Silicon wafer cleaning and drying device
By introducing an ultrasonic cleaning tank and a transfer mechanism into the silicon wafer cleaning and drying device, the problem of ineffective flushing of the silicon wafer clamping in the prior art is solved, and efficient silicon wafer cleaning and continuous drying process is achieved, and the working efficiency of the equipment is improved.
Patent Information
- Application Number
- CN202422196301.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-09
- Publication Date
- 2025-05-13
- Estimated Expiration
- 2034-09-09
AI Technical Summary
During cleaning, the existing silicon wafer cleaning and drying device is in a clamped state, so that the clamped area cannot be effectively flushed, resulting in contamination and impurities residues, which will affect the cleaning effect. It also requires two cleaning and drying, resulting in low working efficiency.
A silicon wafer cleaning and drying device including an ultrasonic cleaning tank and a transfer mechanism is designed. The silicon wafer is cleaned through the ultrasonic cleaning tank, and the silicon wafer is transported from the cleaning tank to the drying chamber by using the transfer mechanism to realize a continuous cleaning and drying process, avoiding the impact on the cleaning operation of the next group of silicon wafers.
Through the use of ultrasonic cleaning tanks, the cleaning time of silicon wafers is significantly reduced, the cleaning efficiency is improved, and the overall working efficiency of the equipment is improved through continuous cleaning and drying processes.
Smart Images
Figure CN222856165U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of silicon wafer cleaning, in particular to a silicon wafer cleaning and drying device. Background Art
[0002] In the production of semiconductor devices, silicon wafers must be strictly cleaned. Even trace contamination can cause device failure. The purpose of cleaning is to remove surface contamination and impurities. When cleaning silicon wafers, existing silicon wafer cleaning and drying devices need to first clamp and fix the silicon wafers through a clamping mechanism, and then rinse them through a nozzle to remove contamination and impurities on the surface of the silicon wafers. However, when rinsing the clamped silicon wafers, since the silicon wafers are in a clamped state, the clamping part of the silicon wafer cannot be effectively rinsed, resulting in contamination and impurities remaining at the clamping part of the silicon wafer, which in turn makes the silicon wafer cleaning effect poor.
[0003] CN 220177796 U discloses a silicon wafer cleaning and drying device, comprising a box, a flushing assembly is arranged inside the box, a driving motor is fixedly connected to the top of the box, a rotating shaft is fixedly connected to the output end of the driving motor, an L-shaped plate is fixedly connected to the other end of the rotating shaft, and a bidirectional electric telescopic rod is fixedly connected to one side of the L-shaped plate. In the above silicon wafer cleaning and drying device, after the lower clamping assembly fixes and clamps the lower part of the silicon wafer, the upper part of the silicon wafer can be flushed by the flushing assembly, and after the flushing of the upper part of the silicon wafer is completed, the flushed part of the upper part of the silicon wafer can be fixedly clamped by the upper clamping assembly, so that the fixed clamping of the lower part of the silicon wafer can be released, so as to avoid the lower clamping assembly blocking the silicon wafer, and then the clamping part of the lower part of the silicon wafer can be flushed, so as to avoid the clamping part of the silicon wafer not being flushed and having contamination and impurities remaining, thereby improving the flushing quality of the silicon wafer.
[0004] However, the above-mentioned silicon wafer cleaning device needs to clean the silicon wafers twice, resulting in a long cleaning time for the silicon wafers. In addition, the silicon wafers need to be dried inside the device after cleaning. The next group of silicon wafers can only be cleaned after the drying is completed, which results in low overall working efficiency of the equipment. Utility Model Content
[0005] In order to overcome the above-mentioned defects existing in the prior art, the utility model provides a silicon wafer cleaning and drying device.
[0006] The technical solution adopted by the utility model to solve its technical problems is: a silicon wafer cleaning and drying device, including an ultrasonic cleaning pool, a first conveyor belt and a second conveyor belt are respectively provided on both sides of the ultrasonic cleaning pool, a silicon wafer fixing frame is placed on the first conveyor belt, a drying cabin is provided in the travel direction of the second conveyor belt, the drying cabin is used to dry the silicon wafers transported on the second conveyor belt, and a transfer mechanism is provided above the ultrasonic cleaning pool, the transfer mechanism is used to transport the silicon wafer fixing frame.
[0007] Furthermore, the transfer mechanism includes two groups of gantries, which are respectively located at one end of the first conveyor belt and the second conveyor belt close to the ultrasonic cleaning tank, a lead screw is provided between the two groups of gantries, bearing seats are rotatably installed at both ends of the lead screw, and the two groups of bearing seats are respectively fixedly installed on the gantries, a lead screw nut is cooperated with the lead screw, and the lead screw nut is fixedly installed on the mounting plate, a slide is fixedly installed at the front and rear ends of the mounting plate, a light rod is slidably installed on the slide, and both ends of the light rod are fixedly connected to the gantry, a servo motor is fixedly installed on the gantry on either side of the left or right, and a power output shaft of the servo motor is connected to the rotating shaft of the lead screw.
[0008] Furthermore, a first support plate is fixedly installed at the front and rear ends of the bottom of the mounting plate, a plurality of groups of guide rods are fixedly installed on one side of the first support plate close to the middle of the mounting plate, a second support plate is fixedly installed on the other end of the guide rod, the second support plate is fixedly installed on the mounting plate, a clamping claw is movably installed on the guide rod, a first cylinder is fixedly installed on the two groups of the first support plates, and the power output end of the first cylinder is connected to the clamping claw.
[0009] Furthermore, a support base is slidably mounted on the bottom end of the gantry, the support base is fixedly mounted on the ground, a second cylinder is fixedly mounted on the side wall of the support base, and a power output end of the second cylinder is fixedly connected to the gantry.
[0010] Furthermore, a baffle is fixedly installed at one end of the first conveyor belt close to the ultrasonic cleaning tank.
[0011] Furthermore, a plurality of groups of fixing blocks are fixedly installed on the inner side of the silicon wafer fixing frame. The plurality of groups of fixing blocks are evenly arranged in an array on the silicon wafer fixing frame. The fixing blocks are fixedly installed on the left and right inner walls and the bottom wall of the silicon wafer fixing frame.
[0012] Furthermore, a plurality of groups of air outlets are fixedly mounted on the top inner wall of the drying chamber, a hot air blower is fixedly mounted on the top of the drying chamber, an air supply pipe is fixedly mounted at the air outlet of the hot air blower, and the air supply pipe is connected to each group of air outlets.
[0013] The beneficial effect of the utility model is that the design of the utility model is designed by respectively providing a first conveyor belt and a second conveyor belt on both sides of the ultrasonic cleaning tank, the ultrasonic cleaning tank is filled with cleaning liquid, the transfer mechanism transfers the silicon wafer fixing frame on the first conveyor belt to the ultrasonic cleaning tank, and the silicon wafer is cleaned under the action of ultrasonic waves, and after the cleaning is completed, the transfer mechanism transfers the silicon wafer fixing frame to the second conveyor belt, and the second conveyor belt conveys the silicon wafer to the drying cabin for drying, and at the same time the transfer mechanism is reset to carry out the cleaning operation of the next group of silicon wafers, so the cleaning operation of the next group of silicon wafers will not be affected during drying, and the cleaning of the silicon wafers by the ultrasonic cleaning tank can effectively reduce the time used for cleaning the silicon wafers, thereby improving the working efficiency of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] The utility model is further described below in conjunction with the accompanying drawings and embodiments.
[0015] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;
[0016] Figure 2 It is the front view of the utility model;
[0017] Figure 3 It is a left view of the utility model;
[0018] Figure 4 for Figure 3 Schematic diagram of the cross-sectional structure in the AA direction;
[0019] Figure 5 It is a structural schematic diagram of the transfer mechanism of the utility model.
[0020] In the figure: 1. ultrasonic cleaning tank, 2. first conveyor belt, 3. second conveyor belt, 4. silicon wafer fixing frame, 5. drying chamber, 6. gantry, 7. lead screw, 8. bearing seat, 9. lead screw nut, 10. mounting plate, 11. slide seat, 12. polished rod, 13. servo motor, 14. first support plate, 15. guide rod, 16. second support plate, 17. clamping claw, 18. first cylinder, 19. support seat, 20. second cylinder, 21. baffle, 22. fixing block, 23. air outlet, 24. hot air blower, 25. air pipe. DETAILED DESCRIPTION
[0021] In order to more clearly illustrate the technical solution of the utility model, the utility model is further described below in conjunction with the accompanying drawings. Obviously, the accompanying drawings described below are only one embodiment of the utility model. For ordinary technicians in this field, without paying any creative work, other embodiments can be obtained based on this drawing and embodiment, which all belong to the protection scope of the utility model.
[0022] according to Figure 1-5 As shown, a silicon wafer cleaning and drying device comprises an ultrasonic cleaning pool 1, a first conveyor belt 2 and a second conveyor belt 3 are respectively provided on both sides of the ultrasonic cleaning pool 1, a silicon wafer fixing frame 4 is placed on the first conveyor belt 2, a drying cabin 5 is provided in the traveling direction of the second conveyor belt 3, the drying cabin 5 is used to dry the silicon wafers transported on the second conveyor belt 3, and a transfer mechanism is provided above the ultrasonic cleaning pool 1, the transfer mechanism is used to transport the silicon wafer fixing frame 4.
[0023] In this embodiment, the transfer mechanism includes two groups of gantries 6, and the two groups of gantries 6 are respectively located at one end of the first conveyor belt 2 and the second conveyor belt 3 close to the ultrasonic cleaning tank 1. A lead screw 7 is provided between the two groups of gantries 6, and bearing seats 8 are rotatably installed at both ends of the lead screw 7. The two groups of bearing seats 8 are respectively fixedly installed on the gantry 6, and a lead screw nut 9 is installed on the lead screw 7. The lead screw nut 9 is fixedly installed on the mounting plate 10. A slide seat 11 is fixedly installed at the front and rear ends of the mounting plate 10, and a light rod 12 is slidably installed on the slide seat 11. The two ends of the light rod 12 are fixedly connected to the gantry 6 through a fixed seat, and a servo motor 13 is fixedly installed on the gantry 6 on either side of the left or right side. The power output shaft of the servo motor 13 is connected to the rotating shaft of the lead screw 7 through a coupling, and the lead screw 7 is driven to rotate by the servo motor 13, and the mounting plate 10 slides along the light rod 12 under the cooperation of the lead screw 7 and the lead screw nut 9.
[0024] In this embodiment, a first support plate 14 is fixedly installed at the front and rear ends of the bottom of the mounting plate 10, and a plurality of groups of guide rods 15 are fixedly installed on one side of the first support plate 14 close to the middle of the mounting plate 10. Preferably, the number of guide rods 15 is two groups, and a second support plate 16 is fixedly installed at the other end of the guide rod 15, and the second support plate 16 is fixedly installed on the mounting plate 10. A clamping claw 17 is movably installed on the guide rod 15, and a first cylinder 18 is fixedly installed on the two groups of the first support plates 14, and the power output end of the first cylinder 18 is connected to the clamping claw 17. Driven by the first cylinder 18, the clamping claws 17 approach each other along the direction of the guide rod 15 to grab the silicon wafer fixing frame 4.
[0025] In this embodiment, a support base 19 is slidably installed at the bottom end of the gantry 6, and the support base 19 is fixedly installed on the ground. A second cylinder 20 is fixedly installed on the side wall of the support base 19, and the power output end of the second cylinder 20 is fixedly connected to the gantry 6. The gantry 6 is lifted from the support base 19 by the second cylinder 20, thereby cooperating with the clamp 17 to complete operations such as placing the silicon wafer fixing frame 4 into the ultrasonic cleaning tank 1 or taking it out of the ultrasonic cleaning tank 1.
[0026] In this embodiment, a baffle 21 is fixedly installed at one end of the first conveyor belt 2 close to the ultrasonic cleaning tank 1. The baffle 21 is used to limit the silicon wafer fixing frame 4 on the first conveyor belt 2. When the silicon wafer fixing frame 4 touches the baffle 21, it stops moving forward under the action of the baffle 21 to facilitate the gripping of the clamp 17.
[0027] In this embodiment, a plurality of groups of fixing blocks 22 are fixedly installed on the inner side of the silicon wafer fixing frame 4. The plurality of groups of fixing blocks 22 are evenly arranged in an array on the silicon wafer fixing frame 4. The fixing blocks 22 are fixedly installed on the inner walls and the bottom wall on the left and right sides of the silicon wafer fixing frame 4. The silicon wafer is positioned at three points by the fixing blocks 22.
[0028] In this embodiment, a plurality of groups of air outlets 23 are fixedly installed on the inner wall at the top of the drying chamber 5, a hot air blower 24 is fixedly installed on the top of the drying chamber 5, an air pipe 25 is fixedly installed at the air outlet of the hot air blower 24, and the air pipe 25 is connected to each group of air outlets 23. Hot air is generated by the hot air blower 24 and transported to the air outlet 23 through the air pipe 25. The hot air is discharged from the air outlet 23 to the interior of the drying chamber 5, thereby drying the silicon wafers passing through the drying chamber 5.
[0029] When the utility model is in use, firstly, the silicon wafer holder 4 storing the silicon wafers is placed on the first conveyor belt 2, and the first conveyor belt 2 conveys the silicon wafer holder 4 toward the ultrasonic cleaning tank 1. When the silicon wafer holder 4 moves to the baffle 21, the gantry 6 is driven by the second cylinder 20 to descend, and then the first cylinder 18 drives the clamp 17 to grab the silicon wafer holder 4. After the grabbing is completed, the second cylinder 20 drives the gantry 6 to rise, and then the servo motor 13 drives the mounting plate 10 to move to the top of the ultrasonic cleaning tank 1. The ultrasonic cleaning tank 1 is filled with cleaning liquid, and the gantry 6 descends to immerse the silicon wafer holder 4 in the cleaning liquid, and the silicon wafer is cleaned under the action of ultrasonic waves. After the cleaning is completed The rear gantry 6 rises, and the servo motor 13 continues to drive the mounting plate 10 to move above the second conveyor frame 3. Then the gantry 6 descends to place the silicon wafer fixing frame 4 on the second conveyor belt 3. The second conveyor belt 3 transports the silicon wafer fixing frame 4 to the drying chamber 5, and the hot air is discharged from the air outlet 23 to the interior of the drying chamber 5, thereby drying the silicon wafers passing through the drying chamber 5. While drying, the mounting plate 10 is reset to the initial position to clean the next group of silicon wafers. Therefore, the cleaning operation of the next group of silicon wafers will not be affected during drying, and cleaning the silicon wafers by the ultrasonic cleaning tank 1 can effectively reduce the time used for cleaning the silicon wafers, thereby improving the working efficiency of the equipment.
[0030] The above embodiments are only exemplary embodiments of the present invention and are not intended to limit the present invention. The protection scope of the present invention is defined by the claims. Those skilled in the art may make various modifications or equivalent substitutions to the present invention within the essence and protection scope of the present invention, and such modifications or equivalent substitutions shall also be deemed to fall within the protection scope of the present invention.
Claims
1. A silicon wafer cleaning and drying device, characterized in that: The invention comprises an ultrasonic cleaning pool (1), wherein a first conveyor belt (2) and a second conveyor belt (3) are respectively arranged on both sides of the ultrasonic cleaning pool (1), a silicon wafer fixing frame (4) is placed on the first conveyor belt (2), a drying chamber (5) is arranged in the direction of travel of the second conveyor belt (3), the drying chamber (5) is used to dry the silicon wafers transported on the second conveyor belt (3), and a transfer mechanism is arranged above the ultrasonic cleaning pool (1), the transfer mechanism is used to transport the silicon wafer fixing frame (4).
2. A silicon wafer cleaning and drying device according to claim 1, characterized in that: The transfer mechanism comprises two groups of gantries (6), the two groups of gantries (6) are respectively located at one end of the first conveyor belt (2) and the second conveyor belt (3) close to the ultrasonic cleaning tank (1), a lead screw (7) is arranged between the two groups of gantries (6), the two ends of the lead screw (7) are rotatably mounted with bearing seats (8), the two groups of bearing seats (8) are respectively fixedly mounted on the gantry (6), a lead screw nut (9) is matched and mounted on the lead screw (7), the lead screw nut (9) is fixedly mounted on the mounting plate (10), a slide seat (11) is fixedly mounted on the front and rear ends of the mounting plate (10), a light rod (12) is slidably mounted on the slide seat (11), the two ends of the light rod (12) are fixedly connected to the gantry (6), a servo motor (13) is fixedly mounted on the gantry (6) on either side, and a power output shaft of the servo motor (13) is connected to the rotating shaft of the lead screw (7) with each other.
3. The silicon wafer cleaning and drying device according to claim 2, characterized in that: A first support plate (14) is fixedly mounted at both ends of the bottom of the mounting plate (10); a plurality of guide rods (15) are fixedly mounted on one side of the first support plate (14) close to the middle of the mounting plate (10); a second support plate (16) is fixedly mounted on the other end of the guide rod (15); the second support plate (16) is fixedly mounted on the mounting plate (10); a clamping claw (17) is movably mounted on the guide rod (15); a first cylinder (18) is fixedly mounted on the two groups of the first support plates (14); a power output end of the first cylinder (18) is connected to the clamping claw (17) with each other.
4. The silicon wafer cleaning and drying device according to claim 3, characterized in that: A support seat (19) is slidably mounted on the bottom end of the gantry (6), and the support seat (19) is fixedly mounted on the ground. A second cylinder (20) is fixedly mounted on the side wall of the support seat (19), and a power output end of the second cylinder (20) is fixedly connected to the gantry (6).
5. The silicon wafer cleaning and drying device according to claim 1, characterized in that: A baffle (21) is fixedly mounted on one end of the first conveyor belt (2) close to the ultrasonic cleaning tank (1).
6. The silicon wafer cleaning and drying device according to claim 1, characterized in that: A plurality of groups of fixing blocks (22) are fixedly mounted on the inner side of the silicon wafer fixing frame (4); the plurality of groups of fixing blocks (22) are evenly arranged in an array on the silicon wafer fixing frame (4); and the fixing blocks (22) are fixedly mounted on the left and right inner walls and the bottom wall of the silicon wafer fixing frame (4).
7. The silicon wafer cleaning and drying device according to claim 1, characterized in that: A plurality of groups of air outlets (23) are fixedly mounted on the inner wall of the top of the drying chamber (5), a hot air blower (24) is fixedly mounted on the top of the drying chamber (5), an air supply pipe (25) is fixedly mounted at the air outlet of the hot air blower (24), and the air supply pipe (25) is connected to each group of air outlets (23).