by pressing, but also ensures the smoothness and flatness of the overall processing surface, thereby improving the overall processing quality;

[0020] (2) The auxiliary block drives the slope block to move, so that the slope block contacts the pressing plate, which facilitates the pressing plate to press on the back of the heat sink. Since the overall force-bearing area is large, the overall heat sink will not be deformed, thereby ensuring the flatness and smoothness of the heat sink processing;

[0021] (3) Under the action of the telescopic spring at the side end of the limit block, the inclination block moves forward, so that the inclination block fits tightly with the pressure plate, and moves through the quick-release base, so that the inclination block is conveniently moved out of the pressure plate surface, making it easy to take out the pressure plate, making the overall operation simple and quick;

[0022] (4) The height positioning column and the spring contact column are used together to reduce the problem of increased installation costs caused by the need for a smooth surface of the heat sink, and the heat sink is squeezed to the side by the spring force, making the subsequent processing more stable;

[0023] (5) By driving the cylinder on the interchangeable base, the clamping block clamps the interchangeable plate, which facilitates the removal of the processed products. The overall operation is simple and fast, and it is easy to use, thereby improving the overall production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0025] Figure 2 This is a schematic diagram of the heat sink structure of the utility model;

[0026] Figure 3 This is a schematic diagram of the top view of the interchangeable plate of the utility model;

[0027] Figure 4 This is a schematic diagram of the cutaway structure of the interchangeable plate of the utility model;

[0028] Figure 5 This is a schematic diagram of the structure of the interchangeable plate of the utility model;

[0029] Figure 6 This is a schematic diagram of the interchangeable base structure of the utility model;

[0030] Figure 7 It is a schematic diagram of the structure of the interchangeable base of the utility model when viewed from above.

[0031] In the figure: 1. heat sink; 2. chip body; 3. heat sink; 4. interchange plate; 5. chip slot; 6. pressure plate; 7. limit slot; 8. snap-in positioning column; 9. snap-in slot; 10. snap-in block; 11. auxiliary block; 12. slope block; 13. positioning guide column; 14. quick-release base; 15. height limit step; 16. telescopic spring; 17. limit block; 18. height positioning column; 19. spring contact column; 20. spring block; 21. cylinder; 22. interchange base; 23. first positioning column; 24. second positioning column; 25. clamping block. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0033] Embodiment 1:

[0034] In this embodiment, in order to improve the overall stability, a limit assembly is provided for clamping, the purpose of which is to reduce the problem of vibration during processing causing a decrease in overall stability. Figure 1-Figure 4 The technical solution shown in the figure comprises a heat sink 1, a chip body 2 is arranged on the heat sink 1, a heat sink 3 is installed on the heat sink 1, a limiting assembly is arranged on the surface of the heat sink 1, the chip body 2 is cooled by the heat sink 3, the limiting assembly comprises an interchange plate 4 installed on the surface of the heat sink 1, a chip slot 5 is opened on the interchange plate 4, the interchange plate 4 is clamped on the surface of the heat sink 1 by a pressing plate 6, a clamping positioning column 8 is fixed on the interchange plate 4, the clamping positioning column 8 is clamped in the limiting slot 7, the limiting slot 7 is opened on the surface of the pressing plate 6, the heat sink 1 is limited by the limiting assembly, and the chip body 2 is cooled by the heat sink 1. The heat piece 3 performs heat dissipation operation, and places the chip body 2 inside the chip slot 5 of the interchangeable plate 4, thereby reducing the problem of poor heat dissipation efficiency caused by overall clamping, and placing the pressing plate 6 on the heat sink 1 through the heat dissipation piece 3. At this time, the limiting groove 7 on the pressing plate 6 is sleeved on the clamping positioning column 8 on the interchangeable plate 4, so that the pressing plate 6 can protect the heat sink 1, which is convenient for the installation of the chip body 2, and reduces the problem of easy deformation of the chip body 2 caused by the pressing method of upward pressure or side squeezing, and reduces the problem of reduced overall stability caused by vibration during processing, thereby ensuring the smoothness and flatness of the overall processed surface, and improving the quality of the overall processing.

[0035] Embodiment 2:

[0036] In this embodiment, in order to improve the overall processing quality, a pressing plate 6 is provided to press on the back of the heat sink 1, the purpose of which is to effectively ensure the processing flatness and smoothness of the heat sink 1. Figure 1 , Figure 3 and Figure 4 As shown, a clamping groove 9 is provided on the interchangeable plate 4, and a clamping block 10 is clamped inside the clamping groove 9. The clamping block 10 is connected to an auxiliary block 11, and a slope block 12 is fixed on the auxiliary block 11. A quick-release base 14 is installed on the clamping block 10, and the bottom of the quick-release base 14 is connected to the interchangeable plate 4 through a positioning guide column 13. A height limiting step 15 is provided on the side end of the clamping block 10, and the side end of the auxiliary block 11 is connected to a limiting block 17 through a telescopic spring 16. The limiting block 17 is fixed on the interchangeable plate 4. By applying an external force from the auxiliary block 11, the slope block 12 is moved, which facilitates the contact between the slope block 12 and the pressure plate 6, so that the pressure plate 6 is tightly pressed on the back of the heat sink 1. Due to the large overall force-bearing area, the heat sink 1 will not be deformed, so the flatness and smoothness of the heat sink 1 can be effectively guaranteed, thereby improving the flatness and smoothness of the heat sink 1. The overall quality is improved, and the chip body 2 can fit well with it, ensuring good quality, thereby improving the processing efficiency of the machine, and under the action of the telescopic spring 16 at the side end of the limit block 17, the slope block 12 moves forward, so that the slope block 12 is tightly fitted with the pressure plate 6, thereby playing an effective clamping role, and the quick-release base 14 is moved to make the clamping block 10 move inside the clamping groove 9, so that the slope block 12 is convenient to move out of the surface of the pressure plate 6, and the pressure plate 6 is convenient to be taken out and disassembled, so that the overall service life is greatly improved, and the positioning guide column 13 is convenient for connecting the quick-release base 14. At this time, the clamping block 10 is moved inside the clamping groove 9, so that the interchangeable plate 4 is pressed downward by the positioning guide column 13 until the height limit step 15, which is convenient for the clamping and fixing operation.

[0037] Embodiment three:

[0038] In this embodiment, in order to reduce the overall installation cost, the height positioning column 18 and the spring contact column 19 are provided to cooperate with each other, the purpose of which is to reduce the problem of increased installation cost caused by the need for a smooth surface of the heat sink 1. Figure 5-Figure 7As shown, a height positioning column 18 is installed on the interchangeable plate 4, a spring contact column 19 is arranged on the interchangeable plate 4, a spring block 20 is installed on the interchangeable plate 4, an interchangeable base 22 is connected to the interchangeable plate 4 through a cylinder 21, a first positioning column 23 is arranged on the interchangeable base 22, a second positioning column 24 is arranged on the opposite side of the first positioning column 23, and a clamping block 25 is connected to the output end of the cylinder 21. The height positioning column 18 and the spring contact column 19 are arranged to cooperate with each other, which is convenient for contacting uneven surfaces and transmitting resonance, thereby ensuring processing finish, reducing the problem of increased installation cost caused by the need for a smooth surface of the heat sink 1, and the heat sink 1 is fitted with the spring contact column 19. At this time, the spring block 20 is passed through The heat sink 1 is squeezed to the side by the spring force, so that the later processing is more stable. The first positioning column 23 and the second positioning column 24 on the interchangeable base 22 cooperate with the interchangeable plate 4 to be tightly oriented and positioned, which is convenient for installation and subsequent disassembly. At this time, the cylinder 21 on the interchangeable base 22 is driven, and the clamping block 25 on the cylinder 21 clamps the interchangeable plate 4. After the machine processing is completed, the cylinder 21 is released, and the interchangeable plate 4 is manually taken to the quick-release base 14 to facilitate the removal of the processed product. The overall operation is simple and fast, and it is convenient to use, which improves the overall production efficiency. The content not described in detail in this manual belongs to the existing technology known to professional and technical personnel in this field.

[0039] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A heat sink spring inclined block pressing flying surface device in contact with a chip, comprising a heat sink (1); It is characterized in that Also includes: A chip body (2) is arranged on the heat sink (1), a heat sink (3) is installed on the heat sink (1), a limiting component is arranged on the surface of the heat sink (1), and the chip body (2) is cooled by the heat sink (3); The limiting assembly comprises an interchangeable plate (4) mounted on the surface of the heat sink (1), the interchangeable plate (4) being provided with a chip slot (5), the interchangeable plate (4) being clamped on the surface of the heat sink (1) by a pressure plate (6), a clamping positioning column (8) being fixed on the interchangeable plate (4), the clamping positioning column (8) being clamped in a limiting slot (7), the limiting slot (7) being provided on the surface of the pressure plate (6), and the heat sink (1) being limited by the limiting assembly.

2. A heat sink spring inclined block pressing flying surface device in contact with a chip according to claim 1, characterized in that: The interchange plate (4) is provided with a clamping groove (9), and a clamping block (10) is clamped inside the clamping groove (9).

3. The heat sink spring inclined block pressing flying surface device in contact with the chip according to claim 2, characterized in that: The clamping block (10) is connected to an auxiliary block (11), and a slope block (12) is fixed to the auxiliary block (11).

4. The heat sink spring inclined block pressing flying surface device in contact with the chip according to claim 2, characterized in that: A quick-release base (14) is installed on the clamping block (10); the bottom of the quick-release base (14) is connected to the interchangeable plate (4) via a positioning guide column (13); and a height limiting step (15) is provided at the side end of the clamping block (10).

5. The heat sink spring inclined block pressing flying surface device in contact with the chip according to claim 3, characterized in that: The side end of the auxiliary block (11) is connected to a limit block (17) via a telescopic spring (16), and the limit block (17) is fixed on the interchangeable plate (4).

6. The heat sink spring inclined block pressing flying surface device in contact with the chip according to claim 1, characterized in that: A height positioning column (18) is installed on the interchangeable plate (4), a spring contact column (19) is provided on the interchangeable plate (4), and a spring block (20) is installed on the interchangeable plate (4).

7. The heat sink spring inclined block pressing flying surface device in contact with the chip according to claim 1, characterized in that: The interchangeable plate (4) is connected to an interchangeable base (22) via a cylinder (21), and a first positioning column (23) is provided on the interchangeable base (22).

8. The heat sink spring inclined block pressing flying surface device in contact with the chip according to claim 7, characterized in that: A second positioning column (24) is arranged on the opposite side of the first positioning column (23), and a clamping block (25) is connected to the output end of the cylinder (21).

Images