Double-sided OSP circuit board

Abstract

The utility model relates to the technical field of circuit boards, and discloses a double-sided OSP circuit board which comprises an insulating substrate, the two sides of the insulating substrate are coated with first OSP coatings, the two sides of the two first OSP coatings are coated with PI layers, the outer surfaces of the two PI layers are coated with anti-scratch layers, the outer surfaces of the two anti-scratch layers are coated with heat-proof layers, and the outer surfaces of the two heat-proof layers are coated with heat-proof layers. The outer surfaces of the two heat-proof layers are coated with anti-static layers, and bonding pads are installed on the two faces of the insulating substrate. According to the double-sided OSP circuit board, the first OSP coating and the second OSP coating are coated to protect the exposed copper wire from being oxidized and corroded, so that the weldability and reliability of the circuit board are ensured, meanwhile, the overall oxidation resistance can be improved, the surface of the circuit board can be protected by arranging the anti-scratch layer, and the service life of the circuit board is prolonged. By arranging the anti-static layer, the overall anti-static performance can be improved, and therefore static accumulation and discharging are effectively prevented.

Description

Technical Field

[0001] This application relates to the technical field of circuit boards, and specifically to a double-sided OSP circuit board. Background Art

[0002] The names of circuit boards include: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, printed circuit boards, PCB boards, aluminum substrates, high-frequency boards, thick copper boards, impedance boards, PCBs, ultra-thin circuit boards, ultra-thin circuit boards, printed (copper etching technology) circuit boards, etc. Circuit boards miniaturize and visualize circuits, and play an important role in mass production of fixed circuits and optimizing the layout of electrical appliances.

[0003] When producing circuit boards, the sop process and OSP process are used. Due to high temperatures, the OSP organic film on the PCB pads is damaged, resulting in oxidation of the bare copper pads and causing soldering rejection defects. Therefore, PCBs using the OSP process cannot be applied to injection-molded products with double-sided soldering pads; if PCBs using other processes such as immersion gold, gold plating, lead-free spray tin, silver plating, etc. are used, they either cannot meet the requirements of injection-molded products, have high costs, or occupy a large space and cannot meet the customer's requirements for the best welding effect and the lowest cost.

[0004] The disadvantage of OSP is that the formed protective film is extremely thin and is prone to scratches or abrasions, and careful operation and handling are required. At the same time, for the OSP film after multiple high-temperature welding processes, the OSP film on the un-soldered pads will change color or crack, affecting solderability and reliability. Therefore, if the product has double-sided soldering pads, after the SMT single-sided chip mounting is completed, the second-sided SMT component chip mounting must be completed within 24 hours to ensure product quality and meet customer requirements. Summary of the Utility Model

[0005] Aiming at the deficiencies of the prior art, this application provides a double-sided OSP circuit board, which has the advantages of improving antioxidant properties, etc., and solves the problems raised in the background art.

[0006] To achieve the above object, this application provides the following technical solution: A double-sided OSP circuit board includes an insulating substrate. Both sides of the insulating substrate are coated with a first OSP coating. Both sides of the two first OSP coatings are coated with a PI layer. The outer surfaces of the two PI layers are coated with an anti-scratch layer. The outer surfaces of the two anti-scratch layers are coated with a heat-resistant layer. The outer surfaces of the two heat-resistant layers are coated with an anti-static layer. Solder pads are installed on both sides of the insulating substrate.

[0007] Through the above solution, by setting the anti-scratch layer, it can prevent the surface of the insulating substrate from being damaged by scratches, resulting in film coating breakage and affecting its antioxidant properties.

[0008] Further, the insulating substrate is made of epoxy resin material.

[0009] Through the above solution, the insulating substrate has excellent insulating properties, processability and mechanical strength.

[0010] Further, both of the two PI layers are made of polyimide.

[0011] Through the above solution, polyimide can be processed under high temperature and high pressure, and can generally withstand high temperatures above ℃.

[0012] Further, both of the two anti-scratch layers are made of electroplated nickel.

[0013] Through the above solution, electroplated nickel can effectively prevent the diffusion of copper and gold, improve the reliability of electronic interconnection. At the same time, the nickel layer itself also has certain wear resistance and hardness, which can protect the surface of the circuit board.

[0014] Further, both of the two heat-resistant layers are made of polyimide thin material.

[0015] Through the above solution, the polyimide thin material has excellent heat resistance, chemical corrosion resistance and mechanical strength. It can withstand high temperature environments while maintaining stable heat insulation performance.

[0016] Further, both of the two anti-static layers are made of additive anti-static coatings.

[0017] Through the above solution, the anti-static layer is made of a variety of substances such as polyvinyl alcohol, acrylate, silicone, and organotin, which can improve the antistatic performance of the coating, thus effectively preventing the accumulation and discharge of static electricity.

[0018] Further, on the side surfaces of the two pads facing away from each other, there are solderable layers, and the outer surfaces of the two solderable layers are coated with a second OSP coating.

[0019] Through the above solution, coating the outer surface of the solderable layer with an OSP coating can protect the connected copper wires from oxidation and corrosion, and at the same time can improve the oxidation resistance.

[0020] Further, both of the two solderable layers are made of copper material.

[0021] Through the above solution, the solderable layer can be tightly connected to tin and is difficult to be oxidized.

[0022] Compared with the prior art, the technical solution of the present application has the following beneficial effects:

[0023] This double-sided OSP circuit board can protect the exposed copper wires from oxidation and corrosion by applying the first OSP coating and the second OSP coating, ensuring the solderability and reliability of the circuit board, while improving the overall oxidation resistance. The surface of the circuit board can be protected by setting a scratch-resistant layer, and the overall antistatic performance can be improved by setting an antistatic layer, thus effectively preventing the accumulation and discharge of static electricity. Brief Description of the Drawings

[0024] Figure 1 It is a schematic diagram of the overall structure of this application.

[0025] In the figure:

[0026] 1. Insulating substrate; 2. First OSP coating; 3. PI layer; 4. Scratch-resistant layer; 5. Heat-resistant layer; 6. Antistatic layer; 7. Solder pad; 8. Tin-attaching layer; 9. Second OSP coating. Detailed Embodiment

[0027] Next, the technical solutions in the embodiments of this application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are only a part of the embodiments of this application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of this application.

[0028] Please refer to Figure 1 , a double-sided OSP circuit board in this embodiment includes an insulating substrate 1. The two sides of the insulating substrate 1 are both coated with a first OSP coating 2. The two sides of the two first OSP coatings 2 are both coated with a PI layer 3. The outer surfaces of the two PI layers 3 are both coated with a scratch-resistant layer 4. The outer surfaces of the two scratch-resistant layers 4 are both coated with a heat-resistant layer 5. The outer surfaces of the two heat-resistant layers 5 are both coated with an antistatic layer 6. Solder pads 7 are installed on both sides of the insulating substrate 1. Applying the first OSP coating 2 and the second OSP coating 9 can protect the exposed copper wires from oxidation and corrosion, ensuring the solderability and reliability of the circuit board, while improving the overall oxidation resistance. The surface of the circuit board can be protected by setting a scratch-resistant layer 4, and the overall antistatic performance can be improved by setting an antistatic layer 6, thus effectively preventing the accumulation and discharge of static electricity.

[0029] Please refer to Figure 1, the insulating substrate 1 is made of epoxy resin material. The insulating substrate 1 has excellent insulation performance, processability, and mechanical strength. Both PI layers 3 are made of polyimide. Polyimide can be processed under high temperature and high pressure and can generally withstand high temperatures above 200°C. Both anti-scratch layers 4 are made of electroplated nickel. Electroplated nickel can effectively prevent the diffusion of copper and gold, improving the reliability of electronic interconnection. At the same time, the nickel layer itself also has certain wear resistance and hardness, which can protect the surface of the circuit board. Both heat-resistant layers 5 are made of polyimide thin material. The polyimide thin material has excellent heat resistance, chemical corrosion resistance, and mechanical strength. It can withstand high-temperature environments while maintaining stable heat insulation performance. Both anti-static layers 6 are made of additive anti-static coatings. The anti-static layer 6 is made of various substances such as polyvinyl alcohol, acrylate, silicone, and organotin, which can improve the anti-static performance of the coating, thereby effectively preventing the accumulation and discharge of static electricity.

[0030] Please refer to Figure 1 , on one side of the two pads 7 facing away from each other, there are solderable layers 8 provided. On the outer surfaces of the two solderable layers 8, a second OSP coating 9 is applied. Applying an OSP coating on the outer surface of the solderable layer 8 can protect the connected copper wires from oxidation and corrosion, and at the same time can improve the oxidation resistance. Both solderable layers 8 are made of copper material. The solderable layer 8 can be tightly connected to tin and is difficult to be oxidized.

[0031] In a double-sided OSP circuit board in this embodiment, by applying the first OSP coating 2 and the second OSP coating 9, the exposed copper wires can be protected from oxidation and corrosion, ensuring the solderability and reliability of the circuit board. At the same time, the overall oxidation resistance can be improved. And by setting the anti-scratch layer 4, the surface of the circuit board can be protected. By setting the anti-static layer 6, the overall anti-static performance can be improved, thereby effectively preventing the accumulation and discharge of static electricity.

[0032] The working principle of the above embodiment is: by applying the first OSP coating 2 and the second OSP coating 9, the exposed copper wires can be protected from oxidation and corrosion, ensuring the solderability and reliability of the circuit board. At the same time, the overall oxidation resistance can be improved, thereby improving the overall service life. And by setting the anti-scratch layer 4, the surface of the circuit board can be protected. By setting the anti-static layer 6, the overall anti-static performance can be improved, thereby effectively preventing the accumulation and discharge of static electricity. By setting the anti-scratch layer 4, the diffusion of copper and gold can be effectively prevented, improving the reliability of electronic interconnection. At the same time, the nickel layer itself also has certain wear resistance and hardness, which can protect the surface of the circuit board. Applying the second OSP coating 9 on the outer surface of the solderable layer 8 can protect the connected copper wires from oxidation and corrosion and improve the oxidation resistance at the same time.

[0033] It should be noted that, in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprising", "including" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the element.

[0034] Although the embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A double-sided OSP circuit board, comprising an insulating substrate (1), characterized in that: Both sides of the insulating substrate (1) are coated with a first OSP coating (2), both sides of the two first OSP coatings (2) are coated with a PI layer (3), the outer surfaces of the two PI layers (3) are coated with an anti-scratch layer (4), the outer surfaces of the two anti-scratch layers (4) are coated with a heat-resistant layer (5), the outer surfaces of the two heat-resistant layers (5) are coated with an anti-static layer (6), and pads (7) are installed on both sides of the insulating substrate (1); the insulating substrate (1) is made of epoxy resin material; the two PI layers (3) are both made of polyimide; the two anti-scratch layers (4) are both made of electroplated nickel; the two heat-resistant layers (5) are both made of polyimide thin material; the two anti-static layers (6) are both additive anti-static coatings.

2. The double-sided OSP circuit board according to claim 1, characterized in that: Tin layers (8) are provided on the sides of the two pads (7) facing away from each other, and second OSP coatings (9) are coated on the outer surfaces of the two tin layers (8).

3. The double-sided OSP circuit board according to claim 2, characterized in that: The two tin layers (8) are both made of copper material.

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