Circuit board and electronic equipment

Abstract

The embodiment of the utility model relates to the technical field of electronic equipment, and discloses a circuit board and electronic equipment, the circuit board comprises a substrate provided with a processor, a first M.2 connector and a second M.2 connector, the first M.2 connector and the second M.2 connector are adjacently arranged, a jack of the first M.2 connector and a jack of the second M.2 connector face the same direction, and the processor is arranged on the substrate; a jack of the first M.2 connector faces the side where the second M.2 connector is located, and the jack of the first M.2 connector is higher than the second M.2 connector, so that the projection of first M.2 equipment connected with the first M.2 connector on the substrate and the projection of second M.2 equipment connected with the second M.2 connector on the substrate at least partially coincide; and the first M.2 connector and the second M.2 connector are electrically connected with the processor respectively. Through the mode, the space occupied by the M.2 equipment on the mainboard is reduced, and miniaturization of the mainboard is facilitated.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of electronic equipment, and specifically to a circuit board and electronic equipment. Background Art

[0002] In recent years, electronic devices have become increasingly miniaturized and diversified in function. Therefore, in order to meet the diverse needs of users, it is necessary to continuously optimize the size design of electronic devices and increase the interfaces of electronic devices. At present, M.2 devices are widely used in electronic devices due to their advantages such as fast transmission speed and small thickness. Motherboards with M.2 connectors have become the mainstream demand for electronic device motherboards.

[0003] However, the M.2 device is relatively large in size and is usually connected to the M.2 connector in a direction parallel to the motherboard. Therefore, when an M.2 connector is provided on the motherboard, sufficient space is usually required on the motherboard to accommodate the M.2 device. When multiple M.2 connectors are required on the motherboard, a larger space is required on the motherboard to accommodate the M.2 device, which results in the need to increase the size of the motherboard to accommodate other electronic components and interfaces, and thus the size of the motherboard cannot meet the requirements of miniaturization of electronic devices. Utility Model Content

[0004] In view of the above problems, the embodiments of the present application provide a circuit board and an electronic device for solving the problem that the size of the motherboard will be larger after multiple M.2 connectors are set on the current motherboard.

[0005] According to one aspect of an embodiment of the present application, a circuit board is provided, the circuit board comprising a substrate, a processor, a first M.2 connector and a second M.2 connector; the processor, the first M.2 connector and the second M.2 connector are arranged on the substrate; the first M.2 connector and the second M.2 connector are arranged adjacent to each other, the socket of the first M.2 connector and the socket of the second M.2 connector are oriented in the same direction, the socket of the first M.2 connector faces the side where the second M.2 connector is located, and the height of the socket of the first M.2 connector is higher than that of the second M.2 connector, so that the projection of the first M.2 device connected to the first M.2 connector on the substrate and the projection of the second M.2 device connected to the second M.2 connector on the substrate at least partially overlap; the first M.2 connector and the second M.2 connector are electrically connected to the processor respectively.

[0006] In an optional manner, a first M.2 connector has a first installation area for accommodating a first M.2 device on one side of a socket, and a second M.2 connector has a second installation area for accommodating a second M.2 device on one side of a socket, and the first installation area and the second installation area at least partially overlap on the substrate; a distance between a tail end of the second installation area and the second M.2 connector is less than or equal to a distance between a tail end of the first installation area and the second M.2 connector, wherein the tail end of the second installation area is an end of the second installation area facing away from the second M.2 connector, and the tail end of the first installation area is an end of the first installation area facing away from the first M.2 connector; a fixing point for fixing a first M.2 device connected to the first M.2 connector is provided on the substrate, and the fixing point is located within the first installation area and outside the second installation area or at the tail end of the second installation area.

[0007] In an optional manner, the fixing point includes a fixing column and a fastener. The fixing column is arranged on the substrate. A fixing hole is opened on the fixing column. The fastener is used to pass through the opening at the rear end of the first M.2 device and connect with the fixing hole after the first M.2 device is connected to the first M.2 connector, so as to clamp and fix the first M.2 device.

[0008] In an optional manner, a height difference between the socket of the first M.2 connector and the second M.2 connector is greater than or equal to a height of the second M.2 connector.

[0009] In an optional manner, a plurality of external interfaces are arranged on a side of the substrate facing away from the first M.2 connector, at least some of the plurality of external interfaces are stacked in a direction perpendicular to the substrate, and the plurality of external interfaces are used to connect external devices.

[0010] According to another aspect of an embodiment of the present application, an electronic device is provided, comprising any circuit board described above.

[0011] In an optional manner, the electronic device also includes a radiator, which is in contact with the surface of the processor. The radiator is made of a conductive material, and the surface of the radiator is connected to the ground end of the substrate so that the electrostatic charge on the surface of the processor can be discharged from the ground end through the radiator.

[0012] In an optional manner, a heating module is also provided on the side of the substrate where the processor is located, and the height of the heating module is higher than the height of the processor; a first boss is provided on the side of the heat sink facing the processor, and the first boss is used to fit with the surface of the processor, and other positions of the heat sink are used to fit with the heating module. The first boss is made of conductive material so that the electrostatic charge on the surface of the processor can be discharged from the ground terminal after passing through the first boss and the heat sink.

[0013] In an optional manner, the heat sink is connected to the ground terminal through a conductive component, so that the electrostatic charge on the surface of the processor is discharged from the ground terminal through the heat sink and the conductive component.

[0014] In an optional manner, the conductive component includes a conductive spring sheet and a second boss; the conductive spring sheet is arranged on the side of the substrate facing the heat sink and is connected to the ground end of the substrate; the second boss is arranged on the side of the heat sink facing the processor, and the second boss is made of a conductive material. The second boss is used to contact the conductive spring sheet when the heat sink and the processor are in contact, so that the electrostatic charge on the surface of the processor can be discharged from the ground end after passing through the heat sink, the second boss and the conductive spring sheet.

[0015] The embodiment of the present application sets the first M.2 connector and the second M.2 connector at different heights on the substrate, and sets the socket of the first M.2 connector and the socket of the second M.2 connector in the same direction based on the positional relationship between the two, on the basis that the sockets of the two M.2 connectors can be used normally, so that the two M.2 devices connected by the two M.2 connectors are stacked in a direction perpendicular to the substrate, and the space occupied by the two M.2 devices on the substrate at least partially overlaps, effectively reducing the space occupied by the M.2 devices on the substrate, which is conducive to miniaturization of the circuit board. In addition, the first M.2 connector and the second M.2 connector are electrically connected to the processor respectively, and different circuits can be set for the two M.2 connectors according to actual needs to electrically connect with different connection ends of the processor, so that users can connect different M.2 devices to the two M.2 connectors according to their own needs, and the use of the first M.2 connector and the second M.2 connector is more flexible.

[0016] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present application. Also, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0018] Figure 1 A three-dimensional diagram of a circuit board provided by an embodiment of the utility model is shown;

[0019] Figure 2 Shows Figure 1 A magnified view of point A;

[0020] Figure 3 A schematic diagram showing the structure of a first M.2 device provided in an embodiment of the utility model is shown;

[0021] Figure 4 A cross-sectional view of a circuit board provided by an embodiment of the utility model is shown;

[0022] Figure 5 A schematic diagram of a first partial structure of a circuit board provided by an embodiment of the utility model is shown;

[0023] Figure 6 A second partial structural diagram of a circuit board provided by an embodiment of the utility model is shown;

[0024] Figure 7 A third partial structural schematic diagram of a circuit board provided by an embodiment of the utility model is shown;

[0025] Figure 8 A schematic diagram of a partial structure of a circuit board provided by an embodiment of the utility model from another perspective is shown;

[0026] Fig. 9 A partial cross-sectional view of an electronic device provided by an embodiment of the utility model is shown;

[0027] Fig.10 A three-dimensional diagram of a radiator provided by an embodiment of the utility model is shown;

[0028] Fig.11 Another partial cross-sectional view of the electronic device provided by the embodiment of the utility model is shown.

[0029] The reference numerals in the specific implementation manner are as follows:

[0030] 100, circuit board, 210, first M.2 device, 220, second M.2 device, 300, heat sink;

[0031] 110, substrate, 120, processor, 130, first M.2 connector, 140, second M.2 connector, 150, heating module;

[0032] 111, fixed point, 112, external interface;

[0033] 1111, fixing column, 1112, fastener, 1113, fixing hole;

[0034] 131, a socket of a first M.2 connector, 132, a first mounting area, 133, a tail end of the first mounting area;

[0035] 141. a socket of a second M.2 connector, 142. a second mounting area, 143. a tail end of the second mounting area;

[0036] 211, Golden Finger, 212, Opening;

[0037] 310, first boss, 320, conductive component;

[0038] 321. Conductive spring sheet. 322. Second boss. DETAILED DESCRIPTION

[0039] The following embodiments of the technical solution of the present application are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0041] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0042] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0043] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists, A and B exist at the same time, and B exists. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0044] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0045] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present application.

[0046] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0047] The M.2 connector is a host interface solution that is compatible with a variety of communication protocols, such as SATA, PCIe, USB, HSIC, UART, etc. The M.2 connector has a very fast transmission speed. For example, the M.2KEY B connector using the PCIe×2 interface standard has a maximum read speed of 700MB / s and a write speed of 550MB / s. In addition, the thickness of the M.2 device connected to the M.2 connector is also relatively small. For example, the thickness of the M.2 standard solid-state hard disk after single-sided arrangement is only 2.75mm, and the thickness after double-sided arrangement is only 3.85mm, while the thickness of the SATA standard solid-state hard disk after single-sided arrangement is 4.85mm. In addition, the M.2 standard solid-state hard disk of the same size can provide higher storage capacity. Therefore, the M.2 connector is widely used in electronic devices, and is usually set on the motherboard of the electronic device to connect storage devices such as solid-state hard disks and communication devices such as wireless network cards and Bluetooth modules.

[0048] The inventor of the present application has noticed that in order to conveniently fix the M.2 device to ensure the stability of the M.2 device, the socket of the M.2 connector on the motherboard is usually set in a direction parallel to the motherboard, which results in that after the M.2 device is inserted into the M.2 connector, the position corresponding to the M.2 device on the motherboard will be occupied by the M.2 device, that is, the position corresponding to the M.2 device on the motherboard will be blocked by the M.2 device and other circuit modules cannot be set. Therefore, the motherboard usually reserves a corresponding installation area for the M.2 connector. When the motherboard needs to be compatible with multiple types of M.2 devices, the M.2 connectors corresponding to different types of M.2 devices may be different. Even if the M.2 connectors corresponding to the M.2 devices are the same, the circuit connections between different types of M.2 devices and the processor may be different, which requires multiple M.2 connectors to be set on the motherboard. When multiple M.2 connectors need to be set on the motherboard, separate installation areas need to be reserved for the multiple M.2 connectors on the motherboard, which will result in the need to increase the size of the motherboard to ensure that there is enough space on the motherboard for installing other electronic components or interfaces, which in turn causes the motherboard to be unable to meet the needs of miniaturization of electronic devices.

[0049] In order to provide a motherboard with multiple M.2 connectors while meeting the need for miniaturization of electronic devices, the inventor of the present application has found through in-depth research that although the area of ​​the M.2 device is large, its thickness is small, and even if multiple M.2 devices are stacked together, the overall height is relatively low. Therefore, the inventor of the present application has designed a circuit board based on this feature, on which two M.2 connectors are provided, the two M.2 connectors are arranged adjacent to each other, and the sockets of the two M.2 connectors face the same direction, the socket of one M.2 connector (the first M.2 connector) is higher than that of the other M.2 connector (the second M.2 connector), and the socket of the first M.2 connector faces the side where the second M.2 connector is located, and when the two M.2 connectors are connected to the M.2 devices at the same time, the two M.2 devices are in a vertically stacked state, that is, the projections of the two M.2 devices on the circuit board at least partially overlap.

[0050] This design does not require separate installation areas to be reserved for the two M.2 connectors on the circuit board, effectively reducing the space occupied by the M.2 device on the circuit board, which is conducive to the miniaturization of electronic devices. In addition, the two M.2 connectors are electrically connected to the processor respectively, and the pins of the two M.2 connectors can be electrically connected to different connection ends on the processor according to the connection requirements of different types of M.2 devices, so that the two M.2 connectors can connect different types of M.2 devices, and the M.2 devices on the circuit board can be flexibly set according to different user needs.

[0051] The M.2 connector on the circuit board provided in the example of this application can not only be used to connect M.2 standard solid-state hard drives, but can also be used to connect wireless network cards (for example, WIFI modules, 5G modules, etc.), Bluetooth modules and other communication devices. The M.2 device is used for illustration in the embodiment of this application.

[0052] According to a first aspect of an embodiment of the present application, a circuit board is provided. Figure 1 and Figure 2 , Figure 1 A three-dimensional diagram of a circuit board provided by an embodiment of the utility model is shown. Figure 2 Shows Figure 1 An enlarged view of point A shows that the circuit board 100 includes a substrate 110, a processor 120, a first M.2 connector 130 and a second M.2 connector 140. The processor 120, the first M.2 connector 130 and the second M.2 connector 140 are arranged on the substrate 110. The first M.2 connector 130 and the second M.2 connector 140 are arranged adjacent to each other. The socket 131 of the first M.2 connector and the socket 141 of the second M.2 connector are oriented in the same direction. The socket 131 of the first M.2 connector faces the side where the second M.2 connector 140 is located, and the height of the socket 131 of the first M.2 connector is higher than that of the second M.2 connector 140, so that the projection of the first M.2 device 210 connected to the first M.2 connector 130 on the substrate 110 and the projection of the second M.2 device 220 connected to the second M.2 connector 140 on the substrate 110 at least partially overlap, and the first M.2 connector 130 and the second M.2 connector 140 are electrically connected to the processor 120 respectively.

[0053] The substrate 110 is the main body of the circuit board 100, which is used to install and connect various electronic components, such as integrated circuits, transistors, capacitors, resistors, etc. The circuit on the substrate 110 can be formed by photolithography, etching or other microelectronic process technologies. The processor 120 can be a central processing unit CPU, or an application specific integrated circuit ASIC (Application Specific Integrated Circuit), or one or more integrated circuits configured to implement the embodiments of the present application. One or more processors 120 can be set on the substrate 110, which can be processors 120 of the same type, such as one or more CPUs; or different types of processors 120, such as one or more CPUs and one or more ASICs.

[0054] The first M.2 connector 130 and the second M.2 connector 140 are interfaces for connecting an M.2 device (solid state drive, wireless network card, expansion card, etc.) to a substrate. M.2 connectors can be classified into three types according to the interface type, namely, M.2KEYB connector, M.2KEYM connector and M.2KEYE connector, wherein the M.2KEYB connector can be connected to M.2 devices such as 5G modules, the M.2KEYM connector can be connected to M.2 devices such as solid state drives, and the M.2KEYE connector can be connected to M.2 devices such as WIFI modules.

[0055] like Figure 1 As shown, the first M.2 connector 130 and the second M.2 connector 140 are arranged on the same side of the substrate 110. In order to efficiently utilize the space on the substrate 110, the processor 120 and the first M.2 connector 130 can be arranged on both sides of the substrate 110, that is, the processor 120 is arranged on the side of the substrate 110 away from the first M.2 connector 130. Of course, the processor 120 and the first M.2 connector can also be arranged on the same side of the substrate 110, that is, the processor 120 is arranged on the side of the substrate 110 facing the first M.2 connector 130.

[0056] The first M.2 connector and the second M.2 connector are disposed adjacent to each other on the substrate 110. Specifically, as shown in FIG. Figure 1 As shown, the extension direction of the first M.2 connector and the extension direction of the second M.2 connector can be parallel to each other, and the first M.2 connector and the second M.2 connector are arranged in a direction perpendicular to the extension direction. At this time, the straight line formed by the center position of the first M.2 connector and the center position of the second M.2 connector can be perpendicular to the extension direction, so that the first M.2 device and the second M.2 device can overlap to the maximum extent. Of course, the straight line formed by the center position of the first M.2 connector and the center position of the second M.2 connector may not be perpendicular to the extension direction, as long as the projections of the first M.2 device and the second M.2 device on the substrate 110 partially overlap. In addition, the first M.2 connector and the second M.2 connector can fit together to save space on the substrate 110, and there can also be a gap to make the heat dissipation performance of the two M.2 connectors better.

[0057] like Figure 3 As shown, Figure 3The schematic diagram of the structure of the first M.2 device provided by the embodiment of the utility model is shown. The gold finger 211 of the first M.2 device 210 used to connect to the M.2 connector is usually located at the edge of the first M.2 device 210. This means that after the first M.2 device 210 is inserted into the M.2 connector, the first M.2 device 210 will be located on the side of the direction in which the socket of the M.2 connector faces. As an example, the gold finger 211 of the first M.2 device is inserted into the Figure 2 As shown, the first M.2 device 210 will be located on the side of the first M.2 connector 130 facing the direction indicated by arrow B. Therefore, in order to make the projections of the first M.2 device and the second M.2 device on the substrate 110 at least partially overlap, the socket 131 of the first M.2 connector and the socket 141 of the second M.2 connector need to be in the same direction.

[0058] like Figure 2 As shown, the height of the first M.2 connector 130 is higher than the height of the second M.2 connector 140. If the socket 141 of the second M.2 connector is set to face the direction indicated by arrow C, at least part of the socket 141 of the second M.2 connector will be blocked by the first M.2 connector 130, resulting in the second M.2 connector 140 being unable to be used normally. Therefore, when the first M.2 connector 130 is located on the side of the second M.2 connector 140 facing the direction indicated by arrow D, the socket 131 of the first M.2 connector and the socket 141 of the second M.2 connector need to face the direction indicated by arrow C; when the first M.2 connector 130 is located on the side of the second M.2 connector 140 facing the direction indicated by arrow C, the socket 131 of the first M.2 connector and the socket 141 of the second M.2 connector need to face the direction indicated by arrow D.

[0059] In addition, when the height of the socket 131 of the first M.2 connector is lower than that of the second M.2 connector 140, the socket 131 of the first M.2 connector will be blocked by the second M.2 connector 140, causing the first M.2 connector 130 to be unable to be used normally. Figure 2 As shown, there is a height difference D1 between the socket 131 of the first M.2 connector and the second M.2 connector 140 , that is, the height of the socket 131 of the first M.2 connector is higher than that of the second M.2 connector 140 .

[0060] When both the first M.2 connector 130 and the second M.2 connector 140 are connected to M.2 devices, as an example, Figure 4 As shown, Figure 4The cross-sectional view of the circuit board provided by the embodiment of the utility model is shown, and the first M.2 device connected to the first M.2 connector 130 and the second M.2 device connected to the second M.2 connector 140 are stacked in a direction perpendicular to the substrate 110, so that the projection of the first M.2 device 210 on the substrate 110 and the projection of the second M.2 device 220 on the substrate 110 at least partially overlap. Of course, in addition to the above Figure 4 The size of the second M.2 device shown in the figure is smaller than that of the first M.2 device, so that the second M.2 device is completely covered by the first M.2 device. The size of the second M.2 device may also be greater than or equal to the first M.2 device. In the embodiment of the present application, the sizes of the first M.2 device and the second M.2 device are not limited.

[0061] The first M.2 connector 130 and the second M.2 connector 140 can be electrically connected to the processor 120 by routing on the substrate 110, for example, by forming a circuit on the substrate 110 through photolithography, etching or other microelectronic process technology to connect the first M.2 connector 130 and the processor 120, and the second M.2 connector 140 and the processor 120. When the first M.2 connector 130 and the second M.2 connector 140 are used to connect different M.2 devices (for example, the first M.2 device is a 5G module and the second M.2 device is a WIFI module), the circuits between the first M.2 connector 130 and the second M.2 connector 140 and the processor 120 may be different. In this case, the circuit can be set according to actual needs to electrically connect the first M.2 connector 130 and the second M.2 connector 140 to different connection ends of the processor 120. When the first M.2 connector 130 and the second M.2 connector 140 are used to connect the same M.2 device (for example, the first M.2 device and the second M.2 device are both solid-state drives), the same circuit can be set to electrically connect the first M.2 connector 130 and the second M.2 connector 140 to the same connection end of the processor 120.

[0062] In the above embodiment, by arranging the first M.2 connector 130 and the second M.2 connector 140 of different heights on the substrate 110, and according to the positional relationship between the two, on the basis that the sockets of the two M.2 connectors can be used normally, the sockets 131 of the first M.2 connector and the sockets 141 of the second M.2 connector are arranged in the same direction, so that the two M.2 devices connected by the two M.2 connectors are stacked in a direction perpendicular to the substrate 110, and the space occupied by the two M.2 devices on the substrate 110 at least partially overlaps, effectively reducing the space occupied by the M.2 devices on the substrate 110, which is conducive to miniaturization of the circuit board 100. In addition, the first M.2 connector 130 and the second M.2 connector 140 are electrically connected to the processor 120 respectively, and different circuits can be set for the two M.2 connectors according to actual needs to be electrically connected to different connection ends of the processor 120, so that users can connect different M.2 devices to the two M.2 connectors according to their own needs, and the use of the first M.2 connector 130 and the second M.2 connector 140 is more flexible.

[0063] In order to further ensure the stability of the electronic device, it is usually necessary to fix the first M.2 device and the second M.2 device on the substrate. If the second M.2 device is larger than the first M.2 device, the second M.2 device will hinder the fixation of the first M.2 device. Therefore, in order to make the fixation of the first M.2 device and the second M.2 device more convenient, in some embodiments of the present application, such as Figure 5 and Figure 6 As shown, Figure 5 The first partial structural diagram of the circuit board provided by the embodiment of the utility model is shown. Figure 6 A schematic diagram of a second partial structure of a circuit board provided by an embodiment of the utility model is shown, wherein a socket 131 of a first M.2 connector has a first mounting area 132 for accommodating a first M.2 device facing one side, and a socket 141 of a second M.2 connector has a second mounting area 142 for accommodating a second M.2 device facing one side, the first mounting area 132 and the second mounting area 142 at least partially overlap on a substrate 110, and a distance between a tail end 143 of the second mounting area and the second M.2 connector 140 is less than or equal to a distance between a tail end 133 of the first mounting area and a distance between a tail end 134 of the second mounting area and a second M.2 connector 140. 3 and the second M.2 connector 140, wherein the tail end 143 of the second mounting area is an end of the second mounting area 142 away from the second M.2 connector 140, the tail end 133 of the first mounting area is an end of the first mounting area 132 away from the first M.2 connector 130, and a fixing point 111 for fixing the first M.2 device connected to the first M.2 connector 130 is provided on the substrate 110, and the fixing point 111 is located within the first mounting area 132 and outside the second mounting area 142 or at the tail end 143 of the second mounting area.

[0064] The first mounting area 132 is a mounting space reserved on the substrate 110 for the first M.2 connector 130 (eg, Figure 5 and Figure 6 The second mounting area 142 is the mounting space reserved for the second M.2 connector 140 on the substrate 110 (e.g., the area enclosed by the dotted line frame connected to the first M.2 connector 130). That is, when the first M.2 connector 130 is connected to the first M.2 device, the projection of the first M.2 device on the substrate 110 is located in the first mounting area 132, or coincides with the first mounting area 132. Figure 5 and Figure 6 That is, when the second M.2 connector 140 is connected to the second M.2 device, the projection of the second M.2 device on the substrate 110 is located within the first installation area 132 .

[0065] like Figure 5 and Figure 6 As shown, the tail end 143 of the second mounting area is located in the first mounting area 132, that is, Figure 4 As shown, when the first M.2 connector 130 is connected to the first M.2 device 210, and the second M.2 connector 140 is connected to the second M.2 device 220, the entire second M.2 device 220 will be sandwiched between the first M.2 device 210 and the substrate 110. It should be noted that, in addition to Figure 5 and Figure 6 As shown, the entire second installation area 142 is disposed within the first installation area 132. The second installation area 142 may also be extended to the outside of the first installation area 132 along the direction indicated by the Y axis. Figure 7 As shown, Figure 7 A third partial structural schematic diagram of the circuit board provided by an embodiment of the utility model is shown, in which the second M.2 connector 140 is translated along the direction indicated by the Y-axis until part of the second M.2 connector 140 is located outside the first installation area 132, or the length of the second M.2 device connected to the second M.2 connector 140 in the direction indicated by the Y-axis is greater than the length of the first M.2 device connected to the first M.2 connector 130 in the direction indicated by the Y-axis, as long as the end of the first M.2 device facing away from the first M.2 connector 130 is located outside the second installation area 142.

[0066] The fixing point 111 does not refer to a specific point, but a structure on the substrate 110 for fixing the first M.2 device connected to the first M.2 connector 130. The fixing point 111 can be a hole on the substrate 110 for setting a fixing member for fixing the first M.2 device (for example, a threaded hole, a through hole, etc.), or a fixing member fixedly connected to the substrate 110 (for example, a fixing column with a fixing hole, a fixing buckle, etc.). The fixing point 111 can be located within the first mounting area 132 and outside the second mounting area 142 (for example, Figure 5 In this case, in order to fix the second M.2 device connected to the second M.2 connector 140, a fixing point can be set in the second installation area 142 for fixing the second M.2 device. The fixing point 111 can also be located within the first installation area 132 and at the tail end 143 of the second installation area (as shown in FIG. Figure 6 As shown), at this time, in addition to being used to fix the first M.2 device, the fixing point 111 can also be used to fix the second M.2 device, that is, the fixing point 111 can fix the first M.2 device and the second M.2 device at the same time.

[0067] It should be particularly pointed out that in order to enable the first M.2 connector 130 and the second M.2 connector 140 to connect to M.2 devices of various sizes, multiple fixing points can be respectively set in the first installation area 132 and the second installation area 142, as long as it is ensured that when the first M.2 connector 130 is connected to the first M.2 device and the second M.2 connector 140 is connected to the second M.2 device, the distance between the fixing point fixing the first M.2 device and the second M.2 connector 140 is greater than or equal to the distance between the fixing point fixing the second M.2 device and the second M.2 connector 140.

[0068] In the above embodiment, a fixing point 111 for fixing the first M.2 device is provided outside the second installation area 142 or at the rear end of the second installation area 142, so that the first M.2 device will not be hindered by the second M.2 device when being fixed, and the fixing of the first M.2 device is more convenient.

[0069] In order to further facilitate the fixing of the first M.2 device, in some embodiments of the present application, such as Figure 4 As shown, the fixing point includes a fixing column 1111 and a fastener 1112. The fixing column 1111 is arranged on the substrate 110. A fixing hole 1113 is opened on the fixing column 1111. The fastener 1112 is used to pass through the opening 212 at the rear end of the first M.2 device 210 and connect with the fixing hole 1113 after the first M.2 device 210 is connected to the first M.2 connector 130, so as to clamp and fix the first M.2 device 210.

[0070] When fixing the first M.2 device 210, Figure 4 As shown, after the first M.2 device 210 is plugged into the first M.2 connector 130, the tail end of the first M.2 device 210 is placed on the top of the fixing column 1111, and then the fastener 1112 is pressed into the fixing hole 1113, thereby clamping the first M.2 device 210 between the fastener 1112 and the fixing column 1111. The fixing column 1111 can be fixed to the substrate 110 by welding, plugging, threaded connection, etc. The fixing hole 1113 on the fixing column 1111 can be a threaded hole or a slot. When the fixing hole 1113 is a threaded hole, the fastener 1112 can be a component such as a screw or a screw with a head. When the fixing hole 1113 is a slot, the fastener 1112 can be a rubber part, a silicone part, etc. The opening 212 at the tail end of the first M.2 device 210 can be a notch located at the tail end of the first M.2 device 210 (such as Figure 3 The arc-shaped notch shown in the figure may also be a through hole opened at the rear end of the first M.2 device 210.

[0071] It should be particularly pointed out that when the fixing point is used to fix the first M.2 device 210 and the second M.2 device 220 at the same time, the fixing column 1111 can be decomposed into two parts, and fixing holes are respectively opened on the two parts. When installing the M.2 device, one of the split bodies (the first split body) is set on the substrate 110. After the second M.2 device 220 is plugged into the second M.2 connector 140, the tail end of the second M.2 device 220 is placed on the top of the first split body, and then the connecting end on the other split body (the second split body) is passed through the second M.2 device 220 and connected to the fixing hole of the first split body to clamp the second M.2 device 220 between the first split body and the second split body; then, after the first M.2 device 210 is plugged into the first M.2 connector 130, the tail end of the first M.2 device 210 is placed on the top of the second split body, and then the fastener 1112 is passed through the first M.2 device and connected to the fixing hole of the second split body to clamp the first M.2 device between the fastener 1112 and the second split body.

[0072] In the above embodiment, by providing the fixing column 1111 and the fastener 1112, after the first M.2 device is connected to the first M.2 connector 130, the tail end of the first M.2 device 210 is placed on the top of the fixing column 1111, and the fastener 1112 is passed through the first M.2 device 210 and connected to the fixing hole 1113 on the fixing column 1111, so that the first M.2 device 210 can be clamped and fixed between the fixing column 1111 and the fastener 1112, and the first M.2 device 210 is convenient to fix. In addition, when disassembling the first M.2 device 210, only the fastener 1112 needs to be separated from the fixing column 1111, so that the first M.2 device 210 can be separated from the first M.2 connector 130, and the disassembly of the first M.2 device 210 is also convenient.

[0073] In order to improve the heat dissipation speed of the first M.2 device and the second M.2 device, in some embodiments of the present application, such as Figure 8 As shown, Figure 8 A partial structural schematic diagram of a circuit board provided by an embodiment of the utility model from another perspective is shown, and a height difference D1 between the socket 131 of the first M.2 connector and the second M.2 connector 140 is greater than or equal to a height D2 of the second M.2 connector 140 .

[0074] In order to ensure that the M.2 device can dissipate heat normally, after the M.2 device is connected to the M.2 connector, there is often a certain amount of space between the M.2 device and the substrate for heat dissipation, such as Figure 4 As shown, there will be a certain gap between the second M.2 device 220 and the substrate. Therefore, as long as the height difference D1 between the socket 131 of the first M.2 connector and the second M.2 connector 140 is greater than or equal to the height D2 of the second M.2 connector 140, it can be ensured that after the first M.2 device is connected to the first M.2 connector 130, there can be a certain space distance between the second M.2 connector 140, thereby ensuring that there is a gap between the first M.2 device and the second M.2 device to speed up the heat dissipation of the first M.2 device and the second M.2 device. The height of the first M.2 connector 130 can be 8.5mm, the height of the second M.2 connector 140 can be 3mm, and the sockets of both are located at the top of the M.2 connector. Of course, in order to speed up the heat dissipation of the first M.2 device and the second M.2 device, a thermal conductive pad, thermal conductive silicone grease or other thermal conductive structures can also be set between the first M.2 device and the second M.2 device to speed up the heat dissipation.

[0075] In the above embodiment, by setting the height difference D1 between the socket 131 of the first M.2 connector and the second M.2 connector 140 to be relatively large, a certain gap exists between the first M.2 device and the second M.2 device after the first M.2 device is connected to the first M.2 connector 130 and the second M.2 device is connected to the second M.2 connector 140, which is beneficial to the heat dissipation of the first M.2 device and the second M.2 device. In addition, when the second M.2 device is fixed with a fastener, the gap between the first M.2 device and the second M.2 device can accommodate the head of the fastener, effectively avoiding the head of the fastener from abutting against the first M.2 device, thereby causing the first M.2 device to deform or affecting the stability of the connection between the first M.2 device and the first M.2 connector.

[0076] In electronic devices, external interfaces (such as USB interfaces, PCIe interfaces, etc.) for connecting external devices (such as USB flash drives, terminal devices, server devices, etc.) are usually set on the mainboard. These external interfaces also need to occupy space on the mainboard. Therefore, in order to further reduce the size of the circuit board, in some embodiments of the present application, such as Figure 8 As shown, a plurality of external interfaces 112 are arranged on a side of the substrate 110 away from the first M.2 connector 130 , at least some of the plurality of external interfaces 112 are stacked in a direction perpendicular to the substrate 110 , and the plurality of external interfaces 112 are used to connect external devices.

[0077] The external interface 112 refers to an interface on an electronic device for connecting external devices or accessories. Users can expand the functions of the electronic device or transmit data with other devices through the external interface 112 according to their own needs. The external interface 112 can be a USB interface, an HDMI interface, a PCIe interface, etc. The multiple external interfaces 112 on the substrate 110 can be interfaces of the same type, such as multiple USB interfaces or multiple HDMI interfaces, or can be interfaces of different types, such as one or more USB interfaces and one or more HDMI interfaces. When the height of the multiple external interfaces 112 is small, the multiple external interfaces 112 can be stacked in a direction perpendicular to the substrate 110 to reduce the space occupied by the external interfaces 112 on the substrate 110. Of course, if Figure 8 As shown, when the plurality of external interfaces 112 include interfaces with a relatively large height, such as a network interface, these interfaces with a relatively large height may also be separately disposed on the substrate 110 .

[0078] In the above embodiment, by arranging the external interface 112 on the side of the substrate 110 away from the first M.2 connector 130, the space utilization rate on the substrate 110 can be improved, which is conducive to the miniaturization of the circuit board. In addition, stacking multiple external interfaces 112 in a direction perpendicular to the substrate 110 effectively reduces the space of the substrate 110 occupied by the external interface 112, further improving the space utilization rate of the substrate 110.

[0079] According to another aspect of the present application example, an electronic device is provided, the electronic device comprising the circuit board described in any of the above embodiments. The electronic device can be a server device such as a network security machine and a computer, or a terminal device such as a mobile phone, a computer, or a tablet, or other devices such as a television set and a speaker.

[0080] When electrostatic charges accumulate on the surface of the processor, the high voltage caused by the electrostatic charges will affect the performance of the processor or even directly damage the processor. Therefore, in order to ensure that the processor is not damaged by electrostatic charges, in some embodiments of the present application, such as Fig. 9 As shown, Fig. 9 A partial cross-sectional view of an electronic device provided by an embodiment of the utility model is shown, and the electronic device also includes a heat sink 300, which is in contact with the surface of the processor 120. The heat sink 300 is made of a conductive material, and the surface of the heat sink 300 is connected to the ground end of the substrate 110 so that the electrostatic charge on the surface of the processor 120 can be discharged from the ground end through the heat sink 300.

[0081] The processor 120 usually generates a lot of heat during operation. If the processor 120 is not cooled in time, the temperature of the processor 120 will be too high, which will affect the performance of the processor 120 or even damage the processor 120. Therefore, a heat sink 300 is usually set in the electronic device to absorb the heat generated by the processor 120 and transfer the heat to the surrounding environment. The heat sink 300 can be an air heat sink, and its material can be a metal material with strong thermal conductivity such as aluminum, copper, copper-aluminum alloy, steel, etc. Among them, the conductivity of copper is better than most conductive metals. Therefore, the heat sink 300 can be made of copper material, so that when the heat sink 300 absorbs the heat of the processor 120, it can also conduct the electrostatic charge accumulated on the surface of the processor 120 to the ground terminal of the substrate 110.

[0082] The surface of the heat sink 300 can be connected to a conductive structure (e.g., a conductive spring, a conductive column, etc.) disposed on the substrate 110, and then the conductive structure is connected to the ground terminal of the substrate 110 by arranging a circuit on the substrate 110, so that the static electricity accumulated on the surface of the processor 120 is discharged from the ground terminal through the heat sink 300, the conductive structure on the substrate 110 and the corresponding circuit. The surface of the heat sink 300 can also be connected to the ground terminal of the substrate 110 with the fixing screws that fix the heat sink 300, for example, the mounting holes on the substrate 110 connected to the fixing screws are connected to the ground terminal of the substrate 110, and the fixing screws and the mounting holes can be made of conductive metal materials, such as copper, iron, etc., so that the static electricity accumulated on the surface of the processor 120 is discharged from the ground terminal through the heat sink 300, the fixing screws and the mounting holes on the substrate 110. Of course, the above-mentioned multiple different connection methods can also be applied to the heat sink 300 together, so that the static electricity accumulated on the surface of the processor 120 can be discharged through multiple different channels, and the speed of static electricity discharge is faster.

[0083] The above-mentioned embodiment connects the heat sink 300 to the ground terminal on the substrate 110 so that after the heat sink 300 and the processor 120 are placed in close contact, in addition to absorbing the heat of the processor 120, it can also conduct the electrostatic charge on the surface of the processor 120 to the ground terminal on the substrate 110, so that the electrostatic charge can be discharged from the ground terminal, providing a good discharge path for the electrostatic charge on the surface of the processor 120, and effectively improving the electrostatic protection capability of the circuit board.

[0084] In order to further ensure the stability of the contact between the heat sink and the processor surface, in some embodiments of the present application, such as Fig. 9 and Fig.10 As shown, Fig.10 A three-dimensional diagram of a heat sink provided by an embodiment of the utility model is shown. A heating module 150 is further provided on the side of the substrate 110 where the processor 120 is located. The height of the heating module 150 is higher than the height of the processor 120. A first boss 310 is provided on the side of the heat sink 300 facing the processor 120. The first boss 310 is used to fit with the surface of the processor 120, and other positions of the heat sink 300 are used to fit with the heating module 150. The first boss 310 is made of a conductive material so that the electrostatic charge on the surface of the processor 120 can be discharged from the ground terminal after passing through the first boss 310 and the heat sink 300.

[0085] In addition to the processor 120, there are usually other heat generating modules 150 on the substrate 110, such as an image processor, a power management integrated circuit, a voltage regulating module, etc. However, when the temperature of these heat generating modules 150 is too high, the temperature inside the electronic device will be too low, and then the electronic components inside the electronic device will operate in a high temperature environment, which will not only affect the performance of the electronic device, but also cause damage to the electronic components inside the electronic device. Therefore, it is usually necessary to dissipate the heat of the heat generating modules 150 on the substrate 110. In addition, when the heat generating module 150 is located near the processor 120, the same heat sink 300 can usually be used to dissipate the heat of the heat generating module 150 and the processor 120 to reduce the number of heat sinks 300 in the electronic device.

[0086] like Fig. 9 As shown in FIG. 1 , when there is a height difference D3 between the heating module 150 and the processor 120, the heat sink 300 will be blocked by the heating module 150 when being set, so that the surface of the heat sink 300 cannot fit the surface of the processor 120. At this time, the electrostatic charge on the surface of the processor 120 cannot be discharged to the ground through the heat sink 300. Fig.10 As shown, a first boss 310 may be provided at a position on the surface of the heat sink 300 corresponding to the processor 120, so that Fig. 9 As shown, when the other surfaces of the heat sink 300 are in contact with the heat generating module 150, the first boss 310 can be in contact with the surface of the processor 120. Fig. 9 In addition to being set to be larger than the size of the processor 120 , it can also be set to be smaller than or equal to the size of the processor 120 .

[0087] The first boss 310 can be made of a conductive metal material with strong thermal conductivity, such as aluminum, copper, copper-aluminum alloy, and steel. The first boss 310 can be integrally formed with the heat sink 300, such as by integral injection molding, to simplify the production process of the heat sink 300. It can also be independently generated and connected by conductive screws, conductive clips, etc. In this way, first bosses 310 of different heights can be set on the surface of the heat sink 300 according to the height difference between the processor 120 and the heating module 150 on the substrate 110, so that the heat sink 300 can be more flexible to use and more applicable.

[0088] In the above embodiment, a first boss 310 is provided on the heat sink 300. When other surfaces of the heat sink 300 are in contact with the heating module 150, the heat sink 300 can be in contact with the surface of the processor 120 through the first boss 310, so that the contact stability between the heat sink 300 and the processor 120 is higher, thereby ensuring that the electrostatic charge on the surface of the processor 120 can be discharged from the ground end through the heat sink 300.

[0089] In order to ensure that the heat sink and the ground terminal on the substrate are stably connected, in some embodiments of the present application, such as Fig. 9 As shown, the heat sink 300 is connected to the ground terminal through the conductive component 320, so that the electrostatic charge on the surface of the processor 120 is discharged from the ground terminal through the heat sink 300 and the conductive component 320. The conductive component 320 can be set on the heat sink 300. For example, a conductive boss, a conductive spring sheet and other structures are set on the heat sink 300 as the conductive component 320. When the surface of the heat sink 300 is in contact with the surface of the processor 120, the end of the conductive component 320 facing away from the heat sink 300 will abut against the conductive point on the substrate 110 that is connected to the ground end. The conductive component 320 can also be set on the substrate 110. For example, a conductive boss, a conductive spring sheet and other structures are set on the substrate 110 as the conductive component 320, and the conductive component 320 is connected to the ground end on the substrate 110. When the surface of the heat sink 300 is in contact with the surface of the processor 120, the end of the conductive component 320 facing away from the substrate 110 abuts against the surface of the heat sink 300, so that the heat sink 300 is connected to the ground end on the substrate 110.

[0090] Of course, the conductive component 320 can not only be a separate structure, but also be composed of structures respectively arranged on the heat sink 300 and the substrate 110. For example, conductive bosses are respectively arranged on the heat sink 300 and the substrate 110. When the surface of the heat sink 300 is in contact with the surface of the processor 120, the conductive bosses on the heat sink 300 and the conductive bosses on the substrate 110 are abutted against each other, so that the heat sink 300 is connected to the ground terminal of the substrate 110 through the two conductive bosses. In the above embodiment, by setting the conductive component 320, the heat sink 300 is connected to the ground terminal on the substrate 110 through the conductive component 320, so that the connection between the heat sink 300 and the ground terminal on the substrate 110 is more stable.

[0091] In order to further ensure the stability of the connection between the heat sink and the substrate, in some embodiments of the present application, such as Fig.10 and Fig.11 As shown, Fig.11 Another partial cross-sectional view of an electronic device provided by an embodiment of the utility model is shown, wherein the conductive component includes a conductive spring piece 321 and a second boss 322, wherein the conductive spring piece 321 is disposed on the side of the substrate 110 facing the heat sink 300 and is connected to the grounding end of the substrate 110, and the second boss 322 is disposed on the side of the heat sink 300 facing the processor 120, and the second boss 322 is made of a conductive material, and the second boss 322 is used to contact the conductive spring piece 321 when the heat sink 300 and the processor 120 are attached, so that the electrostatic charge on the surface of the processor 120 can be discharged from the grounding end after passing through the heat sink 300, the second boss 322 and the conductive spring piece 321.

[0092] like Fig.10 As shown, the second boss 322 is a small protrusion disposed on the surface of the heat sink 300, and its overall volume is small to avoid occupying too much space on the heat sink 300. A plurality of second bosses 322 can be disposed on a heat sink 300 for connecting to the ground terminal of the substrate 110. The material and configuration of the second boss 322 are the same as those of the first boss 310, and will not be described again here. Fig.11 As shown, a conductive spring 321 is disposed on the substrate 110 at a position opposite to the second boss 322. The conductive spring 321 can be made of conductive metals such as aluminum, copper, copper-aluminum alloy, and steel. When the heat sink 300 and the processor 120 are attached to each other, the second boss 322 will contact the conductive spring 321, and the electrostatic charge on the surface of the processor 120 will flow from the second boss 322 on the heat sink 300 to the conductive spring 321, and then be discharged from the ground terminal through the conductive spring 321.

[0093] In the above embodiment, when the height of the second boss 322 of the heat sink 300 is too high due to a processing error, the second boss 322 can also compress the conductive spring sheet 321 to make the surface of the heat sink 300 fit with the processor 120, thereby ensuring the stability of the contact between the heat sink 300 and the processor 120. In addition, due to the presence of the second boss 322, it is not necessary to set a conductive spring sheet 321 with a large height on the substrate 110 to contact the surface of the heat sink 300, thereby further ensuring the stability of the contact between the conductive spring sheet 321 and the heat sink 300.

[0094] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A circuit board, characterized in that: The circuit board comprises: a substrate, a processor, a first M.2 connector and a second M.2 connector; The processor, the first M.2 connector and the second M.2 connector are arranged on the substrate; The first M.2 connector and the second M.2 connector are arranged adjacent to each other, the socket of the first M.2 connector and the socket of the second M.2 connector are oriented in the same direction, the socket of the first M.2 connector faces the side where the second M.2 connector is located, and the socket of the first M.2 connector is higher than the socket of the second M.2 connector, so that a projection of a first M.2 device connected to the first M.2 connector on the substrate and a projection of a second M.2 device connected to the second M.2 connector on the substrate at least partially overlap; The first M.2 connector and the second M.2 connector are electrically connected to the processor respectively.

2. The circuit board according to claim 1, characterized in that: The first M.2 connector has a first mounting area for accommodating the first M.2 device on one side of the socket, and the second M.2 connector has a second mounting area for accommodating the second M.2 device on one side of the socket, and the first mounting area and the second mounting area at least partially overlap on the substrate; The distance between the tail end of the second mounting area and the second M.2 connector is less than or equal to the distance between the tail end of the first mounting area and the second M.2 connector, wherein the tail end of the second mounting area is an end of the second mounting area away from the second M.2 connector, and the tail end of the first mounting area is an end of the first mounting area away from the first M.2 connector; A fixing point for fixing the first M.2 device connected to the first M.2 connector is provided on the substrate, and the fixing point is located within the first installation area and outside the second installation area or at the tail end of the second installation area.

3. The circuit board according to claim 2, characterized in that: The fixing point includes a fixing column and a fastener. The fixing column is arranged on the substrate. A fixing hole is opened on the fixing column. The fastener is used to pass through the opening at the rear end of the first M.2 device and connect with the fixing hole after the first M.2 device is connected to the first M.2 connector, so as to clamp and fix the first M.2 device.

4. The circuit board according to claim 1, characterized in that: A height difference between the socket of the first M.2 connector and the second M.2 connector is greater than or equal to a height of the second M.2 connector.

5. The circuit board according to any one of claims 1 to 4, characterized in that: A plurality of external interfaces are arranged on a side of the substrate away from the first M.2 connector, at least some of the plurality of external interfaces are stacked in a direction perpendicular to the substrate, and the plurality of external interfaces are used to connect external devices.

6. An electronic device, characterized in that: The electronic device comprises: a circuit board as described in any one of claims 1-5.

7. The electronic device according to claim 6, characterized in that: The electronic device also includes a radiator, which is in contact with the surface of the processor. The radiator is made of a conductive material, and the surface of the radiator is connected to the ground end of the substrate so that the electrostatic charge on the surface of the processor can be discharged from the ground end through the radiator.

8. The electronic device according to claim 7, characterized in that: A heating module is also provided on the side of the substrate where the processor is located, and the height of the heating module is higher than the height of the processor; A first boss is provided on the side of the heat sink facing the processor, the first boss is used to fit with the surface of the processor, and the other position of the heat sink is used to fit with the heating module. The first boss is made of conductive material so that the electrostatic charge on the surface of the processor can be discharged from the ground end after passing through the first boss and the heat sink.

9. The electronic device according to claim 7, characterized in that: The heat sink is connected to the ground terminal through a conductive component, so that the electrostatic charge on the surface of the processor is discharged from the ground terminal through the heat sink and the conductive component.

10. The electronic device according to claim 9, characterized in that: The conductive component includes a conductive spring and a second boss; The conductive spring is arranged on a side of the substrate facing the heat sink and is connected to a ground end of the substrate; The second boss is arranged on the side of the heat sink facing the processor, and the second boss is made of a conductive material. The second boss is used to contact the conductive spring sheet when the heat sink and the processor are in contact, so that the electrostatic charge on the surface of the processor can be discharged from the ground end after passing through the heat sink, the second boss and the conductive spring sheet.

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