Direct-current boosting device

Abstract

The utility model relates to a direct-current boosting device, which comprises a bottom shell, a middle shell and an upper cover, the upper surface of the bottom shell is connected with the bottom end of the middle shell, the upper cover is detachably connected with the top end of the middle shell, a heat dissipation groove is formed in the lower surface of the bottom shell, cable connectors are arranged on the two opposite side faces of the middle shell, and heat dissipation fins are arranged outside the other two side faces located on the two sides of a cable connector connecting line. A heat insulation plate is arranged in a space formed by the bottom shell and the middle shell, the heat insulation plate divides the space inside the middle shell into an upper layer space and a lower layer space, the boost sensor and the lower circuit board in the lower layer space are connected together, and the terminal strips in the upper layer space are located on the two sides of the cable connector connecting line and close to the position where the cooling fins are located. Through the heat dissipation groove structure on the lower surface of the bottom shell and the heat dissipation fins on the two side faces of the middle shell, heat generated when the device works can be rapidly dissipated out, and a traditional heat dissipation fan structure is not used any more.

Description

Technical Field

[0001] The utility model relates to the technical field of direct current power supply, in particular to a direct current boosting device. Background Art

[0002] The statements in this section merely provide background technical information related to the present invention and do not necessarily constitute prior art.

[0003] High-power DC power supply system is a system that uses stable DC power supply for high-power supply. It can be used in many fields such as data center power supply, automated factories and car charging piles. This type of system will use various specifications and models of DC boost devices to boost the voltage to meet different power transmission needs.

[0004] The DC boost device needs to dissipate heat during operation. The DC boost device in the prior art is usually equipped with a cooling fan or cooling fins to assist in heat dissipation. The cooling fins on the outer shell are used to increase the heat dissipation area, and the cooling fan is used to introduce external cold air into the DC boost device to accelerate air flow. Although the heat dissipation effect can be achieved, the components inside the DC boost device will be exposed to impurities such as dust and water vapor, which will reduce the life of the DC boost device. Utility Model Content

[0005] In order to solve the technical problems existing in the above-mentioned background technology, the utility model provides a DC boost device, which can quickly dissipate the heat of the device when it is working through the heat dissipation groove structure on the lower surface of the bottom shell and the heat sinks on the two sides of the middle shell, and no longer uses the traditional heat dissipation fan structure. The structure of the upper cover + middle shell + bottom shell can achieve the IP protection level, and with the structure of the heat dissipation part, it can improve the protection level while taking into account the heat dissipation performance.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] The utility model provides a direct current boost device, comprising a bottom shell, a middle shell and an upper cover;

[0008] The upper surface of the bottom shell and the bottom end of the middle shell are connected together, the upper cover is detachably connected to the top end of the middle shell, the lower surface of the bottom shell is provided with a heat dissipation groove, two oppositely arranged side surfaces of the middle shell are provided with cable connectors, and the outsides of the other two side surfaces located on both sides of the cable connector connection are provided with heat sinks;

[0009] A heat insulation board is provided in the space formed by the bottom shell and the middle shell, and the heat insulation board divides the space inside the middle shell into an upper space and a lower space. The boost sensor and the lower circuit board in the lower space are connected together, and the terminal row in the upper space is located on both sides of the cable connector connection and close to the location of the heat sink.

[0010] Furthermore, a sealing gasket is provided in the upper cover, and a seal is formed when the upper cover is connected to the top end of the middle shell.

[0011] Furthermore, the upper surface of the bottom shell and the bottom end of the middle shell are formed into one piece by welding.

[0012] Furthermore, the boost sensor and the lower circuit board are integrated by soldering.

[0013] Furthermore, a boost sensor fixing plate is provided on the upper surface of the bottom shell.

[0014] Furthermore, the upper surface of the boost sensor fixing plate is connected to the boost sensor and the lower circuit board.

[0015] Furthermore, the outsides of two oppositely arranged side surfaces of the middle shell are connected to the heat sink via a heat sink fixing block.

[0016] Furthermore, two oppositely arranged side surfaces of the middle shell are provided with cable connectors.

[0017] Furthermore, the upper surface of the heat insulation board is connected to an upper circuit board, and a terminal connector is provided on the upper circuit board. The terminal connector is used to fix the terminal row to the upper circuit board.

[0018] Furthermore, a T-shaped pressing block is provided on the heat sink fixing block, and the T-shaped pressing block applies pressure to the outer surface of the upper cover after the upper cover is connected to the top end of the middle shell.

[0019] Compared with the prior art, one or more of the above technical solutions have the following beneficial effects:

[0020] 1. The heat insulation board divides the space inside the middle shell into two layers, the upper and lower layers. The heat generated by the components will not be transferred under the protection of the heat insulation board, but will be transferred to the heat sinks on both sides of the middle shell and released to the outside environment. At the same time, in addition to the heat dissipation of the lower layer through the heat sink, the heat of the lower layer will also be transferred to the heat dissipation slot structure on the bottom surface of the bottom shell because the boost sensor and the lower circuit board are integrated, and the middle shell and the bottom shell are also integrated, so the heat will be released to the outside environment. The heat dissipation slot structure on the lower surface of the bottom shell and the heat sinks on both sides of the middle shell can quickly dissipate the heat of the device when it is working, and the traditional heat dissipation fan structure is no longer used.

[0021] 2. The structure of upper cover + middle shell + bottom shell is adopted to form a space for accommodating components. In this space, the upper cover and the middle shell are sealed by a sealing gasket, and the middle shell and the bottom shell are welded together to form a whole and also achieve sealing. Only the cable connector opened on the middle shell can make a small amount of contact between the outside atmosphere and the components inside the device, so that the life of the components inside the device is improved and the IP protection level can be achieved. Combined with the structure of the heat dissipation part, the protection level can be improved while taking into account the heat dissipation performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The drawings in the specification, which constitute a part of the present invention, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention.

[0023] Figure 1 It is a structural schematic diagram of a DC boost device provided by the utility model after the bottom shell and the middle shell are welded together;

[0024] Figure 2 This is a schematic diagram of the structure after the sealing gasket is installed inside the upper cover provided by the utility model:

[0025] Figure 3 This is a schematic diagram of the connection structure between the lower circuit board and the boost sensor provided by the utility model after soldering and the boost sensor fixing plate:

[0026] Figure 4 This is a schematic diagram of the connection structure of the heat sink and the heat sink fixing block provided by the utility model:

[0027] Figure 5 This is a schematic diagram of the structure after the boost sensor fixing plate is installed inside the housing provided by the utility model, two large cable connectors and a small cable connector are installed, and fixed to the bottom housing:

[0028] Figure 6 This is a schematic diagram of the structure of the heat insulation board installed inside the shell provided by the utility model, the clamp and the upper circuit board are fixed on the heat insulation board, and the heat sinks are fixed on both sides of the middle shell after the upper terminal connector is installed:

[0029] Figure 7 and Figure 8 All of them are isometric structural schematic diagrams of the ultra-high power sealed DC boost device provided by the utility model.

[0030] In the figure: 1 bottom shell, 2 middle shell, 3 upper cover, 4 sealing gasket, 5 boost sensor fixing plate, 6 boost sensor, 7 lower circuit board, 8 heat sink, 9 heat sink fixing block, 10 hexagonal stud, 11 large cable connector, 12 small cable connector, 13 heat insulation board, 14 terminal connector, 15 clamp, 16 upper circuit board, 17 T-type pressure block. DETAILED DESCRIPTION

[0031] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0032] It should be noted that the following detailed descriptions are exemplary and are intended to provide further description of the present invention. Unless otherwise specified, all technical and scientific terms used herein have the same meanings as those commonly understood by those skilled in the art to which the present invention belongs.

[0033] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the utility model. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0034] As introduced in the background technology, the DC boost device needs to dissipate heat during operation. The DC boost device in the prior art is usually equipped with a cooling fan or cooling fins and other structures to assist in heat dissipation. The cooling fins on the outer shell are used to increase the heat dissipation area, and the cooling fan is used to introduce external cold air into the DC boost device to accelerate air flow. Although the heat dissipation effect can be met, the components inside the DC boost device will be exposed to impurities such as dust and water vapor, which will reduce the life of the DC boost device.

[0035] Therefore, the following embodiment provides a DC boost device, in which the bottom shell and the middle shell are combined into a whole by laser welding technology, a heat dissipation slot structure is separated in the bottom shell, heat sinks are installed on both sides of the middle shell to increase the heat dissipation area, and the interior is divided into upper and lower layers of space by a heat insulation board, and two parts of components with different heat generation are arranged respectively. After the upper cover is installed, the whole device is sealed, which can reach the protection level of IP68 and can achieve a balance between heat dissipation performance and protection performance.

[0036] like Figure 1-Figure 8 As shown, a DC boost device comprises a bottom shell 1, a middle shell 2 and an upper cover 3;

[0037] like Figure 1 As shown, the middle shell 2 is a rectangular structure, which is formed by connecting four shell plates connected end to end, the upper surface of the bottom shell 1 is connected to the bottom surface of the middle shell 2, and the upper cover 3 is detachably connected to the top surface of the middle shell 2, forming a nearly sealed cavity for accommodating components in the boost device.

[0038] In this embodiment, Figure 1 , Figure 3 and Figure 5 As shown, after the bottom shell 1 and the middle shell 2 are laser welded together, the boost sensor fixing plate 5 is fixed to the upper surface of the bottom shell 1 by screws, and the hexagonal studs 10 are fixed to the upper surface of the bottom shell 1. After the bottom shell 1 and the middle shell 2 are connected together, on the one hand, the protection level can be improved, and the chance of internal components contacting with external dust and water vapor can be reduced. At the same time, the heat generated by the internal components can be transferred to the outside through the middle shell 2 and the bottom shell 1 at the same time.

[0039] like Figure 2As shown, after the sealing gasket 4 is installed on the inner surface of the upper cover 3, it is connected to the top surface of the middle shell 2.

[0040] like Figure 3 As shown, the upper surface of the boost sensor fixing plate 5 is connected to the boost sensor 6 and the lower circuit board 7. In this embodiment, the boost sensor 6 and the lower circuit board 7 are fixed together by soldering, and both are fixed to the boost sensor fixing plate 5 by screws. The soldering method makes the boost sensor 6 and the lower circuit board 7 form a whole, and the heat generated can also be quickly transferred to the lower bottom surface of the bottom shell 1 through the boost sensor fixing plate 5.

[0041] like Figure 4 As shown, both sides of the middle shell 2 are connected to the heat sink 8 through the heat sink fixing block 9. After receiving the heat from the components, both sides of the middle shell 2 release the heat to the external environment through the heat sink 8.

[0042] like Figure 5 As shown, cable connectors are provided on two opposite sides of the middle shell 2, which are respectively a large cable connector 11 and a small cable connector 12 in this embodiment. The large cable connector 11 is used to lock and seal the input and output cables, and the small cable connector 12 is used to connect a third-party power supply.

[0043] like Figure 6 As shown, a heat insulating board 13 is provided inside the middle shell 2, dividing the internal space of the middle shell 2 into two layers, the lower layer space is used to accommodate the boost sensor 6 and the lower circuit board 7, and the upper layer space is used to accommodate the upper circuit board 16. The upper circuit board 16 is provided with a terminal connector 14, and the terminal connector 14 is used to fix the terminal row to the upper circuit board 16. The heat insulating board 13 is provided with a clamp 15, which is used to cooperate with the large cable connector 11 to fix the cable connected to the middle shell 2.

[0044] In this embodiment, the terminal rows are located on both sides of the connection formed by the cable connector and are arranged close to the heat sink 8, so that the middle area in the upper space is vacated, and the heat transfer generated by the components in the upper circuit board 16 is not blocked as much as possible, and the heat generated on the terminal row can be transferred to the heat sink 8 on both sides of the middle shell 2 through the shortest possible path.

[0045] like Figure 7 and Figure 8 As shown, a heat dissipation groove is provided on the lower bottom surface of the bottom shell 1, and a T-shaped pressing block 17 is provided on the heat sink fixing block 9. The T-shaped pressing block 17 is used to apply a certain pressure to the outer surface of the upper cover 3 after the upper cover 3 is connected to the top surface of the middle shell 2, to ensure that the sealing gasket 4 can play a role and prevent the upper cover 3 from opening accidentally.

[0046] The bottom shell 1 is the part that fixes the entire DC boost device. Its thickness is greater than that of the middle shell and the upper cover. Therefore, the weight of the bottom shell 1 is relatively high. In this embodiment, a plurality of groups of grooves arranged in parallel are provided on the lower surface of the bottom shell 1. On the one hand, the weight and material consumption of the bottom shell 1 can be reduced while ensuring the strength. On the other hand, the grooved structure increases the contact area between the bottom surface of the bottom shell 1 and the air. At the same time, the bottom shell 1 is a metal structure, and the heat transfer coefficient meets the requirements, so that the bottom surface of the bottom shell 1 forms a heat dissipation groove structure.

[0047] In the above structure, a structure of upper cover 3 + middle shell 2 + bottom shell 1 is adopted to form a space for accommodating components. In the space, the upper cover 3 and the middle shell 2 are sealed by a sealing gasket 4, and the middle shell 2 and the bottom shell 1 are formed into one by welding, which also achieves sealing. Only the cable connector opened on the middle shell 2 can make the outside atmosphere contact with the components inside the device, so that the life of the components inside the device is improved and the protection level of IP68 can be achieved.

[0048] Regarding heat dissipation, the heat insulation board 13 divides the space inside the middle shell 2 into two layers, the upper and lower layers. The heat generated by the components therein will not be transferred due to the blocking of the heat insulation board 13, but will be transferred to the heat sink 8 on both sides of the middle shell 2 and released to the external environment. At the same time, in addition to the heat dissipation of the lower layer through the heat sink 8, since the boost sensor 6 and the lower circuit board 7 are formed as one body, and the middle shell 2 and the bottom shell 1 are also formed as one body, the heat will also be transferred to the heat dissipation groove structure on the lower bottom surface of the bottom shell 1, thereby released to the external environment.

[0049] The heat dissipation groove structure on the lower surface of the bottom shell 1 and the heat sinks 8 on both sides of the middle shell 2 can quickly dissipate the heat when the device is working, so there is no need to worry about the high temperature of the device. At the same time, the device as a whole is nearly sealed and no longer uses traditional heat dissipation fans. The internal components have little chance of contacting external dust and water vapor, which can extend the service life of the device.

[0050] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A DC boost device, characterized in that: Including a bottom shell, a middle shell and an upper cover; The upper surface of the bottom shell and the bottom end of the middle shell are connected together, the upper cover is detachably connected to the top end of the middle shell, the lower surface of the bottom shell is provided with a heat dissipation groove, two oppositely arranged side surfaces of the middle shell are provided with cable connectors, and the outsides of the other two side surfaces located on both sides of the cable connector connection are provided with heat sinks; A heat insulation board is provided in the space formed by the bottom shell and the middle shell, and the heat insulation board divides the space inside the middle shell into an upper space and a lower space. The boost sensor and the lower circuit board in the lower space are connected together, and the terminal row in the upper space is located on both sides of the cable connector connection and close to the location of the heat sink.

2. A DC boost device as claimed in claim 1, characterized in that: A sealing gasket is arranged in the upper cover, and a seal is formed when the upper cover is connected to the top end of the middle shell.

3. A DC boost device as claimed in claim 1, characterized in that: The upper surface of the bottom shell and the bottom end of the middle shell are formed into one piece by welding.

4. A DC boost device as claimed in claim 1, characterized in that: The boost sensor and the lower circuit board are integrated by soldering.

5. A DC boost device as claimed in claim 1, characterized in that: A boost sensor fixing plate is provided on the upper surface of the bottom shell.

6. A DC boost device as claimed in claim 1, characterized in that: The upper surface of the boost sensor fixing plate is connected to the boost sensor and the lower circuit board.

7. A DC boost device as claimed in claim 1, characterized in that: The exteriors of two oppositely arranged side surfaces of the middle shell are connected to the heat sink via a heat sink fixing block.

8. A DC boost device as claimed in claim 1, characterized in that: Two oppositely arranged side surfaces of the middle shell are provided with cable connectors.

9. A DC boost device as claimed in claim 1, characterized in that: The upper surface of the heat insulation board is connected to the upper circuit board, and the upper circuit board is provided with terminal connectors, which are used to fix the terminal row to the upper circuit board.

10. A DC boost device as claimed in claim 7, characterized in that: The heat sink fixing block is provided with a T-shaped pressing block, and after the upper cover is connected to the top end of the middle shell, the T-shaped pressing block applies pressure to the outer surface of the upper cover.

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