Phased array SIP module based on LTCC technology

Abstract

The phased array SIP module based on the LTCC technology comprises an LTCC substrate, a connector, a phased array TR chip and a microstrip antenna unit which are packaged into a whole, the phased array TR chip and the high-low frequency connector are welded to one side of the LTCC substrate in a surface-mounted mode, the microstrip antenna unit is connected with the other side of the LTCC substrate in a ball planting mode, the LTCC substrate internally comprises a low-frequency circuit and a radio frequency circuit, and the low-frequency circuit is connected with the radio frequency circuit. The low-frequency circuit is connected with the phased array TR chip and the connector, and the radio-frequency circuit is connected with the phased array TR chip, the microstrip antenna unit and the connector. The phased array module can be used for solving the technical problem of low integration level of an existing phased array module and the problem of high cost caused by repeated pressing of a PCB, and has the advantage of miniaturization.

Description

Technical Field

[0001] The utility model relates to the technical field of antennas, and specifically relates to a phased array SIP module based on LTCC technology. Background Art

[0002] Under the requirements of portability, miniaturization and low cost, electronic products are gradually moving towards high-density interconnection and miniaturized design. Therefore, the technology of integrating antennas, substrates and chip systems together to form a SIP (System In a Package) radio frequency module has attracted increasing attention.

[0003] The existing process method is to directly fix the antenna on a PCB (Printed Circuit Board). One side of the printed circuit board is the antenna radiation side, and the other side is the chip and the main board. In addition, connectors are provided for the interconnection between the module and the outside world. However, in the module obtained by this method, the number of layers of the PCB is too many and the lamination times are too many, resulting in a high cost of the PCB, which does not meet the requirements of the low cost of the terminal product. Content of the Utility Model

[0004] To solve the above technical problems, the utility model provides a phased array SIP module based on LTCC technology, which can be used to solve the technical problems of low integration of existing phased array modules and high costs caused by multiple laminations of PCBs.

[0005] To achieve the above technical purpose, the technical solution adopted is: a phased array SIP module based on LTCC technology, including an LTCC substrate, a connector, a phased array TR chip and a microstrip antenna unit encapsulated as a whole. The phased array TR chip and the high and low frequency connectors are surface-mounted and welded to one side of the LTCC substrate, and the microstrip antenna unit is connected to the other side of the LTCC substrate by ball planting. The LTCC substrate includes low-frequency lines and radio frequency lines. The low-frequency lines connect the phased array TR chip and the connector, and the radio frequency lines connect the phased array TR chip, the microstrip antenna unit and the connector.

[0006] Further, the LTCC substrate is of a regular shape.

[0007] Further, the phased array TR chip is a Ka-band eight-channel phased array transmitting chip.

[0008] Further, the microstrip antenna unit is provided with an antenna board. An antenna radiator is etched on one side of the antenna board, and the other side of the antenna board is the antenna ground. A plurality of feed holes penetrate the antenna board. One end of the feed hole is connected to the antenna radiator, and the other end is not connected to the antenna ground. The feed holes and the antenna ground are connected to the LTCC substrate by ball planting.

[0009] Further, the antenna board is a dielectric board with a dielectric constant of 4350B.

[0010] The beneficial effects of the present utility model are as follows:

[0011] (1) By using multiple phased array TR chips and antennas, two polarization networks of horizontal polarization and vertical polarization are formed, thus realizing a dual-polarization multi-channel phased array layout. At the same time, the LTCC substrate and the antenna are integrated together by the method of ball planting, reducing the volume of the SIP module, so that the dual-polarization multi-channel phased array SIP module realized by the present invention has the characteristics of miniaturization and low cost.

[0012] (2) The phased array TR chips, connectors, etc. all adopt surface-mounted welding, improving the producibility of the SIP module and also improving the reliability of the phased array system composed of the SIP module realized based on the present invention. At the same time, the regular shape design of the LTCC substrate can effectively reduce the production and debugging difficulties brought by the special-shaped structure.

[0013] (3) The substrate is made of LTCC. Based on the laminated method of LTCC (low-temperature co-fired ceramic), the signal transmission and high-density interconnection functions at the SIP level are realized.

[0014] (4) Since the millimeter-wave frequency band has a relatively high frequency, the design accuracy requirements for the antenna are relatively high. The antenna radiator formed by etching in this application can meet the design accuracy requirements of the millimeter-wave frequency band for the antenna. At the same time, the designed microstrip antenna unit has a small size, is convenient for arbitrary arrangement and connection with the LTCC substrate, and uses an antenna board of a specific material, so the design accuracy of the antenna is higher. Description of the Drawings

[0015] Figure 1 is a schematic structural diagram of the present utility model;

[0016] Figure 2 is a side schematic diagram of the microstrip antenna of the present utility model;

[0017] Figure 3 is another schematic diagram of the microstrip antenna of the present utility model;

[0018] Figure 4 is a side schematic diagram of the LTCC substrate of the present utility model;

[0019] Figure 5 is another side schematic diagram of the LTCC substrate of the present utility model;

[0020] In the figure: 1, LTCC substrate; 2, phased array TR chip; 3, connector; 4, microstrip antenna unit; 401, antenna board; 402, antenna radiator; 403, antenna ground; 404, feed hole. Detailed Embodiments

[0021] The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application.

[0022] The terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to limit the present application. As used in the specification and appended claims of the present application, the singular forms "a", "an", "the", "above-mentioned", "said", and "this" are also intended to include expressions such as "one or more", unless the context clearly indicates otherwise. It should also be understood that in the following embodiments of the present application, "at least one" and "one or more" mean one, two, or more than two, and "a plurality" means two or more than two. The term "and / or" is used to describe the associated relationship of associated objects and means that three relationships can exist; for example, A and / or B can mean: A exists alone, A and B exist simultaneously, and B exists alone, where A and B can be singular or plural. The character " / " generally means that the associated objects before and after are in an "or" relationship. References to "one embodiment" or "some embodiments" in this specification mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. Thus, statements such as "in one embodiment", "in some embodiments", "in other some embodiments", "in still other embodiments" and the like that appear in different places in this specification are not necessarily all referring to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in another way. The terms "comprising", "including", "having" and their variants all mean "including but not limited to", unless otherwise specifically emphasized in another way.

[0023] In the description of the present application, it should be noted that, unless otherwise clearly defined and limited, the terms "install", "connect", and "couple" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or a contact connection or an integral connection. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present application according to specific circumstances.

[0024] In the description of this specification, specific features, structures, materials, or characteristics can be combined in a suitable manner in any one or more embodiments or examples.

[0025] Such as Figure 1As shown in the figure, a phased array SIP module based on LTCC technology includes an LTCC substrate 1, a connector 3, a phased array TR chip 2, and a microstrip antenna unit 4, which are packaged into one body. The packaged housing structure is not shown in the figure, and its size and shape are not limited. The phased array TR chip 2 and the connector 3 are soldered to one side of the LTCC substrate 1 in a surface-mounting manner, which improves the producibility and connection reliability. The microstrip antenna unit 4 is connected to the other side of the LTCC substrate 1 by ball grid array, which can reduce the volume of the SIP module, improve the integration degree, have low cost, and stable connection performance. The role of the connector is to be used for the interconnection between the SIP module and the outside world. The LTCC substrate 1 includes low-frequency lines and radio-frequency lines. The low-frequency lines connect the phased array TR chip 2 and the connector 3, and the radio-frequency lines connect the phased array TR chip 2, the microstrip antenna unit 4, and the connector 3. By connecting each component through internal lines, the antenna and the chip are integrated in the same cavity, enhancing the integration and reducing the size, and reducing the cost.

[0026] The advantages of the SIP module formed by the antenna based on this application are mainly reflected in: it can provide a larger electromagnetic space for terminal products by changing the module and reducing the size, so as to integrate more functions; and through mature processes such as SMT (Surface Mounted Technology) surface mounting, the processing difficulty of the industrial chain is reduced; in addition, the SIP module can also achieve better electromagnetic shielding function. Integrating the antenna and the LTCC substrate together improves the integration degree of the module and solves the problem of low miniaturization degree of the existing module. The function of dual beams is realized by software controlling the beam switching of the chip.

[0027] For the surface shape of the LTCC substrate, see Figure 4 、 Figure 5 (Low Temperature Co-fired Ceramic); in some embodiments of this application, the substrate is LTCC (Low Temperature Co-fired Ceramic) low temperature co-fired ceramic, which is formed by co-firing and stacking multiple layers of ceramics. Different from the PCB board that needs to be laminated multiple times, its cost also does not increase exponentially with multiple laminations like the PCB board. It contains low-frequency lines and radio-frequency lines inside, is the support body of the SIP module in this application, and is also the carrier for realizing electrical interconnection and signal transmission. The LTCC substrate has the dual functions of conductive lines and support for heat dissipation.

[0028] The internal lines of the LTCC substrate adopt printed circuits, which can realize the functions of electrical connection and radio-frequency signal transmission; at the same time, using LTCC as the substrate is heat-resistant, not easy to warp and deform, and has good heat conduction effect, which can quickly dissipate a large amount of heat generated during the operation of the chip.

[0029] Such as Figure 4 、 Figure 5As shown, the LTCC substrate 1 has a regular shape, and its square structure facilitates the connection and arrangement of components, effectively reducing the production and debugging difficulties brought by irregular structures. Figure 4 One side of it is used for corresponding connection with the phased array TR chip 2, Figure 5 and one side of it is used for connection with the microstrip antenna unit 4.

[0030] The phased array TR chip 2 is an eight-channel phased array transmitting chip in the Ka band, which can make the entire SIP module applicable to the Ka band, making it more convenient to cope with the high frequency and short wavelength of the millimeter wave band. The corresponding circuit structure has a small size, and there are very strict requirements for various aspects such as circuit processing, structural processing, and assembly technology.

[0031] As Figure 2 , Figure 3 shown, the microstrip antenna unit 4 is provided with an antenna board 401. The antenna board 401 is a PCB dielectric board. An antenna radiator 402 is etched on one side of the antenna board 401. The shape of the antenna radiator 402 is not limited and can be reasonably designed according to needs. The antenna radiator 402 formed by etching is convenient to form, has a small size, high integration, and more accurate design accuracy, and can meet the design accuracy requirements of the antenna for the millimeter wave band frequency. The metal layer formed by etching is very flat, and the roughness of the metal layer is very good, which is very advantageous for the design of the millimeter wave phased array antenna in the Ka band. Due to the very high frequency band, the radio frequency performance of the antenna has relatively high requirements for roughness.

[0032] On the other side of the antenna board 401 is the antenna ground 403. A plurality of feed holes 404 penetrate the antenna board 401. The number of feed holes 404 can be designed according to the antenna radiator 402. As Figure 3 shown, the number of feed holes corresponding to each antenna radiator 402 is 8. One end of the feed hole 404 is connected to the antenna radiator 402, and the other end is not connected to the antenna ground 403. There is a ring of holes outside the feed hole in the figure, and the antenna ground is around the hole ring, so that the feed hole 404 does not contact and is not connected to the antenna ground 403. The feed hole 404 and the antenna ground 403 are connected to the LTCC substrate 1 by ball implantation. The antenna board 401 is a dielectric board with a dielectric constant of 4350B, which can further improve the overall performance of the antenna, meet the design accuracy requirements of the antenna, and be more suitable for the millimeter wave band frequency.

[0033] The above embodiments are only used to illustrate the technical solutions of the present application and do not limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A phased array SIP module based on LTCC technology, characterized by: The invention comprises an LTCC substrate (1), a connector (3), a phased array TR chip (2) and a microstrip antenna unit (4) which are packaged as one body; the phased array TR chip (2) and the connector (3) are soldered to one side of the LTCC substrate (1) by patch type; the microstrip antenna unit (4) is connected to the other side of the LTCC substrate (1) by ball planting; the LTCC substrate (1) comprises a low-frequency circuit and a radio-frequency circuit; the low-frequency circuit connects the phased array TR chip (2) and the connector (3); and the radio-frequency circuit connects the phased array TR chip (2), the microstrip antenna unit (4) and the connector (3).

2. The phased array SIP module based on LTCC process as claimed in claim 1, characterized in that: The LTCC substrate (1) is of regular shape.

3. The phased array SIP module based on LTCC process as claimed in claim 1, characterized in that: The phased array TR chip (2) is a Ka-band eight-channel phased array transmitting chip.

4. The phased array SIP module based on LTCC process as claimed in claim 1, characterized in that: The microstrip antenna unit (4) is provided with an antenna plate (401), an antenna radiator (402) is etched on one side of the antenna plate (401), the other side of the antenna plate (401) is an antenna ground (403), a plurality of feeding holes (404) penetrate the antenna plate (401), one end of the feeding hole (404) is connected to the antenna radiator (402), and the other end is not connected to the antenna ground (403), and the feeding hole (404) and the antenna ground (403) are connected to the LTCC substrate (1) by ball planting.

5. The phased array SIP module based on LTCC process as claimed in claim 4, characterized in that: The antenna board (401) is a dielectric board with a dielectric constant of 4350B.

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