Gas circuit device and laser annealing equipment
By setting up high-pressure air blowing holes and low-pressure air pumping holes on both sides of the wafer, a stable cooling air flow is formed, which solves the problem of poor heat dissipation during the wafer laser annealing process, and improves the heat dissipation effect and yield of the workpiece.
Patent Information
- Application Number
- CN202421817742.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-30
- Publication Date
- 2025-07-11
- Estimated Expiration
- 2034-07-30
AI Technical Summary
In the prior art, the wafer has poor heat dissipation effect during laser annealing, which leads to difficulty in temperature control, which may lead to warping or poor wafers, affecting yield.
A gas circuit device is designed, using high-pressure air blowing holes and low-pressure air pumping holes to be located on both sides of the workpiece, forming a stable cooling air flow. The gas blown through the air blowing holes is quickly drawn away by the air pumping holes to prevent the gas from staying or overflowing and improve the heat dissipation effect.
Through this gas circuit device, the heat dissipation effect of the wafer is significantly improved and the yield of workpieces after laser annealing is improved.
Smart Images
Figure CN223090440U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of laser annealing, and particularly relates to a gas path device and a laser annealing apparatus. Background Art
[0002] In the manufacturing process of semiconductor devices, an ion implantation process is performed on the back surface of the wafer, source electrode, or drain electrode of some devices. The ion implantation process can cause serious damage to the silicon lattice, resulting in the doped impurity ions not occupying the correct lattice positions, and some doped regions not having effective electrical activity.
[0003] After the ion implantation process, the wafer needs to be heated. After the wafer is heated to a high temperature state, the impurity atoms will diffuse in the lattice and occupy substitution positions to achieve activation. During the subsequent rapid cooling, the atoms in the lattice are rearranged to achieve the required lattice structure. This heating process is called an annealing process.
[0004] Laser annealing is a process method for heat-treating materials using pulsed lasers. Due to advantages such as high instantaneous temperature, short action time, and small heat-affected zone, laser annealing can well meet the process requirements of electrical activity activation, and thus has become one of the key processes in the chip manufacturing process.
[0005] During the laser annealing process of the wafer, too high a temperature will cause the wafer to warp or become defective. Therefore, it is necessary to control the temperature of the wafer. In the related art, although the wafer is cooled by an inert gas, the cooling effect is generally average. Summary of the Utility Model
[0006] The present application aims to at least solve one of the technical problems existing in the prior art. For this purpose, the present application provides a gas path device that can effectively improve the cooling effect.
[0007] The present application also provides a laser annealing apparatus having the above gas path device.
[0008] The gas path device according to the first aspect embodiment of the present application includes:
[0009] A blowing member provided with a blowing hole for communicating with a first gas source, and the air pressure of the first gas source is greater than the atmospheric pressure;
[0010] A pumping member provided with a pumping hole for communicating with a second gas source, and the air pressure of the second gas source is less than the atmospheric pressure; a first position is provided for placing a workpiece, and the pumping hole and the blowing hole are respectively located on opposite sides of the first position, and the pumping hole is used for pumping the gas blown out by the blowing hole.
[0011] The air path device according to the embodiments of the present application has at least the following beneficial effects: The air extraction hole and the air blowing hole are respectively located on opposite sides of the first position. After the gas blown out from the air blowing hole passes through the workpiece (such as a wafer), it is sucked away by the air extraction hole. The air extraction hole and the air blowing hole can form a stable cooling air flow at the first position, and the gas blown out from the air blowing hole is not likely to stay or disperse around the workpiece after passing through the workpiece. Therefore, it is beneficial to improve the heat dissipation effect.
[0012] According to some embodiments of the present application, a plurality of the air blowing holes are provided, and the plurality of the air blowing holes are spaced apart and distributed around the first position.
[0013] According to some embodiments of the present application, the air blowing member is further provided with a first channel for communicating with the first air source, and each of the air blowing holes is communicated with the first channel.
[0014] According to some embodiments of the present application, the air blowing member is further provided with air inlet holes, one end of each of the air inlet holes is used for communicating with the first air source, the other end of each of the air inlet holes is communicated with the first channel, and the air inlet holes are spaced apart and distributed along the length direction of the first channel.
[0015] According to some embodiments of the present application, the air blowing member includes:
[0016] A first base provided with a first groove;
[0017] A first cover plate connected to the first base. Let the side surface of the first cover plate facing the first base be the first side surface, and the first side surface and the first groove together form the first channel.
[0018] According to some embodiments of the present application, a plurality of the air extraction holes are provided, and the plurality of the air extraction holes are spaced apart and distributed around the first position.
[0019] According to some embodiments of the present application, the air extraction member is further provided with a second channel for communicating with the second air source, and each of the air extraction holes is communicated with the second channel.
[0020] According to some embodiments of the present application, the air extraction member is further provided with air outlet holes, one end of each of the air outlet holes is used for communicating with the second air source, the other end of each of the air outlet holes is communicated with the second channel, and the air outlet holes are spaced apart and distributed along the length direction of the second channel.
[0021] According to some embodiments of the present application, the air extraction member includes:
[0022] A second base provided with a second groove;
[0023] The second cover plate is connected to the second base. Let the side of the second cover plate facing the second base be the second side surface, and the second side surface and the second groove together form the second channel.
[0024] The laser annealing device according to the second aspect embodiment of the present application includes:
[0025] The above-mentioned gas path device;
[0026] A laser device for annealing the workpiece located at the first position.
[0027] The laser annealing device according to the embodiment of the present application has at least the following beneficial effects: By using the above-mentioned gas path device, it is beneficial to improve the heat dissipation effect of the workpiece, and thus it is beneficial to improve the yield rate of the workpiece after annealing.
[0028] The additional aspects and advantages of the present application will be partially given in the following description, partially become obvious from the following description, or be understood through the practice of the present application. Description of the Drawings
[0029] The following further describes the present application in conjunction with the drawings and embodiments, where:
[0030] Figure 1 is the top view of the gas path device according to the embodiment of the present application;
[0031] Figure 2 is Figure 1 the cross-sectional view of the gas path device along the A-A section in
[0032] Figure 3 is Figure 2 the partial enlarged view of the I area in
[0033] Figure 4 is Figure 2 the partial enlarged view of the II area in
[0034] Figure 5 is Figure 1 the three-dimensional view of the gas path device in
[0035] Figure 6 is the schematic diagram of the laser annealing device according to the embodiment of the present application.
[0036] Reference numerals: blowing member 100, blowing hole 110, first channel 120, air inlet hole 130, third channel 140, inlet 141, first cover plate 150, first side surface 151, first base 160, first groove 161;
[0037] Air extraction component 200, air extraction hole 210, second channel 220, air outlet hole 230, fourth channel 240, outlet 241, second cover plate 250, second side surface 251, second base 260, second groove 261;
[0038] Mounting seat 300;
[0039] Laser device 410, workpiece 420. Specific implementation manner
[0040] The embodiments of the present application will be described in detail below. The examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and should not be construed as a limitation to the present application.
[0041] In the description of the present application, it should be understood that with regard to the orientation description, such as the orientation or positional relationship indicated by up, down, front, back, left, right, etc. is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.
[0042] In the description of the present application, the meaning of several is one or more, the meaning of multiple is two or more, greater than, less than, exceeding, etc. are understood as not including the number itself, and above, below, within, etc. are understood as including the number itself. If there is a description of first and second, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence relationship of the indicated technical features.
[0043] In the description of the present application, unless otherwise clearly defined, words such as setting, installing, connecting, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in the present application in combination with the specific content of the technical solution.
[0044] In the description of the present application, the description with reference to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.
[0045] Refer to Figure 1, The air circuit device according to the embodiment of the first aspect of the present application includes a blowing member 100 and a pumping member 200. The blowing member 100 is provided with a blowing hole 110, and the blowing hole 110 is used to communicate with a first air source, and the air pressure of the first air source is greater than the atmospheric pressure. The pumping member 200 is provided with a pumping hole 210, and the pumping hole 210 is used to communicate with a second air source, and the air pressure of the second air source is less than the atmospheric pressure. Let the first position be used to place the workpiece 420. The pumping hole 210 and the blowing hole 110 are respectively located on opposite sides of the first position, and the pumping hole 210 is used to suck the gas blown out by the blowing hole 110.
[0046] The air circuit device according to the embodiment of the present application has at least the following beneficial effects: The pumping hole 210 and the blowing hole 110 are respectively located on opposite sides of the first position. After the gas blown out by the blowing hole 110 passes through the workpiece 420 (such as a wafer), it is sucked away by the pumping hole 210. The pumping hole 210 and the blowing hole 110 can form a stable cooling air flow at the first position, and the gas blown out by the blowing hole 110 is not likely to stay or disperse around the workpiece 420 after passing through the workpiece 420, thereby being beneficial to improving the heat dissipation effect.
[0047] Specifically, the first air source can be an inert gas or nitrogen. The second air source can be generated by a vacuum pump (such as a mechanical vacuum pump, a turbomolecular pump, etc.), a Venturi tube, a diaphragm pump or other means.
[0048] Specifically, the blowing member 100 and the pumping member 200 can be two independent parts or components without a connection relationship, or two fixedly connected parts or components, such as being connected into one body (see the following description), or being fixed by fasteners.
[0049] It should be noted that if the pumping hole 210 is to suck the gas blown out by the blowing hole 110, the blowing direction of the blowing hole 110 needs to intersect with the direction of sucking gas by the pumping hole 210. In a preferred embodiment, the blowing direction of one blowing hole 110 is collinear with the direction of sucking gas by one pumping hole 210. At this time, the air flow between the blowing hole 110 and the pumping hole 210 is more stable, and the gas blown out by the blowing hole 110 is less dispersed.
[0050] It should be noted that the air flow blown out by the blowing hole 110 can not only dissipate heat from the workpiece 420, but also blow away the dust on the workpiece 420, and the pumping hole 210 can suck the gas with dust, so as to keep the workpiece 420 clean.
[0051] Refer to Figure 1 , In some embodiments of the present application, there are multiple blowing holes 110, and the multiple blowing holes 110 are distributed at intervals around the first position.
[0052] By providing a plurality of air blowing holes 110, the air flow blown out from the air blowing holes 110 can blow towards the workpiece 420 from various angles, the contact area between the air flow blown out from the air blowing holes 110 and the workpiece 420 is larger, and the heat dissipation effect is better.
[0053] Specifically, the number of the air blowing holes 110 can be two, three, four or other numbers.
[0054] Refer to Figure 1 , in an improved solution of the above embodiment, the air blowing member 100 is further provided with a first channel 120 for communicating with a first air source, and each air blowing hole 110 is communicated with the first channel 120.
[0055] By providing the first channel 120, it helps to make the air pressures of the respective air blowing holes 110 tend to be consistent, so that the air flow rates blown out from the respective air blowing holes 110 are more consistent, and the cooling of the workpiece 420 is more uniform.
[0056] Refer to Figure 1 , in an improved solution of the above embodiment, the air blowing member 100 is further provided with air inlet holes 130, one ends of the respective air inlet holes 130 are used for communicating with the first air source, the other ends of the respective air inlet holes 130 are communicated with the first channel 120, and the respective air inlet holes 130 are spaced apart along the length direction of the first channel 120.
[0057] By providing a plurality of air inlet holes 130, the air pressure distribution in the first channel 120 will be more uniform, the air flow rates blown out from the respective air blowing holes 110 will be more consistent, and the cooling of the workpiece 420 is more uniform.
[0058] Specifically, the number of the air inlet holes 130 can be two, three, four or other numbers.
[0059] Specifically, refer to Figure 1 , one end of each air inlet hole 130 is communicated with a third channel 140, and the third channel 140 is provided with two inlets 141 which are communicated with the first air source.
[0060] Refer to Figure 1 , in an improved solution of the above embodiment, the respective air inlet holes 130 are evenly distributed along the length direction of the first channel 120. At this time, the air pressure distribution in the first channel 120 will be more uniform, the air flow rates blown out from the respective air blowing holes 110 will be more consistent, and the cooling of the workpiece 420 is more uniform.
[0061] Refer to Figure 2 and Figure 3, in the improved solution of the above embodiment, the blowing member 100 includes a first cover plate 150 and a first base 160. The first base 160 is provided with a first groove 161. The first cover plate 150 is connected to the first base 160. Let the side of the first cover plate 150 facing the first base 160 be the first side 151. The first side 151 and the first groove 161 together form a first channel 120.
[0062] By dividing the blowing member 100 into the first cover plate 150 and the first base 160, and the first channel 120 is jointly formed by the first side 151 and the first groove 161, it is convenient to process the first channel 120, thereby reducing the production cost of the blowing member 100.
[0063] Specifically, the first cover plate 150 can be fixedly connected to the first base 160 through fasteners, or fixedly adhered to the first base 160 through glue, or snap-connected to the first base 160.
[0064] Refer to Figure 1 , in some embodiments of the present application, there are multiple air extraction holes 210, and the multiple air extraction holes 210 are spaced apart around a first position.
[0065] By providing multiple air extraction holes 210, the air extraction holes 210 can suck the gas after heat exchange with the workpiece 420 from various angles, and the probability of the gas after heat exchange staying or dissipating around the workpiece 420 is smaller, and the heat dissipation effect of the workpiece 420 is better.
[0066] Specifically, the number of the air extraction holes 210 can be two, three, four or other numbers.
[0067] Refer to Figure 1 , in the improved solution of the above embodiment, according to some embodiments of the present application, the air extraction member 200 is further provided with a second channel 220 for communicating with a second air source, and each air extraction hole 210 is communicated with the second channel 220.
[0068] By providing the second channel 220 as an intermediate channel for each air extraction hole 210 to communicate with the second air source, it helps to make the air pressure of each air extraction hole 210 tend to be consistent, and further makes the suction force of each air extraction hole 210 tend to be consistent, and the gas in all directions of the workpiece 420 can be evenly sucked away, and the cooling of the workpiece 420 is more uniform.
[0069] Refer to Figure 1 , in the improved solution of the above embodiment, the air extraction member 200 is further provided with air outlet holes 230. One end of each air outlet hole 230 is used for communicating with the second air source, the other end of each air outlet hole 230 is communicated with the second channel 220, and each air outlet hole 230 is spaced apart along the length direction of the second channel 220.
[0070] By setting a plurality of air outlet holes 230, the air pressure distribution in the second channel 220 will be more uniform, the suction force of each air extraction hole 210 will tend to be consistent, and the workpiece 420 will be cooled more uniformly.
[0071] Specifically, the number of the air outlet holes 230 can be two, three, four or other numbers.
[0072] Specifically, referring to Figure 1 one end of each air outlet hole 230 communicates with a fourth channel 240, the fourth channel 240 is provided with two outlets 241, and the two outlets 241 are communicated with a second air source.
[0073] Referring to Figure 2 and Figure 4 in the improvement scheme of the above embodiment, the air extraction member 200 includes a second cover plate 250 and a second base 260. The second base 260 is provided with a second groove 261. The second cover plate 250 is connected to the second base 260. Let the side surface of the second cover plate 250 facing the second base 260 be a second side surface 251, and the second side surface 251 and the second groove 261 together form a second channel 220.
[0074] By dividing the air extraction member 200 into the second cover plate 250 and the second base 260, and the second channel 220 is jointly formed by the second side surface 251 and the second groove 261, it is convenient to process the second channel 220, thereby reducing the production cost of the air extraction member 200.
[0075] Specifically, the second cover plate 250 can be fixedly connected to the second base 260 through fasteners, or fixedly adhered to the second base 260 through glue, or fixedly connected to the second base 260 by snap connection.
[0076] Referring to Figure 1 in some embodiments, the second cover plate 250 and the first cover plate 150 are integrally formed, and the second base 260 and the first base 160 are integrally formed. At this time, the air blowing member 100 and the air extraction member 200 are connected into one body.
[0077] Referring to Figure 5 the air path device further includes mounting seats 300. There are two mounting seats 300, and the two mounting seats 300 are respectively located on both sides of the first base 160. The two mounting seats 300 are fixedly connected to the first base 160 through fasteners. The mounting seats 300 are used for connecting with other devices, and the two inlets 141 of the third channel 140 are respectively arranged on the two mounting seats 300, and the two outlets 241 of the fourth channel 240 are respectively arranged on the two mounting seats 300.
[0078] Referring to Figure 6, The laser annealing equipment according to the second aspect embodiment of the present application includes a gas path device and a laser device 410. The laser device 410 is used to anneal a workpiece 420 located at a first position.
[0079] The laser annealing equipment according to the embodiment of the present application has at least the following beneficial effects: By using the above-mentioned gas path device, it is beneficial to improve the heat dissipation effect of the workpiece 420, thereby being beneficial to improving the yield rate of the annealed workpiece 420.
[0080] The embodiments of the present application have been described in detail above in conjunction with the accompanying drawings. However, the present application is not limited to the above embodiments. Within the scope of knowledge possessed by those of ordinary skill in the art, various changes can be made without departing from the purpose of the present application. In addition, without conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.
Claims
1. Air circuit device, characterized in that, Comprising: A blowing member is provided with a blowing hole for communicating with a first gas source, and the air pressure of the first gas source is greater than the atmospheric pressure. A pumping member is provided with a pumping hole for communicating with a second gas source, and the air pressure of the second gas source is less than the atmospheric pressure. A first position is provided for placing a workpiece, and the pumping hole and the blowing hole are respectively located on opposite sides of the first position, and the pumping hole is used for sucking the gas blown out by the blowing hole.
2. The gas path device according to claim 1, characterized in that, A plurality of the blowing holes are provided, and the plurality of blowing holes are spaced around the first position.
3. The air circuit device according to claim 2, characterized in that, The blowing member is further provided with a first channel for communicating with the first gas source, and each blowing hole is communicated with the first channel.
4. The gas path device according to claim 3, characterized in that, The blowing member is further provided with an air inlet hole, one end of each air inlet hole is used for communicating with the first gas source, the other end of each air inlet hole is communicated with the first channel, and the air inlet holes are spaced along the length direction of the first channel.
5. The gas path device according to claim 3, characterized in that The blowing member includes: A first base provided with a first groove; A first cover plate connected to the first base. The side of the first cover plate facing the first base is a first side surface, and the first side surface and the first groove together form the first channel.
6. The air circuit device according to any one of claims 1 to 5, characterized in that A plurality of the pumping holes are provided, and the plurality of pumping holes are spaced around the first position.
7. The gas path device according to claim 6, characterized in that, The pumping member is further provided with a second channel for communicating with the second gas source, and each pumping hole is communicated with the second channel.
8. The air path device according to claim 7, wherein The pumping member is further provided with an air outlet hole, one end of each air outlet hole is used for communicating with the second gas source, the other end of each air outlet hole is communicated with the second channel, and the air outlet holes are spaced along the length direction of the second channel.
9. The air circuit device according to claim 7, characterized in that, The pumping member includes: A second base provided with a second groove; A second cover plate connected to the second base. The side of the second cover plate facing the second base is a second side surface, and the second side surface and the second groove together form the second channel.
10. Laser annealing equipment, characterized in that, Comprising: The gas path device according to any one of claims 1 to 9; A laser device for annealing the workpiece located at the first position.