Carrier for board-level packaging electroplating

Abstract

The utility model belongs to the technical field of electroplating carriers, and discloses a carrier for board-level packaging electroplating. The carrier for board-level packaging electroplating comprises a carrier mechanism and a locking mechanism, the carrier mechanism comprises an upper carrier assembly and a lower carrier assembly, a carrier is placed on the lower carrier assembly, and the upper carrier assembly can cover the lower carrier assembly; the number of the locking mechanisms is four, the four locking mechanisms are arranged on the periphery of the carrier mechanism in a surrounding mode, each locking mechanism has a first state and a second state, and when the upper carrier assembly covers the lower carrier assembly, the locking mechanisms are switched to the second states so that the upper carrier assembly and the lower carrier assembly can be locked and fixed. The carrier for board-level packaging electroplating solves the problem that a traditional carrier cannot adapt to the requirement of a board-level packaging double-sided electroplating process, and through cooperation of the carrier mechanism and the locking mechanism, the stability of the carrier in the electroplating process is ensured, so that the uniformity and binding force of an electroplated layer are ensured, and the quality of double-sided electroplating is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating carriers, in particular to a carrier for board-level packaging electroplating. Background Art

[0002] Electroplating refers to electrochemical deposition, which uses electrolysis to deposit one or more layers of metal (such as copper, gold, etc.) on the surface of a carrier to form a uniform, dense, and well-bonded metal layer. At present, 5G and autonomous driving have driven a large number of chip demands. Many sensors and radio frequency chips required for applications have low requirements for line width and line pitch and focus on reducing production costs. Currently, the effective area of ordinary wafer-level electroplating is low, the requirements for line width and line pitch are high, and the cost is relatively high. This drives the continuous progress of FOPLP towards multi-chip integration; under the demand of cost reduction, it develops towards large-size board-level packaging. However, the carriers used for wafer packaging in the prior art cannot meet the requirements of large-size board-level packaging.

[0003] Therefore, a carrier for board-level packaging electroplating is needed to solve the above problems. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a carrier for board-level packaging electroplating. Through the cooperation of the carrier mechanism and the locking mechanism, the absolute stability of the carrier during the electroplating process is ensured, thereby guaranteeing the uniformity and bonding force of the electroplating layer and the quality of double-sided electroplating.

[0005] To achieve this purpose, the utility model adopts the following technical solutions:

[0006] A carrier for board-level packaging electroplating, comprising:

[0007] A carrier mechanism, which includes an upper carrier component and a lower carrier component. The carrier is placed on the lower carrier component, and the upper carrier component can be covered on the lower carrier component;

[0008] A locking mechanism, with four locking mechanisms respectively surrounding the periphery of the carrier mechanism. The locking mechanism has a first state and a second state. When the upper carrier component is covered on the lower carrier component, the locking mechanism switches to the second state to lock and fix the upper carrier component and the lower carrier component.

[0009] Preferably, the locking mechanism includes:

[0010] A locking plate, which is provided with a rotating shaft, and the locking plate can rotate around the rotating shaft;

[0011] A driving component, which can drive the locking plate to rotate to switch between the first state and the second state.

[0012] Preferably, the driving assembly includes:

[0013] A first driving member, the output end of the first driving member can move towards the carrier mechanism to drive the locking plate to rotate to the first state;

[0014] An elastic member, the elastic member can drive the locking plate to rotate to the second state.

[0015] Preferably, the locking plate includes:

[0016] A body and a locking portion protruding from the body. In the second state, the locking portion presses against the upper carrier assembly.

[0017] Preferably, the lower carrier assembly includes:

[0018] A lower carrier plate, the lower carrier plate has a first opening, and the carrier is placed on the lower carrier plate and covers the first opening;

[0019] A first sealing member, the first sealing member surrounds the carrier;

[0020] A first wire, the first wire surrounds the first sealing member;

[0021] A second sealing member, the second sealing member surrounds the first wire.

[0022] Preferably, a receiving groove is further formed on the lower carrier plate, and the carrier is clamped in the receiving groove.

[0023] Preferably, the upper carrier assembly includes:

[0024] An upper carrier plate, the upper carrier plate has a second opening, and the second opening is opposite to the first opening;

[0025] A third sealing member, the third sealing member is opposite to the first sealing member;

[0026] A second wire, the second wire is opposite to the first wire;

[0027] A fourth sealing member, the fourth sealing member is opposite to the second sealing member.

[0028] Preferably, the carrier for board-level packaging electroplating further includes:

[0029] A carrier stage, both the carrier mechanism and the locking mechanism are arranged on the carrier stage.

[0030] Preferably, the carrier for board-level packaging electroplating further includes:

[0031] A second driving member capable of pressing the upper carrier assembly against the lower carrier assembly.

[0032] Preferably, the number of the second driving members is plural, and the plural second driving members are distributed around the outer periphery of the carrier mechanism.

[0033] Advantages of the present utility model:

[0034] This carrier for board-level packaging electroplating includes a carrier mechanism and a locking mechanism. The carrier mechanism includes an upper carrier assembly and a lower carrier assembly. The carrier is placed on the lower carrier assembly, and the upper carrier assembly can cover the lower carrier assembly; the number of the locking mechanisms is four, and the four locking mechanisms are respectively disposed around the carrier mechanism. The locking mechanism has a first state and a second state. When the upper carrier assembly covers the lower carrier assembly, the locking mechanism switches to the second state to lock and fix the upper carrier assembly and the lower carrier assembly.

[0035] In use, first place the carrier on the lower carrier assembly, and then accurately cover the upper carrier assembly on the lower carrier assembly. At this time, it can ensure that both sides of the carrier are exposed, preparing for the subsequent double-sided electroplating; when the upper carrier assembly covers the lower carrier assembly, the four locking mechanisms distributed around the carrier mechanism switch to the second state, tightly locking the upper carrier assembly and the lower carrier assembly, ensuring that the position of the carrier will not shift due to liquid flow, bubble generation or other external factors during the electroplating process, thereby ensuring the uniformity and density of the electroplating layer. This carrier for board-level packaging electroplating solves the problem that the traditional carrier cannot meet the requirements of the board-level double-sided electroplating process. Through the cooperation of the carrier mechanism and the locking mechanism, the stability of the carrier during the electroplating process is ensured, thereby ensuring the uniformity and bonding force of the electroplating layer and the quality of the double-sided electroplating. Description of the Drawings

[0036] Figure 1 is a schematic structural view of the carrier for board-level packaging electroplating provided by the present utility model;

[0037] Figure 2 is a cross-sectional view of the carrier for board-level packaging electroplating provided by the present utility model in the first state;

[0038] Figure 3 is Figure 2 a partial enlarged view of part A in

[0039] Figure 4 is a cross-sectional view of the carrier for board-level packaging electroplating provided by the present utility model in the second state;

[0040] Figure 5 is Figure 4 a partial enlarged view of part B in

[0041] Figure 6 is a schematic structural view of the locking plate provided by the present utility model;

[0042] Figure 7 is a schematic structural view of the upper carrier assembly provided by the present utility model;

[0043] Figure 8 is a schematic structural view of the lower carrier assembly provided by the present utility model.

[0044] In the figure:

[0045] 1. Carrier mechanism; 11. Upper carrier assembly; 111. Upper carrier plate; 1111. Second opening; 112. Third seal; 113. Second wire; 114. Fourth seal; 12. Lower carrier assembly; 121. Lower carrier plate; 1211. First opening; 1212. Fixing part; 122. First seal; 123. First wire; 124. Second seal; 125. Accommodating groove;

[0046] 21. Locking plate; 211. Body; 212. Locking part; 22. Rotating shaft; 23. First driving member;

[0047] 3. Carrier table;

[0048] 4. Second driving member. Detailed implementation manners

[0049] The present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present utility model, rather than limiting the present utility model. Additionally, it should be noted that for the convenience of description, only the parts related to the present utility model rather than all the structures are shown in the drawings.

[0050] In the description of the present utility model, unless otherwise clearly defined and limited, the terms "connected", "connected to", and "fixed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0051] In the present utility model, unless otherwise clearly specified and defined, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may also include the situation where the first and second features are not in direct contact but in contact through additional features therebetween. Moreover, the first feature being "above", "over" and "on top of" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "under" and "beneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely indicates that the horizontal height of the first feature is lower than that of the second feature.

[0052] In the description of this embodiment, the orientation or positional relationships such as "above", "below", "right", etc. are based on the orientation or positional relationship shown in the drawings. It is only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0053] Electroplating refers to electrochemical deposition. By means of electrolysis, one or more layers of metals (such as copper, gold, etc.) are deposited on the surface of a carrier to form a uniform, dense and well-bonded metal layer. At present, 5G and autonomous driving have driven a large demand for chips. Many sensors and radio frequency chips required for applications have low requirements for line width and line pitch and focus on reducing production costs. At present, the effective area of ordinary wafer-level electroplating is low, the requirements for line width and line pitch are high and the cost is relatively high. This drives the continuous progress of FOPLP towards multi-chip integration; under the demand of cost reduction, it develops towards large-size board-level packaging. However, the carriers used for wafer packaging in the prior art cannot meet the requirements of large-size board-level packaging.

[0054] To solve the above problems, as Figures 1-8 shown, this embodiment provides a carrier for board-level packaging electroplating. This carrier for board-level packaging electroplating includes a carrier mechanism 1 and a locking mechanism. The carrier mechanism 1 includes an upper carrier assembly 11 and a lower carrier assembly 12. The carrier is placed on the lower carrier assembly 12, and the upper carrier assembly 11 can cover the lower carrier assembly 12; the number of the locking mechanisms is four, and the four locking mechanisms are respectively arranged around the periphery of the carrier mechanism 1. The locking mechanism has a first state and a second state. When the upper carrier assembly 11 covers the lower carrier assembly 12, the locking mechanism switches to the second state to lock and fix the upper carrier assembly 11 and the lower carrier assembly 12.

[0055] In use, first place the carrier on the download vehicle component 12, and then precisely cover the upload vehicle component 11 on the download vehicle component 12. At this time, both sides of the carrier can be ensured to be exposed, preparing for the subsequent double-sided electroplating; when the upload vehicle component 11 is covered on the download vehicle component 12, the four locking mechanisms distributed around the vehicle mechanism 1 switch to the second state, tightly locking the upload vehicle component 11 and the download vehicle component 12, ensuring that the position of the carrier will not shift due to liquid flow, bubble generation or other external factors during the electroplating process, thereby ensuring the uniformity and density of the electroplating layer. This carrier for board-level packaging electroplating solves the problem that traditional carriers cannot meet the requirements of the board-level packaging double-sided electroplating process. Through the cooperation of the vehicle mechanism 1 and the locking mechanism, the stability of the carrier during the electroplating process is ensured, thereby ensuring the uniformity and bonding force of the electroplating layer and guaranteeing the quality of double-sided electroplating.

[0056] Specifically, as Figures 2-5 shown, the locking mechanism includes a locking plate 21 and a driving component. The locking plate 21 is provided with a rotating shaft 22 passing through it. The locking plate 21 can rotate around the rotating shaft 22, and the driving component can drive the locking plate 21 to rotate to switch between the first state and the second state. In the first state, the locking plate 21 is in an open position. At this time, its projection in the Z-axis direction does not coincide with the download vehicle component 12, and the upload vehicle component 11 and the download vehicle component 12 can be freely separated or buckled; after the upload vehicle component 11 is covered on the download vehicle component 12, the locking plate 21 rotates around the rotating shaft 22, and the upper end of the locking plate 21 gradually approaches the vehicle mechanism 1 and finally presses on the upload vehicle component 11, tightly fixing the upload vehicle component 11 and the download vehicle component 12 together through the pressure and friction generated by physical contact. The locking and unlocking of the carrier can be quickly realized by the rotation of the locking plate 21, with a simple structure and high working efficiency.

[0057] In the specific implementation process, as Figure 8 shown, two fixing parts 1212 are convexly provided on the four side walls of the download vehicle component 12. The two fixing parts 1212 are arranged at intervals along the extending direction of the side wall. The two ends of the rotating shaft 22 are respectively fixedly provided on the two fixing parts 1212, so that the locking plate 21 is fixed to the download vehicle component 12 as a whole, facilitating subsequent locking operations.

[0058] In some embodiments, the output end of the driving component is pivotally connected to the locking plate 21. When the driving component moves towards the vehicle mechanism 1, the locking plate 21 rotates to the first state under the drive of the driving component; when the driving component moves away from the vehicle mechanism 1, the locking plate 21 rotates to the second state under the drive of the driving component.

[0059] In this embodiment, as Figures 2-5As shown, the driving assembly includes a first driving member 23 and an elastic member (not shown in the figure). The output end of the first driving member 23 can move towards the vehicle mechanism 1 to drive the locking plate 21 to rotate to the first state, and the elastic member can drive the locking plate 21 to rotate to the second state. When it is necessary to switch to the first state, the first driving member 23 moves towards the vehicle mechanism 1, so that the locking plate 21 rotates to the first state driven by the first driving member 23; when it is necessary to switch to the second state, the first driving member 23 moves away from the vehicle mechanism 1. At this time, the first driving member 23 does not drive the locking plate 21, and the locking plate 21 rotates to the second state driven by the elastic member. This design combines the active driving of the first driving member 23 and the passive reset function of the elastic member, realizing the fast and reliable switching of the state of the locking plate 21. When unlocking is required, the first driving member 23 actively pushes the locking plate 21 to the first state, which is rapid and convenient; during the locking process, once the first driving member 23 withdraws, the elastic member automatically takes over and pulls the locking plate 21 back to the second state steadily to complete the locking action. This design with dual power sources not only improves the flexibility and response speed of the operation, but also ensures the stability and durability of the locking mechanism, effectively reducing operation problems caused by single-component failures.

[0060] In some embodiments, the first driving member 23 is a motor, and in other embodiments, the first driving member 23 is a cylinder. It should be noted that any mechanism in the prior art that can drive the locking plate 21 to rotate can be used as the first driving member 23 in this embodiment, and this embodiment does not make any limitations in this regard.

[0061] Specifically, as Figure 6 shown, the locking plate 21 includes a body 211 and a locking portion 212 protruding from the body 211. In the second state, the locking portion 212 presses against the upper vehicle component 11. By protruding the locking portion 212 on the body 211 and enabling the locking portion 212 to press against the upper vehicle component 11 in the second state, the locking function can be directly and effectively realized. The close contact between the locking portion 212 and the upper vehicle component 11 not only enhances the stability of the locking, but also ensures the accuracy and reliability of the locking action. It can be understood that the rotating shaft 22 passes through the body 211.

[0062] Specifically, as Figure 8As shown, the downloading tool assembly 12 includes a downloading plate 121, a first seal 122, a first wire 123, and a second seal 124. The downloading plate 121 has a first opening 1211. The carrier is placed on the downloading plate 121 and covers the first opening 1211. The first seal 122 surrounds the carrier. The first wire 123 surrounds the first seal 122. The second seal 124 surrounds the first wire 123. By providing the first opening 1211, one side surface of the carrier can be exposed to the electroplating solution. By providing the first seal 122 and the second seal 124 respectively inside and outside the first wire 123, it is ensured that the first wire 123 is isolated from the electroplating solution during electroplating, ensuring the stability and safety of the electroplating process.

[0063] In this embodiment, as Figure 8 shown, a receiving groove 125 is further provided on the downloading plate 121. The carrier is clamped in the receiving groove 125. The design of the receiving groove 125 enables the carrier to be accurately clamped therein, avoiding the movement or deviation of the carrier during electroplating. This precise positioning improves the accuracy of electroplating.

[0064] Furthermore, as Figure 7 shown, the uploading tool assembly 11 includes an uploading plate 111, a third seal 112, a second wire 113, and a fourth seal 114. The uploading plate 111 has a second opening 1111. The second opening 1111 is opposite to the first opening 1211. The third seal 112 is opposite to the first seal 122. The second wire 113 is opposite to the first wire 123. The fourth seal 114 is opposite to the second seal 124. The second opening 1111 being opposite to the first opening 1211 ensures that when the uploading tool assembly 11 is covered on the downloading tool assembly 12, the carrier can cover the second opening 1111, enabling the other side surface of the carrier to be exposed to the electroplating solution. The third seal 112 being opposite to the first seal 122 and the fourth seal 114 being opposite to the second seal 124 result in better sealing performance after the uploading tool assembly 11 and the downloading tool assembly 12 are buckled, ensuring that the first wire 123 and the second wire 113 can be isolated from the electroplating solution.

[0065] Specifically, as Figure 1 shown, this carrier for board-level packaging electroplating further includes a carrier table 3. The carrier mechanism 1 and the locking mechanism are both provided on the carrier table 3. The carrier table 3 serves as a stable support platform, capable of carrying and fixing the carrier mechanism 1 and the locking mechanism, enabling them to maintain a stable position and state during operation, and making the installation, debugging, replacement, and maintenance of the carrier mechanism 1 and the locking mechanism more convenient.

[0066] Specifically, as Figure 1As shown, the carrier for board-level packaging electroplating further includes a second driving member 4, and the second driving member 4 can press the upper carrier assembly 11 against the lower carrier assembly 12. After the upper carrier assembly 11 is placed on the lower carrier assembly 12 and aligned, the second driving member 4 presses against the upper carrier assembly 11, so that the upper carrier assembly 11 and the lower carrier assembly 12 are pressed tightly and sealed. Then, the locking plate 21 switches to the second state to lock the upper carrier assembly 11 and the lower carrier assembly 12. Finally, the second driving member 4 releases the locking of the upper carrier assembly 11 and the lower carrier assembly 12. By first allowing the second driving member 4 to press and lock the upper carrier assembly 11 and the lower carrier assembly 12, and then allowing the locking mechanism to lock the carrier mechanism 1, on the one hand, it can ensure that the upper carrier assembly 11 and the lower carrier assembly 12 will not be misaligned; on the other hand, since a first sealing member 122 and the like are provided between the upper carrier assembly 11 and the lower carrier assembly 12, the upper carrier assembly 11 and the lower carrier assembly 12 can be pressed tightly under the action of the second driving member 4, so that the elastic member can be passively reset and then the carrier mechanism 1 can be locked.

[0067] In this embodiment, as Figure 1 shown, the number of the second driving members 4 is multiple, and the multiple second driving members 4 are distributed around the outer periphery of the carrier mechanism 1. The multiple second driving members 4 are evenly distributed around the outer periphery of the carrier mechanism 1, and can provide uniform force when pressing against the upper carrier assembly 11. This uniform force application helps to ensure full and tight contact between the upper carrier assembly 11 and the lower carrier assembly 12.

[0068] In this embodiment, the second driving member 4 is a cylinder.

[0069] Obviously, the above embodiments of the present invention are only examples for clearly explaining the present invention, and are not intended to limit the implementation manners of the present invention. For those of ordinary skill in the art, various obvious changes, re-adjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to enumerate all the implementation manners here. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the claims of the present invention.

Claims

1. A carrier for board-level packaging electroplating, characterized in that: include: A carrier mechanism (1), the carrier mechanism (1) comprising an upper carrier assembly (11) and a lower carrier assembly (12), the carrier being placed on the lower carrier assembly (12), and the upper carrier assembly (11) being capable of covering the lower carrier assembly (12); A locking mechanism, wherein four locking mechanisms are respectively arranged around the carrier mechanism (1), and the locking mechanism has a first state and a second state. When the upper carrier assembly (11) is covered on the lower carrier assembly (12), the locking mechanism switches to the second state to lock and fix the upper carrier assembly (11) and the lower carrier assembly (12).

2. The board-level packaging electroplating carrier according to claim 1, characterized in that: The locking mechanism comprises: A locking plate (21), wherein the locking plate (21) is provided with a rotating shaft (22), and the locking plate (21) is capable of rotating around the rotating shaft (22); A driving assembly is capable of driving the locking plate (21) to rotate so as to switch between the first state and the second state.

3. The carrier for board-level packaging electroplating according to claim 2, characterized in that: The drive assembly comprises: A first driving member (23), wherein an output end of the first driving member (23) is capable of moving toward the carrier mechanism (1) to drive the locking plate (21) to rotate to the first state; An elastic member, wherein the elastic member is capable of driving the locking plate (21) to rotate to the second state.

4. The carrier for board-level packaging electroplating according to claim 2, characterized in that: The locking plate (21) comprises: A main body (211) and a locking portion (212) protruding from the main body (211); in the second state, the locking portion (212) presses against the upper carrier assembly (11).

5. The board-level packaging electroplating carrier according to claim 1, characterized in that: The lower tool assembly (12) comprises: A download board (121), the download board (121) having a first opening (1211), the carrier being placed on the download board (121) and covering the first opening (1211); A first sealing member (122), the first sealing member (122) surrounding the carrier; A first conductive wire (123), wherein the first conductive wire (123) surrounds the first sealing member (122); A second sealing member (124), wherein the second sealing member (124) surrounds the first conductive wire (123).

6. The carrier for board-level packaging electroplating according to claim 5, characterized in that: The download plate (121) is also provided with a receiving groove (125), and the carrier is clamped in the receiving groove (125).

7. The carrier for board-level packaging electroplating according to claim 5, characterized in that: The upper carrier assembly (11) comprises: An upper loading plate (111), the upper loading plate (111) having a second opening (1111), the second opening (1111) being opposite to the first opening (1211); a third sealing member (112), the third sealing member (112) being opposite to the first sealing member (122); A second conductive wire (113), the second conductive wire (113) being opposite to the first conductive wire (123); A fourth sealing member (114), the fourth sealing member (114) is opposite to the second sealing member (124).

8. The carrier for board-level packaging electroplating according to any one of claims 1 to 7, characterized in that: The carrier for the board-level packaging electroplating further comprises: A carrier (3), the carrier mechanism (1) and the locking mechanism are both arranged on the carrier (3).

9. The carrier for board-level packaging electroplating according to claim 8, characterized in that: The carrier for the board-level packaging electroplating further comprises: A second driving member (4), wherein the second driving member (4) is capable of pressing the upper carrier assembly (11) against the lower carrier assembly (12).

10. The board-level packaging electroplating carrier according to claim 9, characterized in that: There are a plurality of second driving members (4), and the plurality of second driving members (4) are distributed around the periphery of the carrier mechanism (1).

Images