Ultrasonic cleaning machine for silicon chip substrate

Abstract

The utility model relates to the technical field of silicon chip substrates, and provides an ultrasonic cleaning machine for silicon chip substrates, which comprises an ultrasonic cleaning machine body, the outer wall of the bottom end of the ultrasonic cleaning machine body is fixedly connected with a plurality of support columns, a placing assembly is arranged in the ultrasonic cleaning machine body and used for placing the silicon chip substrates, and the support columns are fixedly connected with the ultrasonic cleaning machine body. A transmission assembly is arranged at the upper end of the placement assembly and used for driving the placement assembly to conduct transmission, a cleaning assembly is arranged below the placement assembly and used for cleaning a silicon chip substrate, and the placement assembly comprises a plurality of placement filter frames arranged in the ultrasonic cleaning machine body; a plurality of placing filter frames are vertically distributed in the ultrasonic cleaning machine body at equal intervals, a plurality of clamping holes are formed in the two sides of the top end of each placing filter frame, and the clamping holes are horizontally distributed in the top end of each placing filter frame at equal intervals, so that the contact area between a silicon chip substrate and a cleaning solution is increased; and the cleaning efficiency of the silicon chip substrate is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon chip substrates, and in particular to an ultrasonic cleaning machine for silicon chip substrates. Background Art

[0002] Silicon-based chips refer to integrated circuits of electronic components made using silicon as the material. This type of chip has the advantages of high integration, low power consumption, fast information processing speed, small size and low operating cost. Once silicon-based chips are embedded in devices, they will provide greater convenience for human life.

[0003] After searching, the existing patent (Announcement No.: CN218610747U) discloses an ultrasonic cleaning device for semiconductor chips, which belongs to the technical field of cleaning devices, including an ultrasonic cleaning machine, a filtering circulation component is arranged below the ultrasonic cleaning machine, a spray component is arranged above the ultrasonic cleaning machine, an electric push rod is arranged in the middle of the spray component, a convenient disassembly and assembly component is arranged at the output end of the electric push rod, a mesh frame is arranged below the convenient disassembly and assembly component, and a drying component is arranged on one side of the mesh frame. The utility model sets a filtering circulation component, so that when the device is in use, it is convenient to filter the cleaning liquid in the ultrasonic cleaning machine, and then circulate it to the spray component to perform secondary washing on the semiconductor chip. The utility model realizes the effect of convenient disassembly and assembly of the mesh frame for taking and placing the semiconductor chip by setting a convenient disassembly and assembly component, so that when the device is in use, it is convenient to disassemble and assemble the mesh frame to take and place the semiconductor chip, thereby improving the convenience of use. The above-mentioned utility model is convenient for users to take the chip by disassembling the mesh frame more conveniently, thereby improving the taking efficiency of the device, and at the same time improving the cleaning effect of the chip by secondary spraying of the chip. However, when cleaning the chip, the device places all the chips inside the mesh frame for cleaning, which may cause most of the chips to be stacked together, so that part of the area of ​​some chips cannot be well cleaned, causing some chips to still have stains on the surface, thereby reducing the overall quality of the chip. Utility Model Content

[0004] The utility model proposes an ultrasonic cleaning machine for silicon chip substrates, which solves the problem in the related art that all chips are placed inside a mesh frame for cleaning, which may cause most chips to be stacked together, resulting in part of the area of ​​some chips being unable to be well cleaned, causing some chips to still have stains on the surface, thereby reducing the overall quality of the chip.

[0005] The technical solution of the utility model is as follows: an ultrasonic cleaning machine for silicon chip substrates, comprising: an ultrasonic cleaning machine body, a plurality of pillars fixedly connected to the outer wall of the bottom end of the ultrasonic cleaning machine body, a placement component is arranged inside the ultrasonic cleaning machine body for placing silicon chip substrates, a transmission component is arranged at the upper end of the placement component for driving the placement component for transmission, and a cleaning component is arranged below the placement component for cleaning the silicon chip substrates.

[0006] The placement component includes a plurality of filter placement frames arranged inside the ultrasonic cleaning machine body, the plurality of filter placement frames are vertically equidistantly distributed inside the ultrasonic cleaning machine body, a plurality of engaging holes are opened on both sides of the top of each of the filter placement frames, and the plurality of engaging holes are horizontally equidistantly distributed on the top of the filter placement frames.

[0007] Preferably, the placement assembly also includes a plurality of locking rods fixedly connected to the outer walls on both sides of the bottom end of each filter frame, and the plurality of locking rods are horizontally equidistantly distributed on both sides of the bottom end of the filter frame. The number of the locking rods is consistent with the number of the locking holes and corresponds one to one.

[0008] Preferably, the placement assembly also includes a plurality of fixing blocks fixedly connected to the outer walls on both sides of each filter placement frame, and fixing bolts are arranged on both sides of the plurality of filter placement frames, the bottom end of each fixing bolt passes through the inner wall of the fixing block and is engaged with the inner wall, and a nut is threadedly connected to the outer wall of the bottom end of each fixing bolt.

[0009] Preferably, the placement component also includes a fixing ring fixedly connected to the front and rear outer walls of the topmost filter frame, and the bottom end of each filter frame is fixedly connected to a plurality of storage bottom frames, and the plurality of storage bottom frames are horizontally equidistantly distributed at the bottom end of the filter frame.

[0010] Preferably, the transmission assembly includes a motor fixedly connected to the outer wall of the right end of the ultrasonic cleaning machine body, the output end of the motor passes through the inner wall of the right end of the ultrasonic cleaning machine body and is fixedly connected to a screw rod, the outer wall of the screw rod is threadedly connected to a threaded sleeve, and the left end of the screw rod is rotatably connected to the inner wall of the left end of the ultrasonic cleaning machine body.

[0011] Preferably, the cleaning assembly also includes a connecting rod fixedly connected to the rear end outer wall of the threaded sleeve, the rear end outer wall of the connecting rod is fixedly connected to a slip ring, the inner wall of the slip ring is slidably connected to a sliding rod, both ends of the sliding rod are fixedly connected to the inner wall of the ultrasonic cleaning machine body, the outer walls on both sides of the bottom end of the connecting rod are fixedly connected to hydraulic rods, and the output ends of the two hydraulic rods are fixedly connected to limiting hooks.

[0012] Preferably, the cleaning component includes two ultrasonic cleaning pools fixedly connected to the inner wall of the bottom end of the left side of the ultrasonic cleaning machine body, the front ends of the two ultrasonic cleaning pools are connected to water inlet pipes, and the front ends of the two water inlet pipes pass through the front inner wall of the ultrasonic cleaning machine body and are fixedly connected thereto.

[0013] Preferably, the cleaning component also includes an outlet pipe connected to the bottom ends of the two ultrasonic cleaning pools, the bottom ends of the two water inlet pipes penetrate the bottom outer wall of the ultrasonic cleaning machine body and are installed with valves, the right end outer wall of the right ultrasonic cleaning pool is fixedly connected to a drying frame, and the outer wall of the drying frame is fixedly connected to the inner wall of the ultrasonic cleaning machine body.

[0014] The working principle and beneficial effects of the utility model are:

[0015] In the utility model, the silicon chip substrates are placed inside the storage bottom frame respectively, so that each silicon chip substrate is separated, so as to avoid all the chip substrates being piled together, thereby generating a cleaning dead corner, and then the silicon chip substrates are distributed layer by layer, and the space between each layer of silicon chip substrates is increased, so that enough cleaning liquid enters the inside of the placement filter frame and cleans the silicon chip substrates, thereby increasing the contact area between the silicon chip substrate and the cleaning liquid, improving the cleaning efficiency of the silicon chip substrate, and at the same time, it is convenient for users to fix, and improves the user's taking efficiency, thereby improving the practical efficiency of the device; BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The utility model is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0017] Figure 1 This is a front view structural schematic diagram of the utility model;

[0018] Figure 2 This is a rear view structural schematic diagram of the utility model;

[0019] Figure 3 This is a partial structural diagram of the transmission assembly proposed in the utility model;

[0020] Figure 4 This is a schematic diagram of the expanded structure of the placement component proposed in the utility model;

[0021] Figure 5 This is a schematic diagram of the structure of the placement component part proposed by the utility model;

[0022] Figure 6 The utility model proposed Figure 3 The enlarged structural diagram at A in the middle;

[0023] In the figure: 1. ultrasonic cleaning machine body; 2. pillar; 3. placement component; 301. filter frame; 302. bottom frame; 303. snap-in hole; 304. snap-in rod; 305. fixing block; 306. fixing bolt; 307. nut; 308. fixing ring; 4. transmission component; 401. motor; 402. screw rod; 403. threaded sleeve; 404. connecting rod; 405. slip ring; 406. slide rod; 407. hydraulic rod; 408. limit hook; 5. cleaning component; 501. ultrasonic cleaning tank; 502. water inlet pipe; 503. water outlet pipe; 504. valve; 505. drying frame. DETAILED DESCRIPTION

[0024] The following will be combined with the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] The present application embodiment discloses an ultrasonic cleaning machine for silicon chip substrates. Figure 1-Figure 6An ultrasonic cleaning machine for silicon chip substrates comprises: an ultrasonic cleaning machine body 1, a plurality of pillars 2 are fixedly connected to the outer wall of the bottom end of the ultrasonic cleaning machine body 1, a placing component 3 is arranged inside the ultrasonic cleaning machine body 1 for placing silicon chip substrates, a transmission component 4 is arranged at the upper end of the placing component 3 for driving the placing component 3 for transmission, a cleaning component 5 is arranged below the placing component 3 for cleaning the silicon chip substrates, the placing component 3 comprises a plurality of placing filter frames 301 arranged inside the ultrasonic cleaning machine body 1, and the plurality of placing filter frames 301 are vertically equidistantly distributed inside the ultrasonic cleaning machine body 1, A plurality of engaging holes 303 are provided on both sides of the top of each filter frame 301, and the plurality of engaging holes 303 are horizontally and equidistantly distributed on the top of the filter frame 301. The placement component 3 also includes a plurality of engaging rods 304 fixedly connected to the outer walls on both sides of the bottom of each filter frame 301, and the plurality of engaging rods 304 are horizontally and equidistantly distributed on both sides of the bottom of the filter frame 301. The number of engaging rods 304 is consistent with the number of engaging holes 303, and they correspond one to one. The placement component 3 also includes a plurality of fixing blocks 305 fixedly connected to the outer walls on both sides of each filter frame 301, and a plurality of fixing bolts 306 are provided on both sides of the filter frames 301. The bottom ends of the fixing bolts 306 penetrate the inner wall of the fixing block 305 and are snap-connected therewith, and the outer wall of the bottom end of each fixing bolt 306 is threadedly connected with a nut 307. The placement component 3 also includes a fixing ring 308 fixedly connected to the outer walls of the front and rear sides of the topmost placement filter frame 301, and the bottom end of each placement filter frame 301 is fixedly connected to a plurality of placement bottom frames 302, and the plurality of placement bottom frames 302 are horizontally equidistantly distributed at the bottom end of the placement filter frame 301. The snap-fit ​​rod 304 is snap-connected with the inner wall of the snap-fit ​​hole 303, and the inner wall of the placement filter frame 301 is provided with a plurality of small filter holes to facilitate the entry of the cleaning liquid into the placement filter frame 301. Inside, a plurality of small holes are provided on the inner wall of the storage bottom frame 302 at the bottom end of the filter frame 301, so that the cleaning liquid can enter the storage bottom frame 302 through the small holes inside the storage bottom frame 302 to clean the silicon chip substrate. At the same time, there is a large distance between the first storage bottom frame 302 at the bottom end of the filter frame 301 and the next storage bottom frame 302 at the bottom end of the filter frame 301, so that the space between every two storage bottom frames 302 is large enough, so that the cleaning liquid can enter the storage bottom frame 302 and clean each surface of the silicon chip substrate inside the storage bottom frame 302, thereby improving the cleaning efficiency of the silicon chip substrate.

[0026] See also Figure 1 , Figure 3 and Figure 6The transmission assembly 4 includes a motor 401 fixedly connected to the outer wall of the right end of the ultrasonic cleaning machine body 1, the output end of the motor 401 passes through the inner wall of the right end of the ultrasonic cleaning machine body 1 and is fixedly connected to a screw rod 402, the outer wall of the screw rod 402 is threadedly connected to a threaded sleeve 403, and the left end of the screw rod 402 is rotatably connected to the inner wall of the left end of the ultrasonic cleaning machine body 1. The cleaning assembly 5 also includes a connecting rod 404 fixedly connected to the outer wall of the rear end of the threaded sleeve 403, the outer wall of the rear end of the connecting rod 404 is fixedly connected to a slip ring 405, and the inner wall of the slip ring 405 is slidably connected to a slide rod 406, and both ends of the slide rod 406 are connected to the ultrasonic The inner wall of the cleaning machine body 1 is fixedly connected, and the outer walls on both sides of the bottom end of the connecting rod 404 are fixedly connected with hydraulic rods 407. The output ends of the two hydraulic rods 407 are fixedly connected with limit hooks 408. When the screw rod 402 rotates, the threaded sleeve 403 is driven to rotate by the screw rod 402, and the connecting rod 404 is driven to transmit by the threaded sleeve 403, and the slip ring 405 is driven by the connecting rod 404 to transmit. Because the slip ring 405 is restricted on the sliding rod 406, the connecting rod 404 moves to the left or right under the drive of the threaded sleeve 403, thereby driving the slip ring 405 to slide to the left or right on the sliding rod 406.

[0027] See also Figure 1-Figure 3 and Figure 6, the cleaning component 5 includes two ultrasonic cleaning pools 501 fixedly connected to the inner wall of the bottom end of the left side of the ultrasonic cleaning machine body 1, the front ends of the two ultrasonic cleaning pools 501 are connected with water inlet pipes 502, the front ends of the two water inlet pipes 502 penetrate the front end inner wall of the ultrasonic cleaning machine body 1 and are fixedly connected thereto, the cleaning component 5 also includes a water outlet pipe 503 connected to the bottom ends of the two ultrasonic cleaning pools 501, the bottom ends of the two water inlet pipes 502 penetrate the bottom end outer wall of the ultrasonic cleaning machine body 1 and are installed with valves 504, the right end outer wall of the right ultrasonic cleaning pool 501 is fixedly connected with a drying frame 505, the outer wall of the drying frame 505 is fixedly connected to the inner wall of the ultrasonic cleaning machine body 1, when the filter frame 301 combination is placed in the first ultrasonic cleaning pool 501 on the left and the cleaning is completed, the valve 504 is opened to discharge the cleaning liquid through the water outlet pipe 503, the hydraulic rod 407 is started, the filter frame 301 combination is moved out of the first ultrasonic cleaning pool 501, and then the second ultrasonic cleaning pool 501 is discharged through the second water inlet pipe 502. The cleaning liquid is introduced into the cleaning tank 501. At this time, the motor 401 is started again, so that the output end of the motor 401 drives the screw rod 402 to move in the opposite direction, so that the filter frame 301 assembly is moved to the top of the second ultrasonic cleaning tank 501, and the hydraulic rod 407 is started again, so that the output end of the hydraulic rod 407 drives the limit hook 408 to move downward, and the filter frame 301 assembly is driven to move downward through the limit hook 408, so that the filter frame 301 assembly enters the second ultrasonic cleaning tank 501 for secondary cleaning. After the secondary cleaning is completed, the valve 504 is opened to discharge the cleaning liquid in the second ultrasonic cleaning tank 501, and the hydraulic rod 407 is started to move the filter frame 301 assembly out of the second ultrasonic cleaning tank 501. The motor 401 is started again, so that the output end of the motor 401 continues to drive the screw rod 402 to rotate in the opposite direction, thereby driving the filter frame 301 assembly to move to the right, above the drying frame 505, and the hydraulic rod 407 is started again to dry the inside of the drying frame 505.

[0028] Working principle and use process: the silicon chip substrates to be cleaned are placed in turn inside the storage bottom frame 302 at the bottom of the filter frame 301, and then the locking rod 304 at the bottom of the first filter frame 301 is locked with the locking hole 303 at the top of the second filter frame 301, and all the filter frames 301 are locked in turn in the above manner, and then the fixing bolts 306 are passed through the fixing blocks 305 on the outside of each filter frame 301 in turn, and then the fixing blocks 305 and the fixing bolts 306 are fixed together by nuts 307, so that all the filter frames 301 are fixed together, and the assembled filter frames 301 are placed in the ultrasonic cleaning machine body 1, and the filter frame 301 combination is moved toward the seat, so that the fixing rings 308 on both sides of the top of the filter frame 301 combination are simultaneously sleeved on the limit hooks 408, and the motor 40 is started at this time. 1. The output end of the motor 401 drives the screw rod 402 to rotate, the screw rod 402 drives the threaded sleeve 403 to transmit, the threaded sleeve 403 drives the connecting rod 404 to transmit, the connecting rod 404 drives the hydraulic rod 407 to transmit to the left, the hydraulic rod 407 drives the limit hook 408 to move to the left, the limit hook 408 drives the filter frame 301 combination to move to the left to the top of the leftmost ultrasonic cleaning pool 501, and the hydraulic rod 407 is started, so that the output end of the hydraulic rod 407 drives the limit hook 408 to move downward, and the filter frame 301 combination is driven to move downward to the inside of the ultrasonic cleaning pool 501 through the limit hook 408, so that the cleaning liquid in the ultrasonic cleaning pool 501 covers the filter frame 301 combination, and then the ultrasonic cleaning pool 501 is started, so that the vibrating water waves in the ultrasonic cleaning pool 501 clean the silicon chip substrate.

[0029] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An ultrasonic cleaning machine for silicon chip substrates, comprising: An ultrasonic cleaning machine body (1), characterized in that a plurality of pillars (2) are fixedly connected to the outer wall of the bottom end of the ultrasonic cleaning machine body (1), a placement component (3) is arranged inside the ultrasonic cleaning machine body (1) for placing a silicon chip substrate, a transmission component (4) is arranged at the upper end of the placement component (3) for driving the placement component (3) to transmit, and a cleaning component (5) is arranged below the placement component (3) for cleaning the silicon chip substrate; The placement assembly (3) comprises a plurality of placement filter frames (301) arranged inside the ultrasonic cleaning machine body (1); the plurality of placement filter frames (301) are vertically equidistantly distributed inside the ultrasonic cleaning machine body (1); a plurality of snap-fit ​​holes (303) are provided on both sides of the top of each of the placement filter frames (301); and the plurality of snap-fit ​​holes (303) are horizontally equidistantly distributed on the top of the placement filter frames (301).

2. The ultrasonic cleaning machine for silicon chip substrate according to claim 1, characterized in that: The placement assembly (3) further comprises a plurality of engaging rods (304) fixedly connected to the outer walls on both sides of the bottom end of each placement filter frame (301); the plurality of engaging rods (304) are horizontally and equidistantly distributed on both sides of the bottom end of the placement filter frame (301); the number of the engaging rods (304) and the number of the engaging holes (303) are the same and correspond one to one.

3. The ultrasonic cleaning machine for silicon chip substrate according to claim 1, characterized in that: The placement assembly (3) further comprises a plurality of fixing blocks (305) fixedly connected to the outer walls on both sides of each placement filter frame (301), and fixing bolts (306) are arranged on both sides of the plurality of placement filter frames (301), and the bottom end of each fixing bolt (306) penetrates the inner wall of the fixing block (305) and is engaged therewith, and a nut (307) is threadedly connected to the outer wall of the bottom end of each fixing bolt (306).

4. The ultrasonic cleaning machine for silicon chip substrate according to claim 1, characterized in that: The placement assembly (3) further comprises a fixing ring (308) fixedly connected to the outer walls of the front and rear sides of the topmost placement filter frame (301), and the bottom end of each placement filter frame (301) is fixedly connected to a plurality of storage bottom frames (302), and the plurality of storage bottom frames (302) are horizontally equidistantly distributed at the bottom end of the placement filter frame (301).

5. The ultrasonic cleaning machine for silicon chip substrate according to claim 1, characterized in that: The transmission assembly (4) comprises a motor (401) fixedly connected to the outer wall of the right end of the ultrasonic cleaning machine body (1); the output end of the motor (401) passes through the inner wall of the right end of the ultrasonic cleaning machine body (1) and is fixedly connected to a screw rod (402); the outer wall of the screw rod (402) is threadedly connected to a threaded sleeve (403); and the left end of the screw rod (402) is rotatably connected to the inner wall of the left end of the ultrasonic cleaning machine body (1).

6. The ultrasonic cleaning machine for silicon chip substrate according to claim 5, characterized in that: The cleaning assembly (5) further comprises a connecting rod (404) fixedly connected to the rear end outer wall of the threaded sleeve (403); the rear end outer wall of the connecting rod (404) is fixedly connected to a slip ring (405); the inner wall of the slip ring (405) is slidably connected to a sliding rod (406); both ends of the sliding rod (406) are fixedly connected to the inner wall of the ultrasonic cleaning machine body (1); the outer walls on both sides of the bottom end of the connecting rod (404) are fixedly connected to hydraulic rods (407); and the output ends of the two hydraulic rods (407) are fixedly connected to limit hooks (408).

7. The ultrasonic cleaning machine for silicon chip substrate according to claim 1, characterized in that: The cleaning assembly (5) comprises two ultrasonic cleaning pools (501) fixedly connected to the inner wall of the left bottom end of the ultrasonic cleaning machine body (1); the front ends of the two ultrasonic cleaning pools (501) are connected to water inlet pipes (502); the front ends of the two water inlet pipes (502) penetrate the front inner wall of the ultrasonic cleaning machine body (1) and are fixedly connected thereto.

8. The ultrasonic cleaning machine for silicon chip substrate according to claim 7, characterized in that: The cleaning assembly (5) further comprises a water outlet pipe (503) connected to the bottom ends of the two ultrasonic cleaning pools (501); the bottom ends of the two water inlet pipes (502) penetrate the bottom outer wall of the ultrasonic cleaning machine body (1) and are provided with valves (504); the right outer wall of the right ultrasonic cleaning pool (501) is fixedly connected to a drying frame (505); the outer wall of the drying frame (505) is fixedly connected to the inner wall of the ultrasonic cleaning machine body (1).

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