Circuit packaging module
By installing structural parts on the PCB substrate and injecting sealant into the space surrounding it to form a second glue filling layer, the problem of high cost in the prior art is solved, and effective protection is achieved between the docking plug-in socket and the external circuit connection part, while reducing the total glue filling amount and production cost.
Patent Information
- Application Number
- CN202422010675.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-16
- Publication Date
- 2025-06-13
- Estimated Expiration
- 2034-08-16
AI Technical Summary
When protecting PCB boards with connectors in the prior art, the amount of glue is large, resulting in high cost.
By installing the structural members on the PCB substrate, only the connector is arranged around the connector, and the non-connector is protected by the first glue filling layer. In addition, sealant is injected into the space surrounding the structural member to form a second glue filling layer to target the portion connected to the connector and the external circuit.
The total amount of sealant in the circuit packaging module is reduced, the production cost is reduced, and the connector's seat and external circuit connection are effectively protected.
Smart Images
Figure CN222981758U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of integrated circuit packaging technology, and particularly to a circuit packaging module. Background Art
[0002] Since the packaging of circuits requires moisture and waterproof protection, potting the PCB board can effectively isolate the electronic components installed on the PCB board from the outside world, achieving the purpose of moisture and waterproof protection.
[0003] Potting the PCB board is commonly used in explosion-proof, waterproof and other products. The commonly used method in the market is to add potting layers on the top and back of the PCB board. However, for a PCB board with connectors, the above method cannot protect the seats of the connectors. If it is necessary to protect the seats of the connectors, the existing method is to wrap the entire PCB board with a structural member, and after the connectors are connected, pot the cavity formed by surrounding the structural member, so that the sealing glue covers both the seats of the connectors and the non-connectors at the same time. However, this method occupies a large amount of product space and requires a large amount of potting glue, resulting in too high cost. Summary of the Utility Model
[0004] In order to solve the deficiencies of the prior art, the purpose of this application is to provide a circuit packaging module to solve the problem of high cost caused by a large amount of potting glue when protecting the connectors.
[0005] To achieve the above purpose, this application adopts the following technical solutions:
[0006] A circuit packaging module includes a PCB substrate, connectors, non-connectors, a first potting layer, a structural member and a second potting layer; the connectors are installed on the PCB substrate, and the connectors have seats for connecting with external circuits; the non-connectors are installed on the PCB substrate and are electrically connected to the connectors through the PCB substrate; the first potting layer is located on at least one side of the PCB substrate and covers the non-connectors; the structural member is installed on the PCB substrate and is arranged around the connectors; the second potting layer is located inside the structural member, so that the part of the seat for connecting with the external circuit is covered by the second potting layer.
[0007] Further, the PCB substrate has first positioning holes, the first positioning holes are distributed on the outer edge of the connectors, and one side of the structural member facing the PCB substrate has a matching part, and at least part of the matching part is inserted into the first positioning holes.
[0008] Further, the first potting layer covers one surface of the PCB substrate, and the structural member and the first potting layer are located on the same side surface of the PCB substrate, and the bottom surface of the structural member facing the PCB substrate is attached to the first potting layer or the PCB substrate.
[0009] Further, the first potting layer has a through portion that penetrates through two opposite surfaces of the first potting layer, such that the connector passes through the through portion; the bottom surface of the structural member is attached to the PCB substrate, and at least a part of the structural member is disposed within the through portion, and there is a gap between the edge of the through portion and the side surface of the structural member in a direction perpendicular to the plugging direction of the connector; or, the edge of the through portion is attached to the side surface of the structural member in a direction perpendicular to the plugging direction of the connector.
[0010] Further, the first potting layer has a through portion that penetrates through two opposite surfaces of the first potting layer, such that the connector passes through the through portion; the bottom surface of the structural member is attached to the first potting layer, and the edge of the through portion overlaps with the inner contour of the structural member in the plugging direction of the connector; or, the area surrounded by the edge of the through portion is smaller than the area surrounded by the inner contour of the structural member.
[0011] Further, the PCB substrate has a first positioning hole, the first positioning holes are distributed on the outer edge of the connector, and the side of the structural member facing the PCB substrate has a mating portion, at least a part of the mating portion is embedded within the first positioning hole; the first potting layer has a second positioning hole that penetrates through two opposite surfaces of the first potting layer, wherein the axis of the second positioning hole is substantially coincident with the axis of the first positioning hole.
[0012] Further, when non-connectors are respectively mounted on two opposite surfaces of the PCB substrate, the first potting layer respectively covers the two surfaces of the PCB substrate.
[0013] Further, the first positioning hole includes a through hole or a blind hole into which the mating portion can be inserted, the through hole penetrates through two opposite surfaces of the PCB substrate, the mating portion is disposed within the first positioning hole and plugs the through hole;
[0014] or, the first potting layer located on the surface of the PCB substrate facing away from the connector plugs the through hole.
[0015] Further, the circuit packaging module further includes an adhesive member, the adhesive member is mounted on the side of the structural member facing the PCB substrate, and the structural member is adhered to the first potting layer or the PCB substrate through the adhesive member; the structural member surrounds to form a potting space, and the adhesive member surrounds the outer edge of the potting space.
[0016] Further, the first potting layer is a 3D printed sealant, and a sealant is poured into the potting space surrounded by the structural member to form a second potting layer.
[0017] As can be seen from the above technical solutions, the present utility model provides a circuit packaging module. Through the structural member installed on the PCB substrate, and the structural member is only arranged around the connector, the non-connector is protected by the first potting layer; and by injecting sealant into the space surrounded by the structural member to form a second potting layer, so as to perform targeted protection on the part where the socket of the connector is connected to the external circuit. Compared with the prior art, the total amount of sealant used in the above circuit packaging module is less and the cost is lower. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 is an exploded view of the circuit packaging module in the embodiment of the present application;
[0019] Figure 2 is a bottom view of the structural member in the embodiment of the present application;
[0020] Figure 3 is a schematic diagram of the structural member fitting the first potting layer in the embodiment of the present application;
[0021] Figure 4 is a cross-sectional view of the structural member fitting the first potting layer in the embodiment of the present application;
[0022] Figure 5 is in the embodiment of the present application Figure 4 magnified view of part A;
[0023] Figure 6 is a schematic structural diagram of a structural member fitting the PCB substrate in the embodiment of the present application;
[0024] Figure 7 is another schematic structural diagram of a structural member fitting the PCB substrate in the embodiment of the present application;
[0025] Figure 8 is a schematic diagram of the first potting layer distributed on both sides of the PCB substrate in the embodiment of the present application. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0026] In order to enable those skilled in the art to better understand the solutions of the present application, the technical solutions in the specific embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.
[0027] It should be noted that in the embodiments of the present application, words such as "exemplary" or "for example" are used to represent examples, illustrations or explanations. Any embodiment or design solution described as "exemplary" or "for example" in the embodiments of the present application should not be construed as being more preferred or having more advantages than other embodiments or design solutions. Rather, the use of words such as "exemplary" or "for example" is intended to present relevant concepts in a specific manner. The terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise specified, the meaning of "a plurality" is two or more.
[0028] As Figure 1 shown, the embodiments of the present application provide a circuit packaging module 100, and the circuit packaging module 100 includes:
[0029] A PCB substrate 11, which is manufactured by selectively performing hole processing, electroless copper plating, electroplating copper, etching, etc. on a substrate material - copper clad laminate (CCL) to obtain the required circuit pattern. Optionally, with an inner core thin copper clad board as the base, the conductive pattern layer and the prepreg are alternately laminated together in one step to form an interconnection between three or more conductive pattern layers. The embodiments of the present application do not specifically limit the form of the PCB substrate 11.
[0030] A connector 12, also called a connector, is a device that connects two active circuits to transmit current or signals. The connector 12 is mounted on the PCB substrate 11. Among them, the connector 12 has a socket 121 for connecting to an external circuit and pins for electrically connecting to the PCB substrate 11.
[0031] Non-connectors 13, including but not limited to capacitors, resistors, integrated circuits, etc. The non-connectors 13 are mounted on the PCB substrate 11 and are electrically connected to the connector 12 through the PCB substrate 11.
[0032] A first potting layer 14, which is located on at least one side of the PCB substrate 11 and covers the non-connectors 13 mounted on the PCB substrate 11 to implement protective measures such as waterproofing, moisture-proofing, dust-proofing, insulation, anti-corrosion and explosion-proofing for the non-connectors 13, thereby improving the insulation performance of the internal circuit components of the PCB substrate 11 and preventing circuit components from being directly exposed to the air.
[0033] The first encapsulation layer 14 is made of a 3D-printed sealant, which includes but is not limited to UV glue, conductive glue, quick-drying glue, epoxy glue AB glue, hot-melt structural glue, etc.; among them, UV glue is a special glue mainly used for the repair of PCB substrates 11 and the fixation of circuit components. It uses ultraviolet light for rapid curing and is suitable for automated operations. The types of sealants are not specifically limited in this application. By means of 3D printing, the first encapsulation layer 14 that is substantially consistent with the outer contour of the PCB substrate 11 can be obtained, which can effectively avoid the problems of large encapsulation volume and uneven encapsulation when encapsulating the PCB substrate 11, and reduce the manufacturing cost.
[0034] The structural member 15 is installed on the PCB substrate 11 and is arranged around the connector 12.
[0035] Such as Figure 1 and Figure 2 As shown, in some embodiments, the structural member 15 is a continuous partition distributed around the outer edge of the connector 12, so that the structural member 15 forms a glue-encapsulation space 151 around it. When the structural member 15 is installed on the PCB substrate 11, the connector 12 is located inside the glue-encapsulation space 151.
[0036] The second encapsulation layer 16 is located inside the structural member 15, so that the part where the socket 121 is connected to the external circuit is covered by the second encapsulation layer 16.
[0037] In the embodiments of this application, at least part of the non-connector 13 is covered by the first encapsulation layer 14 to protect the non-connector 13; in addition, a sealant is separately poured into the structural member 15 to form the second encapsulation layer 16 to protect the socket 121 and the part connected to the external circuit, reducing the total encapsulation volume when the circuit packaging module 100 is subjected to encapsulation treatment and reducing the production cost.
[0038] Such as Figure 1 and Figure 2 As shown, in some embodiments, the PCB substrate 11 has first positioning holes 111, and the first positioning holes 111 are distributed on the outer edge of the connector 12. The side of the structural member 15 facing the PCB substrate 11 has a mating portion 152, and at least part of the mating portion 152 is embedded in the first positioning holes 111. To ensure the stability when the structural member 15 is connected to the PCB substrate 11, the number of the first positioning holes 111 is two, and the two first positioning holes 111 are distributed on the left and right sides of the connector 12, and the structural member 15 is limited in the direction perpendicular to the insertion direction of the connector 12 to prevent the structural member 15 from moving relative to the PCB substrate 11 in the direction perpendicular to the insertion direction of the connector 12. Optionally, the number of the first positioning holes 111 can also be greater than or equal to 3. On the premise of meeting the limitation of the structural member 15, the number of the first positioning holes 111 is not specifically limited in the embodiments of this application.
[0039] Exemplarily, the first positioning hole 111 is configured as a through hole that penetrates through two opposite surfaces of the PCB substrate 11. The mating portion 152 is inserted into the first positioning hole 111 and seals the first positioning hole 111.
[0040] Optionally, the first positioning hole 111 is configured as a blind hole, that is, the first positioning hole 111 penetrates through one surface of the PCB substrate 11 where the connector 12 is installed, such that the mating portion 152 can be embedded into the first positioning hole 111.
[0041] Optionally, by designing a recessed groove on the PCB substrate 11 to replace the first positioning hole 111, the shape of the mating portion 152 is substantially the same as the shape of the groove to achieve the limiting effect on the structural member 15.
[0042] In some embodiments, the first potting layer 14 covers one surface of the PCB substrate 11, and the structural member 15 and the first potting layer 14 are located on the same side surface of the PCB substrate 11. The bottom surface of the structural member 15 facing the PCB substrate 11 is attached to the first potting layer 14 or the PCB substrate 11.
[0043] As Figure 3 and Figure 4 shown, the two opposite surfaces of the PCB substrate 11 are respectively defined as the first surface 112 and the second surface 113. Among them, the connector 12 is installed on the first surface 112. When the non-connector 13 is installed on the first surface 112, the first potting layer 14 covers the first surface 112. The first potting layer 14 has a through portion 141 that penetrates through two opposite surfaces of the first potting layer 14. When the first potting layer 14 covers the first surface 112, the connector 12 passes through the through portion 141. Here, the first potting layer 14 covering the first surface 112 can be partial coverage, for example, covering the non-connector part on the first surface.
[0044] Exemplarily, the structural member 15 is fixed on the first potting layer 14, that is, the bottom surface of the structural member 15 facing the PCB substrate 11 is attached to the first potting layer 14. Observed from the plugging direction of the connector 12, the structural member 15 is arranged around the through portion 141, and the area formed by surrounding the edge of the through portion 141 is smaller than the area formed by surrounding the inner contour of the structural member 15, such that the connector 12 can pass through the through portion 141, thereby reducing the manufacturing difficulty of the first potting layer 14.
[0045] Optionally, the bottom surface of the structural member 15 is attached to the first potting layer 14. Observed from the plugging direction of the connector 12, the edge of the through portion 141 overlaps with the inner contour of the structural member 15 in the plugging direction of the connector 12, thereby reducing the material of the first potting layer 14.
[0046] As Figure 5As shown, in some embodiments, the first potting layer 14 has a second positioning hole 142 that penetrates two opposite surfaces of the first potting layer 14. When the first potting layer 14 covers the first surface 112, the axis of the second positioning hole 142 is substantially coincident with the axis of the first positioning hole 111. When the structural member 15 is fixed to the first potting layer 14, the mating portion 152 sequentially passes through the second positioning hole 142 and the first positioning hole 111.
[0047] As Figure 6 shown, in other embodiments, the bottom surface of the structural member 15 is attached to the PCB substrate 11, and at least a part of the structural member 15 is disposed within the through portion 141. There is a gap between the edge of the through portion 141 and the side surface of the structural member 15 in a direction perpendicular to the plugging direction of the connector 12. Thereby reducing the amount of glue required for the first potting layer 14, and thus reducing the production cost.
[0048] During the production process of the circuit packaging module 100, first, the first potting layer 14 is attached to one side surface of the PCB substrate 11 to protect the non-connector 13 through the first potting layer 14. Then, the structural member 15 is mounted on the PCB substrate 11. Through the gap between the through portion 141 and the structural member 15, the production tolerance between the first potting layer 14 and the structural member 15 is avoided from affecting the assembly of the structural member 15.
[0049] As Figure 7 shown, optionally, the edge of the through portion 141 is attached to the side surface of the structural member 15 in a direction perpendicular to the plugging direction of the connector 12.
[0050] The above setting can effectively pot the part where the socket 121 is connected to the external circuit, can avoid the colloid occupying too much space, and the overall potting amount of the circuit packaging module 100 is small and the cost is low.
[0051] In some embodiments, when the non-connector 13 is mounted on the second surface 113 of the PCB substrate 11, the first potting layer 14 covers the second surface 113 and seals the first positioning hole 111.
[0052] As Figure 8 shown, in some embodiments, non-connectors 13 are provided on both the first surface 112 and the second surface 113 of the PCB substrate 11, and the first potting layer 14 covers the first surface 112 and the second surface 113 respectively to protect the non-connectors 13.
[0053] As Figure 2 shown, the circuit packaging module 100 further includes an adhesive member 17. The adhesive member 17 is mounted on a side of the structural member 15 facing the PCB substrate 11, and the structural member 15 is adhered to the first potting layer 14 or the PCB substrate 11 through the adhesive member 17.
[0054] In some embodiments, the structural member 15 is adhered to the first potting layer 14 by the adhesive member 17, and the gap between the structural member 15 and the first potting layer 14 is filled by the adhesive member 17, so that the potting space 151 is isolated by the adhesive member 17 in the direction perpendicular to the plugging direction of the connector 12.
[0055] Alternatively, the structural member 15 is adhered to the PCB substrate 11 by the adhesive member 17, and the gap between the structural member 15 and the PCB substrate 11 is filled by the adhesive member 17.
[0056] The projection of the structural member 15 on the PCB substrate 11 in the plugging direction of the connector 12 is defined as the first projection, and the projection of the adhesive member 17 on the PCB substrate 11 in the plugging direction of the connector 12 is defined as the second projection. The first projection and the second projection basically coincide, that is, the adhesive member 17 surrounds the outer edge of the potting space 151, thereby improving the sealing effect of the potting space 151 in the direction perpendicular to the plugging direction of the connector 12.
[0057] It should be understood that for those of ordinary skill in the art, improvements or transformations can be made according to the above description, and all such improvements and transformations should fall within the protection scope of the appended claims of this application.
Claims
1. A circuit packaging module, comprising: PCB substrate; A connector, the connector being mounted on the PCB substrate and having a seat connected to an external circuit; A non-connector, the non-connector being mounted on the PCB substrate and electrically connected to the connector through the PCB substrate; It is characterized by further comprising: A first glue potting layer, the first glue potting layer is located on at least one side of the PCB substrate and covers the non-connector component; A structural member, the structural member is mounted on the PCB substrate and is arranged around the connector; A second glue potting layer is located inside the structural component, so that a portion of the seat connected to the external circuit is covered by the second glue potting layer.
2. The circuit packaging module according to claim 1, characterized in that: The PCB substrate has a first positioning hole, which is distributed on the outer edge of the connector. The structural member has a matching portion on a side facing the PCB substrate, and at least a portion of the matching portion is inserted into the first positioning hole.
3. The circuit packaging module according to claim 1, characterized in that: The first glue potting layer covers a surface of the PCB substrate, and the structural component and the first glue potting layer are located on the same side surface of the PCB substrate. The bottom surface of the structural component facing the PCB substrate is attached to the first glue potting layer or the PCB substrate.
4. The circuit packaging module according to claim 3, characterized in that: The first glue potting layer has a through portion, and the through portion penetrates two opposite surfaces of the first glue potting layer, so that the connector passes through the through portion; the bottom surface of the structural member is in contact with the PCB substrate, and at least part of the structural member is inserted into the through portion, and there is a gap between the edge of the through portion and the side surface of the structural member in a direction perpendicular to the plug-in direction of the connector; Alternatively, the edge of the through portion is in contact with the side surface of the structural member in a direction perpendicular to the plug-in direction of the connector.
5. The circuit packaging module according to claim 3, characterized in that: The first glue potting layer has a through portion, and the through portion penetrates two opposite surfaces of the first glue potting layer, so that the connector passes through the through portion; the bottom surface of the structural member is in contact with the first glue potting layer, and the edge of the through portion overlaps with the inner contour of the structural member in the plugging direction of the connector; Alternatively, an area formed by the edge of the through portion is smaller than an area formed by the inner contour of the structural component.
6. The circuit packaging module according to claim 5, characterized in that: The PCB substrate has a first positioning hole, which is distributed on the outer edge of the connector; the structural member has a mating portion on the side facing the PCB substrate, and at least a portion of the mating portion is embedded in the first positioning hole; the first glue potting layer has a second positioning hole, which passes through two opposite surfaces of the first glue potting layer, wherein the axis of the second positioning hole substantially coincides with the axis of the first positioning hole.
7. The circuit packaging module according to claim 2, characterized in that: The first positioning hole is configured as a through hole or a blind hole for the matching portion to be inserted, the through hole passes through two opposite surfaces of the PCB substrate, the matching portion is inserted into the through hole and blocks the through hole; Alternatively, the first glue potting layer located on a surface of the PCB substrate facing away from the connector blocks the through hole.
8. The circuit packaging module according to claim 1, characterized in that: When the non-connector components are respectively mounted on two opposite surfaces of the PCB substrate, the first glue potting layer covers the two surfaces of the PCB substrate.
9. The circuit packaging module according to claim 1, characterized in that: The circuit packaging module further includes an adhesive member, which is installed on a side of the structural member facing the PCB substrate, and the structural member is adhered to the first glue potting layer or the PCB substrate through the adhesive member; The structural member surrounds and forms a glue pouring space, and the adhesive member surrounds the outer edge of the glue pouring space.
10. The circuit packaging module according to claim 1, characterized in that: The first glue pouring layer is a 3D printed sealant, and the sealant is poured into the glue pouring space formed around the structural member to form the second glue pouring layer.