Heat dissipation mechanism of laser

Abstract

The utility model relates to a heat dissipation mechanism of a laser, belongs to the field of lasers, and aims to solve the problems of difficulty in heat dissipation and low heat dissipation efficiency of existing lasers. The heat dissipation mechanism of the laser comprises a shell, a light-emitting assembly, a TEC refrigeration sheet, a base, a heat dissipation fan, a heat dissipation plate and a protection plate. Wherein the shell is provided with a containing cavity, the light-emitting assembly is used for emitting laser, the TEC refrigeration sheet is connected with the light-emitting assembly, one side of the fixing part of the base is fixedly connected with the TEC refrigeration sheet, the TEC refrigeration sheet is located between the fixing part and the light-emitting assembly, the cooling fan is connected with the shell and located at one end of the containing cavity, and the cooling plate is fixed to the other side of the fixing part. The heat dissipation plate is provided with a plurality of heat dissipation fins, a heat dissipation groove is formed between every two adjacent heat dissipation fins, an opening of each heat dissipation groove faces the heat dissipation fan, and the protection plate is fixedly connected with the heat dissipation fan. The laser is cooled through the cooling fan, the cooling plate and the TEC refrigeration sheet, the internal cooling efficiency of the laser is improved, and the cooling effect of the laser is further enhanced.

Description

Technical Field

[0001] The present application relates to the field of lasers, and in particular, to a heat dissipation mechanism of a laser. Background Art

[0002] Lasers are devices that can generate laser light based on stimulated radiation amplification and have important applications in many fields. The pump source and gain medium of the laser will generate heat when working. If the heat is not dissipated in time, the temperature inside the laser housing will continue to rise, which will increase the threshold current of the laser and reduce the output power. In severe cases, it will affect the life and performance of the device and accelerate the degradation of the device.

[0003] Existing lasers generally dissipate heat through heat dissipation holes opened on their surfaces during use. When heat continues to be generated, the heat is difficult to evaporate and will remain inside the laser housing, causing heat dissipation difficulties, which in turn affects the normal use of subsequent lasers. Therefore, improvements are needed. Utility Model Content

[0004] The purpose of the embodiments of the present application is to provide a heat dissipation mechanism for a laser to solve the problems of difficult heat dissipation and low heat dissipation efficiency of existing lasers.

[0005] In order to solve the above problems, the present application adopts the following technical solutions:

[0006] The present application provides a heat dissipation mechanism for a laser, comprising:

[0007] A housing having a receiving cavity;

[0008] A light emitting component, used for emitting laser;

[0009] TEC cooling sheet, connected to the light-emitting component;

[0010] A base, provided with a fixing portion, one side of which is fixedly connected to the TEC cooling sheet, wherein the base is located in the accommodating cavity, and the TEC cooling sheet is located between the fixing portion and the light-emitting component;

[0011] A cooling fan connected to the housing, the cooling fan being located at one end of the accommodating cavity;

[0012] A heat sink fixed to the other side of the fixing portion, the heat sink being provided with a plurality of heat sink fins, heat sink grooves being formed between adjacent heat sink fins, and openings of the heat sink grooves facing the heat sink fan;

[0013] A protective plate is fixedly connected to the cooling fan.

[0014] By adopting the above technical solution, the cooling fan emits cooling air through the cooling slot and blows it into the laser to perform air cooling. After power is turned on, the TEC cooling sheet is turned on based on the heat dissipation demand to dissipate heat for the light-emitting component. The light-emitting component is cooled by the TEC cooling sheet, the cooling fan and the heat dissipation plate, so that the heat inside the laser is effectively discharged, the heat dissipation efficiency is improved, and the heat dissipation problem of the laser is solved.

[0015] Furthermore, the heat sink is provided with a plurality of first fixing holes and second fixing holes, wherein the first fixing holes penetrate part of the heat sink fins, wherein the first fixing holes are used to fix the heat sink to the base, and the second fixing holes are used to fix the heat sink fan.

[0016] By adopting the above technical solution, the first fixing hole fixes the heat sink to the base. While the heat sink is cooled by air, it can also transfer temperature to achieve heat conduction, thereby not only fixing the heat sink to the base, but also improving the heat dissipation effect of the laser.

[0017] Furthermore, the heat dissipation plate and the fixing portion are both provided with a plurality of heat conduction holes, and adjacent heat conduction holes are arranged at equal intervals.

[0018] By adopting the above technical solution, when the cooling fan is running, the cooling air blown out passes through the heat conduction holes to dissipate the heat of the light-emitting component, thereby accelerating the heat dissipation efficiency of the light-emitting component and further enhancing the heat dissipation effect of the laser.

[0019] Furthermore, the heat conducting holes are arranged in a row in the same heat dissipation slot.

[0020] By adopting the above technical solution, the heat conducting holes are arranged in a row in the same heat dissipation slot, thereby increasing the heat dissipation flow, facilitating heat conduction, and improving the heat dissipation degree of the laser.

[0021] Furthermore, the light-emitting component includes a light-emitting part, a support and a fastener, the light-emitting part is respectively connected to the support and the TEC cooling plate, the support is provided with a fastening hole, the fixing part is provided with a fixing hole adapted to the fastening hole, and the fastener passes through the fastening hole and the fixing hole to clamp and fix the TEC cooling plate to the fixing part.

[0022] By adopting the above technical solution, the fastener clamps the TEC cooling plate to the fixing part, fixes the TEC cooling plate, enables the TEC cooling plate to work stably, improves the working efficiency of the TEC cooling plate, and is beneficial to cooling the light-emitting component and improving the heat dissipation efficiency.

[0023] Furthermore, the support and the top surface of the TEC cooling plate are flush, and the light emitting element is located on the top surface of the support and the TEC cooling plate.

[0024] Since the top surfaces of the support and the TEC cooling sheet are flush, the light-emitting component can be evenly arranged on the top surfaces of the support and the TEC cooling sheet, and the laser emitted by the light-emitting component is more conducive to subsequent operations such as transmission and focusing to meet the use requirements. At the same time, the TEC cooling sheet is in direct contact with the light-emitting component, directly cooling the light-emitting component and enhancing the cooling effect.

[0025] Furthermore, the protective plate is provided with a mounting hole and a ventilation hole, a plurality of the mounting hole rings are arranged around the ventilation hole, and the mounting holes are used to fix the protective plate and the cooling fan to the heat dissipation plate.

[0026] The protective plate and the cooling fan are fixed to the heat sink through the mounting holes, so that the protective plate, the cooling fan, the heat sink, the base and the shell form a whole, and the cooling fan is blown in through the ventilation holes of the protective plate, so that the cooling fan can operate normally, which is convenient for heat dissipation of the laser.

[0027] Furthermore, the shell is provided with a heat dissipation hole, and the heat dissipation hole is communicated with the accommodating cavity.

[0028] Since the shell is provided with the heat dissipation hole, and the heat dissipation hole is communicated with the accommodating cavity, the heat in the accommodating cavity can be discharged through the heat dissipation hole.

[0029] Furthermore, the heat dissipation hole is a waist hole.

[0030] By adopting the above technical solution, the heat dissipation hole is in the shape of a waist hole, which expands the heat dissipation area and improves the heat dissipation effect.

[0031] Furthermore, the shell is provided with a plurality of heat dissipation holes, and the plurality of heat dissipation holes are arranged at equal intervals.

[0032] Since the shell is provided with a plurality of heat dissipation holes, the heat dissipation effect of the laser is improved, and the plurality of heat dissipation holes are arranged at equal intervals, which is convenient for processing and simplifies the processing and manufacturing steps.

[0033] In summary, the present application includes at least one of the following beneficial technical effects:

[0034] 1. The cooling fan cools the laser, and the TEC cooling sheet dissipates the heat of the light-emitting components after working. The cooling fan, heat sink and TEC cooling sheet dissipate the heat of the laser, which improves the internal heat dissipation efficiency of the laser and enhances the heat dissipation effect of the laser.

[0035] 2. The heat sink and the fixing part are provided with multiple heat conduction holes, through which the heat inside the laser is discharged to improve the heat dissipation efficiency of the laser. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 A schematic diagram of the structure of a heat dissipation mechanism of a laser provided in an embodiment of the present application, wherein the housing is hidden;

[0037] Figure 2 A front view of a heat dissipation mechanism of a laser provided in an embodiment of the present application;

[0038] Figure 3 for Figure 2 Schematic diagram of the structure of the heat dissipation mechanism of the laser;

[0039] Figure 4 A schematic diagram of the structure of a base, a heat dissipation fan, a heat dissipation plate and a protective plate provided in an embodiment of the present application;

[0040] Figure 5 for Figure 4 Exploded view of the mid-base, cooling fan, heat sink, and protective plate;

[0041] Figure 6 An exploded diagram of a heat dissipation mechanism of a laser provided in an embodiment of the present application, wherein a working crystal, a light-emitting component and a TEC cooling sheet are hidden;

[0042] Figure 7 A schematic diagram of the structure of a heat sink provided in an embodiment of the present application; and

[0043] Figure 8 for Figure 7 Front view of the heat sink.

[0044] Description of reference numerals:

[0045] 1. Shell; 11. Accommodating cavity; 12. Heat dissipation hole;

[0046] 2. Light-emitting assembly; 21. Light-emitting member; 22. Support; 221. Fastening hole; 23. Fastener;

[0047] 3. TEC cooling sheet; 4. base; 41. fixing part; 411. fixing hole; 5. cooling fan;

[0048] 6. heat sink; 61. heat sink fins; 62. heat sink; 63. first fixing hole; 64. second fixing hole; 7. protective plate; 71. mounting hole; 72. ventilation hole; 8. working crystal; 9. lens assembly; 91. lens holder; 92. lens; Q. thermal conductive hole. DETAILED DESCRIPTION

[0049] The specific implementation methods of the present application are described in detail below with reference to the accompanying drawings.

[0050] It should be noted that, in the absence of conflict, the embodiments and technical features in the embodiments of the present application can be combined with each other, and the detailed description in the specific implementation method should be understood as an explanation of the purpose of the present application and should not be regarded as an improper limitation on the present application.

[0051] It should be understood that the orientation or position relationship is based on the orientation or position relationship shown in the drawings. These orientation terms are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application.

[0052] In the field of traditional high-power lasers, since the laser will produce thermal effects when working, cooling measures are generally taken to ensure the normal use of the laser and the protection of the equipment. Most of them use water cooling systems for heat dissipation. The water cooling system has a better heat dissipation effect, but the overall volume of the water cooling system is large, which will occupy a large space and increase production costs. In the air cooling method, heat is dissipated through the heat dissipation holes opened on the surface of the laser. When heat is continuously generated, it is difficult to volatilize the heat and will remain inside the laser housing, resulting in heat dissipation difficulties, which in turn affects the normal use of the subsequent laser. Therefore, it is necessary to improve the heat dissipation mechanism of the laser.

[0053] Figure 1 A schematic diagram of the structure of a heat dissipation mechanism of a laser provided in an embodiment of the present application, wherein the housing is hidden; Figure 2 for Figure 1 Front view of the heat dissipation mechanism of the laser.

[0054] In view of this, if Figure 1 and Figure 2 As shown, the embodiment of the present application provides a heat dissipation mechanism of a laser, including a housing 1, a light-emitting component 2, a TEC cooling sheet 3, a base 4, a heat dissipation fan 5, a heat dissipation plate 6 and a protective plate 7. The housing 1 is provided with a receiving cavity 11, the light-emitting component 2 is used to emit laser light, the TEC cooling sheet 3 is connected to the light-emitting component 2, the base 4 is provided with a fixing portion 41, one side of the fixing portion 41 is fixedly connected to the TEC cooling sheet 3, the base 4 is located in the receiving cavity 11, the TEC cooling sheet 3 is located between the fixing portion 41 and the light-emitting component 2, the heat dissipation fan 5 is connected to the housing 1, the heat dissipation fan 5 is located at one end of the receiving cavity 11, the heat dissipation plate 6 is fixed to the other side of the fixing portion 41, the heat dissipation plate 6 is provided with a plurality of heat dissipation fins 61, and heat dissipation grooves 62 are formed between adjacent heat dissipation fins 61, the opening of the heat dissipation grooves 62 faces the heat dissipation fan 5, and the protective plate 7 is fixedly connected to the heat dissipation fan 5.

[0055] Specifically, the base 4 is provided with a resonant cavity, and the light emitting component 2, the TEC cooling sheet 3 and the working crystal 8 are located in the resonant cavity. The resonant cavity is used to provide optical feedback capability to form a continuous oscillation of stimulated radiation, so that the light beam is continuously enhanced, and at the same time, the direction and frequency of the light beam are limited, so that the output light beam has excellent directionality and monochromaticity. The working crystal 8 uses light as an excitation source, and then excites and amplifies the light back and forth through the resonant cavity, and finally realizes the output of the laser. The output laser is emitted from the lens assembly 9. For example, the lens assembly 9 is located at one end of the laser and partially protrudes from the laser. The lens assembly 9 includes a lens holder 91 and a lens 92. The lens 92 is mounted on the lens holder 91. The laser formed by the excitation of the working crystal 8 is transmitted from the lens 92 to the target object.

[0056] For example, the light emitting component 2, the TEC cooling sheet 3 and the working crystal 8 are all fixed on the base 4, the TEC cooling sheet 3, the light emitting component 2 and the working crystal 8 are arranged in sequence, the TEC cooling sheet 3 cools the light emitting component 2, the light emitting component 2 emits light, and forms a laser after passing through the working crystal 8. The cooling fan 5 is located at one end of the accommodating cavity 11, the lens assembly 9 is located at the other end of the laser, the cooling fan 5 is fixed on the housing 1, the opening of the heat dissipation slot 62 on the heat dissipation plate 6 faces the cooling fan 5, the cooling fan 5 emits heat dissipation air through the heat dissipation slot 62, blows into the laser, and cools the inside, and the protective plate 7 protects the cooling fan 5.

[0057] It should be understood that the TEC (Therm electric Cooler) cooling sheet 3 is installed between the light emitting component 2 and the heat sink 6, with its cold side in contact with the chip of the light emitting component 2 to provide cooling, and its hot side in contact with the heat sink 6 to dissipate heat to the outside.

[0058] It should be noted that the cooling fan 5 emits cooling air through the cooling slot 62 to cool the laser, and the TEC cooling sheet 3 is turned on based on the heat dissipation demand after power is turned on, thereby dissipating the heat of the light-emitting component 2. The light-emitting component 2 is dissipated by the TEC cooling sheet 3, the cooling fan 5 and the heat dissipation plate 6, so that the heat inside the laser is effectively discharged, the heat dissipation efficiency is improved, and the heat dissipation problem of the laser is solved.

[0059] Figure 3 for Figure 2 Schematic diagram of the heat dissipation mechanism of the laser. Figure 4 A schematic diagram of the structure of a base, a cooling fan, a cooling plate and a protective plate provided in an embodiment of the present application. Figure 5 for Figure 4 Exploded view of the base, cooling fan, heat sink and protective plate. Figures 3 to 5As shown, in some embodiments, the protective plate 7 is provided with a mounting hole 71 and a ventilation hole 72 , and a plurality of mounting holes 71 are arranged around the ventilation hole 72 , and the mounting holes 71 are used to fix the protective plate 7 and the cooling fan 5 to the heat dissipation plate 6 .

[0060] Specifically, the protective plate 7 has a roughly quadrilateral profile, and mounting holes 71 are provided at each corner of the quadrilateral. The ventilation holes 72 are located in the middle of the protective plate 7. Multiple mounting holes 71 are arranged around the ventilation holes 72. The protective plate 7 and the heat dissipation fan 5 can be fixed to the heat dissipation plate 6 through the mounting holes 71. For example, a through hole is provided at a corresponding position of the heat dissipation fan 5, and the second fixing hole 64 of the heat dissipation plate 6 is a threaded hole. The screws are passed through the mounting holes 71 and the through holes of the heat dissipation fan 5 in sequence, and are threadedly connected (tightened) with the second fixing hole 64 of the heat dissipation plate 6, so that the protective plate 7, the heat dissipation fan 5 and the heat dissipation plate 6 are assembled into a whole, and air is introduced into the heat dissipation fan 5 through the ventilation holes 72 of the protective plate 7, so that the heat dissipation fan 5 operates normally, which is convenient for heat dissipation of the laser.

[0061] Figure 6 An exploded diagram of a heat dissipation mechanism of a laser provided in an embodiment of the present application, wherein a working crystal, a light-emitting component and a TEC cooling sheet are hidden; Figure 7 A schematic diagram of the structure of a heat sink provided in an embodiment of the present application; Figure 8 for Figure 7 The front view of the heat sink. Figures 6 to 8 As shown, in some embodiments, the heat dissipation plate 6 and the fixing portion 41 are both provided with a plurality of heat conduction holes Q, and adjacent heat conduction holes Q are arranged at equal intervals.

[0062] Specifically, the heat sink 6 is provided with a plurality of heat sink fins 61, and heat sink grooves 62 are formed between adjacent heat sink fins 61. The opening of the heat sink grooves 62 faces the heat sink fan 5. The heat conduction hole Q is located in the middle of the heat sink 6. The second fixing hole 64 of the heat sink 6 is located on the peripheral side of the heat sink 6. The heat sink 6 is fixed to one side of the fixing part 41, and the heat sink 6 and the fixing part 41 are both provided with heat conduction holes Q, through which the heat dissipation of the light-emitting component 2 is improved.

[0063] It should be understood that there may be a plurality of heat-conducting holes Q to increase the heat-conducting efficiency, and adjacent heat-conducting holes Q are arranged at equal intervals. In particular, the heat-conducting holes Q are arranged in a row in the same heat dissipation slot 62 .

[0064] When the cooling fan 5 is running, the cooling air blown out passes through the heat conducting holes Q to dissipate heat for the light emitting component 2, thereby accelerating the heat dissipation efficiency of the light emitting component 2, and further enhancing the heat dissipation effect of the laser. In addition, the heat conducting holes Q are arranged in a row, further increasing the heat dissipation flow and improving the heat dissipation degree of the laser.

[0065] In some embodiments, the heat sink 6 is provided with a plurality of first fixing holes 63 and second fixing holes 64 , wherein the first fixing holes 63 penetrate part of the heat sink fins 61 , wherein the first fixing holes 63 are used to fix the heat sink 6 to the base 4 , and the second fixing holes 64 are used to fix the heat sink fan 5 .

[0066] Specifically, a plurality of first fixing holes 63 are provided in the middle of the heat sink 6, and a fixing hole 411 is provided at a corresponding position of the fixing portion 41 of the base 4, and screws or bolts are passed through the first fixing holes 63 and the fixing holes 411 to fix the heat sink 6 to the base 4. For example, the heat sink 6 and the light emitting component 2 are respectively located on both sides of the fixing portion 41, and the heat sink 6, the light emitting component 2, and the fixing portion 41 are all provided with holes, and after the bolts are passed through the corresponding holes, the heat sink 6 and the light emitting component 2 are fixed to the base 4.

[0067] Since the first fixing hole 63 fixes the heat sink 6 on the base 4, the heat sink 6 can transfer temperature and achieve heat conduction while being air-cooled, thereby not only fixing the heat sink 6 and the base 4 but also improving the heat dissipation effect of the laser.

[0068] In some embodiments, the light-emitting component 2 includes a light-emitting component 21, a support 22 and a fastener 23, the light-emitting component 21 is respectively connected to the support 22 and the TEC cooling plate 3, the support 22 is provided with a fastening hole 221, the fixing part 41 is provided with a fixing hole 411 adapted to the fastening hole 221, and the fastener 23 is penetrated by the fastening hole 221 and the fixing hole 411 to clamp and fix the TEC cooling plate 3 to the fixing part 41.

[0069] Specifically, the fixing portion 41 is provided with a fixing hole 411, the support 22 is provided with a fastening hole 221, the fixing hole 411 is adapted to the fastening hole 221, and the fastener 23 penetrates the fastening hole 221 and the fixing hole 411 to clamp the TEC cooling sheet 3. The light-emitting component 21 is used to emit light, the support 22 supports the light-emitting component 21, and the TEC cooling sheet 3 cools the light-emitting component 21. For example, the light-emitting component 21 is a light-emitting chip, the support 22 is a heat sink, the TEC cooling sheet 3 is connected to the heat sink, and cools the light-emitting component 21. For example, the TEC cooling sheet 3 and the fixing portion 41 are bonded by thermal conductive silicone grease, which improves the heat conduction effect while reducing the pollution to the internal resonant cavity of the laser.

[0070] Since the fastener 23 clamps and fixes the TEC cooling sheet 3 to the fixing portion 41 , the fixing effect of the TEC cooling sheet 3 is improved, which is beneficial to cooling the light-emitting component 2 and improving the heat dissipation efficiency.

[0071] In some embodiments, the support 22 and the top surface of the TEC cooling sheet 3 are flush, and the light-emitting element 21 is located on the top surface of the support 22 and the TEC cooling sheet 3. Since the support 22 and the top surface of the cooling sheet are flush, the light-emitting element 21 can be evenly arranged on the top surface of the support 22 and the TEC cooling sheet 3, and the laser emitted by the light-emitting element 21 is more conducive to subsequent operations such as transmission and focusing to meet the use requirements. At the same time, the TEC cooling sheet 3 is directly in contact with the light-emitting element 21, which improves the heat dissipation effect.

[0072] In some embodiments, Figure 3 and Figure 6 As shown, the housing 1 is provided with a heat dissipation hole 12, and the heat dissipation hole 12 is connected to the accommodating cavity 11. In particular, the heat dissipation hole 12 is a waist hole. Alternatively, the housing 1 is provided with a plurality of heat dissipation holes 12, and the plurality of heat dissipation holes 12 are arranged at equal intervals.

[0073] Since the heat dissipation holes of the housing 1 are connected to the accommodating cavity 11, the heat in the accommodating cavity 11 can be discharged through the heat dissipation holes 12. When the heat dissipation holes 12 are waist holes, the heat dissipation area is effectively expanded, the heat dissipation effect is improved, and multiple heat dissipation holes 12 can improve the heat dissipation efficiency of the laser.

[0074] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit the same. Although the present application has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to replace some of the technical features therein by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions claimed to be protected by the present application.

Claims

1. A heat dissipation mechanism for a laser, characterized in that: include: A housing having a receiving cavity; A light emitting component, used for emitting laser; A TEC cooling sheet connected to the light-emitting component; A base, provided with a fixing portion, one side of which is fixedly connected to the TEC cooling sheet, wherein the base is located in the accommodating cavity, and the TEC cooling sheet is located between the fixing portion and the light-emitting component; A cooling fan connected to the housing, the cooling fan being located at one end of the accommodating cavity; A heat sink fixed to the other side of the fixing portion, the heat sink being provided with a plurality of heat sink fins, heat sink grooves being formed between adjacent heat sink fins, and openings of the heat sink grooves facing the heat sink fan; A protective plate is fixedly connected to the cooling fan.

2. A heat dissipation mechanism for a laser according to claim 1, characterized in that: The heat sink is provided with a plurality of first fixing holes and second fixing holes, wherein the first fixing holes penetrate part of the heat sink fins, wherein the first fixing holes are used to fix the heat sink to the base, and the second fixing holes are used to fix the heat sink fan.

3. The heat dissipation mechanism of a laser according to claim 1, characterized in that: The heat dissipation plate and the fixing portion are both provided with a plurality of heat conduction holes, and adjacent heat conduction holes are arranged at equal intervals.

4. The heat dissipation mechanism of a laser according to claim 3, characterized in that: The heat conducting holes are arranged in a row in the same heat dissipation slot.

5. The heat dissipation mechanism of a laser according to claim 1, characterized in that: The light-emitting component includes a light-emitting part, a support and a fastener, the light-emitting part is respectively connected to the support and the TEC cooling plate, the support is provided with a fastening hole, the fixing part is provided with a fixing hole adapted to the fastening hole, and the fastener passes through the fastening hole and the fixing hole to clamp and fix the TEC cooling plate to the fixing part.

6. The heat dissipation mechanism of a laser according to claim 5, characterized in that: The support and the top surface of the TEC cooling plate are flush, and the light emitting element is located on the top surface of the support and the TEC cooling plate.

7. The heat dissipation mechanism of a laser according to claim 1, characterized in that: The protective plate is provided with a mounting hole and a ventilation hole, a plurality of the mounting hole rings are arranged around the ventilation hole, and the mounting holes are used to fix the protective plate and the cooling fan to the cooling plate.

8. The heat dissipation mechanism of a laser according to claim 1, characterized in that: The shell is provided with a heat dissipation hole, and the heat dissipation hole is communicated with the accommodating cavity.

9. The heat dissipation mechanism of a laser according to claim 8, characterized in that: The heat dissipation hole is a waist hole.

10. The heat dissipation mechanism of a laser according to claim 8, characterized in that: The shell is provided with a plurality of heat dissipation holes, and the plurality of heat dissipation holes are arranged at equal intervals.

Images