Modularized high-power ups power supply

Abstract

The utility model discloses a modular high-power ups power supply, and relates to the ups power supply technical field, the modular high-power ups power supply comprises a shock pad, a carrying handle support, an adjusting button, a loading and unloading handle and a dustproof cover, a cabinet is arranged above the shock pad, the carrying handle support is arranged at the center line position of the cabinet, the dustproof cover is arranged at the top of the cabinet, the side surface of the dustproof cover is provided with a ventilation hole, and the ventilation hole is arranged on the side surface of the dustproof cover. The water pump is installed above the case, the heat dissipation pipeline is installed on the right side of the water pump, the heat conduction pipe is installed on the outer ring of the heat dissipation pipeline, the semiconductor cooling fins are installed on the left side of the heat conduction pipe, the cooling fins are arranged on the left side of the semiconductor cooling fins, the cooling fan is installed on the left side of the cooling fins, and the heat conduction plate is arranged below the heat conduction pipe. According to the equipment, the adjusting button is slidably connected to the midpoint position of the loading and unloading grip, pressure is applied to the extrusion sliding block to enable the extrusion sliding block to slide outwards, the driving connecting rod is pushed to contract the limiting bolt, and a quick-release structure can be formed.

Description

Technical Field

[0001] The utility model relates to the technical field of UPS power supplies, in particular to a modular high-power UPS power supply. Background Art

[0002] UPS, or uninterruptible power supply, is an uninterruptible power supply with an energy storage device. It is mainly used to provide uninterruptible power supply to some equipment that has high requirements for power supply stability. When the mains input is normal, the UPS stabilizes the mains and supplies it to the load. At this time, the UPS is an AC voltage stabilizer, and it also charges the battery inside the machine; when the mains power is interrupted (power outage), the UPS immediately switches the DC power of the battery to the load through the inverter switching method to continue to supply 220V AC power to the load, so that the load maintains normal operation and protects the load software and hardware from damage. UPS equipment can usually provide protection against overvoltage or undervoltage, but the existing UPS power supply has some shortcomings, such as:

[0003] A UPS power supply described in Publication No. CN111601481B is provided with a shielding member capable of shielding the air inlet and the air outlet to prevent dust from entering the interior of the box. Although it can effectively prevent the entry of dust during use, it will affect the air intake and air outlet of the equipment, resulting in a reduced heat dissipation effect. In addition, the equipment is an integrated structure, resulting in cumbersome internal component replacement, and the UPS power supply requires regular maintenance, which increases the maintenance cost. Utility Model Content

[0004] The purpose of the utility model is to provide a modular high-power UPS power supply to solve the problem proposed in the above background technology that the equipment on the existing market is provided with a shielding member that can block the air inlet and outlet to prevent dust from entering the interior of the box. Although it can effectively prevent the entry of dust during use, it will affect the air intake and air outlet of the equipment, resulting in a reduced heat dissipation effect. In addition, the equipment is an integrated structure, which makes it cumbersome to replace internal components, and the UPS power supply requires regular maintenance, which increases the maintenance cost.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a modular high-power UPS power supply, including a shock-absorbing pad, a handle bracket, an adjustment button, a loading and unloading handle and a dust cover;

[0006] A chassis is installed above the shock-absorbing pad, a handle bracket is provided at the midline position of the chassis, and a dust cover is installed on the top of the chassis, ventilation holes are provided on the side of the dust cover, a water pump is installed above the chassis, a heat dissipation pipeline is installed on the right side of the water pump, a heat conducting pipe is installed on the outer ring of the heat dissipation pipeline, a semiconductor heat sink is installed on the left side of the heat conducting pipe, a heat dissipation fin is provided on the left side of the semiconductor heat sink, a heat dissipation fan is installed on the left side of the heat dissipation fin, a heat conducting plate is provided below the heat conducting pipe, a bearing block is provided on the right side of the heat conducting plate, a loading and unloading handle is installed on the left side of the bearing block, an adjustment button is installed at the midpoint of the loading and unloading handle, an extrusion slider is installed above the adjustment button, a driving connecting rod is installed above the extrusion slider, a spring is provided on the upper surface of the driving connecting rod, and a limiting bolt is installed on the right side of the driving connecting rod, and a fixing groove is provided on the inner side of the chassis.

[0007] As a preferred technical solution of the utility model, the four shock-absorbing pads are respectively fixedly connected to the top corners of the bottom of the chassis, and the shock-absorbing pads are set to be a rubber material with the same thickness as the chassis wall thickness;

[0008] By adopting the above technical solution, the device can provide sufficient shock-absorbing effect for the chassis and protect the device by setting the shock-absorbing pad to a rubber material with a thickness the same as the wall thickness of the chassis.

[0009] As a preferred technical solution of the utility model, the top of the chassis is fixedly connected to a dust cover, two diagonal surfaces of the dust cover are provided with ventilation holes, and a water pump in the dust cover is fixedly connected to the chassis, the water pump is driven by a built-in motor, and the right side of the water pump is fixedly connected to a heat dissipation pipeline;

[0010] By adopting the above technical solution, the device drives the water pump to operate through a built-in motor, which can reduce the noise generated by the device during use and make the device more compact.

[0011] As a preferred technical solution of the utility model, the heat dissipation pipeline forms a circulation pipeline through an S-shaped structure, and the heat dissipation pipeline runs through the heat conduction plate and connects the upper and lower heat conduction plates into one;

[0012] By adopting the above technical solution, the device forms a circulation pipeline through an S-shaped structure through the heat dissipation pipeline, and penetrates the heat conduction plate to connect the upper and lower parts of the heat conduction plate into one, which can fully contact with the hardware equipment and effectively improve the heat dissipation efficiency.

[0013] As a preferred technical solution of the utility model, a heat conducting pipe is set on the outer ring of the heat dissipation pipeline on the right side of the water pump, eight semiconductor heat sinks are evenly and fixedly connected to the left side of the heat conducting pipe, and the heat dissipation fins are fixedly connected to the left side of the semiconductor heat sink. Seven cooling fans on the side of the heat dissipation fins are fixedly connected to the chassis, and seven cooling fans at the ventilation hole position on the left side of the dust cover are evenly and fixedly connected to the upper surface of the chassis;

[0014] By adopting the above technical solution, the device can provide a strong heat dissipation effect for the heat dissipation fins by arranging seven cooling fans on the side of the heat dissipation fins and fixing them with the chassis. The heat pipe is cooled through the semiconductor heat sink to drive the cooling water in the heat dissipation pipeline to achieve the purpose of heat dissipation of the equipment. The seven cooling fans at the ventilation holes on the left side of the dust cover are evenly fixedly connected to the upper surface of the chassis to further increase the air circulation speed.

[0015] As a preferred technical solution of the utility model, a bearing block is sandwiched between the two heat conducting plates, the left side of the bearing block is fixedly connected to the loading and unloading handle, the loading and unloading handle is a hollow structure, and the midpoint of the loading and unloading handle is slidably connected to the adjustment button, the adjustment button is slidably connected to the extrusion slider up and down, the driving connecting rod above the extrusion slider is rotatably connected to the loading and unloading handle, the right side of the driving connecting rod is rotatably connected to the limit bolt, and the upper surface of the left side of the driving connecting rod is fixedly connected to the spring;

[0016] By adopting the above technical solution, the device slides the adjustment button at the midpoint of the loading and unloading handle, applies pressure to the extrusion slider to make it slide outward, and pushes the driving connecting rod to retract the limit bolt, thereby forming a quick-release structure.

[0017] As a preferred technical solution of the present utility model, fixing grooves are provided on the upper and lower inner walls of the chassis, and a handle bracket is fixedly connected to the midpoint of the outer side of the chassis.

[0018] By adopting the above technical solution, the device is fixedly connected to the handle bracket at the midpoint of the outer side of the chassis, which can improve the convenience of carrying the device during use and improve the maneuverability of the device.

[0019] Compared with the prior art, the beneficial effects of the utility model are:

[0020] 1. The device provides sufficient shock absorption effect for the chassis and protects the device by setting the shock-absorbing pad to rubber material with the same thickness as the chassis wall;

[0021] 2. The device uses a built-in motor to drive the water pump, which can reduce the noise generated by the device and make the device more compact;

[0022] 3. The device forms a circulation pipeline through an S-shaped structure through the heat dissipation pipeline, and penetrates the heat conduction plate to connect the upper and lower parts of the heat conduction plate into one, which can fully contact with the hardware equipment and effectively improve the heat dissipation efficiency;

[0023] 4. The device provides a strong heat dissipation effect for the heat dissipation fins by setting seven heat dissipation fans on the side of the heat dissipation fins and fixing them to the chassis. Then, the semiconductor heat sink is used to cool the heat pipe and drive the cooling water in the heat dissipation pipeline to achieve the purpose of heat dissipation of the device. The seven heat dissipation fans at the ventilation holes on the left side of the dust cover are evenly fixedly connected to the upper surface of the chassis to further increase the air circulation speed.

[0024] 5. The device slides and connects the adjustment button at the midpoint of the loading and unloading handle, applies pressure to the extrusion slider to make the extrusion slider slide outward, and pushes the driving connecting rod to retract the limit bolt, so as to form a quick-release structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a side view of the structure of the utility model;

[0026] Figure 2 This is a schematic diagram of the connection structure between the water pump and the heat dissipation pipeline of the utility model;

[0027] Figure 3 This is a schematic diagram of the side view structure of the heat conducting pipe of the utility model;

[0028] Figure 4 This is a schematic diagram of the connection structure between the heat dissipation pipeline and the heat conduction plate of the utility model;

[0029] Figure 5 This is a schematic diagram of the connection structure between the load-bearing block and the heat-conducting plate of the utility model;

[0030] Figure 6 This is a schematic diagram of the cross-sectional side view of the loading and unloading handle of the utility model;

[0031] Figure 7 This is a front view of the cross-section structure of the loading and unloading handle of the utility model;

[0032] Figure 8 It is a side view structural schematic diagram of the handle bracket of the utility model.

[0033] In the figure: 1. shock-absorbing pad; 2. handle bracket; 3. adjustment button; 4. loading and unloading handle; 5. ventilation hole; 6. chassis; 7. bearing block; 8. cooling fan; 9. heat pipe; 10. semiconductor heat sink; 11. cooling fins; 12. water pump; 13. heat conduction plate; 14. limit bolt; 15. heat dissipation pipeline; 16. driving connecting rod; 17. extrusion slider; 18. spring; 19. fixing groove; 20. dust cover. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0035] See also Figure 1-8 The technical solution of the utility model is as follows: a modular high-power UPS power supply, including a shock-absorbing pad 1, a handle bracket 2, an adjustment button 3, a loading and unloading handle 4, a ventilation hole 5, a chassis 6, a bearing block 7, a cooling fan 8, a heat pipe 9, a semiconductor heat sink 10, a heat sink fin 11, a water pump 12, a heat conduction plate 13, a limit bolt 14, a heat dissipation pipeline 15, a driving connecting rod 16, an extrusion slider 17, a spring 18, a fixing groove 19 and a dust cover 20;

[0036] A chassis 6 is installed above the shock-absorbing pad 1, and a handle bracket 2 is provided at the midline position of the chassis 6. Four shock-absorbing pads 1 are fixedly connected to the top corners of the bottom of the chassis 6 respectively, and the shock-absorbing pad 1 is set to a rubber material with the same thickness as the wall thickness of the chassis 6. The device provides sufficient shock-absorbing effect for the chassis 6 and provides protection for the device by setting the shock-absorbing pad 1 to a rubber material with the same thickness as the wall thickness of the chassis 6. A dust cover 20 is installed on the top of the chassis 6, and ventilation holes 5 are provided on the side of the dust cover 20. A water pump 12 is installed above the chassis 6, and a heat dissipation pipeline 15 is installed on the right side of the water pump 12. The dust cover 20 is fixedly connected to the top of the chassis 6, and ventilation holes 5 are provided on two diagonal surfaces of the dust cover 20. The water pump 12 in the dust cover 20 is fixedly connected to the chassis 6, and the water pump 12 adopts a built-in The device is driven by a motor, and a heat dissipation pipeline 15 is fixedly connected to the right side of the water pump 12. The device drives the water pump 12 to operate through a built-in motor, which can reduce the noise generated by the device during use and make the device more compact. A heat pipe 9 is installed on the outer ring of the heat dissipation pipeline 15, a semiconductor heat sink 10 is installed on the left side of the heat pipe 9, a heat dissipation fin 11 is arranged on the left side of the semiconductor heat sink 10, and a heat dissipation fan 8 is installed on the left side of the heat dissipation fin 11. The heat dissipation pipeline 15 forms a circulation pipeline through an S-shaped structure, and the heat dissipation pipeline 15 passes through the heat conducting plate 13 and connects the upper and lower parts of the heat conducting plate 13 as a whole. The device forms a circulation pipeline through the heat dissipation pipeline 15 through the S-shaped structure, and passes through the heat conducting plate 13 to connect the upper and lower parts of the heat conducting plate 13 as a whole, which can be fully connected with the heat dissipation pipeline 15. Hardware equipment contact, effectively improve the heat dissipation efficiency, a heat conducting plate 13 is arranged under the heat conducting pipe 9, a bearing block 7 is arranged on the right side of the heat conducting plate 13, a loading and unloading handle 4 is installed on the left side of the bearing block 7, and an adjustment button 3 is installed at the midpoint of the loading and unloading handle 4. The heat conducting pipe 9 is set on the outer ring of the heat dissipation pipeline 15 on the right side of the water pump 12, and eight semiconductor heat sinks 10 are evenly fixedly connected to the left side of the heat conducting pipe 9. The semiconductor heat sink 10 is fixedly connected to the heat dissipation fin 11 on the left side. Seven cooling fans 8 on the side of the heat dissipation fin 11 are fixedly connected to the chassis 6, and seven cooling fans 8 at the position of the ventilation hole 5 on the left side of the dust cover 20 are evenly fixedly connected to the upper surface of the chassis 6. The device can provide strong heat dissipation for the heat dissipation fin 11 by arranging seven cooling fans 8 on the side of the heat dissipation fin 11 and fixing them to the chassis 6. The heat dissipation effect is achieved, and then the semiconductor heat sink 10 is used to cool the heat pipe 9 to drive the cooling water in the heat dissipation pipeline 15 to achieve the purpose of equipment heat dissipation. The seven cooling fans 8 at the ventilation hole 5 on the left side of the dust cover 20 are evenly fixedly connected to the upper surface of the chassis 6 to further improve the air circulation speed. An extrusion slider 17 is installed above the adjustment button 3, and a driving connecting rod 16 is installed above the extrusion slider 17. A spring 18 is provided on the upper surface of the driving connecting rod 16, and a limited position bolt 14 is installed on the right side of the driving connecting rod 16. A bearing block 7 is sandwiched between the two heat conducting plates 13. The left side of the bearing block 7 is fixedly connected to the loading and unloading handle 4. The loading and unloading handle 4 is a hollow structure, and the midpoint of the loading and unloading handle 4 is slidably connected to the adjusting button 3, and the adjusting button 3 is slidably connected to the extrusion slider 17 up and down.The driving connecting rod 16 above the extrusion slider 17 is rotatably connected to the loading and unloading handle 4, the right side of the driving connecting rod 16 is rotatably connected to the limit bolt 14, and the upper surface of the left side of the driving connecting rod 16 is fixedly connected to the spring 18. The device slides and connects the adjustment button 3 at the midpoint of the loading and unloading handle 4, applies pressure to the extrusion slider 17 to make the extrusion slider 17 slide outward, and pushes the driving connecting rod 16 to shrink the limit bolt 14, so that a quick-release structure can be formed. A fixing groove 19 is provided on the inner side of the chassis 6, and the fixing groove 19 is provided on the upper and lower inner walls of the chassis 6, and the handle bracket 2 is fixedly connected to the midpoint of the outer side of the chassis 6. The device is fixedly connected to the handle bracket 2 at the midpoint of the outer side of the chassis 6, which can improve the convenience of carrying the device during use and improve the mobility of the device.

[0037] Working principle: When using this modular high-power UPS power supply, first weld the motherboard, battery and other components to the right side of the supporting block 7, then hold the loading and unloading handle 4 and press the adjustment button 3 at the same time, the adjustment button 3 applies pressure to the extrusion slider 17 to make the extrusion slider 17 slide outward, and push the driving connecting rod 16 to retract the limit bolt 14, so that the extrusion slider 17 can be easily inserted into the chassis 6, release the loading and unloading handle 4 and the adjustment button 3, and under the action of the internal spring 18, the limit bolt 14 pops out again and engages with the fixed groove 19 on the inner side of the chassis 6, then connect the power supply cable, start the equipment, and the water pump 12 and the cooling fan 8 above the chassis 6 start to run, and the heat is dissipated for the semiconductor heat sink 10 under the action of the heat sink fins 11, and the cooling surface of the semiconductor heat sink 10 is cooled by the heat pipe 9, so that the temperature of the cooling water flowing through the heat dissipation pipeline 15 drops, and the heat is dissipated for the entire device along with the heat conduction plate 13.

[0038] Thereby completing a series of tasks, the contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field.

[0039] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A modular high-power UPS power supply, comprising a shock-absorbing pad (1), a handle bracket (2), an adjustment button (3), a loading and unloading handle (4) and a dust cover (20), characterized in that: A chassis (6) is installed above the shock-absorbing pad (1), a handle bracket (2) is provided at the midline position of the chassis (6), a dust cover (20) is installed on the top of the chassis (6), a ventilation hole (5) is provided on the side of the dust cover (20), a water pump (12) is installed above the chassis (6), a heat dissipation pipeline (15) is installed on the right side of the water pump (12), a heat conduction pipe (9) is installed on the outer ring of the heat dissipation pipeline (15), a semiconductor heat sink (10) is installed on the left side of the heat conduction pipe (9), a heat dissipation fin (11) is provided on the left side of the semiconductor heat sink (10), and a heat dissipation fin (11) is installed on the left side of the heat dissipation fin (11). A heat dissipation fan (8) is provided, a heat conduction plate (13) is provided below the heat conduction pipe (9), a bearing block (7) is provided on the right side of the heat conduction plate (13), a loading and unloading handle (4) is installed on the left side of the bearing block (7), an adjustment button (3) is installed at the midpoint of the loading and unloading handle (4), an extrusion slider (17) is installed above the adjustment button (3), a driving connecting rod (16) is installed above the extrusion slider (17), a spring (18) is provided on the upper surface of the driving connecting rod (16), and a limit bolt (14) is installed on the right side of the driving connecting rod (16), and a fixing groove (19) is provided on the inner side of the chassis (6).

2. A modular high power UPS power supply according to claim 1, characterized in that: The four shock-absorbing pads (1) are respectively fixedly connected to the top corners of the bottom of the chassis (6), and the shock-absorbing pads (1) are made of a rubber material with a thickness that is the same as the wall thickness of the chassis (6).

3. A modular high power UPS power supply according to claim 2, characterized in that: The top of the chassis (6) is fixedly connected to a dust cover (20), two diagonal surfaces of the dust cover (20) are provided with ventilation holes (5), and a water pump (12) in the dust cover (20) is fixedly connected to the chassis (6), the water pump (12) is driven by a built-in motor, and the right side of the water pump (12) is fixedly connected to a heat dissipation pipeline (15).

4. A modular high power UPS power supply according to claim 3, characterized in that: The heat dissipation pipeline (15) forms a circulation pipeline through an S-shaped structure, and the heat dissipation pipeline (15) penetrates the heat conduction plate (13) and connects the upper and lower parts of the heat conduction plate (13) into one body.

5. A modular high power UPS power supply according to claim 4, characterized in that: The outer ring of the heat dissipation pipeline (15) on the right side of the water pump (12) is equipped with a heat conducting pipe (9); the left side of the heat conducting pipe (9) is evenly and fixedly connected to eight semiconductor heat sinks (10); the left side of the semiconductor heat sink (10) is fixedly connected to a heat dissipation fin (11); seven heat dissipation fans (8) on the side of the heat dissipation fin (11) are fixedly connected to the chassis (6); and the seven heat dissipation fans (8) at the position of the ventilation hole (5) on the left side of the dust cover (20) are evenly and fixedly connected to the upper surface of the chassis (6).

6. A modular high power UPS power supply according to claim 5, characterized in that: A bearing block (7) is sandwiched between the two heat conducting plates (13); the left side of the bearing block (7) is fixedly connected to the loading and unloading handle (4); the loading and unloading handle (4) is a hollow structure, and the midpoint of the loading and unloading handle (4) is slidably connected to the adjusting button (3); the adjusting button (3) is slidably connected to the extrusion slider (17) above and below; the driving connecting rod (16) above the extrusion slider (17) is rotatably connected to the loading and unloading handle (4); the right side of the driving connecting rod (16) is rotatably connected to the limit bolt (14), and the upper surface of the left side of the driving connecting rod (16) is fixedly connected to the spring (18).

7. A modular high power UPS power supply according to claim 6, characterized in that: The upper and lower inner walls of the chassis (6) are both provided with fixing grooves (19), and the midpoint of the outer side of the chassis (6) is fixedly connected to the handle bracket (2).

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