Wafer photoetching equipment

Abstract

The wafer photoetching equipment comprises a bottom plate, a back plate is fixedly connected to the rear side of the top of the bottom plate, a top plate is fixedly connected to the top of the back plate, a positioning seat is fixedly connected to the left side of the top of the bottom plate, a wafer placement box is fixedly connected to the right side of the top of the bottom plate, and a square groove is formed in the surface of the top plate. According to the utility model, the electric telescopic rod is started to drive the sucker manipulator to move downwards, so that the sucker manipulator is in contact with the surface of the wafer to grab the wafer, and when the screw block moves to the left of the square groove, the wafer is located right above the positioning seat, so that the electric telescopic rod extends, the lower surface of the wafer is in contact with the positioning seat, and meanwhile, the sucker manipulator relieves the grabbing of the wafer; therefore, the wafer can be conveniently placed above the positioning seat, the wafer does not need to be manually moved by a worker, the situation that the wafer is collided and damaged during movement is avoided, the yield of wafer photoetching is improved, and the wafer photoetching device is convenient for a user to use.

Description

Technical Field

[0001] The utility model relates to the technical field of wafers, and specifically relates to a wafer lithography device. Background Technique

[0002] A wafer refers to a silicon wafer used to fabricate silicon semiconductor circuits, and its raw material is silicon. High-purity polysilicon is dissolved and doped with a silicon crystal seed, and then slowly pulled out to form a cylindrical single-crystal silicon. After the silicon ingot is ground, polished, and sliced, a silicon wafer, that is, a wafer, is formed. The domestic wafer production lines are mainly 8 inches and 12 inches.

[0003] After retrieval, a wafer lithography device disclosed in Chinese Patent Application No. 202321094699.3 includes a working box. The working box is internally provided with a working cavity. A positioning seat is arranged at the bottom end of the working cavity. A positioning device is arranged at the top end of the positioning seat. A lithography machine is arranged at the top end of the working cavity. The positioning device includes a worm gear, a worm, a positioning column, and a positioning block. The positioning seat is internally provided with a positioning cavity. Multiple positioning through holes are arranged at the top end of the positioning cavity. A positioning groove is arranged at the bottom end of the positioning cavity corresponding to the positioning through holes. A positioning column is arranged between the positioning groove and the positioning through hole. The positioning column is slidably connected to the bottom of the positioning groove and the side wall of the positioning through hole respectively. Through the setting of the positioning device, it is convenient to clamp and position the wafer by moving the positioning block, so that the wafer is aligned with the lithography machine, thereby improving the lithography effect of the wafer.

[0004] Although the above patent facilitates the clamping and positioning of the wafer by moving the positioning block through the setting of the positioning device, so that the wafer is aligned with the lithography machine, thereby improving the lithography effect of the wafer, it is not convenient to place the wafer on the positioning seat conveniently during actual use. It is necessary for the staff to manually place the wafer on the positioning seat. During the placement process, the wafer is prone to collision during movement, resulting in damage to the wafer, reducing the yield rate of wafer lithography, and bringing inconvenience to the use of the user.

[0005] Therefore, it is necessary to transform it, so that the wafer can be conveniently placed above the positioning seat, without the need for the staff to manually move the wafer, avoiding the situation of collision and damage of the wafer during movement, improving the yield rate of wafer lithography, and facilitating the use of the user. Content of the Utility Model

[0006] To solve the problems raised in the above-mentioned background technology, the purpose of the present utility model is to provide a wafer lithography device, which has the advantages of being able to conveniently place the wafer above the positioning seat without manual movement of the wafer by the staff, avoiding the situation of collision damage during wafer movement, improving the yield rate of wafer lithography, and being convenient for users to use. It solves the problem that it is not convenient to place the wafer on the positioning seat, and the staff needs to manually place the wafer on the positioning seat. During the placement process, the wafer is prone to collision during movement, resulting in wafer damage, reducing the yield rate of wafer lithography, and bringing inconvenience to the use of users.

[0007] To achieve the above purpose, the present utility model provides the following technical solutions: A wafer lithography device, including a bottom plate, a back plate is fixedly connected to the rear side of the top of the bottom plate, a top plate is fixedly connected to the top of the back plate, a positioning seat is fixedly connected to the left side of the top of the bottom plate, a wafer placement box is fixedly connected to the right side of the top of the bottom plate, a square groove is opened on the surface of the top plate, a positive and negative motor is fixedly connected to the right side of the top plate, the output end of the positive and negative motor penetrates into the interior of the square groove and is fixedly connected to a screw rod, the left end of the screw rod is rotatably connected to the left side inner wall of the square groove, a screw block is threadedly connected to the surface of the screw rod, the front and rear sides of the screw block are slidably connected to the front and rear sides of the inner wall of the square groove, an electric telescopic rod is fixedly connected to the bottom of the screw block, a moving plate is fixedly connected to the bottom of the electric telescopic rod, a suction cup manipulator is fixedly connected to the bottom of the moving plate, the suction cup manipulator is located above the wafer placement box, and a lithography manipulator is arranged on the front side of the left side of the bottom of the top plate.

[0008] Preferably, a first support rod is fixedly connected to the front surface of the moving plate, a hollow telescopic rod is fixedly connected to the top of the first support rod, the top of the hollow telescopic rod is slidably connected to the bottom of the top plate, a second support rod is fixedly connected to the back surface of the moving plate, and the rear end of the second support rod is slidably connected to the front surface of the back plate.

[0009] Preferably, a pressure sensing block is fixedly connected to the left side of the top of the top plate, the pressure sensing block is electrically connected to the positive and negative motor, a convex strip is fixedly connected above the left side of the screw block, a buffer block is fixedly connected to the right side inner wall of the square groove, and the right side of the screw block is attached to the left side of the buffer block.

[0010] Preferably, a limiting ring is fixedly connected to the top of the positioning seat, a protective pad is fixedly connected to the top of the positioning seat and located inside the limiting ring, and a positioning suction cup is fixedly connected to the center of the top of the positioning seat.

[0011] Preferably, a sponge pad is fixedly connected to the bottom of the inner wall of the wafer placement box, a protective ring is fixedly connected to the inner wall of the wafer placement box, and observation slots communicating with each other are formed in the front sides of the wafer placement box and the protective ring.

[0012] Preferably, sliders are fixedly connected to the front and rear sides of the screw block, sliding grooves adapted to the sliders are formed in the front and rear sides of the inner wall of the square groove, the sliders are slidably connected to the sliding grooves, and the length of the sliding grooves is equal to the length of the square groove.

[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0014] 1. In the present utility model, multiple wafers are placed inside the wafer placement box, and then the electric telescopic rod is started. The start of the electric telescopic rod drives the moving plate to move downward. The downward movement of the moving plate drives the suction cup manipulator to move downward, so that the suction cup end contacts the surface of the wafer to grab it. After the grabbing is completed, the electric telescopic rod contracts, so that the wafer is moved out of the inside of the wafer placement box. Then, the forward and reverse motor is started to drive the screw rod to rotate. The rotation of the screw rod drives the screw block to move leftward. The leftward movement of the screw block drives the wafer to move leftward. When the screw block moves to the left of the square groove, the wafer is located directly above the positioning seat. Then, the electric telescopic rod is extended, so that the lower surface of the wafer contacts the positioning seat, and at the same time, the suction cup manipulator releases the grabbing of the wafer. Then, the wafer is processed by the lithography manipulator, thereby achieving the effect that the wafer can be conveniently placed above the positioning seat without manual movement of the wafer by the staff, avoiding the situation of collision damage of the wafer during movement, improving the yield rate of wafer lithography, and facilitating the use by the user.

[0015] 2. In the present utility model, by setting the first support rod, the hollow telescopic rod and the second support rod to cooperate with each other, a stretching effect is achieved on the front and rear sides of the moving plate, so that the moving plate can maintain balance when moving left and right, avoiding the situation that the wafer grabbed by the suction cup manipulator falls and is damaged due to the shaking of the moving plate during movement. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a schematic structural diagram of the present utility model;

[0017] Figure 2 is a top view structural diagram of the present utility model;

[0018] Figure 3 is a right view structural diagram of the present utility model;

[0019] Figure 4 is the present utility model Figure 2 an enlarged structural diagram of A in.

[0020] In the figure: 1, bottom plate; 2, back plate; 3, top plate; 4, positioning seat; 5, wafer placement box; 6, square groove; 7, forward and reverse motor; 8, screw rod; 9, screw block; 10, electric telescopic rod; 11, moving plate; 12, suction cup manipulator; 13, lithography manipulator; 14, first support rod; 15, hollow telescopic rod; 16, second support rod; 17, pressure sensing block; 18, convex strip; 19, buffer block; 20, limiting ring; 21, protective pad; 22, positioning suction cup; 23, sponge pad; 24, protective ring; 25, observation groove; 26, slider; 27, chute. Detailed implementation mode

[0021] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0022] As Figures 1 to 4 shown, a wafer lithography device provided by the present invention includes a bottom plate 1. A back plate 2 is fixedly connected to the rear side of the top of the bottom plate 1. A top plate 3 is fixedly connected to the top of the back plate 2. A positioning seat 4 is fixedly connected to the left side of the top of the bottom plate 1. A wafer placement box 5 is fixedly connected to the right side of the top of the bottom plate 1. A square groove 6 is formed on the surface of the top plate 3. A forward and reverse motor 7 is fixedly connected to the right side of the top plate 3. The output end of the forward and reverse motor 7 penetrates into the interior of the square groove 6 and is fixedly connected to a screw rod 8. The left end of the screw rod 8 is rotatably connected to the left side inner wall of the square groove 6. A screw block 9 is threadedly connected to the surface of the screw rod 8. The front and rear sides of the screw block 9 are slidably connected to the front and rear side inner walls of the square groove 6. An electric telescopic rod 10 is fixedly connected to the bottom of the screw block 9. A moving plate 11 is fixedly connected to the bottom of the electric telescopic rod 10. A suction cup manipulator 12 is fixedly connected to the bottom of the moving plate 11. The suction cup manipulator 12 is located above the wafer placement box 5. A lithography manipulator 13 is arranged on the front side of the left side below the top plate 3.

[0023] Referring to Figure 1 , a first support rod 14 is fixedly connected to the front surface of the moving plate 11. A hollow telescopic rod 15 is fixedly connected to the top of the first support rod 14. The top of the hollow telescopic rod 15 is slidably connected to the bottom of the top plate 3. A second support rod 16 is fixedly connected to the back surface of the moving plate 11. The rear end of the second support rod 16 is slidably connected to the front surface of the back plate 2.

[0024] As a technical optimization solution of the present utility model, by setting the combined use of the first support rod 14, the hollow telescopic rod 15 and the second support rod 16, a stretching effect is achieved on the front side and the rear side of the moving plate 11, enabling the moving plate 11 to maintain balance when moving left and right, and avoiding the situation where the wafers grabbed by the suction cup manipulator 12 fall and are damaged due to the shaking of the moving plate 11 during movement.

[0025] Reference Figure 2 and Figure 4 Refer to FIGS. 6 and 7. On the left side of the top of the top plate 3, a pressure sensing block 17 is fixedly connected. The pressure sensing block 17 is electrically connected to the forward and reverse motor 7. Above the left side of the screw block 9, a convex strip 18 is fixedly connected. On the right side of the inner wall of the square groove 6, a buffer block 19 is fixedly connected. The right side of the screw block 9 is in contact with the left side of the buffer block 19.

[0026] As a technical optimization solution of the present utility model, by setting the combined use of the pressure sensing block 17 and the convex block, when the convex block contacts the pressure sensing block 17 when the screw block 9 moves to the left side of the square groove 6, the forward and reverse motor 7 is controlled to stop, avoiding the situation where the screw block 9 collides with the top plate 3 and causes the wafers held by the suction cup manipulator 12 to fall due to shaking. By setting the buffer block 19, the impact force when the screw block 9 contacts the right side inner wall of the square groove 6 is reduced, and the shaking is reduced.

[0027] Reference Figure 1 Refer to FIG. 8. On the top of the positioning seat 4, a limit ring 20 is fixedly connected. On the top of the positioning seat 4, a protective pad 21 located inside the limit ring 20 is fixedly connected. In the center of the top of the positioning seat 4, a positioning suction cup 22 is fixedly connected.

[0028] As a technical optimization solution of the present utility model, by setting the limit ring 20 and the protective pad 21, the bottom and the periphery of the wafer are protected, avoiding the situation where the wafer directly contacts the surface of the positioning seat 4 and is worn. By setting the positioning suction cup 22, an adsorption effect can be achieved on the bottom of the wafer, avoiding the situation where the wafer is displaced and damaged during processing.

[0029] Reference Figure 1 Refer to FIG. 9. At the bottom of the inner wall of the wafer placement box 5, a sponge pad 23 is fixedly connected. On the inner wall of the wafer placement box 5, a protective ring 24 is fixedly connected. Observation slots 25 that communicate with each other are provided on the front sides of the wafer placement box 5 and the protective ring 24.

[0030] As a technical optimization solution of the present utility model, by setting the sponge pad 23 and the protective ring 24, a protective effect is achieved on the wafers placed inside the wafer placement box 5, avoiding the situation where the surface of the wafer is scratched and affects its use. By setting the observation slots 25, the staff can directly see the remaining number of wafers inside the wafer placement box 5, facilitating the staff to add wafers in a timely manner.

[0031] ReferenceFigure 4 On both the front and rear sides of the screw block 9, there are sliding blocks 26 fixedly connected. On both the front and rear sides of the inner wall of the square groove 6, there are sliding grooves 27 which are used in cooperation with the sliding blocks 26. The sliding blocks 26 are slidably connected to the sliding grooves 27, and the length of the sliding grooves 27 is equal to the length of the square groove 6.

[0032] As a technical optimization scheme of the present utility model, by setting the cooperation of the sliding blocks 26 and the sliding grooves 27, a limiting and stabilizing effect is achieved on the screw block 9, enabling the screw block 9 to only move left and right inside the square groove 6, avoiding the situation where the screw block 9 shakes and tilts during movement, which affects normal use.

[0033] The working principle and usage process of the present utility model: Place multiple wafers inside the wafer placement box 5, then start the electric telescopic rod 10. By starting the electric telescopic rod 10, the moving plate 11 is driven to move downward. The downward movement of the moving plate 11 drives the suction cup manipulator 12 to move downward, so that its suction cup end contacts the surface of the wafer to grasp it. When the grasping is completed, the electric telescopic rod 10 contracts, so that the wafer is moved out of the inside of the wafer placement box 5. Then, by starting the forward and reverse motor 7 to drive the screw rod 8 to rotate, the rotation of the screw rod 8 drives the screw block 9 to move leftward. The leftward movement of the screw block 9 drives the wafer to move leftward. When the screw block 9 moves to the left of the square groove 6, the wafer is located directly above the positioning seat 4. Then, extend the electric telescopic rod 10 so that the lower surface of the wafer contacts the positioning seat 4, and at the same time release the grasping of the wafer by the suction cup manipulator 12. Then, process the wafer through the lithography manipulator 13, thereby achieving the effect that the wafer can be conveniently placed above the positioning seat 4 without the need for staff to manually move the wafer, avoiding the situation where the wafer collides and is damaged during movement, improving the yield rate of wafer lithography, and facilitating the use of the user.

[0034] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or further includes elements inherent to such process, method, article or device.

[0035] Although the embodiments of the present utility model have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. A wafer lithography device, comprising a bottom plate (1), characterized in that: A backboard (2) is fixedly connected to the rear side of the top of the bottom plate (1). A top plate (3) is fixedly connected to the top of the backboard (2). A positioning seat (4) is fixedly connected to the left side of the top of the bottom plate (1). A wafer placement box (5) is fixedly connected to the right side of the top of the bottom plate (1). A square groove (6) is formed on the surface of the top plate (3). A forward and reverse motor (7) is fixedly connected to the right side of the top plate (3). The output end of the forward and reverse motor (7) penetrates into the interior of the square groove (6) and is fixedly connected to a screw rod (8). The left end of the screw rod (8) is rotatably connected to the left side inner wall of the square groove (6). A screw block (9) is threadedly connected to the surface of the screw rod (8). The front and rear sides of the screw block (9) are both slidably connected to the front and rear side inner walls of the square groove (6). An electric telescopic rod (10) is fixedly connected to the bottom of the screw block (9). A moving plate (11) is fixedly connected to the bottom of the electric telescopic rod (10). A suction cup manipulator (12) is fixedly connected to the bottom of the moving plate (11). The suction cup manipulator (12) is located above the wafer placement box (5). A photolithography manipulator (13) is arranged on the front side of the left side of the bottom of the top plate (3).

2. The wafer lithography device according to claim 1, characterized in that: A first support rod (14) is fixedly connected to the front surface of the moving plate (11). A hollow telescopic rod (15) is fixedly connected to the top of the first support rod (14). The top of the hollow telescopic rod (15) is slidably connected to the bottom of the top plate (3). A second support rod (16) is fixedly connected to the back surface of the moving plate (11). The rear end of the second support rod (16) is slidably connected to the front surface of the backboard (2).

3. A wafer lithography apparatus according to claim 1, characterized in that: A pressure sensing block (17) is fixedly connected to the left side of the top of the top plate (3). The pressure sensing block (17) is electrically connected to the forward and reverse motor (7). A convex strip (18) is fixedly connected above the left side of the screw block (9). A buffer block (19) is fixedly connected to the right side inner wall of the square groove (6). The right side of the screw block (9) is in contact with the left side of the buffer block (19).

4. A wafer lithography device according to claim 1, characterized in that: A limiting ring (20) is fixedly connected to the top of the positioning seat (4). A protective pad (21) located inside the limiting ring (20) is fixedly connected to the top of the positioning seat (4). A positioning suction cup (22) is fixedly connected to the center of the top of the positioning seat (4).

5. A wafer lithography device according to claim 1, wherein: A sponge pad (23) is fixedly connected to the bottom of the inner wall of the wafer placement box (5). A protective ring (24) is fixedly connected to the inner wall of the wafer placement box (5). Observation grooves (25) that communicate with each other are formed on the front sides of the wafer placement box (5) and the protective ring (24).

6. A wafer lithography apparatus according to claim 1, characterized in that: Sliders (26) are fixedly connected to the front and rear sides of the screw block (9). Sliding grooves (27) that cooperate with the sliders (26) are formed on the front and rear side inner walls of the square groove (6). The sliders (26) are slidably connected to the sliding grooves (27). The length of the sliding grooves (27) is equal to the length of the square groove (6).

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