Chip welding or removing module and chip processing device

Abstract

The utility model relates to the technical field of chip processing, in particular to a chip welding or removing module and a chip processing device. The chip welding or removing module comprises a mounting plate, a heating assembly, an adsorption assembly and a tin removing assembly. The heating assembly is movably arranged on the mounting plate in the Z direction and is used for adjusting the height of the heating assembly, so that the heating assembly can heat the PCB and melt soldering tin on the PCB; the adsorption assembly is movably arranged on the mounting plate in the Z direction and used for adjusting the height of the adsorption assembly, so that the adsorption assembly can remove a chip on the heated PCB from the PCB or place the chip on the heated PCB; the tin removing assembly is movably arranged on the mounting plate in the Z direction and used for adjusting the height of the tin removing assembly, and after the adsorption assembly removes the chip from the PCB, the tin removing assembly can remove molten soldering tin. According to the structure, the working efficiency of chip processing is improved, the device is simplified, the size of the device is reduced, and the device is convenient to popularize and use.

Description

Technical Field

[0001] The utility model relates to the technical field of chip processing, in particular to a chip welding or removing module and a chip processing device. Background Technique

[0002] With the development of technology, chips are welded on a PCB board for use in various electronic products. Currently, there are many automatic chip mounting devices to improve the welding efficiency of chips on the PCB board. At the same time, in order to avoid waste of raw materials, a rework device is usually used to remove the chips on the PCB board from the PCB and perform tin removal treatment on the PCB board for secondary use of the PCB board.

[0003] The above-mentioned welding and removal of chips on the PCB board need to be carried out on different devices respectively, which is inefficient in the actual production and processing process, and the two devices occupy a large area, which is not conducive to popularization and use. Summary of the Utility Model

[0004] The technical problem to be solved by the embodiments of the utility model is to provide a chip processing device to solve the problems in the prior art that the welding and removal of chips on the PCB board need to be carried out on different devices respectively, which is inefficient in the actual production and processing process, and the two devices occupy a large area, which is not conducive to popularization and use.

[0005] The utility model discloses a chip welding or removing module, including: a mounting plate, a heating component, an adsorption component and a tin removal component; the heating component is movably arranged on the mounting plate along the Z direction for adjusting the height of the heating component so that the heating component can heat the PCB board and melt the solder on the PCB board; the adsorption component is movably arranged on the mounting plate along the Z direction for adjusting the height of the adsorption component so that the adsorption component can remove the chip on the heated PCB board from the PCB board, or place the chip on the heated PCB board and weld it on the PCB board through solder; the tin removal component is movably arranged on the mounting plate along the Z direction for adjusting the height of the tin removal component. After the adsorption component removes the chip from the PCB board, the tin removal component can remove the melted solder.

[0006] Optionally, the heating component includes a heater and a flow guiding component connected to each other. The heater is disposed on the mounting plate. The heater includes a first housing that forms a receiving cavity having a first opening and a second opening. An installation frame is disposed in the receiving cavity. At least one heating plate is disposed on the installation frame, and a heating wire is embedded in the heating plate. Airflow can enter the receiving cavity along the first opening, and after being heated by the heating plate, it is output along the second opening. The flow guiding component is disposed at one end of the first housing close to the second opening for guiding the hot airflow output from the second opening to the PCB board.

[0007] Optionally, the flow guiding component includes a transition piece and a flow guiding piece that are connected to each other. The transition piece includes a second housing and multiple groups of air guiding plates disposed in the second housing. The second housing is connected to the first housing. A transition cavity is formed in the second housing, and the transition cavity is communicated with the second opening. The multiple groups of air guiding plates are located at one end of the transition cavity close to the first housing, and the air guiding plates are used to make the hot airflow flow close to the inner wall of the second housing. The flow guiding piece includes an annular housing. One end of the annular housing is connected to the second housing, and the other end forms an annular air outlet hole. A flow guiding base is further disposed in the annular housing, and the flow guiding base is used to guide the airflow output from the transition cavity to the annular air outlet hole.

[0008] Optionally, the solder removing component includes a negative pressure box body and a suction nozzle communicated with the negative pressure box body. The negative pressure box body is disposed on the mounting plate. The negative pressure box body forms a negative pressure cavity having a third opening and a fourth opening. The third opening is communicated with the suction nozzle, and the fourth opening is connected to an external negative pressure device. An adsorption plate is further disposed in the negative pressure cavity, and through holes are formed in the adsorption plate and are communicated with the negative pressure cavity. The suction nozzle is used to suck the melted solder on the PCB board into the negative pressure cavity and adhere it to the adsorption plate. A hot air pipe is further sleeved on the suction nozzle, and one end of the suction nozzle away from the negative pressure box body extends out of the hot air pipe, and the hot air pipe is connected to an external heat source device.

[0009] Optionally, a camera is further disposed on the mounting plate. The camera is used to photograph the position information of the chips on the PCB board or the position information of the solder on the PCB board. The adsorption component can remove the chips from the PCB board according to the position information of the chips, or the adsorption component can also place the chips on the PCB board according to the position information of the solder on the PCB board.

[0010] Optionally, a first linear module and a second linear module are disposed on the mounting plate. The heater is disposed on the first linear module, and the negative pressure box body is disposed on the second linear module.

[0011] Optionally, a fixing base is provided on the mounting plate; the adsorption assembly includes a first driver and a mounting member which are oppositely arranged, and both the first driver and the mounting member are arranged on the fixing base; a first turntable is sleeved on the driving shaft of the first driver, a second turntable is fixedly connected to the mounting member, an adsorption tube is inserted into the mounting member, the first turntable and the second turntable are connected by a first belt, and the first driver can drive the second turntable to rotate, so that the adsorption tube rotates with the rotation of the mounting member to adjust the setting angle of the adsorption tube; the adsorption tube is also connected to an external negative pressure device.

[0012] Optionally, a second driver, a slide rail and a rotating shaft are provided on the mounting plate, the second driver and the rotating shaft are oppositely arranged, the driving shaft of the second driver and the rotating shaft are connected by a second belt, the slide rail is located inside the second belt, a slider is provided on the slide rail, the slider is connected to one side of the second belt, and one end of the adsorption tube away from the first driver is inserted into the slider and rotatably connected to the slider, and the second driver is used to drive the slider to move on the slide rail to adjust the position of the adsorption tube in the z direction.

[0013] Optionally, a grating is further provided on the fixing base, and the grating is sleeved on the adsorption tube and coaxially arranged with the adsorption tube, and an inductor is further provided on the fixing base, and the inductor corresponds to the grating.

[0014] The present invention also discloses a chip processing device, which includes a material tray, an XY-direction movement assembly and the above-mentioned chip welding or removal module, and the material tray or the chip welding or removal module is arranged on the XY-direction movement assembly.

[0015] Compared with the prior art, the beneficial effects of the chip welding or removal module and the chip processing device provided by the embodiments of the present invention are as follows:

[0016] The heating component, the adsorption component, and the tin removal component are all movably arranged on the mounting plate along the Z direction, used to adjust the heights of the heating component, the adsorption component, and the tin removal component on the mounting plate, so that the heating component, the adsorption component, and the tin removal component can be adapted to the PCB board, and the soldering or removal of the chip can be realized under the mutual cooperation of the heating component, the adsorption component, and the tin removal component. Specifically, on the one hand, the PCB board is heated by the heating component to melt the solder on the PCB board. At this time, the chip on the PCB board is separated from the PCB board, and the chip is removed from the PCB board by the adsorption component. Then, the melted solder is removed by the tin removal component, and a complete and clean PCB board is obtained, realizing the secondary utilization of the PCB board. On the other hand, the PCB board is heated by the heating component to melt the solder on the PCB board. The chip is placed on the heated PCB board by the adsorption component, and the chip is connected to the melted solder to complete the soldering of the chip on the PCB board. In the embodiment of the present invention, by integrating the heating component, the adsorption component, and the tin removal component onto the mounting plate, the soldering or removal of the chip can be realized under the cooperation between the heating component, the adsorption component, and the tin removal component. The soldering of the chip on the PCB board or the tin removal treatment of the PCB board can be realized by one device, and the secondary utilization of the PCB board is completed. The above structure improves the working efficiency of chip processing, simplifies the device and reduces the volume of the device, facilitating the popularization and use of the device. Description of the Drawings

[0017] The technical solution of the present invention will be further described in detail below in conjunction with the drawings and embodiments. In the drawings:

[0018] Figure 1 is the overall schematic diagram of the chip soldering or removal module provided by the embodiment of the present invention;

[0019] Figure 2 is the overall structural schematic diagram of the heating component provided by the embodiment of the present invention;

[0020] Figure 3 is the structural schematic diagram of the heater provided by the embodiment of the present invention;

[0021] Figure 4 is the structural schematic diagram of the transition piece provided by the embodiment of the present invention;

[0022] Figure 5 is the structural schematic diagram of the flow guide piece provided by the embodiment of the present invention;

[0023] Figure 6 is one of the structural schematic diagrams of the adsorption component provided by the embodiment of the present invention;

[0024] Figure 7 is the second structural schematic diagram of the adsorption component provided by the embodiment of the present invention;

[0025] Figure 8 It is the third structural schematic diagram of the adsorption component provided by the embodiment of the present utility model;

[0026] Figure 9 It is the exploded view of the tin removing component provided by the embodiment of the present utility model;

[0027] Figure 10 It is the top view of the tin removing component provided by the embodiment of the present utility model;

[0028] Figure 11 is Figure 10 the B-B sectional view of.

[0029] Each reference numeral in the figure is: 10, mounting plate; 110, first linear module; 120, second linear module; 131, second driver, 132, slide rail; 133, rotating shaft; 134, second belt; 135, slider; 141, inductor; 142, grating; 150, fixed seat; 20, heating component; 210, heater; 211, first housing; 2101, first opening; 2102, second opening; 2111, mounting frame; 212, heating plate; 220, flow guiding component; 221, transition piece; 2211, second housing; 22101, transition cavity; 2212, air guiding plate; 22121, first blade; 22122, second blade; 222, flow guiding piece; 2221, annular housing; 2222, annular air outlet hole; 2223, flow guiding base; 22231, first flow guiding plate; 22232, second flow guiding plate; 30, tin removing component; 310, negative pressure box body; 311, bottom plate; 312, outer shell; 3101, third opening; 3102, fourth opening; 3103, negative pressure cavity; 3111, adsorption plate; 3104, through hole; 320, adsorption nozzle; 330, hot air pipe; 40, adsorption component; 410, first driver; 411, first turntable; 420, mounting piece; 421, second turntable; 422, adsorption pipe; 430, first belt; 440, connecting plate; 50, camera. Detailed implementation manners

[0030] It should be noted that, without conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. Now, with reference to the drawings, the preferred embodiments of the present utility model will be described in detail.

[0031] The embodiment of the present utility model provides a chip welding or removing module, such as Figure 1As shown, it includes a mounting plate 10, a heating component 20, an adsorption component 40 and a tin removal component 30. The heating component 20 is movably arranged on the mounting plate 10 along the Z direction for adjusting the height of the heating component 20 so that the heating component 20 can heat the PCB board and melt the solder on the PCB board; the adsorption component 40 is movably arranged on the mounting plate 10 along the Z direction for adjusting the height of the adsorption component 40 so that the adsorption component 40 can remove the chip on the heated PCB board from the PCB board, or place the chip on the heated PCB board and weld it to the PCB board through the solder; the tin removal component 30 is movably arranged on the mounting plate 10 along the Z direction for adjusting the height of the tin removal component 30. After the adsorption component 40 removes the chip from the PCB board, the tin removal component 30 can remove the melted solder.

[0032] Among them, the heating component 20, the adsorption component 40 and the tin removal component 30 are all movably arranged on the mounting plate 10 along the Z direction for adjusting the heights of the heating component 20, the adsorption component 40 and the tin removal component 30 on the mounting plate 10 so that the heating component 20, the adsorption component 40 and the tin removal component 30 can be adapted to the PCB board, and the welding or removal of the chip can be realized under the mutual cooperation of the heating component 20, the adsorption component 40 and the tin removal component 30. Specifically, on the one hand, the PCB board is heated by the heating component 20 to melt the solder on the PCB board. At this time, the chip on the PCB board is separated from the PCB board, and the chip is removed from the PCB board by the adsorption component 40. Then, the melted solder is removed by the tin removal component 30 to obtain a complete and clean PCB board, realizing the secondary utilization of the PCB board; on the other hand, the PCB board is heated by the heating component 20 to melt the solder on the PCB board. The chip is placed on the heated PCB board by the adsorption component 40, and the connection between the chip and the melted solder is completed to complete the welding of the chip on the PCB board. In the embodiment of the present utility model, by integrating the heating component 20, the adsorption component 40 and the tin removal component 30 onto the mounting plate 10, the welding or removal of the chip can be realized under the cooperation of the heating component 20, the adsorption component 40 and the tin removal component 30. The welding of the chip on the PCB board or the tin removal treatment of the PCB board can be completed through one device, realizing the secondary utilization of the PCB board; the above structure improves the working efficiency of chip processing, simplifies the device and reduces the volume of the device, facilitating the popularization and use of the device.

[0033] As a preferred solution of this embodiment, referring to Figures 2 to 5, the heating component 20 includes: a heater 210 and a flow guiding component 220 that are connected to each other. The heater 210 is disposed on the mounting plate 10; the heater 210 includes a first housing 211. The first housing 211 forms a receiving cavity having a first opening 2101 and a second opening 2102. An installation frame 2111 is arranged in the receiving cavity. At least one heating plate 212 is arranged on the installation frame 2111. The heating plate 212 is embedded with heating wires. Airflow can enter the receiving cavity along the first opening 2101, and after being heated by the heating plate 212, it is output along the second opening 2102; the flow guiding component 220 is disposed at one end of the first housing 211 close to the second opening 2102 for guiding the hot air flow output from the second opening 2102 to the PCB board.

[0034] In this embodiment, a structural example of the heating component 20 is given. Specifically, the heating component 20 includes a heater 210 and a flow guiding component 220. The heater 210 is disposed on the mounting plate 10 to realize the connection between the heating component 20 and the mounting plate 10. The heater 210 includes a first housing 211, and the first housing 211 forms a receiving cavity having a first opening 2101 and a second opening 2102. The installation frame 2111 in the receiving cavity provides a stable installation condition for the arrangement of the heating plate 212; among them, the first opening 2101 is used to connect to a gas source, such as a blower, to provide a stable air flow. After the air flow enters the receiving cavity along the first opening 2101, heat is generated and released by the operation of the heating wires embedded in the heating plate 212, heating the air flow in the receiving cavity to generate a hot air flow. The hot air flow is output along the second opening 2102, and under the action of the flow guiding component 220, the hot air flow is transported to the PCB board, thereby heating the solder on the PCB board and melting it, improving the melting rate of the solder.

[0035] The layout method and the number of the above-mentioned heating plates 212 are not specifically limited. Refer to Figure 3 , the number of the heating plates 212 is four, and they are distributed in pairs and oppositely in the installation frame 2111.

[0036] The layout method of the above-mentioned heating wires in the heating plate 212 is not specifically limited here. For example, the heating wires are laid in an S-shaped structure on the heating plate 212. The above layout method can improve the heating efficiency of the heating wires.

[0037] As a preferred solution of this embodiment, refer to Figures 2 to 5, the flow guiding assembly 220 includes a transition member 221 and a flow guiding member 222 that are interconnected. The transition member 221 includes a second housing 2211 and a plurality of groups of air guiding plates 2212 disposed within the second housing 2211. The second housing 2211 is connected to the first housing 211, and a transition cavity 22101 is formed within the second housing 2211. The transition cavity 22101 communicates with the second opening 2102. The plurality of groups of air guiding plates 2212 are located at one end of the transition cavity 22101 close to the first housing 211, and the air guiding plates 2212 are configured to cause the air flow to flow close to the inner wall of the second housing 2211. The flow guiding member 222 includes an annular housing 2221. One end of the annular housing 2221 is connected to the second housing 2211, and an annular air outlet hole 2222 is formed at the other end. A flow guiding base 2223 is further disposed within the annular housing 2221, and the flow guiding base 2223 is configured to direct the air flow output from the transition cavity 22101 to the annular air outlet hole 2222.

[0038] In this embodiment, a structural example of the flow guiding assembly 220 is given. Specifically, the flow guiding assembly 220 includes a transition member 221 and a flow guiding member 222 that are interconnected. The purpose is to adjust the flow direction of the hot air flow so that the hot air flow can specifically fall on the solder surface of the PCB board, improve the heating rate of the solder, and shorten the melting time of the solder. More specifically, the transition member 221 includes a second housing 2211 and a plurality of groups of air guiding plates 2212 disposed within the second housing 2211. The second housing 2211 is connected to the first housing 211 to realize the connection between the transition member 221 and the flow guiding member 222. The air guiding plates 2212 are located at one end of the transition cavity 22101 close to the first housing 211. Under the guiding action of the air guiding plates 2212, the flow direction of the hot air flow changes and flows along the inner wall of the second housing 2211. At the same time, the flow guiding member 222 is provided with an annular housing 2221. The annular housing 2221 communicates with the second housing 2211 to realize the interconnection between the transition member 221 and the flow guiding member 222 for the circulation of the hot air flow. The hot air flow output along the second housing 2211 can flow within the annular housing 2221 and be output through the annular air outlet hole 2222. The purpose of providing the flow guiding base 2223 is to adjust the flow direction of the hot air flow to the periphery of the annular housing 2221 so that the hot air flow can continuously and stably be output from the annular air outlet hole 2222.

[0039] Refer to Figure 5, in this embodiment, the structural composition and guiding principle of the guiding base 2223 are given. The guiding base 2223 has a trapezoidal structure, and first guiding plates 22231 are uniformly arranged around the top of the trapezoidal structure. At the same time, second guiding plates 22232 are uniformly arranged around the bottom of the trapezoidal structure. The hot air flow enters through the annular housing 2221 and is dispersed to the periphery of the annular housing 2221 through the first guiding plates 22231, the trapezoidal structure, and the second guiding plates 22232, and is output along the annular air outlet holes 2222.

[0040] In this embodiment, there is no specific limitation on the structure of the annular housing 2221. For example, it can be rectangular or circular, and the corresponding annular air outlet holes 2222 can also be rectangular or circular, which can be selected according to the actual use situation. For example, when the chip soldering or removal module of this embodiment needs to be processed for ball grid array packaging (BGA), in order to match the BGA at this time, the annular housing 2221 and the annular air outlet holes 2222 are rectangular.

[0041] As a preferred solution of this embodiment, refer to Figures 9 to 11 , the desoldering assembly 30 includes: a negative pressure box body 310 and a suction nozzle 320 communicated with the negative pressure box body 310; the negative pressure box body 310 is arranged on the mounting plate 10, and the negative pressure box body 310 forms a negative pressure cavity 3103 having a third opening 3101 and a fourth opening 3102. The third opening 3101 is communicated with the suction nozzle 320, and the fourth opening 3102 is connected to an external negative pressure device; an adsorption plate 3111 is further arranged in the negative pressure cavity 3103, and through holes 3104 are formed on the adsorption plate 3111, and the through holes 3104 are communicated with the negative pressure cavity 3103; the suction nozzle 320 is used for sucking the melted solder on the PCB board into the negative pressure cavity 3103 and attaching it to the adsorption plate 3111; a hot air pipe 330 is sleeved on the suction nozzle 320, and one end of the suction nozzle 320 away from the negative pressure box body 310 extends out of the hot air pipe 330, and the hot air pipe 330 is connected to an external heat source device.

[0042] Among them, a structural example of the tin removal component 30 is given here. Specifically, the tin removal component 30 includes a negative pressure box body 310 and a suction nozzle 320. The negative pressure box body 310 is arranged on the mounting plate 10 to realize the setting of the tin removal component 30 on the mounting plate 10. The fourth opening 3102 of the negative pressure box body 310 is connected to an external negative pressure device, so that a negative pressure is formed inside the negative pressure box body 310 through the external negative pressure device. The suction nozzle 320 is connected to the third opening 3101, so that a negative pressure is generated at the suction nozzle 320 to suck the molten solder on the PCB board into the suction nozzle 320, achieving the purpose of removing the molten solder on the PCB board. The molten solder sucked in through the suction nozzle 320 enters the negative pressure cavity 3103 along the third opening 3101. By arranging a suction plate 3111 in the negative pressure cavity 3103, the temperature of the molten solder gradually decreases during the movement process and can solidify on the suction plate 3111 to collect the solder and prevent the solder from entering the external negative pressure device along the fourth opening 3102 and damaging the external negative pressure device. Among them, the through holes 3104 on the suction plate 3111 are used to realize negative pressure adsorption and ensure the smoothness of the work, so that the tin suction work can proceed normally and orderly. The through holes 3104 are generally arranged in an array to ensure good adhesion of the solder on the suction plate 3111.

[0043] Refer to Figure 9 , the negative pressure box body 310 includes a bottom plate 311 and a housing 312. The housing 312 is sleeved on the bottom plate 311 to form a negative pressure cavity 3103. The third opening 3101 and the fourth opening 3102 are located at opposite ends of the bottom plate 311. The suction nozzle 320 and the hot air pipe 330 are both arranged on the bottom plate 311.

[0044] In this embodiment, the hot air pipe 330 is sleeved on the suction nozzle 320, and a preset gap is maintained between the hot air pipe 330 and the suction nozzle 320. The hot air pipe 330 is connected to an external heat source device through the fourth opening 3102. During the process of the suction nozzle 320 sucking solder, the external heat source conveys hot air to the surface of the solder along the gap between the hot air pipe 330 and the suction nozzle 320, which can prevent the heat dissipation on the surface of the solder and the phenomenon of solder solidification during the alternating work of the heating component 20 and the suction component 40, so as to ensure the smoothness of the work of the suction nozzle 320 and the removal efficiency of the solder.

[0045] In this embodiment, during the working process of the tin removal component 30, generally in order to realize secondary fixation of the solder in the negative pressure cavity 3103 and ensure the collection efficiency of the solder, through holes 3104 arranged in an array are also provided on one side of the bottom plate 311 close to the third opening 3101. The through holes 3104 are communicated with the third opening 3101. If some solder does not adhere to the suction plate 3111 and is collected by the suction plate 3111, or adheres to the bottom plate 311 along with the negative pressure air flow, the collection efficiency of the solder is improved again, protecting the service life of the external negative pressure device.

[0046] As a preferred solution of this embodiment, with reference to Figure 1 , a camera 50 is further provided on the mounting plate 10. The camera 50 is used to photograph the position of the chip on the PCB board, or the position of the solder on the PCB board. The adsorption component 40 can remove the chip from the PCB board according to the position information of the chip, or the adsorption component 40 can also place the chip on the PCB board according to the position information of the solder on the PCB board.

[0047] The purpose of setting the camera 50 is to photograph the position of the chip on the PCB board to obtain a chip position information, and the adsorption component 40 can remove the chip from the PCB board according to the position information of the chip. The accuracy of the adsorption component 40 in removing the chip is improved, and the working efficiency is improved. At the same time, the camera 50 can also photograph the position of the solder on the PCB board to obtain a solder position information, and the adsorption component 40 can place the chip at the corresponding position on the PCB board according to the solder position information, improving the welding efficiency of the chip.

[0048] During the use of the above camera 50, a controller also needs to be equipped. Its electrical connection relationship and control logic are prior art and will not be specifically limited here.

[0049] As a preferred solution of this embodiment, with reference to Figure 1 , a first linear module 110 and a second linear module 120 are provided on the mounting plate 10; the heater 210 is arranged on the first linear module 110, and the negative pressure box 310 is arranged on the second linear module 120.

[0050] In this embodiment, an implementation method in which the heating component 20 and the tin removal component 30 are movably arranged on the mounting plate 10 along the Z direction is given. By setting a first linear module 110 and a second linear module 120 on the mounting plate 10, and arranging the heater 210 of the heating component 20 on the first linear module 110 and the negative pressure box 310 of the tin removal component 30 on the second linear module 120, the driving directions of the first linear module 110 and the second linear module 120 are both set along the Z direction on the mounting plate 10. Driven by the first linear module 110 and the second linear module 120, the positions of the heating component 20 and the tin removal component 30 are adjustable along the Z direction to better match the PCB board, thereby achieving the purpose of improving the working efficiency of chip soldering and chip removal.

[0051] The above first linear module 110 and second linear module 120 can adopt a lead screw driven linear module, a synchronous belt driven linear module, a rack and pinion driven linear module, etc., which will not be specifically limited here. With reference to Figure 1 , an example in which both the first linear module 110 and the second linear module 120 are lead screw driven linear modules is given.

[0052] As a preferred solution of this embodiment, refer to Figure 6 and Figure 8 , a fixing seat 150 is provided on the mounting plate 10; the adsorption assembly 40 includes a first driver 410 and a mounting member 420, both the first driver 410 and the mounting member 420 are arranged on the fixing seat 150; a first turntable 411 is sleeved on the driving shaft of the first driver 410, a second turntable 421 is fixedly connected to the mounting member 420, an adsorption tube 422 is inserted into the mounting member 420, the first turntable 411 and the second turntable 421 are connected by a first belt 430, and the first driver 410 can drive the second turntable 421 to rotate, so that the adsorption tube 422 rotates with the rotation of the mounting member 420 to adjust the setting angle of the adsorption tube 422; the adsorption tube 422 is also connected to an external negative pressure device.

[0053] Among them, a structural example of the adsorption assembly 40 is given here. Specifically, the first turntable 411 sleeved on the driving shaft of the first driver 410 and the second turntable 421 fixedly connected to the mounting member 420 are connected by a first belt 430 to form a belt drive structure. The first driver 410 works to provide driving force to drive the second turntable 421 to rotate, so that the adsorption tube 422 rotates with the rotation of the mounting member 420 to achieve the purpose of adjusting the setting angle of the adsorption tube 422. During the working process, the adsorption tube 422 is connected to an external negative pressure device to generate suction force, which can adsorb the chip. Adjusting the setting angle of the adsorption tube 422 can make the adsorption tube 422 rotate to a position adapted to the chip, ensure the adsorption of the chip by the adsorption tube 422, improve the adsorption efficiency, and complete the welding or removal of the chip.

[0054] Refer to Figure 7 , a connecting plate 440 is provided to fix the first driver 410 and the mounting member 420, improve the connection stability between the two, and further improve the overall stability of the adsorption assembly 40.

[0055] As a preferred solution of this embodiment, refer to Figures 6 to 8 , the following are provided on the mounting plate 10: a second driver 131, a slide rail 132, and a rotating shaft 133. The second driver 131 and the rotating shaft 133 are arranged opposite to each other. The driving shaft of the second driver 131 and the rotating shaft 133 are connected by a second belt 134. The slide rail 132 is located inside the second belt 134. A slider 135 is provided on the slide rail 132. The slider 135 is connected to one side of the second belt 134. One end of the adsorption tube 422 away from the first driver 410 is inserted into the slider 135 and is rotatably connected to the slider 135. The second driver 131 is used to drive the slider 135 to move on the slide rail 132 to adjust the position of the adsorption tube 422 in the z direction.

[0056] An implementation method of movably arranging the adsorption component 40 along the Z direction on the mounting plate 10 is given here. Specifically, a second driver 131 and a rotating shaft 133 are provided, and the drive shaft of the second driver 131 is connected to the rotating shaft 133 through a second belt 134 to form a belt drive structure. A slide rail 132 is arranged inside the second belt 134, and a slider 135 is arranged on the slide rail 132. Among them, the slider 135 is connected to the slide rail 132 in a matching manner and is connected to one side of the second belt 134. At the same time, an adsorption tube 422 is inserted into the slider 135. The second driver 131 works to provide a driving force to drive the rotating shaft 133 to rotate, realizing the operation of the second belt 134. The slider 135 moves on the slide rail 132 under the action of the second belt 134. By the forward and reverse rotation of the second driver 131, the slider 135 is enabled to push the adsorption tube 422 to perform reciprocating motion along the Z direction, adjusting the position of the adsorption tube 422 so that the adsorption tube 422 is adapted to the chip.

[0057] One end of the above-mentioned adsorption tube 422 far from the first driver 410 is inserted into the slider 135 and is rotatably connected to the slider 135 to ensure the smooth progress of the first driver 410 driving the adsorption tube 422 to rotate. Among them, the adsorption tube 422 and the slider 135 can be connected through a bearing (not shown in the figure) to improve the smoothness and continuity of the rotation of the adsorption tube 422.

[0058] After the above-mentioned adsorption tube 422 is inserted into the mounting member 420, in order to ensure the consistency of the rotation of the adsorption tube 422 with the mounting member 420, the adsorption tube 422 and the mounting member 420 are fixed through a flange (not shown in the figure) so that the adsorption tube 422 can rotate synchronously with the mounting member 420, improving the working efficiency of the adsorption component 40.

[0059] As a preferred solution of this embodiment, refer to Figure 8 , a grating 142 is arranged on the fixed seat 150, and the grating 142 is sleeved on the mounting member 420 and is coaxially arranged with the adsorption tube 422. An inductor 141 is also arranged on the fixed seat 150, and the inductor 141 corresponds to the grating 142.

[0060] Among them, when light irradiates on the grating 142, the light passing through the grating 142 will diffract to form a specific light spot pattern. The inductor 141 will detect the light spot pattern on the grating 142 and convert this information into an electrical signal. By analyzing the electrical signal output by the inductor 141, the rotation angle of the adsorption tube 422 relative to the grating 142 can be determined, facilitating the control of the adsorption tube 422, improving the adaptability of the adsorption tube 422 to the chip, and thus improving the working efficiency.

[0061] The embodiment of the present application also discloses a chip processing device, which includes a material tray (not shown in the figure), an XY-direction movement component (not shown in the figure), and the chip welding or removal module in the foregoing embodiment. The material tray, or the chip welding or removal module is disposed on the XY-direction movement component.

[0062] During the use of the above chip processing device, in different working scenarios, different products to be processed are placed on the material tray. For example: in a working scenario, when chip welding is required, a PCB board is placed on the material tray, and solder is placed on the PCB board in advance. The position of the material tray, or the chip welding or removal module is adjusted by the XY-direction movement component, so that the heating component 20 can reach the position corresponding to the solder on the PCB board, and the solder is melted. Then, the position of the material tray, or the chip welding or removal module is adjusted again by the XY-direction movement component, so that the adsorption component 40 reaches the position corresponding to the melted solder, and the adsorbed chip is placed at the melted solder to complete the chip welding.

[0063] In another working scenario, when chip removal is required, a PCB chip package (a chip is welded on the PCB board) is placed on the material tray. The position of the material tray, or the chip welding or removal module is adjusted by the XY-direction movement component, so that the heating component 20 reaches the position corresponding to the solder on the PCB board, and the solder is melted to separate the chip from the PCB board. Then, the position of the material tray, or the chip welding or removal module is adjusted again by the XY-direction movement component, so that the adsorption component 40 reaches the position corresponding to the chip, and the chip is removed from the PCB board. Then, the position of the material tray, or the chip welding or removal module is adjusted again by the XY-direction movement component, so that the de-tinning component 30 reaches the position corresponding to the melted solder, and the melted solder is removed to obtain a clean PCB board, and the clean PCB board is recycled for secondary use.

[0064] The XY-direction movement component can be implemented by two linear movement modules, and the position change of the material tray, or the chip welding or removal module is completed under the interaction of the two linear modules.

[0065] Figure 1 The reverse directions of the arrows in... respectively represent the X direction, the Y direction, and the Z direction.

[0066] The above chip processing device includes the same structure and beneficial effects as the chip welding or removal module in the foregoing embodiment. The structure and beneficial effects of the chip welding or removal module have been described in detail in the foregoing embodiment, and will not be repeated here.

[0067] It should be understood that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than limiting it. For those skilled in the art, the technical solutions recorded in the above embodiments can be modified, or some of the technical features can be equivalently replaced; and all such modifications and replacements should fall within the protection scope of the appended claims of the present invention.

Claims

1. A chip welding or removal module, characterized in that, Comprising: Mounting plate; Heating component, movably arranged on the mounting plate in the Z direction, for adjusting the height of the heating component so that the heating component can heat the PCB board and melt the solder on the PCB board; Adsorption component, movably arranged on the mounting plate in the Z direction, for adjusting the height of the adsorption component so that the adsorption component can remove the chip on the heated PCB board from the PCB board, or place the chip on the heated PCB board and solder it to the PCB board through solder; Desoldering component, movably arranged on the mounting plate in the Z direction, for adjusting the height of the desoldering component. After the adsorption component removes the chip from the PCB board, the desoldering component can remove the melted solder.

2. The chip soldering or removal module according to claim 1, wherein The heating component includes: A heater and a flow guide component connected to each other, the heater being arranged on the mounting plate; The heater includes a first housing, the first housing forming a receiving cavity having a first opening and a second opening. An installation frame is arranged in the receiving cavity, at least one heating plate is arranged on the installation frame, heating wires are embedded in the heating plate, and air flow can enter the receiving cavity along the first opening and be output along the second opening after being heated by the heating plate; The flow guide component is arranged at one end of the first housing close to the second opening for guiding the hot air flow output from the second opening to the PCB board.

3. The chip soldering or removing module according to claim 2, wherein The flow guide component includes: A transition piece and a flow guide piece connected to each other. The transition piece includes a second housing and multiple groups of air guide plates arranged in the second housing. The second housing is connected to the first housing. A transition cavity is formed in the second housing, and the transition cavity is communicated with the second opening. Multiple groups of the air guide plates are located at one end of the transition cavity close to the first housing, and the air guide plates are used to make the hot air flow flow close to the inner wall of the second housing; The flow guide piece includes an annular housing. One end of the annular housing is connected to the second housing, and the other end forms an annular air outlet hole. A flow guide base is also arranged in the annular housing, and the flow guide base is used to guide the air flow output from the transition cavity to the annular air outlet hole.

4. The chip soldering or removal module according to claim 2, wherein The desoldering component includes: A negative pressure box body and a suction nozzle communicated with the negative pressure box body; the negative pressure box body is arranged on the mounting plate, the negative pressure box body forms a negative pressure cavity having a third opening and a fourth opening, the third opening is communicated with the suction nozzle, and the fourth opening is connected to an external negative pressure device; An adsorption plate is also arranged in the negative pressure cavity, and through holes are formed in the adsorption plate, and the through holes are communicated with the negative pressure cavity; the suction nozzle is used to suck the melted solder on the PCB board into the negative pressure cavity and adhere it to the adsorption plate; A hot air pipe is also sleeved on the suction nozzle, and one end of the suction nozzle far from the negative pressure box body extends out of the hot air pipe, and the hot air pipe is connected to an external heat source device.

5. The chip soldering or removing module according to claim 1, characterized in that A camera is also provided on the mounting plate. The camera is used to capture the position information of the chips on the PCB or the position information of the soldering on the PCB. The adsorption component can remove the chips from the PCB according to the position information of the chips, or the adsorption component can also place the chips on the PCB according to the position information of the soldering on the PCB.

6. The chip soldering or removing module according to claim 4, characterized in that, A first linear module and a second linear module are provided on the mounting plate; The heater is arranged on the first linear module, and the negative pressure box body is arranged on the second linear module.

7. The chip soldering or removing module according to claim 4, characterized in that, A fixed seat is provided on the mounting plate; The adsorption component includes a first driver and a mounting member arranged oppositely. Both the first driver and the mounting member are arranged on the fixed seat; A first turntable is sleeved on the driving shaft of the first driver. A second turntable is fixedly connected to the mounting member. An adsorption tube is inserted into the mounting member. The first turntable and the second turntable are connected by a first belt. The first driver can drive the second turntable to rotate, so that the adsorption tube rotates with the rotation of the mounting member to adjust the setting angle of the adsorption tube; the adsorption tube is also connected to an external negative pressure device.

8. The chip soldering or removing module according to claim 7, characterized in that, The following are provided on the mounting plate: A second driver, a slide rail and a rotating shaft. The second driver and the rotating shaft are arranged oppositely. The driving shaft of the second driver and the rotating shaft are connected by a second belt. The slide rail is located inside the second belt. A slider is arranged on the slide rail. The slider is connected to one side of the second belt. One end of the adsorption tube away from the first driver is inserted into the slider and is rotatably connected to the slider. The second driver is used to drive the slider to move on the slide rail to adjust the position of the adsorption tube in the z direction.

9. The chip soldering or removal module according to claim 8, wherein, A grating is also provided on the fixed seat, and the grating is sleeved on the adsorption tube and is coaxially arranged with the adsorption tube. An inductor is also provided on the fixed seat, and the inductor corresponds to the grating.

10. A chip processing device, characterized in that, It includes a material tray, an XY-direction movement component and the chip soldering or removal module according to any one of claims 1 to 9. The material tray or the chip soldering or removal module is arranged on the XY-direction movement component.

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