Rotating disc type efficient and automatic chip placing equipment

Abstract

The utility model discloses a rotating disc type efficient automatic chip placing device which comprises a rotating disc type carrying device, and a plurality of adsorption carrying mechanisms are arranged on the outer edge of the rotating disc type carrying device in the circumferential direction at equal angles. A wafer feeding mechanism, a rotating device, a turn-over device, a chip receiving device and a defective product recycling mechanism are sequentially arranged on the periphery of the rotating disc type carrying device in the conveying direction, wherein the rotating device enables a chip to rotate around a vertical shaft to achieve direction adjustment, the turn-over device enables the chip to rotate around a horizontal shaft to achieve turn-over, and the chip receiving device receives the chip carried by the rotating disc type carrying device. A chip separating and transferring device is arranged between the wafer feeding mechanism and the rotating disc type carrying device, a chip detecting device is arranged above the chip separating and transferring device, and a wafer clamping mechanism is arranged on the opposite side of the wafer feeding mechanism. According to the utility model, the rotating disc type carrying device is adopted, chips can be carried efficiently, the whole equipment layout is compact, and the space is saved.

Description

Technical Field

[0001] The utility model belongs to the technical field of chip processing, and particularly relates to a rotary chip high-efficiency automatic tray loading device.

Background Art

[0002] In the process of semiconductor chip processing, it is necessary to transfer the single chips tested on the whole wafer to the Tray tray. When there was no relevant tray loading device designed in the early stage, the chip tray loading process used the manual method to place the chips into the chip slots of the Tray tray one by one, which had the problems of high labor cost, low tray loading efficiency and chip damage. However, with the improvement of automation, relevant automatic tray loading devices have been designed to realize chip tray loading. For example, a chip tray loading device disclosed in Chinese Patent Publication No. CN118173473A, including a wafer ring loading and unloading device, a Tray tray loading and unloading device, and a chip separation and transfer device. The chip separation and transfer device is used to separate a single chip from the wafer ring at the wafer ring working position and place the single chip on a chip slot of the Tray tray located at the Tray tray working position. In this solution, moving the tray or moving and placing the chips on the wafer ring both adopt multi-axis linear movement to achieve the moving action, which not only occupies a large space, but also needs to be realized by multiple linear movements to achieve three-dimensional space movement, with a slow beat and low production efficiency.

[0003] Therefore, it is necessary to provide a rotary chip high-efficiency automatic tray loading device to solve the above technical problems.

Content of the Utility Model

[0004] The main purpose of the utility model is to provide a rotary chip high-efficiency automatic tray loading device, which adopts a rotary handling device, can complete the handling of chips with high efficiency, and the layout of the whole device is compact, saving space.

[0005] The utility model realizes the above purpose through the following technical solutions: a rotary chip high-efficiency automatic tray loading device, which includes a frame and a rotary handling device arranged on the frame. A plurality of adsorption and handling mechanisms for adsorbing and handling chips are arranged at equal angles along the circumferential direction on the outer edge of the rotary handling device; a wafer feeding mechanism, a rotating device for adjusting the direction of the chip by rotating around the vertical axis, a turning device for turning the chip by rotating around the horizontal axis, a chip receiving device for receiving the chips handled by the rotary handling device, and a defective product recycling mechanism are sequentially arranged on the outer circumference of the rotary handling device along the conveying direction. A chip separation and transfer device for separating the chip from the wafer blue film is arranged between the wafer feeding mechanism and the rotary handling device. A chip detection device is arranged above the chip separation and transfer device. A wafer clamping mechanism for handling a single wafer on the wafer feeding mechanism to the chip separation and transfer device is arranged on the opposite side of the wafer feeding mechanism.

[0006] Further, the chip separation and transfer device includes an XYZ moving and positioning mechanism for positioning a single wafer, and a thimble mechanism that extends from below into the interior of the XYZ moving and positioning mechanism to contact the back surface of the wafer and lift the chip to separate the chip from the wafer blue film. The thimble mechanism includes a first driving member, a first support frame driven by the first driving member to move up and down, a second driving member fixed on the first support frame, and a thimble assembly driven by the second driving member to rotate. A plurality of thimbles for lifting the chip are provided on the thimble assembly.

[0007] Further, the wafer clamping mechanism includes a clamping module for clamping the wafer in the wafer feeding mechanism, and an X-axis driving module for driving the clamping module to move between the wafer feeding mechanism and the chip separation and transfer device. The clamping module includes a moving frame, an upper clamping jaw fixed on the moving frame, a first air cylinder fixed on the moving frame, and a lower clamping jaw driven by the first air cylinder to move up and down and cooperate with the upper clamping jaw to perform clamping and opening actions.

[0008] Further, the rotary handling device includes a turntable on which a plurality of the adsorption and handling mechanisms are installed, a disc driving module for driving the turntable to rotate, and a mounting disc arranged in parallel above the turntable and concentric with it. A pushing module for pushing the adsorption and handling mechanism downward to facilitate material picking and placing is provided on the outer periphery of the mounting disc.

[0009] Further, the adsorption and handling mechanism includes a first mounting bracket fixed on the lower surface of the turntable, an elastic pushing component movably arranged inside the first mounting bracket, and a suction nozzle arranged at the lower end of the elastic pushing component. Gas channels that communicate with each other and allow gas to enter and exit are provided inside the elastic pushing component and the suction nozzle. The pushing module includes a second mounting bracket fixed on the mounting disc, a third driving motor fixed on the second mounting bracket, and a pushing head driven by the third driving motor to move up and down.

[0010] Further, the rotating device includes a third mounting bracket fixed on the frame, a fourth driving motor fixed on the third mounting bracket, and a clamping mechanism driven by the fourth driving motor to perform a rotating action. The clamping mechanism includes four clamping blocks for clamping around the chip and a clamping module for driving the clamping blocks to perform opening or clamping actions simultaneously. A first sensor for detecting whether there is a chip on the clamping mechanism is provided on the third mounting bracket.

[0011] Further, the turning device includes a fourth mounting bracket fixed on the frame, a fifth driving member fixed on the fourth mounting bracket, and a turning mechanism driven by the fifth driving member and moving from the outer periphery to the center of the turntable. The turning mechanism includes a receiving plate for accommodating the chips, a first stopper and a second stopper respectively arranged on the upper and lower sides of the receiving plate, and a sixth driving motor for driving the receiving plate to rotate and simultaneously driving the first stopper and the second stopper to perform an alternating axial telescopic action; a contour accommodating groove imitating the chips is arranged on the receiving plate, and a second sensor for detecting whether there are chips on the receiving plate is arranged on the fourth mounting bracket.

[0012] Further, the chip receiving device includes a tray feeding mechanism at one end, a chip storage mechanism at the other end, and a transfer conveying mechanism for transferring the empty tray on the tray feeding mechanism to receive the chips on the adsorption and handling mechanism and conveying the tray filled with chips to the chip storage mechanism. The tray feeding mechanism and the chip storage mechanism are linearly arranged along the X direction and are disconnected in the middle to form an avoidance opening for the transfer conveying mechanism to move.

[0013] Further, the transfer conveying mechanism includes a first XY driving module fixed on the frame, a first support plate driven by the first XY driving module to move in the XY direction, a conveying module movably arranged above the first support plate and conveying the tray along the X direction, a linear pushing module for driving the conveying module to move in the X direction to communicate with the tray feeding mechanism or the chip storage mechanism, and a blocking module arranged on the right side of the driving conveying module and used for blocking the forward conveying of the tray. The pushing module is arranged on the mounting plate above the transfer conveying mechanism.

[0014] Further, the defective product recycling mechanism includes a second XY driving module fixed on the frame, a second support plate driven by the second XY driving module to move in the XY direction, and a defective product tray fixed above the second support plate and used for receiving the defective products on the adsorption and handling mechanism. The pushing module is arranged on the mounting plate above the defective product recycling mechanism.

[0015] Compared with the prior art, the beneficial effects of a turntable type high-efficiency automatic chip arranging device of the present utility model are as follows: a turntable type handling device is adopted, and a plurality of adsorption and handling mechanisms are arranged on the outer periphery of the turntable to sequentially handle the chips into the tray, which can efficiently complete the handling of the chips; moreover, the whole device integrates wafer taking, chip taking, chip rotation angle adjustment, chip turning and blanking, and is arranged around the outer periphery of the turntable type handling device, with a compact layout and space saving.

Description of the Drawings

[0016] Figure 1Schematic diagram of the three-dimensional structure of the turntable-type chip high-efficiency automatic palletizing device according to an embodiment of the present utility model;

[0017] Figure 2 Schematic diagram of the top view structure of the turntable-type chip high-efficiency automatic palletizing device according to an embodiment of the present utility model;

[0018] Figure 3 Schematic diagram of the three-dimensional structure of the turntable-type handling device according to an embodiment of the present utility model;

[0019] Figure 4 According to an embodiment of the present utility model Figure 1 Schematic diagram of the three-dimensional structure when sucking the chip at position A in the figure;

[0020] Figure 5 Schematic diagram of the three-dimensional structure of the adsorption and handling mechanism according to an embodiment of the present utility model;

[0021] Figure 6 Schematic diagram of the three-dimensional structure of the pushing module according to an embodiment of the present utility model;

[0022] Figure 7 Schematic diagram of the three-dimensional structure of the turning device according to an embodiment of the present utility model;

[0023] Figure 8 Schematic diagram of the three-dimensional structure of the chip receiving device according to an embodiment of the present utility model;

[0024] Figure 9 Schematic diagram of the three-dimensional structure of the XYZ moving and positioning mechanism according to an embodiment of the present utility model;

[0025] Figure 10 Schematic diagram of the three-dimensional structure of the ejector pin mechanism according to an embodiment of the present utility model;

[0026] Figure 11 Schematic diagram of the three-dimensional structure of the wafer clamping mechanism according to an embodiment of the present utility model;

[0027] Figure 12 Schematic diagram of the three-dimensional structure of the rotating device according to an embodiment of the present utility model;

[0028] Figure 13 Schematic diagram of the three-dimensional structure of the defective product recycling mechanism according to an embodiment of the present utility model;

[0029] The numbers in the figure represent:

[0030] 100 - Turntable-type chip high-efficiency automatic palletizing device; 200 - Wafer; 300 - Tray; 400 - Chip

[0031] 1 - Frame, 11 - Cantilever bracket;

[0032] 2-Rotary transfer device, 21-Suction transfer mechanism, 211-First mounting bracket, 212-Elastic pushing component, 213-Suction nozzle, 214-Pushing shaft, 215-Bushing, 216-Mounting sleeve, 217-Inlet block, 218-Circlip, 219-Spring, 22-Rotary table, 23-Disc drive module, 24-Mounting plate, 25-Pushing module, 251-Second mounting bracket, 252-Third drive motor, 253-Pushing head, 26-Clamping rod;

[0033] 3-Wafer feeding mechanism, 31-Wafer bin, 32-Bin drive module;

[0034] 4-Flipping device, 41-Fourth mounting bracket, 42-Fifth driving part, 43-Sixth drive motor, 44-Holding plate, 45-First stop block, 46-Second stop block, 47-Contoured accommodating groove, 48-Second sensor;

[0035] 5-Chip collecting device, 51-Tray feeding mechanism, 52-Chip storage mechanism, 53-Transfer and conveying mechanism, 531-First XY drive module, 532-First support plate, 533-Conveying module, 5331-Conveying frame, 5332-Transmission shaft, 5333-Conveying drive assembly, 5334-Drive belt, 534-Linear pushing module, 5341-First support shaft, 5342-Connecting rod, 5343-Second support shaft, 5344-Pushing shaft, 5345-Second cylinder, 5351-Blocking plate, 54-Avoidance opening;

[0036] 6-Chip separation and transfer device, 61-XYZ moving and positioning mechanism, 611-Avoidance through hole, 612-XYZ moving table, 613-Avoidance groove, 614-Positioning frame, 615-Clamping slot, 616-XYZ drive module, 62-Ejector pin mechanism, 621-First driving part, 622-First support frame, 623-Second driving part, 624-Ejector pin rotating shaft, 625-Ejecting block, 626-Ejector pin;

[0037] 7-Chip detection device;

[0038] 8-Wafer clamping mechanism, 81-Clamping module, 811-Moving frame, 812-Upper clamping jaw, 813-First cylinder, 814-Lower clamping jaw, 82-X-axis drive module;

[0039] 9-Rotating device, 91-Third mounting bracket, 92-Fourth drive motor, 93-Clamping block, 94-Clamping module, 95-First sensor;

[0040] 10-Defective product recycling mechanism, 101-Second XY drive module, 102-Defective product tray, 103-Second support plate, 104-Waste box.

Specific embodiments

[0041] Please refer to Figures 1-13 In this embodiment, a turntable type high - efficiency automatic chip placing device is provided. The turntable type high - efficiency automatic chip placing device 100 includes a frame 1 and a turntable type handling device 2 arranged on the frame 1. A plurality of adsorption and handling mechanisms 21 for adsorbing and handling chips are arranged at equal angles along the circumferential direction of the outer edge of the turntable type handling device 2; a wafer feeding mechanism 3, a rotating device 9 for rotating the chip around the vertical axis to adjust the direction, a turning device 4 for rotating the chip around the horizontal axis to turn it over, a chip receiving device 5 for receiving the chips handled by the turntable type handling device 2, and a defective product recycling mechanism 10 are arranged in sequence along the conveying direction on the outer periphery of the turntable type handling device 2. A chip separation and transfer device 6 for separating the chip from the wafer blue film is arranged between the wafer feeding mechanism 3 and the turntable type handling device 2. A chip detection device 7 is arranged above the chip separation and transfer device 6. A wafer clamping mechanism 8 for handling a single wafer 200 on the wafer feeding mechanism 3 to the chip separation and transfer device 6 is arranged on the opposite side of the wafer feeding mechanism 3.

[0042] The wafer feeding mechanism 3 includes a wafer bin 31 for storing a plurality of wafers 200 and a bin driving module 32 for driving the wafer bin 31 to move up and down. The wafer bin 31 has a square structure and is open on one side facing the chip separation and transfer device 6 for easy removal of the wafer 200, and the other five sides are closed to prevent the wafer 200 from being contaminated. Support grooves for supporting the wafer 200 are arranged at equal vertical intervals on the front and rear side walls of the wafer bin 31. The bin driving module 32 is vertically fixed on the frame 1 and is driven by a motor screw rod. A reasonable vertical arrangement can save space.

[0043] The chip separation and transfer device 6 includes an XYZ moving and positioning mechanism 61 for positioning a single wafer 200 and a thimble mechanism 62 that extends from below into the interior of the XYZ moving and positioning mechanism 61 to contact the back of the wafer 200 and push up the chip to separate the chip from the wafer blue film.

[0044] The XYZ moving and positioning mechanism 61 includes an avoidance through - hole 611 for avoiding the thimble mechanism 62 arranged in the middle and avoidance grooves 613 for avoiding the wafer clamping mechanism 8 arranged on the left and right sides. The XYZ moving and positioning mechanism 61 includes an XYZ moving table 612, an XYZ driving module 616 for driving the XYZ moving table 612 to move in the XYZ directions, and a positioning frame 614 fixed to the upper end of the XYZ moving table 612 and used for positioning a single chip. A card slot 615 arranged in a square shape with the single wafer 200 is provided inside the positioning frame 614.

[0045] The thimble mechanism 62 includes a first driving member 621, a first support frame 622 driven by the first driving member 621 to move up and down, a second driving member 623 fixed on the first support frame 622, and a thimble assembly driven by the second driving member 623 to rotate. The thimble assembly includes a thimble rotating shaft 624 installed at the output end of the second driving member 623, a top block 625 installed at the top of the thimble rotating shaft 624 and matching the size of the chip, and a plurality of thimbles 626 installed on the top block 625 and used to lift the chip.

[0046] Since the chip is pasted on the blue film, if the adsorption and handling mechanism 21 is directly used to adsorb the chip, there will be a problem that it is difficult to adsorb successfully. Therefore, a thimble mechanism 62 is provided below the XYZ moving and positioning mechanism 61. The thimble 626 of the thimble mechanism 62 pushes the chip upward to separate the chip from the blue film, so that the adsorption and handling mechanism 21 can better adsorb the chip.

[0047] The wafer clamping mechanism 8 includes a clamping module 81 for clamping the wafer 200 in the wafer feeding mechanism 3 and an X-axis driving module 82 for driving the clamping module 81 to move between the wafer feeding mechanism 3 and the chip separation and transfer device 6.

[0048] The clamping module 81 includes a moving frame 811, an upper clamping jaw 812 fixed on the moving frame 811, a first cylinder 813 fixed on the moving frame 811, and a lower clamping jaw 814 driven by the first cylinder 813 to move up and down and realizing the clamping and opening actions with the upper clamping jaw 812.

[0049] The rotary transfer device 2 includes a turntable 22 on which a plurality of adsorption and handling mechanisms 21 are installed, a disk driving module 23 for driving the turntable 22 to rotate, and a mounting disk 24 arranged in parallel above the turntable 22 and concentric with it. A pushing module 25 for pushing the adsorption and handling mechanism 21 downward to facilitate material picking and placing is arranged on the outer periphery of the mounting disk 24.

[0050] An L-shaped cantilever bracket 11 is arranged on the frame 1. The mounting disk 24 is fixedly installed at the end of the cantilever bracket 11 and located above the turntable 22. A plurality of weight reduction grooves are arranged on both the turntable 22 and the mounting disk 24. The chip detection device 7 is fixed above the mounting disk 24. A detection camera is arranged on the chip detection device 7 and is used to take pictures of the chips on the chip separation and transfer device 6. The system detects and confirms the pictures taken. If the detection shows that the chips are qualified, they are transported to the chip receiving device 5. If the detection shows that the chips are unqualified, they are transported to the defective product recycling mechanism 10.

[0051] The adsorption and handling mechanism 21 includes a first mounting bracket 211 fixed to the lower surface of the turntable 22, an elastic pushing component 212 movably arranged inside the first mounting bracket 211, and a suction nozzle 213 arranged at the lower end of the elastic pushing component 212. An air passage that communicates with each other and allows air to enter and exit is provided inside the elastic pushing component 212 and the suction nozzle 213.

[0052] The elastic pushing component 212 includes a pushing shaft 214 and a shaft sleeve 215 arranged on the outer periphery of the pushing shaft 214. The pushing shaft 214 and the shaft sleeve 215 are arranged on the first mounting bracket 211 through a mounting sleeve 216. An air inlet block 217 that supports the upper end of the shaft sleeve 215 is arranged at the upper end of the pushing shaft 214, and the pushing shaft 214 is restricted on the upper surface of the air inlet block 217 through a snap ring 218. A spring 219 is sleeved on the outer periphery of the mounting sleeve 216. The upper end of the spring 219 abuts against the lower surface of the air inlet block 217, and the lower end abuts against the first mounting bracket 211. The suction nozzle 213 is arranged at the lower end of the pushing shaft 214. An activity gap for the shaft sleeve 215 to move up and down is provided between the lower end of the mounting sleeve 216 and the pushing shaft 214.

[0053] The pushing module 25 includes a second mounting bracket 251 fixed to the mounting plate 24, a third driving motor 252 fixed to the second mounting bracket 251, and a pushing head 253 that moves up and down driven by the third driving motor. Two pressing rods 26 that press the upper surface of the wafer 200 are also arranged on both sides of the pushing module 25. After the ejector pin mechanism 62 jacks up, the suction nozzle 213 adsorbs the chip 400 to prevent the chip from bending or warping, and the two arranged pressing rods 26 press on the upper surface of the chip 400.

[0054] Since the chips removed from the wafer 200 may be in the reverse direction, a rotating device 9 needs to be set to rotate the chips by 180° to adjust the chip direction. The rotating device 9 includes a third mounting bracket 91 fixed to the frame 1, a fourth driving motor 92 fixed to the third mounting bracket 91, and a clamping mechanism driven by the fourth driving motor 92 to perform a rotating action; the clamping mechanism includes four clamping blocks 93 that clamp the four sides of the chip and a clamping module 94 that drives the clamping blocks to simultaneously open or clamp. A clamping gap for the chip 400 to enter is formed between the four clamping blocks 93. The clamping module 94 has been described in detail in the patent application No. CN202020130093.0, titled "A Three-Jaw Clamping Structure". Its working principle and structure are similar to those in this solution, and will not be elaborated here; a first sensor 95 for detecting whether there is a chip on the clamping mechanism is arranged on the third mounting bracket 91.

[0055] Since the chip is facing downward when it is removed from the wafer 200, and needs to be facing upward when it is placed on the tray 300, a turning device 4 for turning the chip is provided on the outer periphery of the turntable transport device 2, and a pushing module 25 is provided on the mounting plate 24 above the turning device 4. The pushing module 25 pushes the adsorption transport mechanism 21 downward to facilitate the placement of the chip on the turning device 4. The flipping device 4 includes a fourth mounting bracket 41 fixed on the frame 1, a fifth driving member 42 fixed on the fourth mounting bracket 41, and a flipping mechanism driven by the fifth driving member 42 to move from the outer periphery to the center of the turntable 22, the flipping mechanism includes a accommodating plate 44 for accommodating the chip, a first stopper 45 and a second stopper 46 respectively arranged on the upper and lower sides of the accommodating plate 44, and a sixth driving motor 43 that drives the accommodating plate 44 to rotate and simultaneously drives the first stopper 45 and the second stopper 46 to alternately axially extend and retract; the sixth driving motor 43 can drive the first stopper 45 and the second stopper 46 to alternately axially extend and retract while driving the accommodating plate 44 to rotate, this technology is prior art and will not be described in detail here; the accommodating plate 44 is provided with a contoured accommodating groove 47 that is contoured with the chip, and the fourth mounting bracket 41 is provided with a second sensor 48 for detecting whether there is a chip on the accommodating plate 44. The working principle of the flipping device 4 is as follows: when the adsorption and transporting mechanism 21 transports the chip to the flipping device 4, the fifth driving member 42 drives the flipping mechanism to move from the outer periphery to the center of the turntable 22, so that the flipping mechanism is located directly below the chip. At this time, the first stopper 45 avoids the adsorption and transporting mechanism 21 at the rear side of the contoured receiving groove 47, so that the adsorption and transporting mechanism 21 puts the chip into the contoured receiving groove 47, and at the same time, the second stopper 46 extends into the bottom of the contoured receiving groove 47 to block the chip to prevent the chip from falling. When the chip is completely placed in the contoured receiving groove 47, the sixth driving motor 43 drives the receiving plate 44 to rotate 180° around the horizontal axis, and at the same time drives the first stopper 45 to extend to block the chip to prevent the chip from falling, and drives the second stopper 46 to retract so that the adsorption and transporting mechanism 21 can enter the contoured receiving groove 47 to absorb the flipped chip.

[0056] The chip receiving device 5 includes a tray feeding mechanism 51 at one end, a chip storage mechanism 52 at the other end, and a transfer conveying mechanism 53 for transferring the empty tray above the tray feeding mechanism 51 to receive the chips on the adsorption and conveying mechanism 21 and transporting the tray 300 full of chips to the chip storage mechanism 52. The tray feeding mechanism 51 and the chip storage mechanism 52 are arranged in a straight line along the X direction and are disconnected in the middle to form an avoidance opening 54 for the transfer conveying mechanism 53 to move.

[0057] The working principles of the tray feeding mechanism 51 and the chip storage mechanism 52 are prior art and will not be described in detail here.

[0058] The transfer and conveying mechanism 53 includes a first XY driving module 531 fixed on the frame 1, a first support plate 532 driven by the first XY driving module 531 to move in the XY directions, a conveying module 533 movably arranged above the first support plate 532 and used for conveying the tray 300 in the X direction, a linear pushing module 534 for driving the conveying module 533 to move in the X direction to communicate with the tray feeding mechanism 51 or the chip storage mechanism 52, and a blocking module arranged on the right side of the driving conveying module 533 and used for blocking the forward conveyance of the tray 300. A pushing module 25 is arranged on the mounting plate 24 above the transfer and conveying mechanism 53. The pushing module 25 pushes the adsorption and handling mechanism 21 downward to facilitate placing the qualified products onto the tray 300 of the conveying module 533.

[0059] The conveying module 533 includes a conveying frame 5331, two transmission shafts 5332 arranged at both ends of the conveying frame 5331, and a conveying driving component 5333 for driving the transmission shafts 5332 to rotate. The two transmission shafts 5332 are connected together by transmission belts 5334 to achieve rotational transmission. There are two transmission belts 5334, and the two transmission belts 5334 are arranged in parallel at intervals.

[0060] The linear pushing module 534 includes a first support shaft 5341 fixed on the conveying frame 5331, two connecting rods 5342 rotatably arranged on the first support shaft 5341, a second support shaft 5343 arranged at the other end of the connecting rods 5342, a pushing shaft 5344 rotatably arranged on the second support shaft 5343, and a second cylinder 5345 for driving the pushing shaft 5344 to move the conveying module 533 in the X direction.

[0061] The blocking module includes a blocking plate 5351 for blocking the forward movement of the tray 300 and a third cylinder for driving the up and down movement of the blocking plate 5351.

[0062] The defective product recycling mechanism 10 includes a second XY driving module 101 fixed on the frame 1, a second support plate 103 driven by the second XY driving module 101 to move in the XY directions, and a defective product tray 102 fixed above the second support plate 103 and used for receiving the defective products on the adsorption and handling mechanism 21. A waste box 104 is also arranged on the second support plate 103 to facilitate the collection of waste. A pushing module 25 is arranged on the mounting plate 24 above the defective product recycling mechanism 10. The pushing module 25 pushes the adsorption and handling mechanism 21 downward to facilitate placing the defective products onto the defective product tray 102.

[0063] When the turntable chip efficient automatic plate placing device 100 provided by the present solution is applied, the X-axis driving module 82 of the wafer clamping mechanism 8 drives the clamping module 81 to take out the wafer from the wafer bin 31, and the X-axis driving module 82 reversely drives the clamping module 81 to place the wafer into the card slot 615 of the chip separation and transfer device 6, and the detection camera arranged on the chip detection device 7 takes a picture of the chip on the chip separation and transfer device 6, and the system detects the photographed picture to confirm whether the chip is a good product or a defective product, and the first driving member 621 of the ejector mechanism 62 drives the first supporting frame 622 to drive the ejector assembly to move upward, so that the ejector 626 ejects the chip on the wafer, and pushes the module 2 5 pushes the elastic pushing component 212 of the adsorption and transporting mechanism 21 to move downward so as to contact the chip. After vacuuming, the suction nozzle 213 sucks up the chip. The disc driving module 23 drives the turntable 22 to rotate, so that the just-adsorbed chip moves to the top of the rotating device 9. The adsorption and transporting mechanism 21 places the chip in the clamping gap between the clamping blocks 93. The clamping module 94 drives the clamping blocks 93 to clamp the chip. The fourth driving motor 92 drives the clamping mechanism to rotate 180° around the vertical axis, thereby completing the adjustment of the chip direction. After the chip direction adjustment is completed, the adsorption and transporting mechanism 21 places the chip in the contour receiving groove 47 on the flipping device 4. The first stopper 45 avoids the adsorption at the rear side of the contour receiving groove 47. The conveying mechanism 21 is attached, and at the same time, the second stopper 46 extends into the bottom of the contoured receiving groove 47 to block the chip to prevent the chip from falling. The sixth driving motor 43 drives the receiving plate 44 to rotate 180° to complete the flipping of the chip; the linear push module 534 drives the driving conveying module 533 to move to the left to connect with the tray feeding mechanism 51 to receive the empty tray, and the blocking module blocks the tray 300 from being transported forward so that the empty tray is blocked on the conveying module 533. The linear push module 534 drives the driving conveying module 533 to move to the right, and at the same time, the first XY driving module 531 drives the first supporting plate 532 to drive the conveying module 533 to move to the side of the turntable 22 to receive the adsorption conveying mechanism If the chip on 21 is a good product, the adsorption and transportation mechanism 21 places the chip on the tray 300. If it is a defective product, it continues to be transported forward and is placed on the defective tray 102 of the defective recovery mechanism 10. After the conveying module 533 is full of chips in the tray 300, the first XY driving module 531 drives the first supporting plate 532 to drive the conveying module 533 to move to the avoidance opening 54 and connect with the chip storage mechanism 52, and conveys the tray full of chips to the chip storage mechanism 52. The linear push module 534 drives the driving conveying module 533 to move to the left and connect with the tray feeding mechanism 51 to continue to receive the empty tray, thereby completing the chip receiving action for the next tray.

[0064] The above are only some embodiments of the present invention. For those skilled in the art, several modifications and improvements can be made without departing from the inventive concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. An efficient automatic chip placing device of a turntable type, characterized in that: It includes a frame and a rotary transfer device arranged on the frame. A number of adsorption and transfer mechanisms for adsorbing and transferring chips are arranged at equal angles along the circumferential direction of the outer edge of the rotary transfer device; a wafer feeding mechanism, a rotating device for adjusting the direction of the chip by rotating the chip around the vertical axis, a turning device for turning the chip by rotating the chip around the horizontal axis, a chip receiving device for receiving the chips transferred by the rotary transfer device, and a defective product recycling mechanism are sequentially arranged on the outer circumference of the rotary transfer device along the conveying direction. A chip separation and transfer device for separating the chip from the wafer blue film is arranged between the wafer feeding mechanism and the rotary transfer device. A chip detection device is arranged above the chip separation and transfer device. A wafer clamping mechanism for transferring a single wafer on the wafer feeding mechanism to the chip separation and transfer device is arranged on the opposite side of the wafer feeding mechanism.

2. The high-efficiency automatic chip placing device with a turntable as claimed in claim 1, characterized in that: The chip separation and transfer device includes an XYZ moving and positioning mechanism for positioning a single wafer and a thimble mechanism that extends from below into the interior of the XYZ moving and positioning mechanism to contact the back surface of the wafer and push up the chip to separate the chip from the wafer blue film; the thimble mechanism includes a first driving member, a first support frame driven by the first driving member to move up and down, a second driving member fixed on the first support frame, and a thimble assembly driven by the second driving member to rotate. A number of thimbles for pushing up the chip are arranged on the thimble assembly.

3. The high-efficiency automatic chip placing device with a turntable according to claim 1, characterized in that: The wafer clamping mechanism includes a clamping module for clamping the wafer in the wafer feeding mechanism and an X-axis driving module for driving the clamping module to move between the wafer feeding mechanism and the chip separation and transfer device; the clamping module includes a moving frame, an upper clamping jaw fixed on the moving frame, a first air cylinder fixed on the moving frame, and a lower clamping jaw driven by the first air cylinder to move up and down and cooperate with the upper clamping jaw to perform clamping and opening actions.

4. The efficient automatic chip placing device with a rotary table as claimed in claim 1, wherein: The rotary transfer device includes a turntable for installing a number of the adsorption and transfer mechanisms, a disk driving module for driving the turntable to rotate, and a mounting disk arranged in parallel with the turntable and concentrically above it. A pushing module for pushing the adsorption and transfer mechanism downward to facilitate material taking and placing is arranged on the outer circumference of the mounting disk.

5. The high-efficiency automatic chip placing device of a turntable type according to claim 4, characterized in that: The adsorption and transfer mechanism includes a first mounting bracket fixed on the lower surface of the turntable, an elastic pushing component movably arranged inside the first mounting bracket, and a suction nozzle arranged at the lower end of the elastic pushing component. A gas passage that is mutually communicated and allows gas to enter and exit is arranged inside the elastic pushing component and the suction nozzle; the pushing module includes a second mounting bracket fixed on the mounting disk, a third driving motor fixed on the second mounting bracket, and a pushing head driven by the third driving motor to move up and down.

6. The high-efficiency automatic chip placing device of a turntable type according to claim 1, wherein: The rotating device includes a third mounting bracket fixed on the frame, a fourth driving motor fixed on the third mounting bracket, and a clamping mechanism driven by the fourth driving motor to perform a rotating action; the clamping mechanism includes four clamping blocks for clamping around the chip and a clamping module for driving the clamping blocks to simultaneously perform an opening or clamping action; a first sensor for detecting whether there is a chip on the clamping mechanism is provided on the third mounting bracket.

7. The high - efficiency automatic chip placing device with a rotary table according to claim 1, characterized in that: The turning device includes a fourth mounting bracket fixed on the frame, a fifth driving member fixed on the fourth mounting bracket, and a turning mechanism driven by the fifth driving member and moving from the outer periphery to the center of the turntable. The turning mechanism includes a receiving plate for accommodating the chip, a first stop block and a second stop block respectively arranged on the upper and lower sides of the receiving plate, and a sixth driving motor for driving the receiving plate to rotate and simultaneously driving the first stop block and the second stop block to perform an alternating axial telescopic action; a contour accommodating groove imitating the chip is provided on the receiving plate, and a second sensor for detecting whether there is a chip on the receiving plate is provided on the fourth mounting bracket.

8. The high-efficiency automatic chip arranging device with a turntable according to claim 4, wherein: The chip receiving device includes a tray feeding mechanism at one end, a chip storage mechanism at the other end, and a transfer conveying mechanism for transferring the empty tray on the tray feeding mechanism to receive the chip on the adsorption and handling mechanism and transporting the tray filled with chips to the chip storage mechanism. The tray feeding mechanism and the chip storage mechanism are linearly arranged along the X direction and are disconnected in the middle to form an avoidance opening for the movement of the transfer conveying mechanism.

9. The efficient automatic chip arranging device with a turntable as claimed in claim 8, wherein: The transfer conveying mechanism includes a first XY driving module fixed on the frame, a first support plate driven by the first XY driving module to move in the XY direction, a conveying module movably arranged above the first support plate and conveying the tray along the X direction, a linear pushing module for driving the conveying module to move in the X direction to communicate with the tray feeding mechanism or the chip storage mechanism, and a blocking module arranged on the right side of the driving conveying module and used to block the forward conveying of the tray. The pushing module is arranged on the mounting plate above the transfer conveying mechanism.

10. The high-efficiency automatic chip arranging device with a turntable as claimed in claim 4, wherein: The defective product recycling mechanism includes a second XY driving module fixed on the frame, a second support plate driven by the second XY driving module to move in the XY direction, and a defective product tray fixed above the second support plate and used to receive the defective products on the adsorption and handling mechanism. The pushing module is arranged on the mounting plate above the defective product recycling mechanism.

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