High-heat-dissipation copper guide pillar heat dissipation aluminum substrate

Abstract

The utility model discloses a copper guide pillar heat dissipation aluminum substrate with high heat dissipation, which relates to the field of aluminum substrate structures and comprises a substrate body, a plurality of connecting units are arranged on the substrate body, heat dissipation through holes are arranged in the connecting units, insulating sleeves are arranged in the heat dissipation through holes, a plurality of heat dissipation pieces are inserted in the insulating sleeves, and the tops of the heat dissipation pieces are flush with the top surface of the substrate body. The bottoms of the heat dissipation pieces protrude out of the bottom face of the substrate body. According to the high-heat-dissipation copper guide pillar heat dissipation aluminum substrate, the heat dissipation piece which is flush with the top face of the substrate body and protrudes out of the bottom face is arranged on the substrate body, most of heat dissipated when an electronic element installed on the top face of the substrate body works is transmitted to the bottom of the substrate body through the heat dissipation piece, and therefore the heat dissipation area is increased, and the heat dissipation effect of the aluminum substrate is improved.

Description

Technical Field

[0001] The utility model relates to the field of aluminum substrate structures, and particularly to a copper pillar heat dissipation aluminum substrate with high heat dissipation performance. Background Art

[0002] With the rapid development of electronic technology, the integration and power density of electronic devices have been continuously improved, making the heat dissipation problem of devices increasingly prominent. Poor heat dissipation will not only affect the performance of the devices, but also may shorten the service life of the devices.

[0003] Since electronic components are closely installed on the surface of the roadbed board, the traditional heat dissipation structure of aluminum substrates usually relies on the thermal conductivity of the material and the heat dissipation area on the surface of the substrate. However, due to the limited thermal conductivity of aluminum and the limitation of the heat dissipation area on the surface of the substrate by the device size and design, it is difficult for the heat dissipation effect of traditional aluminum substrates to meet the requirements of high-power devices. In addition, during the heat dissipation process of traditional aluminum substrates, there is often a problem of large thermal resistance, resulting in the inability to dissipate heat in a timely and effective manner.

[0004] Therefore, in order to solve the above problems, an aluminum substrate structure with better heat dissipation performance is needed to improve the heat dissipation efficiency of electronic devices and ensure the stability and reliability of the devices under high-power operation. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a copper pillar heat dissipation aluminum substrate with high heat dissipation performance. On the substrate body of this copper pillar heat dissipation aluminum substrate, heat dissipation components are provided that are flush with the top surface of the substrate body and protrude from the bottom surface. Most of the heat dissipated when the electronic components installed on the top surface of the substrate body are working is transferred to the bottom of the substrate body through the heat dissipation components, thereby increasing the heat dissipation area and improving the heat dissipation effect of the aluminum substrate.

[0006] The above optimized structure of the utility model is achieved through the following technical solutions: a copper pillar heat dissipation aluminum substrate with high heat dissipation performance, including a substrate body, a plurality of connection units are provided on the substrate body, heat dissipation through holes are provided in the connection units, insulating sleeves are provided in the heat dissipation through holes, a plurality of heat dissipation components are inserted into the insulating sleeves, the top of the heat dissipation components is flush with the top surface of the substrate body, and the bottom of the heat dissipation components protrudes from the bottom surface of the substrate body.

[0007] In some embodiments, the connection unit includes two columns of pins arranged in parallel, the heat dissipation through hole is provided between the two columns of pins, and the two columns of pins are symmetrically arranged on both sides of the heat dissipation through hole.

[0008] In some embodiments, at least two heat dissipation holes are provided in the insulating sleeve, and the heat dissipation components are inserted into the heat dissipation holes.

[0009] In some embodiments, a limiting block is provided at the top of the heat dissipation member, limiting grooves are provided on both sides of the heat dissipation through holes, the limiting block is in plug-in fit with the limiting grooves, and the height of the limiting block is equal to the depth of the limiting grooves.

[0010] In some embodiments, the heat dissipation member is a square column, and a frustum is provided at one end of the heat dissipation member protruding from the bottom surface of the substrate body.

[0011] In some embodiments, a plurality of heat dissipation grooves are provided at one end of the heat dissipation member protruding from the bottom surface of the substrate body, and the plurality of heat dissipation grooves are uniformly arranged on the outer surface of the heat dissipation member.

[0012] In some embodiments, the insulating sleeve is made of high-temperature insulating glue.

[0013] In some embodiments, the heat dissipation member is a copper column.

[0014] In summary, the present utility model has the following beneficial effects:

[0015] A plurality of heat dissipation members are arranged on the substrate body of the copper guide post heat dissipation aluminum substrate with high heat dissipation. The top surface of the heat dissipation member is flush with the top surface of the substrate body, which does not affect the installation of electronic components on the substrate body. The bottom surface of the heat dissipation surface protrudes from the bottom surface of the substrate body and contacts the air at the bottom, thereby forming a double heat dissipation structure of the heat dissipation member and the substrate body; most of the heat dissipated when the electronic components installed on the top surface of the substrate body work is transferred to the bottom of the substrate body through the heat dissipation member, thereby increasing the heat dissipation area, improving the heat dissipation effect of the aluminum substrate, and realizing the efficient heat dissipation of the aluminum substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a schematic structural diagram of the present utility model;

[0017] Figure 2 is a schematic structural diagram of another perspective of the present utility model.

[0018] In the figure: 1. Substrate body; 11. Connection unit; 12. Heat dissipation through hole; 13. Insulating sleeve; 14. Heat dissipation member; 15. Heat dissipation hole. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0019] The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without making creative efforts shall fall within the protection scope of the present utility model.

[0020] Reference Figure 1-2A high heat dissipation copper guide column heat dissipation aluminum substrate comprises a substrate body 1, a plurality of connection units 11 are arranged on the substrate body 1, the connection unit 11 may comprise two rows of pins arranged in parallel, a heat dissipation through hole 12 is arranged between the two rows of pins, the two rows of pins are symmetrically arranged on both sides of the heat dissipation through hole 12, so as to ensure the heat dissipation effect of the electronic component when the connection unit 11 is connected with the electronic component, the electronic component may be a lamp bead, a heat dissipation through hole 12 is arranged in the connection unit 11, an insulating sleeve 13 is arranged in the heat dissipation through hole 12, a plurality of heat dissipating parts 14 are inserted in the insulating sleeve 13, the heat dissipating through hole 12 can be filled with high temperature insulating glue in the insulating sleeve 13, and a hole of the same size as the heat dissipating part 14 is engraved by an engraving machine after cooling and forming, so as to meet the high temperature use conditions and realize the electrical isolation between the heat dissipating part 14 and the substrate body 1, and at the same time enhance the insulation sleeve 13 and the heat dissipating through hole The connection strength between 12 is improved, thereby improving the stability of the heat sink 14 installed on the substrate body 1; at least two heat dissipation holes 15 are provided in the insulating sleeve 13, and the heat dissipation holes 15 are inserted with the heat dissipation parts 14. The top of the heat sink 14 is provided with electronic components. The top of the heat sink 14 can be flush with the top surface of the substrate body 1, so that when the electronic components are fixed on the substrate body 1, the bottom of the electronic components is tightly fitted with the top of the heat sink 14, thereby realizing efficient heat dissipation of the electronic components. The fixing method of the electronic components and the substrate body 1 is the existing technology and will not be repeated here; the bottom of the heat sink 14 protrudes from the bottom surface of the substrate body 1, and forms a double heat dissipation structure with the substrate body 1. Through the transfer of the heat sink 14, most of the heat of the electronic components on the heat sink 1 is transferred to the bottom of the substrate body 1, and heat exchange is carried out with the bottom air, thereby realizing efficient heat dissipation of the substrate body 1.

[0021] In some embodiments, a limit block is provided on the top of the heat sink 14, and limit grooves are provided on both sides of the heat dissipation hole 12. The limit block is plugged into the limit groove, and the height of the limit block is equal to the depth of the limit groove. By plugging the limit block into the limit groove and setting the limit block height to the same as the depth of the limit groove, the plug-in positioning can be ensured, and the position stability of the heat sink 14 in the heat dissipation hole 12 can be improved, and it is not easy to shake.

[0022] In some embodiments, the heat sink 14 may be a square column with high heat transfer performance, such as a copper column. The high heat transfer performance of the heat sink 14 can be used to achieve efficient heat dissipation of electronic components. The heat sink 14 is protruding from the bottom surface of the substrate body 1 at one end and is provided with a cone. The cone may be a structure with a larger top and a smaller bottom, which facilitates the insertion of the heat sink 14 into the heat dissipation through hole 12.

[0023] In some embodiments, the heat sink 14 protrudes from the bottom surface of the substrate body 1 and is provided with a plurality of heat dissipation grooves, and the plurality of heat dissipation grooves are evenly arranged on the outer surface of the heat sink 14. The design of the heat dissipation grooves can further increase the contact area between the heat sink 14 and the air, thereby improving the heat dissipation efficiency.

[0024] The specific installation process and principles are as follows:

[0025] First, prepare an aluminum substrate. According to the design requirements, a plurality of connection units 11 are processed on the substrate body 1. The connection unit 11 is designed as two columns of parallel pins, and an appropriate space is left between the two columns of pins for arranging heat dissipation through holes 12. The two columns of pins are symmetrically arranged on both sides of the heat dissipation through hole 12 to ensure the uniformity of heat dissipation.

[0026] Next, fill the heat dissipation through hole 12 with high-temperature insulating glue. After it cools and forms, use a carving machine to open heat dissipation holes 15 at the position of the cooled and formed glue. The number and shape of the heat dissipation holes 15 correspond to the number and shape of the heat dissipation parts 14, so as to form an insulating sleeve 13 in the heat dissipation through hole 12, effectively isolating the electrical connection between the heat dissipation part 14 and the substrate body 1 and ensuring the safety of the circuit.

[0027] Then, apply high-temperature insulating glue on the surface of the heat dissipation part 14, insert the heat dissipation part 14 into the heat dissipation hole 15, make the top surface of the heat dissipation part 14 flush with the top surface of the substrate body 1, and the bottom protrude from the bottom surface of the substrate body 1; wait for the high-temperature insulating glue applied on the surface of the heat dissipation part 14 to cool and form, and the fixing installation of the heat dissipation part 14 on the substrate body 1 is completed. Electrically connect the electronic components installed on the top of the heat dissipation part 14 to the corresponding pins on the connection unit 11 to realize the installation of the electronic components on the substrate body 1.

[0028] When the electronic components work, the generated heat will be transferred to the heat dissipation part 14 and the substrate body 1. Since the bottom of the heat dissipation part 14 protrudes from the bottom surface of the substrate body 1 and is directly in contact with the air, most of the generated heat is dissipated into the air, and a small part of the heat is dissipated into the air through the substrate body 1, thus achieving an efficient heat dissipation effect. At the same time, due to the design of the heat dissipation grooves at the bottom of the heat dissipation part 14, the contact area between the heat dissipation part 14 and the air is increased, so that the heat can be quickly dissipated into the air, further improving the heat dissipation effect.

[0029] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A copper guide post heat dissipation aluminum substrate with high heat dissipation, comprising a substrate body (1), and a plurality of connection units (11) are arranged on the substrate body (1), and it is characterized in that: The connection unit (11) is provided with heat dissipation through holes (12). An insulating sleeve (13) is arranged in the heat dissipation through holes (12). A plurality of heat dissipation elements (14) are inserted in the insulating sleeve (13). The top of the heat dissipation element (14) is flush with the top surface of the substrate body (1), and the bottom of the heat dissipation element (14) protrudes from the bottom surface of the substrate body (1).

2. The high heat dissipation copper guide post heat dissipation aluminum substrate according to claim 1, characterized in that: The connection unit (11) includes two rows of pins arranged in parallel. The heat dissipation through holes (12) are arranged between the two rows of pins, and the two rows of pins are symmetrically arranged on both sides of the heat dissipation through holes (12).

3. The aluminum substrate for heat dissipation of a copper guide post with high heat dissipation according to claim 1, characterized in that: At least two heat dissipation holes (15) are arranged in the insulating sleeve (13), and the heat dissipation elements (14) are inserted in the heat dissipation holes (15).

4. The high heat dissipation copper guide post heat dissipation aluminum substrate according to claim 3, wherein: A limiting block is arranged at the top of the heat dissipation element (14). Limiting grooves are arranged on both sides of the heat dissipation through hole (12). The limiting block is inserted and matched with the limiting groove, and the height of the limiting block is equal to the depth of the limiting groove.

5. A highly heat-dissipating copper guide post heat-dissipating aluminum substrate according to claim 1, characterized in that: The heat dissipation element (14) is a square column, and a frustum of a cone is arranged at one end of the heat dissipation element (14) protruding from the bottom surface of the substrate body (1).

6. The high heat dissipation copper guide post heat dissipation aluminum substrate according to claim 1, characterized in that: A plurality of heat dissipation grooves are arranged at one end of the heat dissipation element (14) protruding from the bottom surface of the substrate body (1), and the plurality of heat dissipation grooves are uniformly arranged on the outer surface of the heat dissipation element (14).

7. The aluminum substrate for heat dissipation of a copper guide post with high heat dissipation according to claim 1, wherein: The insulating sleeve (13) is made of high-temperature insulating glue.

8. A highly heat-dissipating copper guide post heat-dissipating aluminum substrate according to claim 5, characterized in that: The heat dissipation element (14) is a copper column.

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