Scrap collecting structure of hardware machining and polishing device

By designing components such as protective covers and electric permanent magnet mesh plates in hardware processing and polishing devices, the problem of waste chip splash interference with the collection structure is solved, and efficient waste chip collection is achieved and secondary pollution is reduced.

CN223084515UActive Publication Date: 2025-07-11HUIZHOU YIDINGSHENG TECH IND CO LTD
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Patent Information

Application Number
CN202422325123.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-23
Publication Date
2025-07-11
Estimated Expiration
2034-09-23

AI Technical Summary

Technical Problem

During the hardware processing and polishing process, waste chips splash out from the adsorption range of the equipment, interfering with the waste chip collection structure and affecting the collection effect.

Method used

A waste chip collection structure of hardware processing and polishing device is designed, including a protective cover, adsorption cavity, adsorption hole, connecting hose, collection pipeline, fan, collection box and electric permanent magnet mesh plate. It is moved simultaneously with the robot arm to intercept splashed waste chips, and secondary interception is performed through the fan and electric permanent magnet mesh plate.

Benefits of technology

Effectively intercept splashed waste chips, improve collection effect, avoid secondary pollution, and improve the working quality of waste chip collection structure.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The utility model relates to the field of hardware machining, in particular to a hardware machining polishing device scrap collecting structure which comprises a workbench, a mechanical arm is arranged at the upper end of the workbench, a connecting rod is fixedly installed at the lower end of the mechanical arm, a protective cover is fixedly installed on the surface of the connecting rod, and an adsorption cavity is formed in the upper side of the interior of the protective cover. An adsorption hole is formed in the lower end of the adsorption cavity, a connecting hose is fixedly connected to the side of the upper end of the protective cover, a waste chip treatment box is fixedly mounted at the position, located on the side of the mechanical arm, of the upper end of the workbench, a collecting pipeline is fixedly connected to the left end of the waste chip treatment box, a fan is fixedly mounted in the collecting pipeline, and a collecting box is arranged in the waste chip treatment box; a through hole is formed in the left end of the collecting box; the grinding device is matched with the protective cover to synchronously move with a grinding point, so that the distance between the grinding device and waste chips is controlled to be reduced, meanwhile, the protective cover is used for intercepting the splashed waste chips, most of the waste chips are still located on the periphery of the protective cover, and the waste chip collecting effect is improved.
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Description

Technical Field

[0001] The utility model relates to the field of hardware processing, in particular to a waste chip collection structure for a hardware processing and polishing device. Background Technique

[0002] Hardware processing and polishing generally uses mechanical physical processing to reduce the surface roughness of workpieces and obtain a bright and flat surface. However, many fine metal waste chips will be generated during the processing, polluting the surrounding working environment and gradually accumulating on the processing table. Usually, a chip collection structure will be set on the polishing processing table to work with the polishing device to reduce the impact of metal waste chips.

[0003] Currently, when a hardware processing and polishing device is in processing, waste chips will fly everywhere, causing the waste chips to get out of the adsorption range of the device, thus interfering with the waste chip collection structure and affecting the collection effect of the waste chip collection structure.

[0004] Therefore, in view of the above problems that waste chips fly and get out of the adsorption range of the device, interfering with the waste chip collection structure and affecting the collection effect of the waste chip collection structure, a waste chip collection structure for a follow-up type anti-splash hardware processing and polishing device can be designed. Content of the Utility Model

[0005] In order to overcome the problems that waste chips fly and get out of the adsorption range of the device, interfering with the waste chip collection structure and affecting the collection effect of the waste chip collection structure.

[0006] The technical solution of the utility model is: a waste chip collection structure for a hardware processing and polishing device, including a workbench, a robotic arm is arranged at the upper end of the workbench, a connecting rod is fixedly installed at the lower end of the robotic arm, a protective cover is fixedly installed on the surface of the connecting rod, an adsorption cavity is opened on the upper side inside the protective cover, adsorption holes are opened at the lower end of the adsorption cavity, a connecting hose is fixedly connected to the side of the upper end of the protective cover, a waste chip treatment box is fixedly installed at the side of the robotic arm at the upper end of the workbench, a collection pipe is fixedly connected to the left end of the waste chip treatment box, a blower is fixedly installed inside the collection pipe, a collection box is arranged inside the waste chip treatment box, a through hole is opened at the left end of the collection box, an electro-permanent magnet mesh plate is fixedly installed inside the collection box, and a control connecting plate is fixedly installed at the front end of the collection box extending to the outside of the waste chip treatment box.

[0007] Preferably, a polishing wheel is arranged at the lower end of the connecting rod, one end of the connecting hose is communicated with the adsorption cavity, and the other end of the connecting hose is communicated with the collection pipe.

[0008] As a preference, the adsorption holes are distributed at equal intervals, and a protective net is fixedly installed inside the adsorption holes.

[0009] As a preference, the collection box is slidably connected to the waste chip treatment box, and the through hole is communicated with the collection pipe.

[0010] Preferably, the electro-permanent magnet mesh plates are equally spaced, and the control connecting plate is controlled to be snap-fitted with the waste chip disposal box.

[0011] Preferably, the electro-permanent magnet mesh plates are fixedly connected to the control connecting plate, and an electric control button is fixedly installed at the front end of the control connecting plate.

[0012] Preferably, a ventilation groove is provided at the upper end of the waste chip disposal box, and a dust-proof net is fixedly installed inside the ventilation groove.

[0013] Advantages of the present utility model:

[0014] For the waste chip collection structure of the hardware processing and polishing device of the present utility model, it moves synchronously with the protective cover and the grinding point, thereby controlling and reducing the distance from the waste chips. At the same time, the protective cover is used to intercept the flying waste chips, so that most of the waste chips are still around the protective cover, which is beneficial to improving the waste chip collection effect. When the waste chips are collected and enter the inside of the collection box, most of the metal waste chips are intercepted and adsorbed by the electro-permanent magnet mesh plates, and secondary interception is carried out in cooperation with the dust-proof net, which can prevent the metal waste chips from leaking outside the waste chip disposal box along with the air flow and causing secondary pollution, and is beneficial to improving the working quality of the waste chip collection structure. Description of the Drawings

[0015] Figure 1 The three-dimensional structure schematic diagram of the waste chip collection structure of the hardware processing and polishing device of the present utility model is shown;

[0016] Figure 2 The three-dimensional structure schematic diagram of the protective cover of the present utility model is shown;

[0017] Figure 3 The three-dimensional structure schematic diagram of the waste chip disposal box of the present utility model is shown Figure 1 ;

[0018] Figure 4 The three-dimensional structure schematic diagram of the waste chip disposal box of the present utility model is shown Figure 2 .

[0019] Description of the reference numerals: 1, workbench; 2, robotic arm; 3, connecting rod; 4, protective cover; 5, adsorption cavity; 6, adsorption hole; 7, connecting hose; 8, waste chip disposal box; 9, collection pipe; 10, fan; 11, collection box; 12, through hole; 13, electro-permanent magnet mesh plate; 14, control connecting plate; 15, polishing wheel; 16, protective net; 17, ventilation groove; 18, dust-proof net. Detailed Embodiments

[0020] The present utility model will be further described below with reference to the drawings and embodiments.

[0021] Please refer to Figures 1 - 4, this utility model provides an embodiment: a waste chip collection structure for a hardware processing and polishing device, including a workbench 1, a robotic arm 2 is arranged at the upper end of the workbench 1, a connecting rod 3 is fixedly installed at the lower end of the robotic arm 2, a protective cover 4 is fixedly installed on the surface of the connecting rod 3, an adsorption cavity 5 is opened on the upper side inside the protective cover 4, an adsorption hole 6 is opened at the lower end of the adsorption cavity 5, a connecting hose 7 is fixedly connected to the side of the upper end of the protective cover 4, a waste chip treatment box 8 is fixedly installed at the side of the robotic arm 2 on the upper end of the workbench 1, a collection pipe 9 is fixedly connected to the left end of the waste chip treatment box 8, a fan 10 is fixedly installed inside the collection pipe 9, a collection box 11 is arranged inside the waste chip treatment box 8, a through hole 12 is opened at the left end of the collection box 11, an electro-permanent magnet mesh plate 13 is fixedly installed inside the collection box 11, and a control connecting plate 14 is fixedly installed at the front end of the collection box 11 extending to the outside of the waste chip treatment box 8.

[0022] Please refer to Figures 1 - 2 , in this embodiment, a polishing wheel 15 is arranged at the lower end of the connecting rod 3, one end of the connecting hose 7 is communicated with the adsorption cavity 5, the other end of the connecting hose 7 is communicated with the collection pipe 9, the adsorption holes 6 are distributed at equal intervals, a protective net 16 is fixedly installed inside the adsorption holes 6, the robotic arm 2 drives the polishing wheel 15 to process the workpiece, and moves synchronously with the protective cover 4, so as to control and reduce the distance from the waste chips, and at the same time use the protective cover 4 to intercept the flying waste chips, so that most of the waste chips are still around the protective cover 4. The fan 10 drives the air to flow, so that the waste chips enter the waste chip treatment box 8 from the adsorption holes 6, completing the waste chip collection work and being beneficial to improving the waste chip collection effect.

[0023] Please refer to Figures 3 - 4 , in this embodiment, the collection box 11 is slidably connected to the waste chip treatment box 8, the through hole 12 is communicated with the collection pipe 9, the electro-permanent magnet mesh plates 13 are distributed at equal intervals, the control connecting plate 14 is snap-connected to the waste chip treatment box 8, the electro-permanent magnet mesh plate 13 is fixedly connected to the control connecting plate 14, an electric control button is fixedly installed at the front end of the control connecting plate 14, a ventilation slot 17 is arranged at the upper end of the waste chip treatment box 8, and a dust-proof net 18 is fixedly installed inside the ventilation slot 17. When the waste chips are collected and enter the collection box 11, the electro-permanent magnet mesh plate 13 is controlled through the electric control button and the control connecting plate 14, so that the outer surface of the electro-permanent magnet mesh plate 13 is in the state of charging and magnetically attracting materials, which is convenient for intercepting and adsorbing most of the metal waste chips, keeping the metal waste chips stable inside the collection box 11, and cooperating with the dust-proof net 18 for secondary interception, which can avoid the metal waste chips leaking outside the waste chip treatment box 8 with the air flow and generating secondary pollution, and is beneficial to improving the working quality of the waste chip collection structure.

[0024] When working, the polishing wheel 15 is driven by the robotic arm 2 to process the workpiece, and it moves synchronously with the protective cover 4, thereby controlling and reducing the distance from the waste chips. At the same time, the protective cover 4 is used to intercept the splashing waste chips, so that most of the waste chips still remain around the protective cover 4. The air is driven to flow by the blower 10, so that the waste chips enter the inside of the waste chip treatment box 8 from the adsorption holes 6. When the waste chips are collected and enter the inside of the collection box 11, the electro-permanent magnet mesh plate 13 is controlled by the electric control button and the control connecting plate 14, so that the electro-permanent magnet mesh plate 13 appears in a state of magnetically attracting materials, which is convenient for intercepting and adsorbing most of the metal waste chips, keeping the metal waste chips stable inside the collection box 11, and cooperating with the dust-proof net 18 for secondary interception, which can prevent the metal waste chips from leaking to the outside of the waste chip treatment box 8 along with the air flow and causing secondary pollution.

[0025] Through the above steps, the protective cover 4 is moved synchronously with the polishing point, thereby controlling and reducing the distance from the waste chips. At the same time, the protective cover 4 is used to intercept the splashing waste chips, so that most of the waste chips still remain around the protective cover 4, so as to solve the problem that the waste chips splash out of the adsorption range of the equipment, interfere with the waste chip collection structure, and affect the collection effect of the waste chip collection structure.

Claims

1. Scrap collection structure for a waste chip of a hardware processing and polishing device, comprising a workbench (1), characterized in that: A manipulator (2) is provided at the upper end of the workbench (1). A connecting rod (3) is fixedly installed at the lower end of the manipulator (2). A protective cover (4) is fixedly installed on the surface of the connecting rod (3). An adsorption cavity (5) is provided on the upper side inside the protective cover (4). An adsorption hole (6) is provided at the lower end of the adsorption cavity (5). A connecting hose (7) is fixedly connected to the side of the upper end of the protective cover (4). A waste chip treatment box (8) is fixedly installed on the upper end of the workbench (1) on the side of the manipulator (2). A collection pipe (9) is fixedly connected to the left end of the waste chip treatment box (8). A fan (10) is fixedly installed inside the collection pipe (9). A collection box (11) is provided inside the waste chip treatment box (8). A through hole (12) is provided at the left end of the collection box (11). An electro-permanent magnet mesh plate (13) is fixedly installed inside the collection box (11). The front end of the collection box (11) extends to the outside of the waste chip treatment box (8) and a control connection plate (14) is fixedly installed.

2. The waste chip collection structure of the hardware processing and polishing device according to claim 1, characterized in that: A polishing wheel (15) is provided at the lower end of the connecting rod (3). One end of the connecting hose (7) is communicated with the adsorption cavity (5), and the other end of the connecting hose (7) is communicated with the collection pipe (9).

3. The waste chip collection structure of the hardware processing and polishing device according to claim 1, characterized in that: The adsorption holes (6) are distributed at equal intervals, and a protective net (16) is fixedly installed inside the adsorption holes (6).

4. The waste chip collection structure of the hardware processing and polishing device according to claim 1, wherein: The collection box (11) is slidably connected to the waste chip treatment box (8), and the through hole (12) is communicated with the collection pipe (9).

5. The waste chip collection structure of the hardware processing and polishing device according to claim 1, characterized in that: The electro-permanent magnet mesh plates (13) are distributed at equal intervals, and the control connection plate (14) is snap-connected to the waste chip treatment box (8).

6. The waste chip collection structure of the hardware processing and polishing device according to claim 5, characterized in that: The electro-permanent magnet mesh plate (13) is fixedly connected to the control connection plate (14), and an electric control button is fixedly installed at the front end of the control connection plate (14).

7. The waste chip collection structure of the hardware processing and polishing device according to claim 1, characterized in that: A ventilation slot (17) is provided at the upper end of the waste chip treatment box (8), and a dust-proof net (18) is fixedly installed inside the ventilation slot (17).