Nickel plating group box for narrow-face copper plate of crystallizer

By designing a detachable insulating plate and back plate structure in the plating chamber, combined with the liquid inlet pipeline and pole bar arrangement, the problems of increasing impurities of plating solution and consistency in hardness in the trough electroplating are solved, and an efficient step-type electroplating effect is achieved.

CN223087966UActive Publication Date: 2025-07-11DALIAN ECONOMIC & TECH DEV ZONE DASHAN SURFACE TREATMENT CO LTD
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Patent Information

Application Number
CN202421832213.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-31
Publication Date
2025-07-11
Estimated Expiration
2034-07-31

AI Technical Summary

Technical Problem

The existing tank electroplating method leads to an increase in impurities of the plating solution, reducing conductivity efficiency, and step-type electroplating cannot be achieved, and the traditional method cannot meet the different hardness requirements at the meniscus of the crystallizer.

Method used

The detachable insulating plate and back plate design is adopted, and the copper plate of the workpiece is directly attached to the back plate of the plating chamber, combined with the liquid inlet pipeline and pole bar arrangement to realize the circulation of the plating solution and step-by-step electroplating.

Benefits of technology

The conductive efficiency is improved, the impurities of plating liquid are avoided, and the step-type electroplating effect is achieved with a lower upper plating layer of copper plate on the workpiece, with a higher lower plating layer.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a crystallizer narrow surface copper plate nickel plating group box, which comprises a box body base and a group box outer wall, the group box outer wall is enclosed by two side plates and two back plates, the group box outer wall is arranged on the box body base to form a plating solution box body, a plurality of detachable binding insulation plates are arranged on the back plates of the plating solution box body, and the binding insulation plates are arranged on the box body base. The face, located on the inner side of the plating solution box body, of the combining insulating plate and the face, located on the inner side of the plating solution box body, of the back plate are combining planes of the plating solution box body, a plurality of bolt installation holes are formed in the combining insulating plate, combining bolts with conductivity are assembled on the bolt installation holes, two pole bars are arranged above the plating solution box body in the length direction of the plating solution box body, and a plurality of anode plates are hung on each pole bar in the length direction of the plating solution box body. The anode plate is located in the plating solution box body, a box body base located in the plating solution box body is provided with a solution inlet and a solution return port, and a solution inlet pipeline is arranged. According to the utility model, the non-electroplating surface of the workpiece copper plate is combined on the combining plane of the plating solution box body, and electroplating is carried out in the plating solution in the box body without using an insulating tape for sealing protection, so that the electric conductivity is improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of electroplating equipment, and particularly relates to a nickel plating group box for the narrow face copper plate of a mold. Background Art

[0002] At present, in the market of the narrow face copper plate of a mold, trough electroplating (immersion electroplating) is adopted. The narrow copper plate is assembled with a stainless steel conductive hanging hook, and the narrow face copper plate is hoisted into a plating solution tank by a lifting tool for electroplating. Its main advantages are that the electroplating equipment is simple, the main body of the equipment is a DC power supply and a plating tank, the investment in the production line is low, and it is easy to construct. Therefore, this electroplating method is widely used. However, the defects are that the plating solution corrodes the white steel hanging tool, the impurities of the white steel hanging tool are incorporated into the plating solution, the amount of impurities formed in the plating solution increases, the conductivity efficiency is reduced, and further the utilization rate of the main material is reduced; the non-electroplating surface of the narrow face copper plate needs to be sealed with insulating tape; in addition, in traditional trough nickel plating, the plating solution performs internal circulation in the plating solution tank, and stepped electroplating cannot be realized. Therefore, the hardness of the upper port coating and the lower port coating of the narrow face copper plate is the same. In order to meet the thermal shock effect of high-temperature molten steel at the meniscus of the mold, the hardness requirement of the upper port coating of the workpiece copper plate is lower, and in order to meet the friction of the steel billet moving in the mold, the hardness requirement of the lower port coating is higher. Content of the Utility Model

[0003] In view of the above problems, the utility model provides a nickel plating group box for the narrow face copper plate of a mold, which uses a clamping insulating plate as a tooling, directly clamps the narrow face copper plate on the back plate of the plating solution box body through the tooling, and electroplates it in the circulating plating solution in the plating solution box body.

[0004] To achieve the above purpose, the following technical solutions are adopted: a nickel plating group box for the narrow face copper plate of a mold, including a box body base and an outer wall of the group box. The outer wall of the group box is formed by enclosing two side plates and two back plates, and the outer layer of the back plate and the side plate is reinforced with white steel plates. The outer wall of the group box is installed on the box body base to form a plating solution box body. A number of detachable clamping insulating plates are arranged on the back plate of the plating solution box body, and the number of clamping insulating plates is evenly arranged along the length direction of the back plate. The side of the clamping insulating plate and the back plate facing the inside of the plating solution box body is the clamping plane of the plating solution box body. A number of bolt mounting holes are arranged on the clamping insulating plate, and conductive clamping bolts are assembled on the bolt mounting holes. The non-electroplating surface of the workpiece copper plate is clamped on the clamping plane of the plating solution box body through the clamping bolts, and any clamping bolt is used as the cathode connection terminal.

[0005] Two pole bars are arranged along the length direction above the plating solution box body. The pole bars are used as the anode connection terminals. A number of anode plates are suspended along the length direction of each pole bar. The anode plates on the two pole bars are symmetrically arranged, and the anode plates are located inside the plating solution box body.

[0006] The box base located inside the electroplating box body is provided with a liquid inlet and a liquid return port, and a liquid inlet pipeline is arranged. The liquid inlet is connected to the liquid inlet pipeline, and both the liquid inlet and the liquid return port are externally connected to a liquid storage tank.

[0007] Further, the liquid inlet pipeline includes a tee pipe and two branch pipelines. The tee pipe is respectively connected to the liquid inlet and the two branch pipelines. The two branch pipelines are arranged along the length direction of the electroplating box body. The distances from the two branch pipelines to the two back plates are equal. A number of liquid injection holes are opened on each branch pipeline, and the liquid injection holes form an angle of 45° with the horizontal plane.

[0008] Further, L-shaped baffles are arranged at the positions corresponding to the liquid injection holes on the branch pipelines, and the L-shaped baffles are installed on the box base inside the plating solution box body.

[0009] Further, the distances from the anode plates suspended on the two pole bars to the corresponding back plates are equal respectively.

[0010] Further, the bolt mounting holes on the butting insulating plate are long holes, and the butting bolts are assembled in the long holes through cushion blocks.

[0011] Further, copper plate support blocks are arranged on the inner wall of the back plate, and the copper plate support blocks are located below the butting insulating plate.

[0012] Further, leakage baffle plates are welded on the outer edges around the box base. A leakage trough is formed between the leakage baffle plates and the plating solution box body, and a liquid discharge port is left at the bottom of the leakage trough.

[0013] Further, square steel pipes are installed on the white steel plate on the outer layer of the back plate for reinforcement.

[0014] Advantages of the utility model:

[0015] In this new type, a detachable butting insulating plate is designed on the back plate of the plating solution box body as the butting tool for the workpiece copper plate. The butting plane of the butting insulating plate and the back plate on the inner side of the box body is the butting plane of the plating solution box body. The non-electroplated surface of the workpiece copper plate is butted on this plane, and electroplating is carried out in the plating solution in the box body. There is no need to use insulating tape to seal and protect the non-electroplated surface, avoiding impurities of the lifting tool and the insulating tape from mixing into the plating solution, improving the conductivity, and shortening the electroplating time.

[0016] The liquid inlet and the liquid return port are arranged inside the plating solution box body for externally connecting to a liquid storage tank. By controlling the liquid inlet volume, the height of the plating solution in the electroplating box body is realized, so that the hardness of the upper layer of the coating is lower and the hardness of the lower layer of the coating is higher, realizing stepped electroplating; and a liquid inlet pipeline is arranged inside the plating solution box body, and liquid injection holes are opened on the liquid inlet pipeline, so that the plating solution surges in the box body, preventing pinholes from appearing on the electroplated surface of the workpiece copper plate. Description of the drawings

[0017] Figure 1 It is a cross-sectional view in the main viewing direction of the utility model;

[0018] Figure 2 is a cross-sectional view of the present utility model in the side view direction;

[0019] Figure 3 is a top view of the present utility model;

[0020] Figure 4 is a structural schematic diagram of the outer wall of the group box.

[0021] As shown in the figure: 1. Box base; 2. Back plate; 3. Side plate; 4. Clamping insulating plate; 5. Pole bar; 6. Anode plate; 7. Liquid inlet; 8. Liquid return port; 9. Three-way pipe; 10. Branch pipeline; 11. L-shaped baffle; 12. Leakage baffle; 13. Drain port; 14. Square steel pipe; 20. Copper plate support block; 40. Bolt mounting hole; 41. Clamping bolt; 42. Spacer; 900. Workpiece copper plate. Specific embodiments

[0022] Embodiment 1

[0023] The following is further described in conjunction with the accompanying drawings. As Figures 1-4 shown, a nickel-plated group box for the narrow face copper plate of a mold is provided, including a box base 1 and the outer wall of the group box. The box base 1 is composed of a composite of a PVC plate and a carbon steel plate. The outer wall of the group box is assembled and enclosed by two side plates 3 and two back plates 2. The back plate 2 and the side plate 3 are composite structures with a PVC plate wrapped with a white steel plate for reinforcement. Installation slot holes for installing the clamping insulating plate 4 are reserved on the plate surface of the back plate 2. The clamping insulating plate 4 is provided with a number of bolt mounting holes 40 for clamping the workpiece copper plate. Since the hole distances of the bolt holes on different models of workpiece copper plates 900 are different, the bolt mounting holes 40 are designed as long slots to facilitate clamping with different models of workpiece copper plates 900. Among them Figure 2 the clamping insulating plate 4, the clamping bolt 41 and the spacer 42 are not visible in this view direction and are represented by dotted lines, and the pole bar 5, the anode plate 6 and the legs of the box base 1 are not shown Figure 3 the square steel pipe 14 is not shown

[0024] For the design of the plating solution tank body, the outer wall of the assembled tank is installed on the tank body base 1 to form the plating solution tank body. To prevent the deformation of the plating solution tank body after injecting the plating solution, square steel pipes 14 are installed on the white steel plate on the outer layer of the back plate 2 for reinforcement. A number of detachable clamping insulating plates 4 are installed on the back plate 2. The clamping insulating plates 4 are evenly arranged along the length direction of the back plate 2. The side of the clamping insulating plate 4 and the back plate 2 facing the inside of the plating solution tank body is the clamping plane of the plating solution tank body. Conductive clamping bolts 41 are assembled on the bolt mounting holes 40. The clamping bolts 41 are assembled in the bolt mounting holes 40 through the cushion blocks 42. When assembling the workpiece copper plate 900, the clamping bolts 41 are installed from the electroplating surface side of the workpiece copper plate 900, passing through the bolt holes of the workpiece copper plate 900, the bolt mounting holes 40 of the clamping insulating plate 4 and the cushion blocks 42 in sequence, and clamping the non-electroplating surface of the workpiece copper plate 900 on the clamping plane of the plating solution tank body.

[0025] Copper plate support blocks 20 are arranged on the inner wall of the back plate 2 for positioning and supporting the workpiece copper plate 900. The copper plate support blocks 20 are located below the clamping insulating plates 4.

[0026] Two pole bars 5 are arranged along the length direction above the plating solution tank body. The distances from the anode plates 6 suspended on the two pole bars 5 to their corresponding back plates 2 are equal respectively. The pole bars 5 are supported by on-site third-party support frames. A number of anode plates 6 are suspended along the length direction of each pole bar 5. The anode plates 6 on the two pole bars 5 are symmetrically arranged. The anode plates 6 are located inside the plating solution tank body.

[0027] On the tank body base 1 located inside the electroplating tank body, there are a liquid inlet 7 and a liquid return port 8, and a liquid inlet pipeline is arranged. The liquid inlet 7 is connected to the liquid inlet pipeline. The liquid inlet 7 and the liquid return port 8 are used for connecting to an external liquid storage tank. The liquid inlet pipeline includes a tee pipe 9 and two branch pipelines 10. The tee pipe 9 is respectively connected to the liquid inlet 7 and the two branch pipelines 10. The two branch pipelines 10 are arranged along the length direction of the electroplating tank body. The distances from the two branch pipelines 10 to the two back plates 2 are equal respectively. A number of liquid injection holes are opened on each branch pipeline 10. The liquid injection holes form an angle of 45° with the horizontal plane, ensuring that during the electroplating process, the plating solution surges when circulating in the plating solution tank body, preventing the appearance of pinholes on the electroplating surface of the workpiece copper plate 900. To prevent the plating solution from splashing to the base and reflecting onto the workpiece copper plate 900 when the liquid injection holes are injecting liquid in a cycle, an L-shaped baffle 11 is arranged at the corresponding position of the liquid injection holes. The L-shaped baffle 11 is installed on the tank body base 1 inside the plating solution tank body.

[0028] Leakage baffle plates 12 are welded on the outer edges around the tank body base 1. A leakage trough is formed between the leakage baffle plates 12 and the plating solution tank body. A liquid discharge port 13 is left at the bottom of the leakage trough, preventing the leakage of the tank solution caused by misoperation during the electroplating process or after electroplating is completed. Once there is any leakage, the tank solution remains within the enclosure and can be directly recycled.

[0029] During operation, the corresponding clamping insulating plate 4 is equipped according to the model of the workpiece copper plate 900. Since the models of the workpiece copper plates 900 are different, the clamping insulating plate 4 with bolt mounting holes 40 matching the bolt holes of the workpiece copper plate 900 should be equipped. The workpiece copper plate 900 is assembled on the clamping plane of the plating solution tank body. On the clamping insulating plates 4 assembled on the two back plates 2, respectively select a clamping bolt 41 as the cathode connection terminal, and the two pole bars 5 as the anode connection terminals, and wire and energize them respectively to form a current loop. The liquid inlet 7 and the liquid return port 8 in the plating solution tank body are externally connected to a liquid storage tank and the liquid is circulated through a circulating pump. The plating solution enters through the liquid inlet 7 via the liquid inlet pipeline and returns through the liquid return port 8, forming a circulating plating solution in the plating solution tank body to ensure the stability of the plating solution parameters. By adjusting the liquid inlet parameters, stepped electroplating can be achieved.

[0030] The present utility model is not limited to this embodiment, and any equivalent conceptions or changes within the technical scope disclosed by the present utility model are included in the protection scope of the present utility model.

Claims

1. A nickel-plated group box for the narrow face copper plate of a mold, comprising a box body base (1) and an outer wall of the group box, characterized in that, The outer wall of the tank group is formed by enclosing two side plates (3) and two back plates (2). The outer layers of the back plates (2) and the side plates (3) are reinforced with white steel plates. The outer wall of the tank group is installed on the tank body base (1) to form a plating solution tank body. A number of detachable clamping insulating plates (4) are provided on the back plate (2) of the plating solution tank body. The number of clamping insulating plates (4) is evenly arranged along the length direction of the back plate. The side of the clamping insulating plate (4) and the back plate (2) facing the inner side of the plating solution tank is the clamping plane of the plating solution tank body. A number of bolt mounting holes (40) are provided on the clamping insulating plate (4). Conductive clamping bolts (41) are assembled on the bolt mounting holes (40). The workpiece copper plate (900) is clamped on the clamping plane of the plating solution tank body with its non-electroplated surface through the clamping bolts (41). Any one of the clamping bolts (41) serves as the cathode connection terminal. Two pole bars (5) are arranged along the length direction above the plating solution tank body. The pole bars (5) serve as the anode connection terminals. A number of anode plates (6) are suspended along the length direction of each pole bar (5). The anode plates (6) on the two pole bars (5) are symmetrically arranged. The anode plates (6) are located inside the plating solution tank body. An inlet (7) and a return outlet (8) are provided on the tank body base (1) inside the electroplating tank body. And a liquid inlet pipeline is arranged. The inlet (7) is connected to the liquid inlet pipeline. Both the inlet (7) and the return outlet (8) are externally connected to a liquid storage tank.

2. The nickel-plated assembly box for the narrow face copper plate of the mold according to claim 1, wherein The liquid inlet pipeline includes a tee pipe (9) and two branch pipelines (10). The tee pipe (9) is respectively connected to the inlet (7) and the two branch pipelines (10). The two branch pipelines (10) are arranged along the length direction of the electroplating tank body. The distances from the two branch pipelines (10) to the two back plates (2) are equal. A number of liquid injection holes are opened on each branch pipeline (10). The liquid injection holes form an angle of 45° with the horizontal plane.

3. The nickel-plated crystallizer narrow face copper plate assembly box according to claim 2, characterized in that, L-shaped baffles (11) are arranged at the positions corresponding to the liquid injection holes on the branch pipelines (10). The L-shaped baffles (11) are installed on the tank body base (1) inside the plating solution tank body.

4. The crystallizer narrow face copper plate nickel plating group box according to claim 3, characterized in that, The distances from the suspended anode plates (6) on the two pole bars (5) to the corresponding back plates (2) are equal respectively.

5. The nickel-plated copper plate for the narrow face of the mold according to claim 4, wherein The bolt mounting holes (40) on the clamping insulating plates (4) are long holes. The clamping bolts (41) are assembled in the long holes through pads (42).

6. The nickel-plated crystallizer narrow face copper plate assembly box according to claim 5, characterized in that, Copper plate support blocks (20) are provided on the inner wall of the back plate (2). The copper plate support blocks (20) are located below the clamping insulating plates (4).

7. The crystallizer narrow face copper plate nickel plating group box according to claim 6, characterized in that, Leakage baffles (12) are welded on the outer edges around the tank body base (1). A leakage trough is formed between the leakage baffles (12) and the plating solution tank body. A liquid discharge port (13) is left at the bottom of the leakage trough.

8. The crystallizer narrow-face copper plate nickel-plated group box according to any one of claims 1-7, characterized in that, Square steel pipes (14) are installed on the white steel plates on the outer layer of the back plate (2) for reinforcement.